Computing card and electronic equipment

Abstract

The utility model relates to the technical field of data processing equipment, and discloses a computing card and electronic equipment. The computing card comprises a first heat source, a first radiator, a second radiator and a second heat source which are arranged at intervals in the first direction. A first radiating gap is formed between the first heat source and the first radiator, a third radiating gap is formed between the first radiator and the second radiator, and a second radiating gap is formed between the second radiator and the second heat source. The heat conduction supporting assemblies are arranged in the first heat dissipation gaps and the second heat dissipation gaps, one end of each heat conduction supporting assembly is connected with the heat source assembly, and the other end of each heat conduction supporting assembly is connected with the heat dissipation assembly. The device further comprises a positioning connecting assembly. The positioning connection assembly is used for fixing the third heat dissipation gap and assembling the heat source assembly and the heat dissipation assembly together. The PCIE computing card solves the problem that a PCIE computing card in the prior art has large stress risk.

Description

Technical Field

[0001] The utility model relates to the technical field of data processing equipment, in particular to a computing card and an electronic device. Background Art

[0002] The pluggable standard card with a standard size, such as a PCIE (Peripheral Component Interconnect Express) computing card, is widely used in many fields such as big data, artificial intelligence, and cloud computing. At present, the PCIE computing card usually has a frame structure of two PCB boards plus two radiators. Along the up and down direction, the two PCB boards are respectively arranged at intervals above and below the installation space, the two radiators are located between the two PCB boards, and a spring is arranged between the two radiators. After assembly, the spring is compressed, and the reaction force of the spring is applied to the two radiators, so that the two radiators are respectively in close contact with the two PCB boards.

[0003] At present, after the PCIE computing card is assembled, usually the degree of compression of the springs at different positions is different, and the reaction forces of the springs are also different, resulting in the deformation of the PCB board above the spring, as Figure 2 shown, and further resulting in a large deformation stress in the product, making the product have a large stress risk. Therefore, how to reduce the stress risk of the product is an urgent problem to be solved in the industry. Summary of the Utility Model

[0004] The utility model provides a computing card and an electronic device to solve the problem of large stress risk existing in the PCIE computing card in the prior art.

[0005] The first aspect of the utility model provides a computing card, including:

[0006] A heat source component, including a first heat source and a second heat source;

[0007] A heat dissipation component, including a first radiator and a second radiator;

[0008] Along a first direction, the first heat source, the first radiator, the second radiator and the second heat source are arranged at intervals; a first heat dissipation gap is formed between the first heat source and the first radiator, a third heat dissipation gap is formed between the first radiator and the second radiator, and a second heat dissipation gap is formed between the second radiator and the second heat source;

[0009] A heat conduction and support component is arranged in the first heat dissipation gap and the second heat dissipation gap. One end of the heat conduction and support component is connected to the heat source component, and the other end is connected to the heat dissipation component, for heat conduction and fixing the first heat dissipation gap and the second heat dissipation gap;

[0010] A positioning and connecting component is used to fix the third heat dissipation gap and assemble the heat source component and the heat dissipation component together.

[0011] According to the computing card provided by the present invention, the heat conduction and support component includes:

[0012] A heat conduction medium, the two ends of which are respectively connected to the heat source component and the heat dissipation component for heat conduction;

[0013] A support member, one end of which is soldered to the heat source component and the other end abuts against the heat dissipation component.

[0014] According to the computing card provided by the present invention, the support member includes a gasket corresponding to the assembly hole of the heat source component; the inner diameter of the gasket is D4, the outer diameter of the gasket is D3, the aperture of the assembly hole is D2, and the pad diameter of the assembly hole is D1, and D3 + D4 ≥ D1 + D2.

[0015] According to the computing card provided by the present invention, the support member includes:

[0016] A limiting section inserted into the assembly hole of the heat source component and soldered to the heat source component;

[0017] A support section coaxially arranged with the limiting section, the diameter of the support section being greater than that of the limiting section, and the two ends of the support section respectively abut against the heat source component and the heat dissipation component.

