Laser packaging shell and laser

Abstract

The utility model discloses a laser packaging shell and a laser. The laser packaging shell comprises a tube seat, a tube cap, a tube tongue and a tube pin, the pipe seat comprises a base, a containing cavity is formed between the pipe cap and the base, and an inserting hole is formed in the base; the pin comprises a solid cylinder and a cylindrical sleeve sleeved outside the solid cylinder, the solid cylinder is hermetically inserted into the insertion hole, the cylindrical sleeve and the tube tongue are positioned on the same side of the base and are positioned in the accommodating cavity, and the other end of the solid cylinder protrudes out of the surface, back on to the tube tongue, of the base; wherein the solid cylinder is a kovar alloy part, the outer diameter of the solid cylinder ranges from 0.4 mm to 1 mm, the cylindrical sleeve is an oxygen-free copper part, and the inner diameter of the cylindrical sleeve is 0.001 mm to 0.01 mm smaller than the outer diameter of the solid cylinder. Resistance introduced by the pins can be reduced, joule heat generated when the laser works is further reduced, deformation and stress caused by thermal mismatch of materials are reduced, and the light output power of the laser is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of lasers, and particularly relates to a laser packaging shell and a laser. Background Art

[0002] For high-power semiconductor laser diodes, there are mainly two sources of heat: one is the heat generated by the semiconductor laser chip itself. When the laser works, part of the input electrical energy is converted into light output in the active region, and the other electrical energy is converted into heat. On the one hand, this leads to a decrease in the photoelectric conversion efficiency of the laser, thereby reducing the output power. On the other hand, it causes strain or deformation of each component due to the difference in the coefficient of thermal expansion between materials, thereby damaging the optical path or the packaging structure; the other is the joule heat generated by the packaging components. If the resistance of the packaging components can be reduced and the joule heat generated by the packaging components during operation can be reduced, it will have significant benefits for improving the performance and lifespan of the laser.

[0003] In the existing TO packaging of high-power semiconductor lasers, the pins and the base body of the socket are generally welded together by soft glass. For cost and processing sealing considerations, the pins are generally made of kovar alloy. The resistivity of kovar alloy is relatively large, and the smaller the diameter and the longer the length, the greater the resistance. To reduce the resistance of the pins, the diameter of the pins can be increased. However, to ensure the airtightness of the packaging, the diameter of the pins should not be increased too much to ensure that the length of the sealed weld (the length of the sealed weld is also the circumference of the pin) is small. Usually, the diameter of the pins is between 0.25 and 1 mm, and the general diameter of the laser TO packaging does not exceed 0.6 mm. Although the existing pins have been plated with a thin layer of gold (the thickness of the thin gold is 0.1 μm to 0.3 μm) on the surface to reduce the resistance, the pins still introduce a resistance of 0.1 ohm to 0.5 ohm to the TO packaging, which is not conducive to reducing the joule heat generated by the packaging components during operation.

[0004] In view of the above deficiencies, it is necessary to design a laser packaging shell and a laser. Summary of the Utility Model

[0005] The purpose of the utility model is to reduce the resistance introduced by the pins, thereby providing a laser packaging shell and a laser.

[0006] To solve the above technical problems, the technical solution of the utility model is as follows:

[0007] A laser packaging shell includes a socket, a cap, a tongue, and pins. The socket includes a base, and an accommodation cavity is formed between the cap and the base. A plug hole is provided on the base.

[0008] The pin includes a solid cylinder and a cylindrical sleeve sleeved outside the solid cylinder. The solid cylinder is sealingly inserted into the insertion hole. The cylindrical sleeve and the tongue are on the same side of the base and are both located in the accommodation cavity. The other end of the solid cylinder protrudes from the surface of the base facing away from the tongue. Among them, the solid cylinder is a kovar alloy part with an outer diameter of 0.25 mm to 1 mm, the cylindrical sleeve is an oxygen-free copper part, and the inner diameter of the cylindrical sleeve is 0.001 mm to 0.01 mm smaller than the outer diameter of the solid cylinder.

