Circuit board convenient for heat dissipation

Abstract

The utility model relates to the field of circuit boards, and discloses a circuit board convenient for heat dissipation, which comprises a printed circuit board, the front end and the rear end of the printed circuit board are respectively provided with an upper clamping plate and a lower clamping plate, and one side of the upper surface of the upper clamping plate close to the middle of the printed circuit board is provided with a plurality of fixing grooves. A plurality of flow guide plates are arranged at the upper end of the printed circuit board, a plurality of heat dissipation boxes are fixedly connected to the upper surface of the upper clamping plate at the front end, and cross plates are fixedly connected to the rear ends of the inner walls of the heat dissipation boxes. Compared with an existing circuit board, the circuit board is provided with the heat dissipation box, the front end and the rear end of the flow guide plate are clamped into the fixing grooves, so that the flow guide plate is fixed, then the power fan rotates, external wind power is sucked in by the power fan, and then flow guide treatment is carried out through the flow guide plate; therefore, the flow rate of air on the surface of the circuit board is accelerated, and the printed circuit board is more convenient to dissipate heat.

Description

Technical Field

[0001] The utility model relates to the field of circuit boards, in particular to a circuit board facilitating heat dissipation. Background Art

[0002] A circuit board is a substrate used to support and connect electronic components. It is printed with conductors, connection lines, and metal contacts of other electronic components to build the circuit of an electronic device. Circuit boards are widely used in modern electronic devices and are one of the basic components of electronic products. When a circuit board is in use, the power consumption generated during operation is converted into heat energy, resulting in the circuit board heating up. Therefore, there is an urgent need for technical improvement.

[0003] When an existing circuit board is in use, the heat dissipation effect through the surface-bonded heat dissipation components is relatively low. When the circuit board is used in a high-temperature environment for a long time, it may cause some solder joints to become desoldered. Moreover, when an existing circuit board is damaged, most of them cannot effectively disassemble the heat dissipation components, resulting in a relatively high cost for later circuit board replacement. Therefore, there is an urgent need for technical improvement. Summary of the Utility Model

[0004] The purpose of the utility model is to solve the deficiencies existing in the prior art and propose a circuit board facilitating heat dissipation. Compared with the existing circuit boards, when this printed circuit board is damaged, the upper clamping plate and the lower clamping plate can be toggled by a worker, so that the upper clamping plate drives the connecting rod to squeeze the damping spring inside the activity groove, and then the upper clamping plate and the lower clamping plate are separated from the printed circuit board, and then it can be installed on another circuit board, thus effectively reducing the cost of using this type of printed circuit board later.

[0005] To achieve the above purpose, the utility model provides the following technical solutions:

[0006] A circuit board facilitating heat dissipation, including a printed circuit board. Upper clamping plates and lower clamping plates are respectively arranged at the front end and the rear end of the printed circuit board. A plurality of fixing grooves are respectively opened on one side of the upper surface of the upper clamping plate close to the middle of the printed circuit board. A plurality of flow guiding plates are arranged at the upper end of the printed circuit board. A plurality of heat dissipation boxes are fixedly connected to the upper surface of the front upper clamping plate. Cross plates are fixedly connected to the rear ends of the inner walls of the heat dissipation boxes. A power fan is arranged at the center of the outer wall of the front end of the cross plate. A plurality of connecting rods are fixedly connected to the lower surface of the upper clamping plate. A plurality of activity grooves are respectively opened inside the lower clamping plates. An installation groove is arranged inside the connecting rod. A fixing shaft is fixedly connected to the inner bottom surface of the activity groove. A damping spring is sleeved on the shaft body of the fixing shaft. A sliding groove is respectively opened on the outer wall of one side of the lower clamping plate close to the printed circuit board. A honeycomb plate is arranged at the lower end of the printed circuit board;

[0007] Through the above technical solution, through the tightly fitting structural design and the stable connection between components, the heat transfer efficiency and heat dissipation performance of the circuit board can be effectively improved, ensuring that the electronic components can maintain a safe temperature range during operation and improving the reliability and stability of the circuit board.