[0018] According to the computing card provided by the present invention, the positioning and connecting component includes:

[0019] A first connecting member, one end of which is connected to the first radiator, and the other end is connected to the second radiator and the second heat source, for fixing the third heat dissipation gap and assembling the second radiator and the second heat source together;

[0020] A second connecting member, which is detachable from the first heat source, the first radiator and the first connecting member, for assembling the first heat source and the first radiator together.

[0021] According to the computing card provided by the present invention, the first connecting member includes:

[0022] A limiting support column located in the third heat dissipation gap for fixing the third heat dissipation gap; along the first direction, a first threaded hole is provided in the limiting support column, and the second connecting member is threadedly assembled in the first threaded hole;

[0023] The screw is arranged at one end of the limit support column away from the second connecting piece, and is threadedly connected to the second radiator and the second heat source.

[0024] According to the computing card provided by the present invention, the support piece located in the first heat dissipation gap is connected to the second connecting piece, and the support piece located in the second heat dissipation gap is connected to the screw.

[0025] According to the computing card provided by the present invention, the heat-conducting medium includes heat-conducting gel, silicone grease or ultra-flexible heat-conducting pad.

[0026] According to the computing card provided by the present invention, the first heat dissipation gap is 0.1 mm to 2 mm; the second heat dissipation gap is 0.1 mm to 2 mm.

[0027] The second aspect of the present invention provides an electronic device, including the computing card described in any one of the above.

[0028] For the computing card provided by the present invention, by arranging the first heat source, the first radiator, the second radiator and the second heat source at intervals along the first direction, the first heat dissipation gap, the third heat dissipation gap and the second heat dissipation gap can be sequentially formed along the first direction. By arranging the heat-conducting support assembly in the first heat dissipation gap and the second heat dissipation gap, and both ends of the heat-conducting support assembly are respectively connected to the heat source assembly and the heat dissipation assembly, not only can the heat of the heat source assembly be transferred to the heat dissipation assembly to achieve heat conduction, but also the first heat dissipation gap and the second heat dissipation gap can be fixed to prevent the heat source assembly, that is, the first heat source and the second heat source, from deforming, avoiding the generation of deformation stress in the heat source assembly, and further reducing the stress risk of the product. By arranging the positioning connection assembly, it is possible to avoid arranging an elastic structure between the two radiators, releasing the pressure risk brought by the spring of the existing PCIE computing card. In addition, the positioning connection assembly can not only fix the third heat dissipation gap to prevent the heat dissipation assembly, that is, the first radiator and the second radiator, from deforming, avoiding the generation of deformation stress in the heat dissipation assembly, and further reducing the stress risk of the product, but also assemble the heat source assembly and the heat dissipation assembly together, avoiding the need to additionally design a connection structure for assembling the heat source assembly and the heat dissipation assembly together, improving the assembly efficiency. Through the setting of the first heat dissipation gap, the second heat dissipation gap and the third heat dissipation gap, it can be ensured that the product can meet the heat dissipation efficiency. That is to say, this embodiment solves the problem of large stress risk existing in the existing PCIE computing card.

[0029] The electronic device of the present invention includes the above-mentioned computing card, so it has at least the above advantages. Description of the Drawings

[0030] To more clearly illustrate the technical solutions in the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0031] Figure 1 is a schematic structural diagram of the buckle plate of an existing PCIE computing card;

[0032] Figure 2 is a schematic assembly structure diagram of the buckle plate, spring and radiator after the existing PCIE computing card is assembled.

[0033] Figure 3 is a schematic structural diagram of the computing card provided by the present utility model.

[0034] Figure 4 is one of the schematic structural diagrams of the support member of the present utility model.

[0035] Figure 5 is a schematic structural diagram of the gasket and the pad.

[0036] Figure 6 is another schematic structural diagram of the support member of the present utility model.

[0037] Figure 7 Schematic structural diagram of the first connecting member of the computing card provided by the present utility model.

