Adsorption device

Abstract

The utility model discloses an adsorption device, which belongs to the technical field of wafer processing equipment and comprises a supporting seat, a first carrying seat and a second carrying seat. A ceramic piece is mounted on the first carrying seat; the ceramic piece is provided with a plurality of first material suction holes distributed at intervals. A plurality of suckers are arranged on the second carrying seat at intervals; each suction cup is provided with a second suction hole, and the supporting base is provided with a first air exhaust channel and a second air exhaust channel. The first carrying seat is provided with a first communicating channel communicated with the first material suction holes of the ceramic part, the second carrying seat is provided with a second communicating channel communicated with the second material suction holes of the suction cups, and when the first carrying seat is installed on the supporting seat, the second air exhaust channel is used for forming negative pressure to adsorb the first carrying seat, and the first air exhaust channel is communicated with the first communicating channel; when the second carrying seat is installed on the supporting seat, the second air exhaust channel is used for forming negative pressure to adsorb the second carrying seat, and the first air exhaust channel is communicated with the second communication channel. The adsorption device provided by the utility model is high in universality and can be used for adsorbing different types of wafers.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing equipment, in particular to an adsorption device. Background Art

[0002] In the field of semiconductor manufacturing processes, it is often necessary to temporarily bond an ultra-thin wafer and a carrier wafer first to enhance its structural strength and facilitate subsequent process flows. For temporarily bonded wafers, after the relevant processes are completed, a debonding operation needs to be carried out to release the connection between the wafer and the carrier wafer. Currently, the common wafer types in the semiconductor field mainly include Frame-frame ultra-thin wafers, flat wafers, and warped wafers. There are significant differences in the surface structures of different types of wafers and their sensitivities to adsorption forces. Since the debonding process requires tight adsorption of the wafer, strict requirements are imposed on the structure of the wafer adsorption stage.

[0003] Most of the existing debonding work stages can only meet the process requirements of a single type of wafer and cannot be compatible with different wafer types, resulting in poor versatility. Summary of the Utility Model

[0004] The purpose of the embodiments of the present utility model is to provide an adsorption device with strong versatility, which can adsorb different types of wafers.

[0005] To achieve the above object, the present utility model adopts the following technical solutions:

[0006] An adsorption device, comprising:

[0007] A support base;

[0008] A first carrier seat for being installed on the support base; a ceramic member is installed on the first carrier seat; the ceramic member has a plurality of first suction holes arranged at intervals;

[0009] And

[0010] A second carrier seat for being installed on the support base; a plurality of suction cups are arranged on the second carrier seat at intervals; each of the suction cups has a second suction hole;

[0011] The support base is provided with a first air extraction channel and a second air extraction channel; the first carrier seat is provided with a first communication channel communicating with each of the first suction holes of the ceramic member, and the second carrier seat is provided with a second communication channel communicating with the second suction holes of each of the suction cups;

[0012] When the first carrier seat is installed on the support base, the second air extraction channel is used to form a negative pressure to adsorb the first carrier seat and the first air extraction channel is communicated with the first communication channel; when the second carrier seat is installed on the support base, the second air extraction channel is used to form a negative pressure to adsorb the second carrier seat and the first air extraction channel is communicated with the second communication channel.

[0013] Optionally, the support base has a support surface, the first carrier has a first adsorption surface and a first mounting surface, the second carrier has a second adsorption surface and a second mounting surface, the ceramic part is arranged on the first adsorption surface, and the suction cup is arranged on the second adsorption surface;

[0014] When the first carrier is mounted on the support base, the first mounting surface abuts against the support surface and together encloses a first adsorption cavity and a second adsorption cavity; the first air extraction channel is communicated with the first communication channel through the first adsorption cavity, and the second air extraction channel is communicated with the second adsorption cavity;

[0015] When the second carrier is mounted on the support base, the second mounting surface abuts against the support surface and together encloses a third adsorption cavity and a fourth adsorption cavity; the first air extraction channel is communicated with the second communication channel through the third adsorption cavity, and the second air extraction channel is communicated with the fourth adsorption cavity.

[0016] Optionally, a first air groove and a second air groove are arranged at intervals on the support surface, a third air groove and a fourth air groove are arranged at intervals on the first mounting surface of the first carrier, and a fifth air groove and a sixth air groove are arranged at intervals on the second mounting surface of the second carrier;

[0017] When the first carrier is mounted on the support base, the inner wall of the third air groove and the inner wall of the first air groove together enclose the first adsorption cavity, and the inner wall of the fourth air groove and the inner wall of the second air groove together enclose the second adsorption cavity;

[0018] When the second carrier is mounted on the support base, the inner wall of the fifth air groove and the inner wall of the first air groove together enclose the third adsorption cavity, and the inner wall of the sixth air groove and the inner wall of the second air groove together enclose the fourth adsorption cavity.