[0008] Furthermore, both the front end and the rear end of the deflector are tightly fitted with the inner wall of the fixed groove;

[0009] Through the above technical solution, since both the front end and the rear end of the deflector are tightly fitted with the inner wall of the fixed groove, the deflector can be better fixed.

[0010] Furthermore, dust-proof nets are provided on both the front inner wall and the rear inner wall of the heat dissipation box;

[0011] Through the above technical solution, since dust-proof nets are provided on both the front inner wall and the rear inner wall of the heat dissipation box, the dust-proof performance of the heat dissipation box can be effectively improved.

[0012] Furthermore, sliding plates are fixedly connected to the upper ends of the outer walls on both sides of the honeycomb board, and the outer walls of the sliding plates are tightly fitted with the inner walls of the sliding grooves;

[0013] Through the above technical solution, since sliding plates are fixedly connected to the upper ends of the outer walls on both sides of the honeycomb board and the outer walls of the sliding plates are tightly fitted with the inner walls of the sliding grooves, the honeycomb board can be better installed and disassembled.

[0014] Furthermore, one side of the upper surface of the lower clamping plate and one side of the lower surface of the upper clamping plate are respectively tightly fitted with the printed circuit board;

[0015] Through the above technical solution, since one side of the upper surface of the lower clamping plate and one side of the lower surface of the upper clamping plate are respectively tightly fitted with the printed circuit board, the heat dissipation component can be better fixed on the printed circuit board.

[0016] Furthermore, the lower end of the connecting rod penetrates through the lower clamping plate to the inside of the movable groove;

[0017] Through the above technical solution, since the lower end of the connecting rod penetrates through the lower clamping plate to the inside of the movable groove, the upper clamping plate and the lower clamping plate can be better fixed to each other.

[0018] Furthermore, the lower surface of the damping spring is fixedly connected to the inner bottom surface of the installation groove;

[0019] Through the above technical solution, since the lower surface of the damping spring is fixedly connected to the inner bottom surface of the installation groove, the upper clamping plate and the lower clamping plate can be better clamped.

[0020] The utility model has the following beneficial effects:

[0021] 1. A circuit board facilitating heat dissipation proposed by the present utility model. Compared with the existing circuit boards, this circuit board is provided with a heat dissipation box. By clamping the front end and the rear end of the flow guide plate into the fixing grooves, the flow guide plate is fixed. Then, the power fan rotates, sucking the external wind force in. Then, through the flow guide plate for flow guiding treatment, the air flow rate on the surface of the circuit board is accelerated, making this printed circuit board more convenient for heat dissipation.

[0022] 2. A circuit board facilitating heat dissipation proposed by the present utility model. Compared with the existing circuit boards, this circuit board is provided with an upper clamping plate and a lower clamping plate. When this printed circuit board is damaged, the staff can toggle the upper clamping plate and the lower clamping plate, so that the upper clamping plate drives the connecting rod to squeeze the damping spring inside the moving groove, and then separates the upper clamping plate and the lower clamping plate from the printed circuit board, and installs it on another circuit board, effectively reducing the cost of using this type of printed circuit board in the later stage. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 Isometric view of a circuit board facilitating heat dissipation proposed by the present utility model;

[0024] Figure 2 Structural schematic diagram of a circuit board facilitating heat dissipation proposed by the present utility model;

[0025] Figure 3 Isometric view of the honeycomb board in a circuit board facilitating heat dissipation proposed by the present utility model;

[0026] Figure 4 Isometric view of the flow guide plate in a circuit board facilitating heat dissipation proposed by the present utility model;

[0027] Figure 5 Cross-sectional view of the upper clamping plate in a circuit board facilitating heat dissipation proposed by the present utility model;

