Semiconductor packaging device

Abstract

The utility model provides a semiconductor packaging device, which belongs to the technical field of packaging devices, mainly aims to solve the problem that a welding head cannot move freely when the conventional packaging device performs packaging operation, and adopts the technical scheme that the semiconductor packaging device comprises a base, two groups of working plates are welded in the base, and fixing assemblies are arranged on two sides of the two groups of working plates; a first fixing seat is arranged at the top of the base, a first screw and a second screw which can rotate are arranged in the first fixing seat, the first screw and the second screw are sleeved with the same welding assembly, the first screw and the second screw are connected through a transmission assembly, a first motor is arranged at the top of the base, and a main shaft of the first motor is connected with the first screw. The first motor drives the first screw rod to rotate, the transmission assembly drives the second screw rod to rotate together, and then the first screw rod, the second screw rod and the welding assembly are matched, so that the welding head can freely move in the X axis and the Y axis.

Description

Technical Field

[0001] The utility model belongs to the technical field of packaging devices, and more specifically, particularly relates to a semiconductor packaging device. Background Art

[0002] Semiconductor packaging refers to connecting the circuit pins on a silicon wafer to external connectors with wires. When performing the packaging operation, the metal pads on the chip are usually connected to the pins of the package through wires or other connection methods for connection to an external circuit.

[0003] For example, the Chinese utility model patent with the patent number 202022388793.2 provides a semiconductor packaging device. Through the settings of a mounting plate, a slider, a welding head, an adjusting column and other parts, the device can simultaneously package two semiconductors, improving the packaging work efficiency. At the same time, the position of the welding head can be adjusted, making the operation more convenient and the practicability stronger. Currently, when traditional semiconductor packaging devices perform wire welding and packaging, the welding head often cannot move freely for welding, and users need to continuously adjust the position of the substrate, resulting in poor convenience. Summary of the Utility Model

[0004] In order to solve the above technical problems, the utility model provides a semiconductor packaging device to solve the technical problem that in the prior art, the welding head of a traditional semiconductor packaging device often cannot move freely during the packaging operation.

[0005] The purpose and effect of a semiconductor packaging device of the utility model are achieved by the following specific technical means:

[0006] A semiconductor packaging device includes a base. Two working plates are welded inside the base. Fixed components are arranged on both sides of the two working plates. A first fixed seat is arranged on the top of the base. A rotatable first screw rod and a second screw rod are arranged inside the first fixed seat. The same set of welding components is sleeved on the first screw rod and the second screw rod. The first screw rod and the second screw rod are connected through a transmission component. A first motor is arranged on the top of the base. The main shaft of the first motor is connected to the first screw rod.

[0007] According to a preferred embodiment, the welding component includes a moving part. The same set of the moving part is sleeved on the first screw rod and the second screw rod. A third screw rod is arranged inside the moving part. One side of the moving part is connected to a housing through four L-shaped connecting pieces. A detachable maintenance door is arranged on one side of the housing. A second motor is arranged inside the housing. The main shaft of the second motor is connected to the third screw rod.

[0008] According to a preferred embodiment, a welding block is sleeved on the third screw rod. Two groups of limiting sliders are respectively arranged at both ends of the welding block. Two groups of sliding grooves are respectively formed on the inner side surfaces of both ends of the moving member. The two groups of limiting sliders are respectively clamped in the two groups of sliding grooves. The welding assembly further includes a welding head, and the welding head is threadedly connected to the bottom of the welding block.

[0009] According to a preferred embodiment, all four groups of fixing components include fixing members. Four groups of the fixing members are respectively arranged on both sides of the two working plates. Four groups of sponge pads are respectively arranged on one side of the four groups of fixing members. Sliding blocks are connected to the other sides of the four groups of fixing members. Four groups of through grooves are respectively formed on the inner side surfaces of both sides of the base. The four groups of sliding blocks are respectively clamped in the four groups of through grooves.

[0010] According to a preferred embodiment, multiple groups of springs are respectively fixedly connected to the inner side surfaces of both sides of the base. One sides of the multiple groups of springs are respectively connected to the four groups of fixing members. All four groups of fixing components further include finger buckles, and the four groups of finger buckles are respectively arranged on one side of the four groups of sliding blocks.

[0011] According to a preferred embodiment, a first pulley is sleeved on the first screw rod, a second pulley is sleeved on the second screw rod, the transmission assembly includes a transmission belt, and the transmission belt is wound around the first pulley and the second pulley.