[0019] Optionally, both the first air groove and the second air groove are annular grooves and the centers of the first air groove and the second air groove coincide, both the third air groove and the fourth air groove are annular and the centers of the third air groove and the fourth air groove coincide, and both the fifth air groove and the sixth air groove are annular and the centers of the fifth air groove and the sixth air groove coincide.

[0020] Optionally, the support surface is further provided with a first isolation platform, which is located between the first air groove and the second air groove. The first mounting surface of the first carrier is provided with a second isolation platform, and the second mounting surface of the second carrier is provided with a third isolation platform. When the first carrier is mounted on the support seat, the second isolation platform abuts against the first isolation platform. When the second carrier is mounted on the support seat, the third isolation platform abuts against the first isolation platform.

[0021] Optionally, the support seat is provided with an assembly reference portion, the first carrier is provided with a first positioning portion, and the second carrier is provided with a second positioning portion;

[0022] When the first carrier is mounted on the support seat, the assembly reference portion is aligned with the first positioning portion;

[0023] When the second carrier is mounted on the support seat, the assembly reference portion is aligned with the second positioning portion.

[0024] Optionally, the support seat is provided with a distance sensor, the first carrier is provided with a first sensing portion, and the second carrier is provided with a second sensing portion;

[0025] When the first carrier is mounted on the support seat, there is a first distance between the distance sensor and the first sensing portion;

[0026] When the second carrier is mounted on the support seat, there is a second distance between the distance sensor and the second sensing portion;

[0027] The first distance is less than or greater than the second distance.

[0028] Optionally, an induction surface is provided at the first sensing portion. When the first carrier is mounted on the support seat, the first distance is the distance between the distance sensor and the induction surface;

[0029] An induction hole is provided at the second sensing portion. When the second carrier is mounted on the support seat, the second distance is the distance between the distance sensor and the induction hole.

[0030] Optionally, the first carrier is provided with a first handle portion, and the second carrier is provided with a second handle portion.

[0031] Optionally, the first lifting handle is located at the edge of the first carrier and is provided with a first lifting groove, the second lifting handle is located at the edge of the second carrier and is provided with a second lifting groove, the edge of the support base is provided with an avoidance groove. When the first carrier is installed on the support base, the avoidance groove is located below the first lifting groove and communicates with the first lifting groove. When the second carrier is installed on the support base, the avoidance groove is located below the second lifting groove and communicates with the second lifting groove.

[0032] The beneficial effects of the present utility model are as follows: This adsorption device uses the first carrier and the second carrier to carry wafers. Among them, a ceramic part is installed on the first carrier to realize the adsorption and positioning of ultra-thin wafers of the Frame frame. A suction cup is installed on the second carrier to realize the adsorption and positioning of warped wafers or flat wafers. Thereby, the compatibility of the adsorption device with different types of wafers is improved. The adsorption device can adapt to different types of wafers. The first carrier and the second carrier are respectively installed on the support base by adsorption to achieve interchangeability, so that the first carrier and the second carrier can be quickly interchanged. This adsorption device has strong versatility, can adsorb different types of wafers, and is convenient for the wafers to undergo the cleaning process. Description of the Drawings

[0033] The following further elaborates on the present utility model in detail according to the drawings and embodiments.

[0034] Figure 1 It is a structural schematic diagram of the adsorption device. In the figure, the first carrier is installed on the support base;

[0035] Figure 2 It is a structural schematic diagram of the adsorption device. In the figure, the second carrier is installed on the support base;

[0036] Figure 3 It is a structural schematic diagram of the support base;

[0037] Figure 4 It is a structural schematic diagram of the top view of the first carrier;

[0038] Figure 5 It is a structural schematic diagram of the bottom view of the first carrier;

[0039] Figure 6 It is a structural schematic diagram of the top view of the second carrier. In the figure, a partial cross-section of the second carrier is shown;

[0040] Figure 7 It is a structural schematic diagram of the bottom view of the second carrier.