[0038] Reference numerals:

[0039] 110, the first heat source; 120, the second heat source; 210, the first radiator; 220, the second radiator; 300, the first heat dissipation gap; 400, the second heat dissipation gap; 500, the third heat dissipation gap;

[0040] 600, the heat-conducting support assembly; 610, the heat-conducting medium; 620, the support member; 621, the first mounting hole; 622, the gasket; 623, the limiting section; 624, the support section; 625, the first limiting platform;

[0041] 700, the positioning and connecting assembly; 710, the first connecting member; 720, the second connecting member; 711, the limiting support column; 712, the screw; 701, the support column; 702, the convex platform; 703, the second limiting platform; 704, the third limiting platform;

[0042] 810, the upper cover; 820, the base. Detailed implementation manners

[0043] To make the objectives, technical solutions and advantages of the present utility model clearer, the technical solutions in the present utility model will be clearly and completely described below with reference to the accompanying drawings in the present utility model. Apparently, the described embodiments are some but not all of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0044] In the description of the embodiments of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the embodiments of the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the embodiments of the present utility model. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and should not be construed as indicating or implying relative importance.

[0045] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "connected" and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present utility model can be understood according to specific circumstances.

[0046] In the embodiments of the present utility model, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0047] In the description of this specification, the descriptions referring to terms such as "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the embodiments of the present utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0048] The current computing card assembly process sequentially includes: base plate assembly, radiator assembly, pillar fixing, spring assembly, radiator assembly, buckle plate assembly, screw fixing, and upper cover fixing. The base plate is a PCB board, and the base plate is welded to the chip; the buckle plate is a PCB board, and the buckle plate is also welded to the chip. After assembling the buckle plate, 4 screws at the middle position of the buckle plate need to be locked. As Figure 1 shown, when locking these 4 screws in sequence, the reaction forces generated by the remaining unfixed springs are different from the reaction forces generated by the fixed springs, causing the buckle plate to deform, as Figure 2 shown.

[0049] Strain gauges are installed at the 4 screws at the middle position of the buckle plate. Taking the 4 screws as four test sites, they are respectively recorded as test site 1, test site 2, test site 3, and test site 4. Strain tests are performed on the four test sites, and the results are shown in Table 1.

[0050] Table 1 Strain test results of four test sites

[0051]

[0052] From the test results, it can be seen that the maximum strain values of test site 2, test site 3, and test site 4 exceed the standard value of 500, which also indicates that there is a relatively large stress risk in the product. Therefore, how to reduce the stress risk of the product is an urgent problem to be solved in the industry.

[0053] To solve the above problems existing in the prior art, this embodiment provides a computing card. As Figure 3 shown, the computing card of this embodiment includes a heat source component, a heat dissipation component, a heat conduction support component 600, and a positioning and connection component 700.

[0054] Among them, the heat source assembly includes a first heat source 110 and a second heat source 120. The heat dissipation assembly includes a first heat sink 210 and a second heat sink 220. Along the first direction, the first heat source 110, the first heat sink 210, the second heat sink 220, and the second heat source 120 are arranged at intervals; a first heat dissipation gap 300 is formed between the first heat source 110 and the first heat sink 210, a third heat dissipation gap 500 is formed between the first heat sink 210 and the second heat sink 220, and a second heat dissipation gap 400 is formed between the second heat sink 220 and the second heat source 120. The heat conduction support assembly 600 is disposed in the first heat dissipation gap 300 and the second heat dissipation gap 400; one end of the heat conduction support assembly 600 is connected to the heat source assembly, and the other end is connected to the heat dissipation assembly, for heat conduction and fixing the first heat dissipation gap 300 and the second heat dissipation gap 400. The positioning and connection assembly 700 is used to fix the third heat dissipation gap 500 and assemble the heat source assembly and the heat dissipation assembly together.