[0012] According to a preferred embodiment, a fixing ring is threadedly connected to the first screw rod, a fixing sleeve is threadedly connected to one end of the second screw rod, multiple anti-slip grooves are formed on the fixing sleeve, two second fixing seats are arranged on the top of the base, and the first screw rod and the second screw rod respectively pass through the two second fixing seats.

[0013] According to a preferred embodiment, multiple groups of sponge clamping pads are respectively arranged on the tops of the two working plates.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] 1. By starting the first motor to drive the first screw rod to rotate, through the setting of the transmission assembly, as the first screw rod rotates, the second screw rod also rotates accordingly, and the moving member can perform X-axis movement. Through the setting of the welding assembly, the second motor drives the third screw rod to rotate, the limiting sliders limit the welding block, and the welding block can move in the Y-axis direction. Subsequently, the encapsulation operation is carried out through the welding head, which solves the problem that the welding head of the encapsulation device often cannot move freely for welding, and improves the practicability.

[0016] 2. Through the setting of the sponge cushion, the user can clamp the substrate on the workbench. Through the setting of the fixing component, the user can pull the finger buckle to make the sliding block slide outwards, and then the spring resets the sliding block so that the fixing piece can fix the substrate secondly. And through the sponge pad on the fixing piece, the damage to the substrate can be effectively prevented. Description of the Drawings

[0017] Figure 1 It is a schematic structural diagram of a semiconductor packaging device of the present utility model;

[0018] Figure 2 It is an exploded view of a semiconductor packaging device of the present utility model;

[0019] Figure 3 It is a schematic structural diagram of the fixing component in a semiconductor packaging device of the present utility model;

[0020] Figure 4 It is a schematic structural diagram of a semiconductor packaging device of the present utility model after being disassembled.

[0021] In the figure, the corresponding relationship between the component names and the drawing reference numbers is as follows:

[0022] 10. Base; 11. Working plate; 110. Sponge pad; 111. Fixing piece; 112. Sliding block; 113. Through groove; 114. Spring; 115. Finger buckle; 12. First fixing seat; 13. First screw; 130. Fixing ring; 14. Second screw; 140. Fixing sleeve; 141. Anti-slip groove; 15. Second fixing seat; 16. First pulley; 17. Second pulley; 18. Transmission belt; 19. Sponge cushion; 20. Moving part; 201. Third screw; 202. Welding block; 203. Limit slider; 204. Chute; 205. Welding head; 206. L-shaped connecting piece; 207. Outer shell; 208. Inspection door; 209. Second motor; 21. First motor. Detailed Embodiment

[0023] The following further describes in detail the embodiments of the present utility model in conjunction with the drawings and examples. The following examples are used to illustrate the present utility model, but cannot be used to limit the scope of the present utility model.

[0024] Example:

[0025] As shown in the Figure 1 to the Figure 4 drawings:

[0026] The utility model provides a semiconductor packaging device, which includes a base 10. Two working plates 11 are welded inside the base 10. Fixing components are arranged on both sides of the two working plates 11. The fixing components can effectively fix the substrate, and can effectively avoid damaging the substrate during the fixing process. A first fixing seat 12 is arranged on the top of the base 10. The first fixing seat 12 can effectively fix the first screw 13 and the second screw 14. A rotatable first screw 13 and a second screw 14 are arranged inside the first fixing seat 12. The same set of welding components is sleeved on the first screw 13 and the second screw 14. The welding components can move along the Y-axis on the first screw 13 and the second screw 14 and perform welding operations on the substrate. The first screw 13 and the second screw 14 are connected through a transmission component. A first motor 21 is arranged on the top of the base 10. The main shaft of the first motor 21 is connected to the first screw 13. The first motor 21 provides power for the rotation of the first screw 13, and through the transmission component, the first screw 13 and the second screw 14 rotate in the same direction, so that the moving part 20 moves along the X-axis on the first screw 13 and the second screw 14.