[0041] Explanation of the reference numerals in the drawings. In the figure:

[0042] 11, support base; 12, first carrier; 13, second carrier; 14, ceramic part; 15, suction cup; 16, distance sensor;

[0043] 110. First air extraction channel; 111. Second air extraction channel; 112. Support surface; 113. First air groove; 114. Second air groove; 115. First isolation table; 116. Avoidance groove; 117. Assembly reference part

[0044] 120. First communication channel; 121. First adsorption surface; 122. First installation surface; 123. Third air groove; 124. Fourth air groove; 125. Second isolation table; 126. First positioning part; 127. First induction part; 128. First handle part; 129. First lifting groove

[0045] 130. Second communication channel; 131. Second adsorption surface; 132. Second installation surface; 133. Fifth air groove; 134. Sixth air groove; 135. Third isolation table; 136. Second positioning part; 137. Second induction part; 138. Second handle part; 139. Second lifting groove Detailed implementation mode

[0046] To make the technical problems solved by the present utility model, the technical solutions adopted and the achieved technical effects clearer, the technical solutions of the embodiments of the present utility model will be further described in detail below with reference to the drawings. Obviously, the described embodiments are only part of the embodiments of the present utility model, rather than all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present utility model

[0047] In the description of the present utility model, unless otherwise clearly defined and limited, terms such as "connected", "fixed", "connected", "communicated", "abutted", "clamped", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations

[0048] In the present utility model, unless otherwise clearly specified and defined, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on the top of" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "under the bottom of" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the horizontal height of the first feature is lower than that of the second feature.

[0049] In the description herein, it should be understood that the orientation or positional relationships such as "above", "below", "left", "right", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of description and simplifying the operations, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meanings.

[0050] In the description of this specification, the description referring to terms such as "an embodiment", "example", etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example.

[0051] In addition, it should be understood that although this specification is described according to the embodiments, not every embodiment only contains an independent technical solution. This narrative manner of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0052] Unless otherwise specifically stated or defined, the term "and / or" used in the present utility model includes any and all combinations of one or more of the related listed items.

[0053] For the convenience of narration, unless otherwise stated, the up and down mentioned hereinafter is Figure 1 consistent with the up and down directions of itself.

[0054] In the existing semiconductor technology field, there are various types of wafers. The relatively common wafers generally include Frame-frame ultra-thin wafers, flat wafers, and warped wafers. Flat wafers and warped wafers are both single wafers. Among them, a flat wafer is a wafer in a plane, and a warped wafer is a wafer with a certain curved surface arc on its surface. A Frame-frame ultra-thin wafer is a wafer with a frame. The central part of the Farme-frame ultra-thin wafer is the wafer, and the outer ring is the Farme frame, that is, the outer ring is an iron ring, and the iron ring and the wafer are connected by a thin film.

[0055] As Figures 1 to 7 shown, this embodiment provides an adsorption device, including a support base 11, a first carrier 12, and a second carrier 13. The first carrier 12 is used to be installed on the upper surface of the support base 11. A ceramic part 14 is installed on the first carrier 12. The ceramic part 14 is installed on the upper surface of the first carrier 12. The ceramic part 14 has a plurality of first suction holes arranged at intervals. The ceramic part 14 is used to adsorb the Frame-frame ultra-thin wafer. The ceramic part 14 is also called microporous ceramics. The first suction holes are a large number of open or closed micron-level air holes on its surface and inside. When adsorbing the Frame-frame ultra-thin wafer, the adsorption force is uniform and will not damage the wafer structure. The second carrier 13 is used to be installed on the support base 11. A plurality of suction cups 15 are arranged at intervals on the second carrier 13. The plurality of suction cups 15 are arranged at intervals on the upper surface of the second carrier 13. Each suction cup 15 has a second suction hole. The rubber material of the suction cup 15 can completely fit and adsorb the warped wafer. The plurality of suction cups 15 use the negative pressure generated by the second suction holes to adsorb the warped wafer or the flat wafer.

[0056] The support base 11 is provided with a first air extraction channel 110 and a second air extraction channel 111. The first air extraction channel 110 and the second air extraction channel 111 are arranged at intervals and both penetrate the support base 11 from top to bottom. The first carrier 12 is provided with a first communication channel 120 communicating with each first suction hole of the ceramic part 14. The first communication channel 120 penetrates the first carrier 12 from top to bottom. The second carrier 13 is provided with a second communication channel 130 communicating with the second suction holes of the suction cups 15. The second communication channel 130 penetrates the second carrier 13 from top to bottom. There are a plurality of second communication channels 130 and they correspond to the plurality of suction cups 15 one by one.

