PCB lead bonding carrier
By designing a PCB wire bonding vehicle for bonding machines, the problem that the prior art cannot automate operations is solved, and automated, efficient and accurate wire bonding is achieved, which improves production efficiency and processing accuracy, reduces costs and improves yield.
Patent Information
- Application Number
- CN202421545770.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-02
- Publication Date
- 2025-05-30
- Estimated Expiration
- 2034-07-02
AI Technical Summary
Existing wire bonding machines cannot automate operations, especially for substrate products that exceed track thickness or have surface assembly processes, resulting in low production efficiency and difficult to ensure processing accuracy.
A PCB wire bonding vehicle is designed, including a vehicle body, a pressure plate and a heating block. The vehicle body has multiple positioning grooves for mounting the PCB board, and its thickness is the same as the track depth, and it can slide in the bonding machine track to achieve automated, efficient and accurate wire bonding operations.
Through this vehicle, the bonding machine can automatically locate and pull materials, reduce manual operations, improve production efficiency and processing accuracy, reduce labor costs and production costs, and improve yield.
Smart Images
Figure CN222928590U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor packaging, and more precisely, to a PCB lead bonding carrier. Background Art
[0002] During the semiconductor packaging process, lead bonding is usually required on a PCB. Currently, automated lead bonding equipment is mostly used for operation to improve production efficiency and processing quality. The automated lead bonding equipment has certain limitations on the thickness and width of the bonding product substrate. The track thickness for fixing the substrate by the automated lead bonding machine is limited, and the substrate needs to be an unprocessed bare board without surface mounting technology.
[0003] For substrate products that exceed the track thickness or have undergone surface mounting technology, the existing lead bonding machines cannot achieve automatic operation. Currently, for substrate products that exceed the track thickness or have undergone surface mounting technology, generally, the heating blocks for surface mounting welding components are avoided, and a pressing plate is used for pressing. During the operation, the product needs to be manually placed on the heating block, and then the operation pressing plate is used to press the product. After the bonding is completed, the product is manually taken out. It can be seen that the existing lead bonding method mainly relies on manual alignment, feeding, bonding, and material taking, with low production efficiency and difficult to ensure processing accuracy.
[0004] In summary, there is a need in the art for a structure that can overcome the problem of the bonding machine being unable to perform automated operation due to the thickness of the product substrate, so as to improve production efficiency and product quality. Summary of the Utility Model
[0005] In view of this, the purpose of the utility model is to provide a PCB lead bonding carrier, which includes a carrier body. The carrier body has a plurality of positioning grooves for installing PCB boards. The carrier body is arranged in the track of the bonding machine and has the same thickness as the track of the bonding machine. Through the carrier body, the bonding machine can achieve automated, efficient, and precise lead bonding operation.
[0006] To achieve the above purpose, the utility model provides a PCB lead bonding carrier, which includes a carrier body, a pressing plate, and a heating block. The carrier body is slidably installed in the track of the bonding machine. The pressing plate is combined and installed with the pressing device of the bonding machine. The heating block is combined and installed with the heating device of the bonding machine. The carrier body has several positioning grooves for installing PCB boards, and the thickness of the carrier body is the same as the depth of the track. The carrier body is driven by the gripper of the bonding machine to slide in the track.
[0007] Preferably, the bottom of the positioning groove has several positioning pins, which are correspondingly arranged with the openings on the PCB board. When the PCB board is placed inside the positioning groove, the positioning pins are respectively inserted into the openings.
[0008] Preferably, the thickness of the positioning groove is equal to the thickness of the PCB board.
[0009] Preferably, a material taking groove communicating with the positioning groove is provided on the side of the positioning groove.
[0010] Preferably, heating through holes are provided at the bottom of the positioning groove, pressing plate through holes are provided at positions corresponding to the heating through holes on the pressing plate, and the heating block contacts the PCB board through the heating through holes for heating.
[0011] Preferably, a plurality of direction indication marks are provided on the top surface of the carrier body.
[0012] Compared with the prior art, the advantages of a PCB wire bonding carrier disclosed by the present utility model are as follows: the PCB wire bonding carrier can carry and position a plurality of PCB boards, and the bonding machine can cooperate to realize automatic material pulling and automatic positioning, reducing manual operation, thereby improving production efficiency and processing accuracy; adopting the PCB wire bonding carrier can reduce labor costs, and further reduce the overall production cost; adopting the PCB wire bonding carrier can reduce the situation of product scrapping caused by accidental touch during manual loading and pressing by personnel, improve the yield rate, ensure product quality, and further reduce the production cost. Description of the Drawings
[0013] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model, and for those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0014] As Figure 1 shown is a schematic exploded view of a PCB wire bonding carrier of the present utility model.