[0027] The welding components include a moving part 20. The moving part 20 serves as the carrier of the welding components. The same set of moving parts 20 is sleeved on the first screw 13 and the second screw 14. A third screw 201 is arranged inside the moving part 20. The user can insert the third screw 201 from one end of the moving part 20. The third screw 201 can be fixed in the moving part 20 and can rotate. One side of the moving part 20 is connected with a housing 207 through four L-shaped connecting pieces 206. The user can connect the L-shaped connecting pieces 206, the housing 207 and the moving part 20 through screws. A detachable inspection door 208 is arranged on one side of the housing 207. The inspection door 208 enables the user to maintain and repair the second motor 209 inside the housing 207. A second motor 209 is arranged inside the housing 207. The main shaft of the second motor 209 is connected to the third screw 201. The second motor 209 provides power for the rotation of the third screw 201.

[0028] A welding block 202 is sleeved on the third screw 201. The welding block 202 can move along the Y-axis as the third screw 201 rotates. Two limiting sliders 203 are respectively arranged at both ends of the welding block 202. These limiting sliders 203 effectively limit the welding block 202 to prevent it from shifting during the Y-axis movement. Two sliding grooves 204 are respectively formed on the inner side surfaces of both ends of the moving part 20. The two limiting sliders 203 are respectively clamped in the two sliding grooves 204. The limiting sliders 203 can slide in these sliding grooves 204. The welding components further include a welding head 205. The welding head 205 is threadedly connected to the bottom of the welding block 202. The welding head 205 can perform encapsulation welding of the semiconductor and the substrate.

[0029] Among them, please refer to Figure 2 、 Figure 3 andFigure 4 As shown, the four groups of fixing components each include a fixing member 111. The fixing member 111 fixes the substrate. Four groups of fixing members 111 are respectively arranged on both sides of the two working plates 11. Four groups of sponge pads 110 are respectively arranged on one side of the four groups of fixing members 111. These sponge pads 110 can effectively prevent damage to the substrate. On the other side of the four groups of fixing members 111, sliding blocks 112 are respectively connected. Four groups of through grooves 113 are respectively formed on the inner side surfaces of both sides of the base 10. The four sliding blocks 112 are respectively clamped in the four through grooves 113. The sliding blocks 112 can slide in the through grooves 113. A plurality of springs 114 are respectively fixedly connected to the inner side surfaces of both sides of the base 10. One side of the plurality of springs 114 is respectively connected to the four groups of fixing members 111. The four groups of fixing components also each include a finger buckle 115. The four finger buckles 115 are respectively arranged on one side of the four sliding blocks 112. A plurality of sponge clamping pads 19 are respectively fixedly connected to the tops of the two working plates 11. The user can insert the fingers into the finger buckles 115 and pull the finger buckles 115. The sliding blocks 112 slide outwards. The sliding blocks 112 drive the fixing members 111 to move in the same direction. The springs 114 are tightened. The two substrates are clamped into these sponge clamping pads 19 and placed on the two working plates 11. Then the finger buckles 115 are released. The tightened springs 114 reset, driving the fixing members 111 to reset to fix the substrates.

[0030] A first pulley 16 is sleeved on the first screw rod 13. A second pulley 17 is sleeved on the second screw rod 14. The transmission component includes a transmission belt 18. The transmission belt 18 is wound around the first pulley 16 and the second pulley 17. Through the cooperation of the first pulley 16, the second pulley 17 and the transmission belt 18, when the first screw rod 13 rotates, the second screw rod 14 can also rotate in the same direction. A fixing ring 130 is threadedly connected to the first screw rod 13. The user can fix the first pulley 16 on the first screw rod 13 by rotating the fixing ring 130. One end of the second screw rod 14 is threadedly connected with a fixing sleeve 140. After aligning the fixing sleeve 140 with the second screw rod 14, rotate the fixing sleeve 140 to fix the second pulley 17 on the second screw rod 14. A plurality of anti-slip grooves 141 are formed on the fixing sleeve 140. These anti-slip grooves 141 can effectively prevent the user from slipping during the process of rotating the fixing sleeve 140. Two second fixing seats 15 are arranged on the top of the base 10. The first screw rod 13 and the second screw rod 14 respectively pass through the two second fixing seats 15. These second fixing seats 15 play an auxiliary fixing role for the first screw rod 13 and the second screw rod 14, preventing the first screw rod 13 and the second screw rod 14 from shifting.