[0057] The first air extraction channel 110 and the second air extraction channel 111 are both used to communicate with an external air pump so that the first air extraction channel 110 and the second air extraction channel 111 form a negative pressure. When the first carrier 12 is installed on the support base 11, the second air extraction channel 111 adsorbs the first carrier 12 by forming a negative pressure, and the first air extraction channel 110 communicates with the first communication channel 120. The second air extraction channel 111 adsorbs the first carrier 12 by forming a negative pressure to realize the installation of the first carrier 12 on the support base 11. The first air extraction channel 110, the first communication channel 120, and the multiple first material suction holes of the ceramic part 14 are sequentially communicated. When the first air extraction channel 110 forms a negative pressure, the multiple first material suction holes of the ceramic part 14 also generate a negative pressure and adsorb the Frame frame ultra-thin wafer, realizing the adsorption and positioning of the Frame frame ultra-thin wafer. Similarly, when the second carrier 13 is installed on the support base 11, the second air extraction channel 111 adsorbs the second carrier 13 by forming a negative pressure, and the first air extraction channel 110 communicates with the second communication channel 130. The second air extraction channel 111 adsorbs the second carrier 13 by forming a negative pressure to realize the installation of the second carrier 13 on the support base 11. The first air extraction channel 110, the second communication channel 130, and the second material suction holes of each suction cup 15 are sequentially communicated. When the first air extraction channel 110 forms a negative pressure, the second material suction holes of each suction cup 15 also generate a negative pressure and adsorb the warped wafer and the flat wafer, realizing the adsorption and positioning of the warped wafer and the flat wafer. Therefore, this adsorption device can realize the adsorption of different types of wafers, especially effectively adsorbing wafers such as Frame frame ultra-thin wafers, flat wafers, and warped wafers of different sizes.

[0058] This adsorption device is mainly used for debonding. During operation, it cooperates with the laser processing stage part of the fully automatic laser debonding - laser (Laser) and separation (De-bond) equipment to achieve debonding. This adsorption device can install the first carrier 12 or the second carrier 13 on the support base 11 according to the type of the wafer. The ceramic part 14 can be applied to the ultra-thin wafer of a 12-inch Frame. Multiple suction cups 15 are mainly used to adsorb the warped wafer or flat wafer with a diameter of 8 inches. When debonding and other processes need to be carried out on the ultra-thin wafer of the Frame, the first carrier 12 is installed on the support base 11, and the ultra-thin wafer of the Frame is placed on the ceramic part 14 on the first carrier 12. The external air pump is started to make the support base 11 adsorb the first carrier 12, and the ceramic part 14 adsorbs the ultra-thin wafer of the Frame. When debonding and other processes need to be carried out on the flat wafer or warped wafer, the second carrier 13 is installed on the support base 11, and the flat wafer or warped wafer is placed on the suction cups 15 on the second carrier 13. The external air pump is started to make the support base 11 adsorb the second carrier 13, and the suction cups 15 adsorb the flat wafer or warped wafer. This adsorption device is mainly used for cleaning and removing the bonding glue on the wafer surface after debonding. On the premise of ensuring that the wafer is not damaged, it can effectively adsorb ultra-thin wafers of different sizes in the Frame, flat wafers and warped wafers, improving the compatibility and versatility of the adsorption device for different types of wafers, and the adsorption device can be adapted to different types of wafers.

[0059] In addition, in this embodiment, by providing the first air extraction channel 110 and the second air extraction channel 111 in the support base 11, the first communication channel 120 in the first carrier 12, and the second communication channel 130 in the second carrier 13, an air path can be formed when the first carrier 12 and the second carrier 13 are installed on the support base 11. Compared with the existing air path formed by connecting pipe fittings outside the adsorption device, the adsorption device in this embodiment reduces the external pipelines. The air path required for the adsorption device to generate vacuum is hidden inside the adsorption device, simplifying the overall structure of the adsorption device. Only two external air paths need to be connected to the air pump, greatly simplifying the overall structure of the adsorption device and making the adsorption device occupy less space. The first carrier 12 and the second carrier 13 are installed by adsorption, with less surface wear and convenient assembly.

[0060] In one embodiment, the first carrier 12 and the second carrier 13 are alternatively installed on the support base 11, without setting two carrier installation areas on the support base 11, reducing the overall volume of the adsorption device. Optionally, the first air extraction channel 110 and the second air extraction channel 111 are not connected, and negative pressure is formed by different air pumps.

[0061] In one embodiment, the support base 11 has a support surface 112, and the support surface 112 is the upper surface of the support base 11. The first carrier 12 has a first adsorption surface 121 and a first mounting surface 122 for connecting with the support surface 112. The first adsorption surface 121 and the first mounting surface 122 face away from each other. The first adsorption surface 121 faces upward, and the first mounting surface 122 faces downward. The second carrier 13 has a second adsorption surface 131 and a second mounting surface 132 for connecting with the support surface 112. The second adsorption surface 131 and the second mounting surface 132 face away from each other. The second adsorption surface 131 faces upward, and the second mounting surface 132 faces downward. The ceramic part 14 is arranged on the first adsorption surface 121, and the suction cup 15 is arranged on the second adsorption surface 131.