[0055] In this embodiment, by arranging the first heat source 110, the first heat sink 210, the second heat sink 220, and the second heat source 120 at intervals along the first direction, the first heat dissipation gap 300, the third heat dissipation gap 500, and the second heat dissipation gap 400 can be sequentially formed along the first direction. By arranging the heat conduction support assembly 600 in the first heat dissipation gap 300 and the second heat dissipation gap 400, and both ends of the heat conduction support assembly 600 are respectively connected to the heat source assembly and the heat dissipation assembly, not only can the heat of the heat source assembly be transferred to the heat dissipation assembly to achieve heat conduction, but also the first heat dissipation gap 300 and the second heat dissipation gap 400 can be fixed to prevent the heat source assembly, that is, the first heat source 110 and the second heat source 120, from deforming, and the deformation stress of the heat source assembly can be avoided, thereby reducing the stress risk of the product. By arranging the positioning and connection assembly 700, the elastic structure between the two heat sinks can be avoided, and the pressure risk brought by the spring of the existing PCIE computing card is released. In addition, the positioning and connection assembly 700 can not only fix the third heat dissipation gap 500 to prevent the heat dissipation assembly, that is, the first heat sink 210 and the second heat sink 220, from deforming, avoid the deformation stress of the heat dissipation assembly, and thereby reduce the stress risk of the product; but also assemble the heat source assembly and the heat dissipation assembly together, avoid an additional connection structure for assembling the heat source assembly and the heat dissipation assembly, and improve the assembly efficiency. Through the arrangement of the first heat dissipation gap 300, the second heat dissipation gap 400, and the third heat dissipation gap 500, it can be ensured that the product can meet the heat dissipation efficiency. That is to say, this embodiment solves the problem of large stress risk existing in the existing PCIE computing card.

[0056] It can be understood that the first heat source 110 includes a first carrier board, and the second heat source 120 includes a second carrier board. Specifically, the carrier board is a PCB board. That is to say, the computing card of this embodiment includes two PCB boards and two radiators; and the two radiators are arranged between the two PCB boards. Compared with the existing PCIE computing card, the computing card of this embodiment retains the structure of the existing PCIE computing card with two PCB boards and two radiators. That is to say, under the condition that the structural framework of the existing PCIE computing card remains unchanged, this embodiment reduces the stress risk of the PCIE computing card and solves the problem of the large stress risk existing in the PCIE computing card in the prior art.

[0057] It can be understood that the first heat source 110 further includes a first chip, and the first chip is welded to the first carrier board. Specifically, the first chip is soldered to the side of the first carrier board facing the first radiator 210. One side of the first chip facing the first radiator 210 is connected to one end of the heat conduction support component 600. In other words, the first chip is directly in contact with the heat conduction support component 600, improving the heat conduction efficiency.

[0058] It can be understood that the second heat source 120 further includes a second chip, and the second chip is welded to the second carrier board. Specifically, the second chip is soldered to the side of the second carrier board facing the second radiator 220. One side of the second chip facing the second radiator 220 is connected to one end of the heat conduction support component 600. In other words, the second chip is directly in contact with the heat conduction support component 600, improving the heat conduction efficiency.

[0059] Specifically, the first radiator 210 includes a first heat dissipation plate, and the second radiator 220 includes a second heat dissipation plate. The first heat dissipation plate is preferably a copper plate, and the second heat dissipation plate is preferably a copper plate. That is to say, along the first direction, the first carrier board, the first heat dissipation plate, the second heat dissipation plate and the second carrier board are arranged at intervals. A first heat dissipation gap 300 is formed between the first carrier board and the first heat dissipation plate, a third heat dissipation gap 500 is formed between the first heat dissipation plate and the second heat dissipation plate, and a second heat dissipation gap 400 is formed between the second heat dissipation plate and the second carrier board.

[0060] It should be noted that the first direction can be Figure 3 the up-down direction shown, or the left-right direction. In the specific embodiments of the utility model, no specific limitation is imposed on the first direction. However, for the convenience of description, the following takes Figure 3 the up-down direction shown as an example to describe the computing card of the present utility model in detail. That is to say, along the direction from top to bottom, the first heat source 110, the first radiator 210, the second radiator 220 and the second heat source 120 are arranged at intervals. The first heat dissipation gap 300, the third heat dissipation gap 500 and the second heat dissipation gap 400 are arranged from top to bottom.

[0061] AsFigure 3 As shown, in some embodiments, the heat-conducting support assembly 600 includes a heat-conducting medium 610 and a support 620; both ends of the heat-conducting medium 610 are respectively connected to the heat source assembly and the heat dissipation assembly for heat conduction. One end of the support 620 is soldered to the heat source assembly, and the other end abuts against the heat dissipation assembly.