[0028] Figure 6 Is Figure 5 Enlarged view of part A in

[0029] LEGEND DESCRIPTION:

[0030] 1. Printed circuit board; 2. Honeycomb board; 3. Lower clamping plate; 4. Upper clamping plate; 5. Flow guide plate; 6. Dust-proof net; 7. Heat dissipation box; 8. Sliding groove; 9. Fixing groove; 10. Slide plate; 11. Cross plate; 12. Power fan; 13. Connecting rod; 14. Moving groove; 15. Damping spring; 16. Fixed shaft; 17. Installation groove. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0031] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts shall fall within the protection scope of the present utility model.

[0032] Referring to Figures 1-6 , an embodiment provided by the present utility model is as follows:

[0033] A circuit board facilitating heat dissipation includes a printed circuit board 1. Upper clamping plates 4 and lower clamping plates 3 are respectively arranged at the front end and the rear end of the printed circuit board 1. A plurality of fixing grooves 9 are formed on one side of the upper surface of the upper clamping plate 4 close to the middle of the printed circuit board 1. A plurality of flow guiding plates 5 are arranged at the upper end of the printed circuit board 1. A plurality of heat dissipation boxes 7 are fixedly connected to the upper surface of the front upper clamping plate 4. Cross plates 11 are fixedly connected to the rear ends of the inner walls of the heat dissipation boxes 7. A power fan 12 is arranged at the center of the outer wall of the front end of the cross plate 11. A plurality of connecting rods 13 are fixedly connected to the lower surface of the upper clamping plate 4. A plurality of moving grooves 14 are formed inside the lower clamping plates 3. An installation groove 17 is arranged inside the connecting rod 13. A fixing shaft 16 is fixedly connected to the inner bottom surface of the moving groove 14. A damping spring 15 is sleeved on the shaft body of the fixing shaft 16. Sliding grooves 8 are formed on the outer walls of the lower clamping plates 3 close to the printed circuit board 1. A honeycomb board 2 is arranged at the lower end of the printed circuit board 1;

[0034] Through the structural design of tight fitting and the stable connection between components, the heat transfer efficiency and heat dissipation performance of the circuit board can be effectively improved, ensuring that the electronic components can maintain a safe temperature range during operation and improving the reliability and stability of the circuit board.

[0035] Both the front end and the rear end of the flow guiding plate 5 are in close contact with the inner walls of the fixing grooves 9. By the fact that both the front end and the rear end of the flow guiding plate 5 are in close contact with the inner walls of the fixing grooves 9, the flow guiding plate 5 can be better fixed. Dust-proof nets 6 are arranged on both the front inner wall and the rear inner wall of the heat dissipation box 7. By the fact that dust-proof nets 6 are arranged on both the front inner wall and the rear inner wall of the heat dissipation box 7, the dust-proof performance of the heat dissipation box 7 can be effectively improved. Sliding plates 10 are fixedly connected to the upper ends of both outer walls of the honeycomb board 2. The outer walls of the sliding plates 10 are in close contact with the inner walls of the sliding grooves 8. By the fact that sliding plates 10 are fixedly connected to the upper ends of both outer walls of the honeycomb board 2 and the outer walls of the sliding plates 10 are in close contact with the inner walls of the sliding grooves 8, the honeycomb board 2 can be better installed and disassembled.

[0036] One side of the upper surface of the lower clamping plate 3 and one side of the lower surface of the upper clamping plate 4 are respectively in close contact with the printed circuit board 1. By the fact that one side of the upper surface of the lower clamping plate 3 and one side of the lower surface of the upper clamping plate 4 are respectively in close contact with the printed circuit board 1, the heat dissipation component can be better fixed on the printed circuit board 1. The lower end of the connecting rod 13 penetrates through the lower clamping plate 3 into the interior of the moving slot 14. By the fact that the lower end of the connecting rod 13 penetrates through the lower clamping plate 3 into the interior of the moving slot 14, the upper clamping plate 4 and the lower clamping plate 3 can be better fixed to each other. The lower surface of the damping spring 15 is fixedly connected to the inner bottom surface of the mounting slot 17. By the fact that the lower surface of the damping spring 15 is fixedly connected to the inner bottom surface of the mounting slot 17, the upper clamping plate 4 and the lower clamping plate 3 can be better clamped.