[0062] When the first carrier 12 is installed on the support base 11, the first mounting surface 122 abuts against the support surface 112 and they jointly enclose a first adsorption cavity and a second adsorption cavity. The first adsorption cavity and the second adsorption cavity are independent of each other and not connected. The lower end of the first communication channel 120 is located in the first adsorption cavity. The upper end of the first air extraction channel 110 is communicated with the first communication channel 120 through the first adsorption cavity. The second air extraction channel 111 is communicated with the second adsorption cavity. When an external air pump is connected, a negative pressure is formed in the second air extraction channel 111 and the second adsorption cavity, so that the support base 11 can adsorb the first carrier 12.

[0063] Similarly, when the second carrier 13 is installed on the support base 11, the second mounting surface 132 abuts against the support surface 112 and they jointly enclose a third adsorption cavity and a fourth adsorption cavity. The third adsorption cavity and the fourth adsorption cavity are independent of each other and not connected. The lower end of the second communication channel 130 is located in the third adsorption cavity. The upper end of the first air extraction channel 110 is communicated with the second communication channel 130 through the third adsorption cavity. The second air extraction channel 111 is communicated with the fourth adsorption cavity. When an external air pump is connected, a negative pressure is formed in the second air extraction channel 111 and the third adsorption cavity, so that the support base 11 can adsorb the second carrier 13.

[0064] Optionally, a first air groove 113 and a second air groove 114 are arranged at intervals on the support surface 112. The first mounting surface 122 of the first carrier 12 is provided with a third air groove 123 and a fourth air groove 124 arranged at intervals. The second mounting surface 132 of the second carrier 13 is provided with a fifth air groove 133 and a sixth air groove 134 arranged at intervals.

[0065] When the first carrier 12 is installed on the support base 11, the inner wall of the third air groove 123 and the inner wall of the first air groove 113 jointly enclose the first adsorption cavity, and the inner wall of the fourth air groove 124 and the inner wall of the second air groove 114 jointly enclose the second adsorption cavity.

[0066] When the second carrier 13 is installed on the support base 11, the inner walls of the fifth air groove 133 and the first air groove 113 jointly enclose a third adsorption cavity, and the inner walls of the sixth air groove 134 and the second air groove 114 jointly enclose a fourth adsorption cavity. Further, both the first air groove 113 and the second air groove 114 are annular grooves, and the centers of the first air groove 113 and the second air groove 114 coincide, for buffering. The first air groove 113 is located within the area enclosed by the second air groove 114. Both the third air groove 123 and the fourth air groove 124 are annular grooves, and the centers of the third air groove 123 and the fourth air groove 124 coincide. The third air groove 123 is located within the area enclosed by the fourth air groove 124. Both the fifth air groove 133 and the sixth air groove 134 are annular grooves, and the centers of the fifth air groove 133 and the sixth air groove 134 coincide. The fifth air groove 133 is located within the area enclosed by the sixth air groove 134. The first air groove 113, the second air groove 114, the third air groove 123, the fourth air groove 124, the fifth air groove 133, and the sixth air groove 134 being annular grooves can increase the adsorption area.

[0067] Further, the support surface 112 is also provided with a first isolation platform 115. The first isolation platform 115 is an annular boss. The first isolation platform 115 is located between the first air groove 113 and the second air groove 114. The first isolation platform 115 separates the first air groove 113 and the second air groove 114. The first mounting surface 122 of the first carrier 12 is provided with a second isolation platform 125, and the second mounting surface 132 of the second carrier 13 is provided with a third isolation platform 135. When the first carrier 12 is installed on the support base 11, the second isolation platform 125 abuts against the first isolation platform 115 to achieve the separation of the first adsorption cavity and the second adsorption cavity, improve the sealing performance between the first adsorption cavity and the second adsorption cavity, ensure the adsorption force between the support base 11 and the first carrier 12 and the adsorption force of the ceramic part 14 on the wafer, so that the adsorption of the wafer and the adsorption of the first carrier 12 do not interfere with each other. When the second carrier 13 is installed on the support base 11, the third isolation platform 135 abuts against the first isolation platform 115 to achieve the separation of the third adsorption cavity and the fourth adsorption cavity, improve the sealing performance between the third adsorption cavity and the fourth adsorption cavity, ensure the adsorption force between the support base 11 and the first carrier 12 and the adsorption force of the chuck 15 on the wafer, so that the adsorption of the wafer and the adsorption of the second carrier 13 do not interfere with each other.