[0009] Further, the inner wall of the cylindrical sleeve is plated with a nickel layer and a gold layer, and the nickel layer is located between the inner wall and the gold layer.

[0010] Further, the thickness of the nickel layer is 0.1 μm to 1 μm, and the thickness of the gold layer is 0.07 μm to 0.5 μm.

[0011] Further, the wall thickness of the cylindrical sleeve is 0.1 mm to 0.5 mm.

[0012] Further, the top end of the cylindrical sleeve does not exceed the top end of the tongue.

[0013] Further, the solid cylinder is hermetically welded to the insertion hole by using soft glass.

[0014] Further, the tube cap includes a light-transmitting member and a cap body. Both ends of the cap body are open. One end is hermetically connected to the base, and the other end is sealed by the light-transmitting member.

[0015] Further, the light-transmitting member is located inside the cap body and is welded to the cap body by using soft glass.

[0016] Further, the light-transmitting member includes a quartz glass sheet and an optical antireflection film plated on the inner surface and / or the outer surface of the quartz glass sheet. The inner surface is the surface of the quartz glass sheet facing the base, and the outer surface is the surface opposite to the inner surface.

[0017] The technical solution of the present utility model has the following advantages:

[0018] 1. The laser packaging housing provided by the present utility model, the pin includes a solid cylinder and a cylindrical sleeve sleeved outside the solid cylinder. The solid cylinder is hermetically inserted into the insertion hole. The cylindrical sleeve and the tongue are on the same side of the base and are both located in the accommodation cavity. The other end of the solid cylinder protrudes from the surface of the base facing away from the tongue. Among them, the solid cylinder is a kovar alloy part with an outer diameter of 0.4 mm to 1 mm, and the cylindrical sleeve is an oxygen-free copper part. The inner diameter of the cylindrical sleeve is 0.001 mm to 0.01 mm smaller than the outer diameter of the solid cylinder. In this way, without excessive increase in the welding circumference of the pin and the base, the resistance introduced by the pin can be reduced, thereby reducing the Joule heat during the operation of the laser, reducing the deformation and stress caused by the thermal mismatch of the material, and ultimately improving the optical output power of the laser.

[0019] 2. The laser packaging housing provided by the present utility model, the inner wall of the cylindrical sleeve is plated with a nickel layer and a gold layer, and the nickel layer is located between the inner wall and the gold layer. In this way, the resistance introduced by the pin can be further reduced, thereby further reducing the Joule heat during the operation of the packaging component, reducing the deformation and stress caused by the thermal mismatch of the material, and ultimately improving the optical output power of the laser.

[0020] 3. The laser packaging housing provided by the present utility model, the light-transmitting member includes a quartz glass sheet and an optical antireflection film plated on the inner surface and / or the outer surface of the quartz glass sheet. In this way, the light transmittance can be improved.

[0021] A laser includes the aforementioned laser packaging housing, as well as a heat sink, a laser chip, and a lead wire, all of which are located in the accommodation cavity of the packaging housing. The heat sink is welded to the tongue of the packaging housing. The laser chip includes a first thickened electrode and a second thickened electrode. The first thickened electrode is connected to the heat sink, and the second thickened electrode is connected to the cylindrical sleeve of the packaging housing through the lead wire.

[0022] The technical solution of the present utility model has the following advantages:

[0023] The laser provided by the present utility model has all the advantages of the aforementioned laser packaging housing. Description of the Drawings

[0024] In order to more clearly illustrate the specific embodiments of the present utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0025] Figure 1Isometric schematic diagram of the laser in the embodiment of the present utility model;

[0026] Figure 2 Isometric schematic diagram of the laser packaging housing in the embodiment of the present utility model after removing the tube cap;

[0027] Figure 3 Cross-sectional schematic diagram of the cooperation between the base and the pin in the embodiment of the present utility model.

[0028] Explanation of reference numerals:

[0029] 100, tube cap; 101, light-transmitting member; 103, cap body; 200, tube base; 201, base; 202, tube tongue; 203, pin; 203a, solid cylinder; 203b, cylindrical sleeve; 205, table portion; 300, laser chip; 400, lead; 500, heat sink; A, soft glass. Detailed implementation manners

[0030] Next, the technical solutions of the present utility model will be clearly and completely described in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present utility model, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0031] In the description of the present utility model, it should be noted that unless otherwise clearly defined and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0032] In addition, the technical features involved in different embodiments of the present utility model described below can be combined with each other as long as they do not conflict with each other.