[0062] In this embodiment, by providing the heat-conducting medium 610 whose both ends are respectively connected to the heat source assembly and the heat dissipation assembly, the heat-conducting medium 610 can directly transfer the heat generated by the heat source assembly to the heat dissipation assembly, improving the heat dissipation efficiency. By providing the support 620 whose both ends are respectively connected to the heat source assembly and the heat dissipation assembly, the support 620 can fix the first heat dissipation gap 300 and the second heat dissipation gap 400, preventing the heat source assembly and the heat dissipation assembly from deforming and avoiding the generation of deformation stress on the heat source assembly and the heat dissipation assembly. By soldering the support 620 to the heat source assembly, drilling holes in the heat source assembly is avoided, simplifying the processing procedure and reducing the processing cost.

[0063] It should be noted that the upper and lower end faces of the heat-conducting medium 610 located in the first heat dissipation gap 300 are respectively connected to the first chip and the first heat dissipation plate. The upper end face of the support 620 located in the first heat dissipation gap 300 is soldered to the first carrier plate, and the lower end face abuts against the first heat dissipation plate.

[0064] It should be noted that the upper and lower end faces of the heat-conducting medium 610 located in the second heat dissipation gap 400 are respectively connected to the second chip and the second heat dissipation plate. The upper end face of the support 620 located in the second heat dissipation gap 400 abuts against the second heat dissipation plate, and the lower end face is soldered to the second carrier plate.

[0065] As Figure 3 、 Figure 4 and Figure 5 shown, in some embodiments, the support 620 includes a gasket 622. The gasket 622 corresponds to the assembly hole of the heat source assembly; the inner diameter of the gasket 622 is D4, the outer diameter of the gasket 622 is D3, the aperture of the assembly hole is D2, and the pad diameter of the assembly hole is D1, and D3 + D4 ≥ D1 + D2. By providing the gasket 622 corresponding to the assembly hole of the heat source assembly, the positioning connection assembly 700 can be installed in the assembly hole and the first installation hole 621 of the gasket 622, improving the aesthetics of the product. By designing the dimensions of the gasket 622 as above, the gasket 622 can be prevented from deviating from the pad. And it is ensured that when the gasket 622 has the maximum offset, the gasket 622 still does not interfere with the assembly hole, ensuring normal assembly.

[0066] Exemplarily, the diameter D1 of the pad is 6 mm, the aperture diameter D2 of the second assembly hole is 2.2 mm, the outer diameter D3 of the gasket 622 is 5.2 mm, and the inner diameter D4 of the gasket 622 is 3.2 mm. That is to say, the wall thickness of the gasket 622 is 1 mm, which can avoid interference problems.

[0067] As Figure 3 and Figure 6 shown, in some other embodiments, the support member 620 includes a limiting section 623 and a support section 624. The limiting section 623 is inserted into the assembly hole of the heat source assembly and is soldered to the heat source assembly. The limiting section 623 not only functions to connect with the heat source assembly but also serves as a pre-positioning function. The support section 624 is coaxially arranged with the limiting section 623, the diameter of the support section 624 is larger than that of the limiting section 623, and both ends of the support section 624 are respectively abutted against the heat source assembly and the heat dissipation assembly.

[0068] In this embodiment, by designing the support member 620 to have a limiting section 623 and a support section 624 with different diameters, a first limiting platform 625 can be formed at the connection between the limiting section 623 and the support section 624. During assembly, the limiting section 623 is inserted into the assembly hole of the heat source assembly, one end of the support section 624 away from the limiting section 623 abuts against the heat dissipation assembly, and one side of the heat source assembly facing the heat dissipation assembly abuts against the first limiting platform 625, so that the support section 624 is clamped between the heat source assembly and the heat dissipation assembly. The support section 624 has a supporting effect on the first heat source 110 and the second radiator 220 located above it, and functions to fix the first heat dissipation gap 300 and the second heat dissipation gap 400.

[0069] Specifically, taking the support member 620 located in the first heat dissipation gap 300 as an example, the limiting section 623 of the support member 620 is inserted into the assembly hole of the first carrier plate and is soldered to the first carrier plate. The lower side surface of the first carrier plate abuts against the first limiting platform 625, and the lower side surface of the support section 624 abuts against the upper side surface of the first heat dissipation plate.