[0015] As Figure 2 shown is a top view of the carrier body of a PCB wire bonding carrier of the present utility model.
[0016] As Figure 3 shown is a front cross-sectional view of the carrier body of a PCB wire bonding carrier of the present utility model.
[0017] As Figure 4 shown is a top side view of the pressing plate of a PCB wire bonding carrier of the present utility model.
[0018] As Figure 5 shown is a bottom side view of the pressing plate of a PCB wire bonding carrier of the present utility model. Detailed Embodiments
[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.
[0020] As Figure 1 shown, a PCB lead bonding carrier of the present application includes a carrier body 1, a pressing plate 2, and a heating block 3. The carrier body 1 is slidably installed in the track of the bonding machine. The pressing plate 2 is combined and installed with the pressing device of the bonding machine, and the heating block 3 is combined and installed with the heating device of the bonding machine. The carrier body 1 is provided with a plurality of positioning grooves 10 for installing the PCB board 4, and the thickness of the carrier body 1 is the same as the depth of the track. The carrier body 1 is driven by the gripper of the bonding machine to move in the track. The pressing device and the heating device are arranged opposite to each other on the upper and lower sides of the track. When the positioning groove 10 moves between the pressing device and the heating device, the pressing plate 2 and the heating block 3 are driven to act on both sides of the PCB board 4 to complete the bonding process. Then, the carrier body 1 is pulled by the feeding gripper to step into the subsequent area. The PCB lead bonding carrier can carry and position multiple PCB boards, and the bonding machine can cooperate to achieve automatic material pulling and automatic positioning, reducing manual operation, thereby improving production efficiency and processing accuracy.
[0021] Specifically, referring to Figure 2 and Figure 3 , the bottom of the positioning groove 10 is provided with a plurality of positioning pins 11, and the positioning pins 11 are correspondingly arranged with the openings on the PCB board 4. When the PCB board 4 is placed inside the positioning groove 10, the positioning pins 11 are respectively inserted into the openings to realize the limitation of the PCB board.
[0022] The thickness H of the positioning groove 10 is equal to the thickness of the PCB board 4. When the PCB board 4 is placed inside the positioning groove 10, the whole does not protrude from the positioning groove 10.
[0023] The side of the positioning groove 10 is provided with a material taking groove 12 communicating with the positioning groove 10, which is convenient for the operator to grab the processed PCB board 4.
[0024] The top surface of the carrier body 1 is provided with a plurality of direction indication marks 13, which are convenient for the operator to judge the placement direction of the carrier body 1 and prevent the situation of reverse placement.
[0025] The bottom of the positioning groove 10 is provided with a heating through hole 100. Referring to Figure 4 and Figure 5, at the position corresponding to the heating through-hole 100 on the pressing plate 2, there is a pressing plate through-hole 21. The heating block 3 contacts the PCB board 4 through the heating through-hole 100 for heating. By providing the pressing plate through-hole 21, the heat conduction of the pressing plate 2 can be avoided from affecting the operation of the bonding machine.
[0026] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the broadest scope consistent with the principles and novel features disclosed herein.
Claims
1. A PCB wire bonding carrier, characterized in that: It includes a carrier body, a pressing plate and a heating block. The carrier body is slidably installed in the track of the bonding machine. The pressing plate is installed in combination with the pressing device of the bonding machine. The heating block is installed in combination with the heating device of the bonding machine. The carrier body has a plurality of positioning grooves for installing PCB boards, and the thickness of the carrier body is the same as the depth of the track. The carrier body is driven by the material claws of the bonding machine to slide in the track.
2. The PCB wire bonding carrier according to claim 1, characterized in that: The bottom of the positioning groove is provided with a plurality of positioning pins, and the positioning pins are arranged corresponding to the openings on the PCB board. When the PCB board is placed inside the positioning groove, the positioning pins are respectively inserted into the openings.
3. The PCB wire bonding carrier according to claim 1, characterized in that: The thickness of the positioning groove is equal to the thickness of the PCB board.
4. The PCB wire bonding carrier according to claim 1, characterized in that: The side of the positioning groove is provided with a material taking groove communicated with the positioning groove.
5. The PCB wire bonding carrier according to claim 1, characterized in that: The bottom of the positioning groove is provided with a heating through hole, and a pressing plate through hole is provided on the pressing plate at a position corresponding to the heating through hole, and the heating block contacts the PCB board through the heating through hole for heating.
6. The PCB wire bonding carrier according to claim 1, characterized in that: The top surface of the carrier body is provided with a plurality of direction indication marks.