[0033] Embodiment 1

[0034] As Figures 1 to 3 shown, this embodiment provides a laser packaging housing, specifically a high-power laser packaging housing. The laser packaging housing mainly includes a tube cap 100 and a tube base 200.

[0035] The cap 100 includes a light-transmitting member 101 and a cap body 103. The light-transmitting member 101 is located inside the cap body 103 and is welded to the cap body 103 using soft glass A. The light-transmitting member 101 includes a quartz glass sheet and an optical antireflection film plated on the inner surface (the inner surface is the surface of the quartz glass sheet facing the base 201) and / or the outer surface (the outer surface is the surface opposite to the inner surface) of the quartz glass sheet. The optical antireflection film can make the transmittance of the light emitted by the laser not less than 95%, or even not less than 98%. The material of the cap body 103 is one or more of oxygen-free copper, tungsten copper, alloy steel, and kovar alloy. Since the optical antireflection film is a prior art, it will not be elaborated here.

[0036] The cap 100 includes a light-transmitting member 101 and a cap body 103. Both ends of the cap body 103 are open. One end is hermetically connected to the base 201, and the other end is sealed by the light-transmitting member 101.

[0037] The base 200 includes a base 201, a tube tongue 202, and pin feet 203.

[0038] The base 201 provides support for the tube tongue 202 and the pin feet 203, is hermetically welded to the cap 100, and forms a receiving cavity between the base 201 and the cap 100. The base 201 is provided with a socket hole. The base 201 has a disc-shaped structure, and the material is one or more of oxygen-free copper, tungsten copper, alloy steel, and kovar alloy.

[0039] The tube tongue 202 is used to mount the heat sink 500 and the laser chip 300. Its material is generally one or more of oxygen-free copper, tungsten copper, alloy steel, and kovar alloy. The tube tongue 202 has a tabletop portion 205 for placing the heat sink 500 and the laser chip 300.

[0040] The pin feet 203 include a solid cylinder 203a and a cylindrical sleeve 203b sleeved outside one end of the solid cylinder 203a. The solid cylinder 203a is fixedly sealed and welded in the socket hole through soft glass A. The cylindrical sleeve 203b and the tube tongue 202 are on the same side of the base 201 and are both located in the receiving cavity. The other end of the solid cylinder 203a protrudes from the surface of the base 201 facing away from the tube tongue 202. The top end of the cylindrical sleeve 203b is welded to the lead 400 (the lead 400 is connected to the laser chip 300), and the bottom end of the solid cylinder 203a is connected to an external circuit. Thus, an electrical signal can be provided for the laser chip 300 in the package through the pin feet 203 and the lead 400.

[0041] Specifically, the outer diameter of the solid cylinder 203a is 0.4 mm to 1 mm, preferably 0.6 mm to 0.8 mm. The inner diameter of the cylindrical sleeve 203b is 0.001 mm to 0.01 mm smaller than the outer diameter of the solid cylinder 203a. The wall thickness of the cylindrical sleeve 203b is 0.1 mm to 0.5 mm. The solid cylinder 203a is a kovar alloy part. The cylindrical sleeve 203b is an oxygen-free copper part. Preferably, the inner wall of the cylindrical sleeve 203b is plated with a nickel layer with a thickness of 0.1 μm to 1 μm and a gold layer with a thickness of 0.07 μm to 0.5 μm. The nickel layer is located between the inner wall of the cylindrical sleeve 203b and the gold layer. And the top end of the cylindrical sleeve 203b does not exceed the top end of the tongue 202. The top end of the tongue 202 does not reach the top wall of the accommodation cavity.