[0070] It should be noted that in the same computing card, two different structures of the support member 620 can be used simultaneously.

[0071] Exemplarily, first assembly holes are provided at the four corners of the first carrier plate of the first heat source 110, and a second assembly hole is provided in the middle of the first carrier plate; the aperture diameter of the second assembly hole is smaller than that of the first assembly hole. In other words, the limiting section 623 can be inserted into the first assembly hole but cannot be inserted into the second assembly hole. The limiting sections 623 of four support members 620 of the first structure are respectively inserted into the four first assembly holes and are soldered to the first carrier plate. The gaskets 622 correspond to the four second assembly holes one by one. The upper side surface of the gasket 622 is soldered to the pad of the second assembly hole, and the lower side surface of the gasket 622 abuts against the first heat dissipation plate.

[0072] Further, the heat-conducting medium 610 refers to a structural member that does not generate a reaction force after being compressed, eliminating the stress risk caused by the elastic deformation of the structural member.

[0073] Specifically, the heat-conducting medium 610 includes heat-conducting gel, silicone grease, or super-flexible heat-conducting pads.

[0074] Specifically, heat-conducting gel is filled between the first chip of the first heat source 110 and the first heat sink, and heat-conducting gel is filled between the second chip of the second heat source 120 and the second heat sink.

[0075] As Figure 3 shown, in some embodiments, the positioning and connecting assembly 700 includes a first connecting member 710 and a second connecting member 720. One end of the first connecting member 710 is connected to the first heat sink 210, and the other end is connected to the second heat sink 220 and the second heat source 120, for fixing the third heat dissipation gap 500 and assembling the second heat sink 220 and the second heat source 120 together. The second connecting member 720 is detachably connected to the first heat source 110, the first heat sink 210, and the first connecting member 710, for assembling the first heat source 110 and the first heat sink 210 together.

[0076] In this embodiment, by providing the first connecting member 710, the fixing of the third heat dissipation gap 500 can be achieved, preventing the heat dissipation assembly from deforming, that is, preventing the first heat sink 210 and the second heat sink 220 from deforming, and avoiding the generation of deformation stress in the heat dissipation assembly; the second heat sink 220 and the second heat source 120 can be assembled together. By providing the second connecting member 720 that is detachably connected to the first connecting member 710, the assembly and disassembly of the computing card are facilitated. The second connecting member 720 is also connected to the first heat sink 210 and the first heat source 110, and cooperating with the first connecting member 710, the assembly of the first heat source 110, the first heat sink 210, the second heat sink 220, and the second heat source 120 can be completed, improving the assembly efficiency.

[0077] As Figure 3 and Figure 7 shown, further, the first connecting member 710 includes a limit support column 711 and a screw 712. The limit support column 711 is located in the third heat dissipation gap 500 for fixing the third heat dissipation gap 500; along the first direction, a first threaded hole is formed in the limit support column 711, and the second connecting member 720 is threadedly assembled in the first threaded hole to achieve the detachable connection between the second connecting member 720 and the limit support column 711. The screw 712 is disposed at one end of the limit support column 711 away from the second connecting member 720 and is threadedly connected to the second heat sink 220 and the second heat source 120.

[0078] In this embodiment, by providing the limit support column 711, the fixing of the third heat dissipation gap 500 can be achieved, the support of the first radiator 210 can be realized, and the limitation of the second radiator 220 can be achieved, so as to prevent the first radiator 210 and the second radiator 220 from deforming. By providing the screw 712, the threaded assembly of the second radiator 220 and the second heat source 120 can be realized, and the upper and lower limitation of the second radiator 220 and the second heat source 120 can be achieved, which can prevent the size of the second heat dissipation gap 400 from changing.

[0079] As Figure 7 shown, specifically, the limit support column 711 includes a support column 701, and a boss 702 is formed on the upper end surface of the support column 701; the boss 702 is coaxially arranged with the support column 701; the diameter of the boss 702 is smaller than that of the support column 701, and a second limit platform 703 is formed at the connection between the boss 702 and the support column 701. The boss 702 is inserted into the first assembly hole of the first heat dissipation plate to realize the pre-positioning of the first heat dissipation plate. A first threaded hole is opened in the boss 702, and the lower end of the first threaded hole extends into the support column 701.