[0031] After the first motor 21 is started, it drives the first screw rod 13 to rotate. Subsequently, through the cooperation of the first pulley 16, the second pulley 17 and the transmission belt 18, the second screw rod 14 rotates in the same direction simultaneously as the first screw rod 13 rotates. The moving part 20 can then move along the X-axis on the first screw rod 13 and the second screw rod 14. When the second motor 209 is started, the third screw rod 201 rotates, and the welding block 202 provided on the third screw rod 201 can move along the Y-axis. Moreover, the two limit sliders 203 will also slide in the chute 204 and limit the welding block 202. The welding head 205 connected to the bottom of the welding block 202 by a nut can perform the encapsulation welding operation on the substrate and the semiconductor.

[0032] The embodiments of the present invention are given for purposes of illustration and description, and are not exhaustive or limit the present invention to the disclosed form. Many modifications and variations are obvious to those of ordinary skill in the art. The embodiments are chosen and described in order to better illustrate the principles of the present invention and its practical applications, and to enable those of ordinary skill in the art to understand the present invention so as to design various embodiments with various modifications suitable for specific purposes.

Claims

1. A semiconductor packaging device, comprising a base (10), characterized in that: Two groups of working plates (11) are welded inside the base (10), and fixing components are arranged on both sides of the two groups of working plates (11). A first fixing seat (12) is arranged on the top of the base (10), and a rotatable first screw rod (13) and a second screw rod (14) are arranged inside the first fixing seat (12). The first screw rod (13) and the second screw rod (14) are sleeved with the same group of welding components, and the first screw rod (13) and the second screw rod (14) are connected through a transmission component. A first motor (21) is arranged on the top of the base (10), and the main shaft of the first motor (21) is connected to the first screw rod (13).

2. A semiconductor packaging device as claimed in claim 1, characterized in that: The welding assembly comprises a moving part (20), the first screw rod (13) and the second screw rod (14) are sleeved with the same group of the moving parts (20), a third screw rod (201) is arranged inside the moving part (20), one side of the moving part (20) is connected to an outer shell (207) through four groups of L-shaped connecting parts (206), a detachable inspection door (208) is arranged on one side of the outer shell (207), a second motor (209) is arranged inside the outer shell (207), and the main shaft of the second motor (209) is connected to the third screw rod (201).

3. A semiconductor packaging device as claimed in claim 2, characterized in that: A welding block (202) is sleeved on the third screw rod (201), two groups of limit sliders (203) are respectively arranged at both ends of the welding block (202), two groups of slide grooves (204) are respectively opened on the inner side surfaces at both ends of the moving member (20), and the two groups of limit sliders (203) are respectively clamped in the two groups of slide grooves (204), and the welding assembly also includes a welding head (205), and the welding head (205) is threadedly connected to the bottom of the welding block (202).

4. A semiconductor packaging device as claimed in claim 1, characterized in that: The four groups of fixing components all include fixing parts (111), the two groups of working plates (11) are respectively provided with four groups of fixing parts (111) on both sides, the four groups of fixing parts (111) are respectively provided with four groups of sponge pads (110) on one side, the four groups of fixing parts (111) are respectively connected with sliding blocks (112) on the other side, the inner side surfaces of both sides of the base (10) are respectively provided with four groups of through grooves (113), and the four groups of sliding blocks (112) are respectively clamped in the four groups of through grooves (113).

5. A semiconductor packaging device as claimed in claim 4, characterized in that: Multiple groups of springs (114) are fixedly connected to the inner side surfaces of both sides of the base (10), and one side of the multiple groups of springs (114) is respectively connected to four groups of fixing components (111). The four groups of fixing components also include finger buckles (115), and the four groups of finger buckles (115) are respectively arranged on one side of the four groups of sliding blocks (112).

6. The semiconductor packaging device according to claim 1, wherein: The first screw rod (13) is sleeved with a first pulley (16), the second screw rod (14) is sleeved with a second pulley (17), the transmission assembly comprises a transmission belt (18), and the transmission belt (18) is wound around the first pulley (16) and the second pulley (17).

7. The semiconductor packaging device according to claim 1, wherein: A fixing ring (130) is threadedly connected to the first screw rod (13), a fixing sleeve (140) is threadedly connected to one end of the second screw rod (14), a plurality of anti-slip grooves (141) are provided on the fixing sleeve (140), two groups of second fixing seats (15) are arranged on the top of the base (10), and the first screw rod (13) and the second screw rod (14) are respectively inserted into the two groups of the second fixing seats (15).

8. The semiconductor packaging device according to claim 1, wherein: A plurality of groups of sponge pads (19) are respectively arranged on the tops of the two groups of working plates (11).

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