[0068] Optionally, the support surface 112 is also provided with a fourth isolation platform and a fifth isolation platform. Both the fourth isolation platform and the fifth isolation platform are annular protrusions. The first air groove 113, the second air groove 114, and the first isolation platform 115 are all located between the fourth isolation platform and the fifth isolation platform. The fourth isolation platform is located within the area enclosed by the fifth isolation platform. A first air groove 113 is formed between the fourth isolation platform and the first isolation platform 115, and a second air groove 114 is formed between the fifth isolation platform and the first isolation platform 115.

[0069] The first mounting surface 122 of the first carrier 12 is provided with a sixth isolation platform and a seventh isolation platform. Both the sixth isolation platform and the seventh isolation platform are annular protrusions. A third air groove 123 is formed between the sixth isolation platform and the second isolation platform 125, and a fourth air groove 124 is formed between the seventh isolation platform and the second isolation platform 125. When the first carrier 12 is mounted on the support base 11, the fourth isolation platform abuts against the sixth isolation platform, and the fifth isolation platform abuts against the seventh isolation platform. In this way, the first adsorption cavity and the second adsorption cavity are sealed in the horizontal direction, further improving the sealing performance of the first adsorption cavity and the second adsorption cavity.

[0070] Similarly, the first mounting surface 132 of the second carrier 13 is provided with an eighth isolation platform and a ninth isolation platform. Both the eighth isolation platform and the ninth isolation platform are annular protrusions. A fifth air groove 133 is formed between the eighth isolation platform and the third isolation platform 135, and a sixth air groove 134 is formed between the ninth isolation platform and the third isolation platform 135. When the second carrier 13 is mounted on the support base 11, the fourth isolation platform abuts against the eighth isolation platform, and the fifth isolation platform abuts against the ninth isolation platform. In this way, the third adsorption cavity and the fourth adsorption cavity are sealed in the horizontal direction, further improving the sealing performance of the third adsorption cavity and the fourth adsorption cavity.

[0071] In one embodiment, the support base 11 is provided with an assembly reference portion 117. There is at least one assembly reference portion 117 and it is located at the edge of the support base 11. The first carrier 12 is provided with a first positioning portion 126. There is at least one first positioning portion 126 and it is located at the edge of the first carrier 12. The second carrier 13 is provided with a second positioning portion 136. There is at least one second positioning portion 136 and it is located at the edge of the second carrier 13. When the first carrier 12 is mounted on the support base 11, the assembly reference portion 117 is aligned with the first positioning portion 126. When the second carrier 13 is mounted on the support base 11, the assembly reference portion 117 is aligned with the second positioning portion 136. The assembly reference portion 117 can be an identification such as a reference scale line, a reference groove, a reference protrusion, etc. The first positioning portion 126 and the second positioning portion 136 can be identifications such as alignment scale lines, alignment grooves, alignment protrusions, etc. When installing the first carrier 12 or the second carrier 13, the first positioning portion 126 of the first carrier 12 or the second positioning portion 136 of the second carrier 13 is aligned with the assembly reference portion 117 of the support base 11 in the vertical direction to assist in positioning the first carrier 12 or the second carrier 13 during installation, facilitating the installation of the first carrier 12 or the second carrier 13.

[0072] Optionally, the support base 11 is provided with a distance sensor 16, the first carrier 12 is provided with a first sensing portion 127, and the second carrier 13 is provided with a second sensing portion 137.

[0073] When the first carrier 12 is installed on the support base 11, there is a first distance between the distance sensor 16 and the first sensing portion 127. When the first carrier 12 is installed on the support base 11, the first carrier 12 is positioned and fitted with the support base 11 through a positioning component. After each installation of the first carrier 12, the measured first distance is the same each time.

[0074] When the second carrier 13 is installed on the support base 11, there is a second distance between the distance sensor 16 and the second sensing portion 137. When the second carrier 13 is installed on the support base 11, the first carrier 13 is positioned and fitted with the support base 11 through a positioning component. After each installation of the second carrier 13, the measured second distance is the same each time.

[0075] The first distance is less than or greater than the second distance. The distance sensor 16 can be used to identify whether the first carrier 12 or the second carrier 13 is installed on the support base 11. The first carrier 12 and the second carrier 13 are respectively used for adsorbing different types of wafers. Before the wafer enters the processing area, it will be detected whether the first carrier 12 or the second carrier 13 meets the current requirements. Only after passing the detection will the subsequent processing procedures such as placing the wafer be carried out. If it is found that the first carrier 12 or the second carrier 13 is installed incorrectly, the first carrier 12 or the second carrier 13 can be replaced by a manipulator or manually.