[0080] Specifically, the upper end surface of the screw 712 is connected to or integrally formed with the lower end surface of the support column 701, and the screw 712 is coaxially arranged with the support column 701; a third limit platform 704 is formed at the connection between the screw 712 and the support column 701, and the third limit platform 704 abuts against the upper end surface of the second heat dissipation plate. In other words, the support column 701 is clamped between the first heat dissipation plate and the second heat dissipation plate to support the first heat dissipation plate, prevent the first heat dissipation plate from moving downward, and prevent the first heat dissipation plate from deforming. The support column 701 and the support member 620 in the second heat dissipation gap 400 limit the second heat dissipation plate to prevent the second heat dissipation plate from deforming and moving downward. The support column 701 and the support member 620 in the first heat dissipation gap 300 limit the first heat dissipation plate to prevent the first heat dissipation plate from deforming and moving downward.

[0081] Specifically, the second connecting member 720 is preferably a screw.

[0082] As Figure 3 shown, in some embodiments, the support member 620 located in the first heat dissipation gap 300 is connected to the second connecting member 720, and the support member 620 located in the second heat dissipation gap 400 is connected to the screw 712. The occupied area of the heat conduction support assembly 600 and the positioning and connecting assembly 700 for the heat source assembly can be reduced, so that more chips can be installed on the carrier plate of the heat source assembly in a limited space, improving the utilization rate of the carrier plate. In addition, the aesthetics of the product is also improved.

[0083] As Figure 5 and Figure 6As shown, specifically, along the first direction, a first mounting hole 621 is formed in the support member 620. Specifically, the positioning and connecting assembly 700 is coaxially arranged with the support member 620; the second connecting member 720 is assembled in the first mounting hole 621 of the support member 620 located in the first heat dissipation gap 300, and the screw 712 is assembled in the first mounting hole 621 of the support member 620 located in the second heat dissipation gap 400.

[0084] Preferably, the first mounting hole 621 is a threaded hole.

[0085] In some embodiments, the first heat dissipation gap 300 is 0.1 mm to 2 mm; the second heat dissipation gap 400 is 0.1 mm to 2 mm. Ensure that the heat dissipation efficiency of the computing card meets the heat dissipation requirements.

[0086] Exemplarily, both the first heat dissipation gap 300 and the second heat dissipation gap 400 are 1.5 mm.

[0087] In some embodiments, the computing card further includes a housing; the housing includes an upper cover 810 and a base 820; the upper cover 810 is disposed on a side of the first heat source 110 away from the first radiator 210, and forms a fourth heat dissipation gap with the first heat source 110, further improving the heat dissipation efficiency; the base 820 is disposed on a side of the second heat source 120 away from the second radiator 220; the upper end of the positioning and connecting assembly 700 is connected to the upper cover 810, and the lower end of the positioning and connecting assembly 700 is connected to the base 820. By providing the housing, the aesthetics of the product is improved, and the heat source components and heat dissipation components are also protected.

[0088] Specifically, for the positioning and connecting assemblies 700 located at the four corners of the computing card, the screw 712 of the first connecting member 710 is threadedly assembled with the second heat dissipation plate, the limiting section 623 and the supporting section 624 located in the second heat dissipation gap 400, the second carrier plate, and the base 820; the second connecting member 720 is threadedly assembled with the upper cover 810, the first carrier plate, the limiting section 623 and the supporting section 624 located in the first heat dissipation gap 300, and the first heat dissipation plate, and is threadedly connected to the first threaded hole of the first connecting member 710.

[0089] Specifically, for the positioning and connecting assemblies 700 located in the middle region of the computing card, the screw 712 of the first connecting member 710 is threadedly assembled with the second heat dissipation plate, the gasket 622 located in the second heat dissipation gap 400, the second carrier plate, and the base 820; the second connecting member 720 is threadedly assembled with the first carrier plate, the gasket 622 located in the first heat dissipation gap 300, and the first heat dissipation plate, and is threadedly connected to the first threaded hole of the first connecting member 710.