[0042] For the laser packaging housing provided in this embodiment, the pin 203 includes a solid cylinder 203a and a cylindrical sleeve 203b sleeved outside the solid cylinder 203a. The solid cylinder 203a is sealed and inserted into the insertion hole. The cylindrical sleeve 203b and the tongue 202 are located on the same side of the base 201 and are both located in the accommodation cavity. The other end of the solid cylinder 203a protrudes from the surface of the base 201 facing away from the tongue 202; wherein, the solid cylinder 203a is a kovar alloy part with an outer diameter of 0.4 mm to 1 mm, the cylindrical sleeve 203b is an oxygen-free copper part, and the inner diameter of the cylindrical sleeve 203b is 0.001 mm to 0.01 mm smaller than the outer diameter of the solid cylinder 203a. In this way, without excessive increase in the welding circumference of the pin 203 and the base 201, the resistance introduced by the pin 203 can be reduced, and the reduction range is 15% to 25%. Furthermore, the joule heat during the operation of the laser can be reduced, the deformation and stress caused by the thermal mismatch of the materials can be reduced, and finally the optical output power of the laser can be improved.

[0043] The following introduces the processing process of the pin 203:

[0044] Prepare the cylindrical sleeve 203b;

[0045] Prepare the solid cylinder 203a, and the inner diameter of the cylindrical sleeve 203b is 0.001 mm to 0.01 mm smaller than the outer diameter of the solid cylinder 203a;

[0046] Heat the cylindrical sleeve 203b to 200 °C for preparation;

[0047] Fix the solid cylinder 203a with a fixture and press it into the cylindrical sleeve 203b;

[0048] Obtain the pin 203 after natural cooling.

[0049] Embodiment 2

[0050] As Figures 1 to 3As shown, the difference between Example 2 and Example 1 lies in that:

[0051] The material of the tongue 202 is oxygen-free copper. The tongue 202 is arranged on the upper surface of the base 201 and its material is oxygen-free copper. The material of the cap body 103 is kovar alloy. An optical antireflection film is deposited on one side surface of the light-transmitting member 101, and the light transmittance of this optical antireflection film for blue light with a wavelength of 435 nm to 480 nm is not less than 98%. The outer diameter of the solid cylinder 203a is 0.6 mm and its material is kovar alloy. The inner diameter of the cylindrical sleeve 203b is 0.596 mm (including 2 μm nickel plating and 0.2 μm gold plating), and the wall thickness is 0.404 mm (including 2 μm nickel plating and 0.2 μm gold plating), and its material is oxygen-free copper. The top end of the cylindrical sleeve 203b is flush with the top end of the tongue 202.

[0052] In this embodiment, the introduced resistance of the pin 203 can be reduced by 0.03 ohm to 0.1 ohm, and the reduction range is 15% to 25%.

[0053] The following table is a comparison table of the experimental data of the pin 203 in terms of resistance and airtightness. It should be noted that in this verification, the outer part of the pin material and the inner and outer parts of the cylindrical sleeve are both plated with 2 μm nickel and 0.2 μm gold, which plays a role in anti-oxidation treatment of the pin body and the oxygen-free copper cylinder and improving the resistance. In principle, the greater the thickness of the gold plating, the greater the reduction in resistance, and the corresponding cost will increase. The reduction value and reduction range of the introduced resistance of the pin 203 in this embodiment are verified and compared according to the nickel-gold plating thickness process described in this specification.

[0054]

[0055] Example 3

[0056] As Figures 1 to 3As shown in the figure, this embodiment provides a laser, which includes the laser packaging housing in Embodiment 1 or Embodiment 2, a laser chip 300, leads 400, and a heat sink 500. The material of the heat sink 500 is SiC, AlN, diamond, etc. A thermally conductive bonding material (such as indium solder, gold-tin solder, thermally conductive silver paste, etc.) is provided between the heat sink 500 and the tab 202 to eutectically bond one side of the heat sink 500 and the tab 202 together. The laser chip 300 is disposed on the side of the heat sink 500 facing away from the tab 202. A conductive bonding material (such as indium solder, gold-tin solder, etc.) is provided between the laser chip 300 and the heat sink 500. The laser chip 300 includes a first thickened electrode and a second thickened electrode, which are respectively located on both sides of the laser chip 300. The first thickened electrode is connected to the heat sink 500. The second thickened electrode is connected to the cylindrical sleeve 203b through the lead 400. Preferably, the heat sink 500 is a SiC heat sink 500 with a size of 1.6 mm × 0.8 mm × 0.3 mm, and the heat sink 500 and the tab 202 are eutectically welded through a 4-μm-thick gold-tin solder sheet. The heat sink 500 and the laser chip 300 are eutectically welded through a 4-μm-thick gold-tin solder sheet.