[0037] Working principle: During production, when the printed circuit board 1 is produced, the upper clamping plate 4 and the lower clamping plate 3 are toggled by the staff, so that the upper clamping plate 4 drives the connecting rod 13 to squeeze the damping spring 15 inside the moving slot 14, so that the printed circuit board 1 is clamped by the upper clamping plate 4 and the lower clamping plate 3. Then, an appropriate amount of thermal grease is applied to the lower surface of the honeycomb board 2, and then the honeycomb board 2 is slid into the chute 8 through the slide plate 10, so that the honeycomb board 2 is in contact with the printed circuit board 1. Then, the flow guide plate 5 is snapped into the fixing slot 9. Then, during daily use, the power fan 12 is driven to rotate by external power, so that the power fan 12 sucks in external air, so that the flow guide plate 5 conducts flow guiding treatment, so that the air on the surface of the printed circuit board 1 is blown away, so as to achieve a better heat dissipation effect by accelerating the air flow rate on the surface.

[0038] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A circuit board for facilitating heat dissipation, comprising a printed circuit board (1), characterized in that: The front and rear ends of the printed circuit board (1) are respectively provided with an upper clamping plate (4) and a lower clamping plate (3); a plurality of fixing grooves (9) are provided on one side of the upper surface of the upper clamping plate (4) close to the middle of the printed circuit board (1); a plurality of guide plates (5) are provided on the upper end of the printed circuit board (1); a plurality of heat dissipation boxes (7) are fixedly connected to the upper surface of the upper clamping plate (4) at the front end; a cross plate (11) is fixedly connected to the rear end of the inner wall of the heat dissipation box (7); a power fan (12) is provided at the center of the outer wall of the front end of the cross plate (11). ), the lower surface of the upper clamping plate (4) is fixedly connected with a plurality of connecting rods (13), the interior of the lower clamping plate (3) is provided with a plurality of movable grooves (14), the interior of the connecting rods (13) is provided with mounting grooves (17), the inner bottom surface of the movable groove (14) is fixedly connected with a fixed shaft (16), the shaft body of the fixed shaft (16) is sleeved with a damping spring (15), the outer wall of the lower clamping plate (3) on one side close to the printed circuit board (1) is provided with a sliding groove (8), and the lower end of the printed circuit board (1) is provided with a honeycomb panel (2).

2. A circuit board for heat dissipation according to claim 1, characterized in that: The front end and the rear end of the guide plate (5) are tightly fitted to the inner wall of the fixing groove (9).

3. A circuit board for heat dissipation according to claim 1, characterized in that: The front inner wall and the rear inner wall of the heat dissipation box (7) are both provided with dustproof nets (6).

4. A circuit board for facilitating heat dissipation according to claim 1, characterized in that: The upper ends of the outer walls on both sides of the honeycomb panel (2) are fixedly connected with slide plates (10), and the outer walls of the slide plates (10) are tightly fitted with the inner walls of the slide grooves (8).

5. A circuit board for facilitating heat dissipation according to claim 1, characterized in that: One side of the upper surface of the lower clamping plate (3) and one side of the lower surface of the upper clamping plate (4) are respectively tightly fitted to the printed circuit board (1).

6. A circuit board for facilitating heat dissipation according to claim 1, characterized in that: The lower end of the connecting rod (13) passes through the lower clamping plate (3) to the inside of the movable groove (14).

7. A circuit board for facilitating heat dissipation according to claim 1, characterized in that: The lower surface of the damping spring (15) is fixedly connected to the inner bottom surface of the mounting groove (17).

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