[0090] A specific embodiment of the second aspect of the present utility model provides an electronic device. The electronic device includes the computing card of any of the above embodiments. Therefore, the electronic device of this embodiment has at least the above advantages, which will not be elaborated here.

[0091] Furthermore, the electronic device can be a computer, a server, or the like.

[0092] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present utility model, rather than to limit them; although the present utility model has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present utility model.

Claims

1. A computing card, characterized in that: include: A heat source assembly, comprising a first heat source (110) and a second heat source (120); A heat dissipation component, comprising a first heat sink (210) and a second heat sink (220); Along a first direction, the first heat source (110), the first radiator (210), the second radiator (220), and the second heat source (120) are arranged at intervals; a first heat dissipation gap (300) is formed between the first heat source (110) and the first radiator (210), a third heat dissipation gap (500) is formed between the first radiator (210) and the second radiator (220), and a second heat dissipation gap (400) is formed between the second radiator (220) and the second heat source (120); A heat-conducting support component (600) is arranged in the first heat-dissipating gap (300) and the second heat-dissipating gap (400), one end of the heat-conducting support component (600) is connected to the heat source component, and the other end is connected to the heat-dissipating component, and is used for heat conduction and fixing the first heat-dissipating gap (300) and the second heat-dissipating gap (400); A positioning connection assembly (700) is used to fix the third heat dissipation gap (500) and to assemble the heat source assembly and the heat dissipation assembly together.

2. The computing card according to claim 1, characterized in that: The thermally conductive support assembly (600) comprises: A heat-conducting medium (610), two ends of which are respectively connected to the heat source component and the heat dissipation component for heat conduction; A support member (620), one end of the support member (620) being connected to the heat source component by soldering, and the other end of the support member being in contact with the heat dissipation component.

3. The computing card according to claim 2, characterized in that: The support member (620) comprises a gasket (622), and the gasket (622) corresponds to the assembly hole of the heat source component; the inner diameter of the gasket (622) is D4, the outer diameter of the gasket (622) is D3, the aperture of the assembly hole is D2, the pad diameter of the assembly hole is D1, and D3+D4≥D1+D2.

4. The computing card according to claim 2, characterized in that: The support member (620) comprises: The limiting section (623) is inserted into the assembly hole of the heat source component and connected to the heat source component by soldering; The support section (624) is coaxially arranged with the limiting section (623); the diameter of the support section (624) is greater than the diameter of the limiting section (623); and two ends of the support section (624) are respectively in contact with the heat source component and the heat dissipation component.

5. The computing card according to claim 2, characterized in that: The positioning connection assembly (700) comprises: a first connecting member (710), one end of the first connecting member (710) being connected to the first heat sink (210), and the other end of the first connecting member (710) being connected to the second heat sink (220) and the second heat source (120), and being used for fixing the third heat dissipation gap (500) and assembling the second heat sink (220) and the second heat source (120) together; The second connecting member (720) is detachably connected to the first heat source (110), the first heat sink (210) and the first connecting member (710), and is used to assemble the first heat source (110) and the first heat sink (210) together.

6. The computing card according to claim 5, characterized in that: The first connecting member (710) comprises: A limiting support column (711) is located in the third heat dissipation gap (500) and is used to fix the third heat dissipation gap (500); along the first direction, a first threaded hole is opened in the limiting support column (711), and the second connecting member (720) is threadedly assembled in the first threaded hole; The screw rod (712) is arranged at one end of the position-limiting support column (711) away from the second connecting member (720), and is threadedly connected to the second heat sink (220) and the second heat source (120).

7. The computing card according to claim 6, characterized in that: The support member (620) located in the first heat dissipation gap (300) is connected to the second connection member (720), and the support member (620) located in the second heat dissipation gap (400) is connected to the screw rod (712).

8. The computing card according to claim 2, characterized in that: The heat-conducting medium (610) includes heat-conducting gel, silicone grease or an ultra-soft heat-conducting pad.

9. The computing card according to any one of claims 1 to 8, characterized in that: The first heat dissipation gap (300) is 0.1 mm to 2 mm; the second heat dissipation gap (400) is 0.1 mm to 2 mm.

10. An electronic device, characterized in that: A computing card comprising any one of claims 1 to 9.

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