[0076] Furthermore, an induction surface is provided at the first sensing portion 127. The first sensing portion 127 is located on the first mounting surface 122, and the induction surface is a part of the first mounting surface 122. There is a first distance between the induction surface and the distance sensor 16. The second sensing portion 137 is located on the second mounting surface 132, and an induction hole is provided at the second sensing portion 137. The induction hole is opened on the second mounting surface 132. There is a second distance between the distance sensor 16 and the bottom wall of the induction hole. In this way, the distance between the first sensing portion 127 and the distance sensor 16 is less than or greater than the distance between the second sensing portion 137 and the distance sensor 16. By using the difference in distance, the first carrier 12 and the second carrier 13 can be identified.

[0077] Optionally, a plurality of pin holes are provided on the support base 11, the first carrier 12, and the second carrier 13. When the first carrier 12 and the second carrier 13 are installed on the support base 11, positioning is achieved by using a positioning component such as a pin passing through the pin holes.

[0078] In one embodiment, the first carrier 12 is provided with a first handle portion 128, and the second carrier 13 is provided with a second handle portion 138. The first handle portion 128 and the second handle portion 138 facilitate lifting the first carrier 12 and the second carrier 13, and facilitate installing the first carrier 12 and the second carrier 13 on the support base 11 or removing the first carrier 12 and the second carrier 13 from the support base 11. The first handle portion 128 and the second handle portion 138 can be grooves or pull rings.

[0079] Optionally, the first lifting handle portion 128 is located at the edge of the first carrier 12 and is provided with a first lifting groove 129. The first lifting groove 129 is opened at the edge of the first mounting surface 122. There are multiple first lifting grooves 129 which are arranged at intervals along the edge of the first carrier 12. The second lifting handle portion 138 is located at the edge of the second carrier 13 and is provided with a second lifting groove 139. The second lifting groove 139 is opened at the edge of the second mounting surface 132. There are multiple second lifting grooves 139 which are arranged at intervals along the edge of the second carrier 13. The edge of the support base 11 is provided with an avoidance groove 116. The avoidance groove 116 is opened at the edge of the support surface 112 of the support base 11. The multiple avoidance grooves 116 correspond one-to-one to the multiple first lifting grooves 129 or to the multiple second lifting grooves 139. When the first carrier 12 is mounted on the support base 11, the avoidance groove 116 is located below the first lifting groove 129 and communicates with the first lifting groove 129. When the second carrier 13 is mounted on the support base 11, the avoidance groove 116 is located below the second lifting groove 139 and communicates with the second lifting groove 139. The avoidance groove 116 facilitates the insertion of a finger or a manipulator, and facilitates lifting the first carrier 12 and the second carrier 13.

[0080] The technical principle of the present utility model has been described above in conjunction with specific embodiments. These descriptions are only for explaining the principle of the present utility model and cannot be construed in any way as a limitation on the protection scope of the present utility model. Based on the explanations herein, those skilled in the art can readily conceive of other specific embodiments of the present utility model without creative efforts, and these embodiments will fall within the protection scope of the present utility model.

Claims

1. An adsorption device, characterized in that: include: Support seat (11); A first carrier (12) is used to be mounted on the support seat (11); the first carrier (12) is mounted with a ceramic component (14); the ceramic component (14) has a plurality of first material suction holes arranged at intervals; as well as A second carrier (13) is used for being mounted on the support seat (11); the second carrier (13) is provided with a plurality of suction cups (15) arranged at intervals; each of the suction cups (15) has a second material suction hole; The support seat (11) is provided with a first air extraction channel (110) and a second air extraction channel (111); the first carrier (12) is provided with a first communication channel (120) connected with each of the first suction holes of the ceramic member (14); the second carrier (13) is provided with a second communication channel (130) connected with each of the second suction holes of the suction cups (15); When the first carrier (12) is mounted on the support seat (11), the second air suction channel (111) is used to form a negative pressure to adsorb the first carrier (12), and the first air suction channel (110) is connected to the first connecting channel (120); when the second carrier (13) is mounted on the support seat (11), the second air suction channel (111) is used to form a negative pressure to adsorb the second carrier (13), and the first air suction channel (110) is connected to the second connecting channel (130).

2. The adsorption device according to claim 1, characterized in that: The support seat (11) has a support surface (112), the first carrier (12) has a first adsorption surface (121) and a first mounting surface (122), the second carrier (13) has a second adsorption surface (131) and a second mounting surface (132), the ceramic component (14) is arranged on the first adsorption surface (121), and the suction cup (15) is arranged on the second adsorption surface (131); When the first carrier (12) is mounted on the support seat (11), the first mounting surface (122) abuts against the support surface (112) and together encloses a first adsorption chamber and a second adsorption chamber; the first air extraction channel (110) is connected to the first connecting channel (120) through the first adsorption chamber, and the second air extraction channel (111) is connected to the second adsorption chamber; When the second carrier (13) is installed on the support seat (11), the second installation surface (132) abuts against the support surface (112) and together encloses a third adsorption chamber and a fourth adsorption chamber; the first air extraction channel (110) is connected to the second connecting channel (130) through the third adsorption chamber, and the second air extraction channel (111) is connected to the fourth adsorption chamber.