[0057] The laser provided in this embodiment has all the advantages of the aforementioned laser packaging housing.

[0058] Obviously, the above embodiments are only examples given for clear illustration and are not limitations on the implementation manners. For those of ordinary skill in the art, other different forms of changes or variations can be made based on the above description. It is not necessary and impossible to list all the implementation manners here. And the obvious changes or variations derived therefrom are still within the protection scope of the present invention.

Claims

1. A laser packaging shell, characterized in that: It comprises a tube seat (200), a tube cap (100), a tube tongue (202), and a tube pin (203); The tube seat (200) comprises a base (201), a receiving cavity is formed between the tube cap (100) and the base (201), and a plug-in hole is provided on the base (201); The tube pin (203) comprises a solid cylinder (203a) and a cylindrical sleeve (203b) sleeved on one end of the solid cylinder (203a); the solid cylinder (203a) is sealed and inserted into the insertion hole; the cylindrical sleeve (203b) and the tube tongue (202) are located on the same side of the base (201) and are both located in the accommodating cavity; the other end of the solid cylinder (203a) protrudes from the surface of the base (201) facing away from the tube tongue (202); wherein, The solid cylinder (203a) is a Kovar alloy part with an outer diameter of 0.4 mm to 1 mm, and the cylindrical sleeve (203b) is an oxygen-free copper part. The inner diameter of the cylindrical sleeve (203b) is 0.001 mm to 0.01 mm smaller than the outer diameter of the solid cylinder (203a).

2. The laser packaging shell according to claim 1, characterized in that: The inner wall of the cylindrical sleeve (203b) is plated with a nickel layer and a gold layer, and the nickel layer is located between the inner wall and the gold layer.

3. The laser packaging shell according to claim 2, characterized in that: The thickness of the nickel layer is 0.1um to 1um, and the thickness of the gold layer is 0.07um to 0.5um.

4. The laser packaging shell according to claim 1, characterized in that: The wall thickness of the cylindrical sleeve (203b) is 0.1 mm to 0.5 mm.

5. The laser packaging shell according to claim 1, characterized in that: The top end of the cylindrical sleeve (203b) does not exceed the top end of the tube tongue (202).

6. The laser package housing according to any one of claims 1 to 5, characterized in that: The solid cylinder (203a) is connected to the plug hole by sealing welding using soft glass (A).

7. The laser package housing according to any one of claims 1 to 5, characterized in that: The tube cap (100) comprises a light-transmitting member (101) and a cap body (103); both ends of the cap body (103) are open, one end is sealedly connected to the base (201), and the other end is sealed by the light-transmitting member (101).

8. The laser packaging shell according to claim 7, characterized in that: The light-transmitting member (101) is located inside the cap body (103) and is welded to the cap body (103) using soft glass (A).

9. The laser packaging shell according to claim 7, characterized in that: The light-transmitting member (101) comprises a quartz glass sheet and an optical anti-reflection film coated on the inner surface and / or outer surface of the quartz glass sheet, the inner surface being the surface on the quartz glass sheet facing the base (201), and the outer surface being the surface opposite to the inner surface.

10. A laser, characterized in that: The invention comprises a laser package shell as claimed in any one of claims 1 to 9, and a laser chip (300), a lead (400) and a heat sink (500) all located in a housing cavity of the package shell, wherein the heat sink (500) is welded to a tube tongue (202) of the package shell, and the laser chip (300) comprises a first thickened electrode and a second thickened electrode, wherein the first thickened electrode is connected to the heat sink (500), and the second thickened electrode is connected to a cylindrical sleeve (203b) of the package shell through the lead (400).

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