3. The adsorption device according to claim 2, characterized in that: The support surface (112) is provided with a first air groove (113) and a second air groove (114) arranged at intervals, the first mounting surface (122) of the first carrier (12) is provided with a third air groove (123) and a fourth air groove (124) arranged at intervals, and the second mounting surface (132) of the second carrier (13) is provided with a fifth air groove (133) and a sixth air groove (134) arranged at intervals; When the first carrier (12) is installed on the support seat (11), the inner wall of the third air groove (123) and the inner wall of the first air groove (113) are together enclosed to form the first adsorption chamber, and the inner wall of the fourth air groove (124) and the inner wall of the second air groove (114) are together enclosed to form the second adsorption chamber; When the second carrier (13) is installed on the support seat (11), the inner wall of the fifth air groove (133) and the inner wall of the first air groove (113) together enclose the third adsorption chamber, and the inner wall of the sixth air groove (134) and the inner wall of the second air groove (114) together enclose the fourth adsorption chamber.

4. The adsorption device according to claim 3, characterized in that: The first air groove (113) and the second air groove (114) are both annular grooves, and the center of the first air groove (113) coincides with the center of the second air groove (114); the third air groove (123) and the fourth air groove (124) are both annular, and the center of the third air groove (123) coincides with the center of the fourth air groove (124); the fifth air groove (133) and the sixth air groove (134) are both annular, and the center of the fifth air groove (133) coincides with the center of the sixth air groove (134).

5. The adsorption device according to claim 3, characterized in that: The support surface (112) is also provided with a first isolation platform (115), and the first isolation platform (115) is located between the first air groove (113) and the second air groove (114); the first mounting surface (122) of the first carrier (12) is provided with a second isolation platform (125), and the second mounting surface (132) of the second carrier (13) is provided with a third isolation platform (135); when the first carrier (12) is installed on the support seat (11), the second isolation platform (125) abuts against the first isolation platform (115); when the second carrier (13) is installed on the support seat (11), the third isolation platform (135) abuts against the first isolation platform (115).

6. The adsorption device according to any one of claims 1 to 5, characterized in that: The support seat (11) is provided with an assembly reference portion (117), the first carrier seat (12) is provided with a first positioning portion (126), and the second carrier seat (13) is provided with a second positioning portion (136); When the first carrier (12) is installed on the support seat (11), the assembly reference portion (117) is aligned with the first positioning portion (126); When the second carrier (13) is installed on the support seat (11), the assembly reference portion (117) is aligned with the second positioning portion (136).

7. The adsorption device according to any one of claims 1 to 5, characterized in that: The support seat (11) is provided with a distance sensor (16), the first carrier seat (12) is provided with a first sensing portion (127), and the second carrier seat (13) is provided with a second sensing portion (137); When the first carrier (12) is installed on the support base (11), a first distance exists between the distance sensor (16) and the first sensing part (127); When the second carrier (13) is installed on the support base (11), a second distance exists between the distance sensor (16) and the second sensing portion (137); The first distance is smaller than or larger than the second distance.

8. The adsorption device according to claim 7, characterized in that: A sensing surface is provided at the first sensing portion (127); when the first carrier (12) is mounted on the support seat (11), the first distance is the distance between the distance sensor (16) and the sensing surface; A sensing hole is provided at the second sensing portion (137); when the second carrier (13) is mounted on the support seat (11), the second distance is the distance between the distance sensor (16) and the sensing hole.

9. The adsorption device according to any one of claims 1 to 5, characterized in that: The first carrier (12) is provided with a first handle portion (128), and the second carrier (13) is provided with a second handle portion (138).

10. The adsorption device according to claim 9, characterized in that: The first handle portion (128) is located at the edge of the first carrier (12) and is provided with a first pulling groove (129); the second handle portion (138) is located at the edge of the second carrier (13) and is provided with a second pulling groove (139); the edge of the support seat (11) is provided with an avoidance groove (116); when the first carrier (12) is installed on the support seat (11), the avoidance groove (116) is located below the first pulling groove (129) and is connected to the first pulling groove (129); when the second carrier (13) is installed on the support seat (11), the avoidance groove (116) is located below the second pulling groove (139) and is connected to the second pulling groove (139).

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