Electronic equipment with glue groove

Abstract

The embodiment of the utility model discloses electronic equipment with a glue groove, relates to the technical field of electrical equipment, and aims to improve the sealing performance of the electronic equipment. The electronic equipment comprises an equipment body, a cavity used for containing a circuit module is formed in the equipment body, a cable inlet is formed in the side wall of the equipment body, and a glue groove used for containing sealing glue is formed in the position, corresponding to the cable inlet, in the equipment body; wherein a glue adhesion enhancing structure is arranged in the glue groove. The cable sealing device is suitable for occasions where cables and equipment are sealed.

Description

Technical Field

[0001] This application relates to the technical field of electrical equipment, and particularly to an electronic device with a glue groove. Background Art

[0002] In electronic devices, cables are usually required to supply power or transmit signals. However, to improve the reliability of electronic devices, the circuit modules in the electronic devices need to be sealed and isolated from the outside. In the prior art, a sealing groove is provided in the electronic device, and the cable is threaded through it, and a sealing glue is provided in the sealing groove to achieve sealing. However, in the prior art, the surface for bonding with the glue in the sealing groove (glue groove) is a plane, and the adhesion ability of the colloid on it is low, resulting in poor sealing performance of the electronic device. Summary of the Utility Model

[0003] In view of this, the embodiments of this application provide an electronic device, which is convenient for improving the sealing performance of the electronic device.

[0004] The embodiments of this application provide an electronic device, including: a device body, the inside of the device body has a cavity for accommodating a circuit module, a cable inlet is provided on the side wall of the device body, and at a position corresponding to the cable inlet inside the device body, a glue groove for accommodating a sealing colloid is provided; wherein, a colloid adhesion enhancing structure is provided in the glue groove.

[0005] According to a specific implementation manner of the embodiments of this application, the colloid adhesion enhancing structure includes: convex and / or concave structures provided on the inner wall of the glue groove.

[0006] According to a specific implementation manner of the embodiments of this application, the colloid adhesion enhancing structure includes: a convex block provided on the inner wall of the glue groove and extending towards the inside of the glue groove, a pore is provided in the convex block, and convex and / or concave structures are provided in the pore; or, the colloid adhesion enhancing structure includes: a cantilever provided on the inner wall of the glue groove and extending towards the inside of the glue groove, and convex and / or concave structures provided on the cantilever.

[0007] According to a specific implementation manner of the embodiments of this application, the convex and concave structures are thread structures.

[0008] According to a specific implementation manner of the embodiments of this application, the cable inlet is provided on the side or bottom of the glue groove, and the colloid adhesion enhancing structure is provided close to the cable inlet.

[0009] According to a specific implementation manner of an embodiment of the present application, on the inner wall of the cable inlet, there is an internal thread for threaded connection with the cable connection part, and the inner diameter and pitch of this internal thread are consistent with the inner diameter and pitch of the threaded structure of the colloid adhesion enhancement structure, or the inner diameter of this internal thread is smaller than the inner diameter of the threaded structure of the colloid adhesion enhancement structure.

[0010] According to a specific implementation manner of an embodiment of the present application, it further includes: a cable, the cable extends into the interior of the device body from the cable inlet and is electrically connected to the circuit module, and the cable is threadedly connected to the internal thread on the inner wall of the cable inlet through the external thread on the outer periphery of the cable connection part; a colloid, the colloid is filled in the glue groove and covers the colloid adhesion enhancement structure.

[0011] According to a specific implementation manner of an embodiment of the present application, there is a preset distance between the outer periphery of the bump or the outer periphery of the cantilever and the notch of the glue groove.

[0012] According to a specific implementation manner of an embodiment of the present application, the threaded structure of the colloid adhesion enhancement structure starts from one end of the bump or the cantilever close to the cable inlet and extends a preset length along the length direction of the cantilever.

[0013] According to a specific implementation manner of an embodiment of the present application, a colloid adhesion enhancement structure is also provided on the end face of the cable connection part facing the inside of the glue groove; the colloid covers this colloid adhesion enhancement structure.

[0014] In the electronic device of this embodiment, by providing a cable inlet on the side wall of the device body, at a position inside the device body corresponding to the cable inlet, there is a glue groove for accommodating the sealing colloid, and a colloid adhesion enhancement structure is provided in the glue groove. In this way, when there is a colloid in the glue groove, the colloid cooperates with the colloid adhesion enhancement structure, which can enhance the adhesion between the sealing colloid and the glue groove, and further improve the sealing performance of the electronic device. Description of the Drawings

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained according to these drawings.

[0016] Figure 1 It is the front view of the partial structure of the electronic device provided in the first embodiment of the present application;

[0017] Figure 2 It is the three-dimensional schematic diagram of the partial structure of the electronic device provided in the first embodiment of the present application;

[0018] Figure 3 Partial structural schematic diagram (without filled colloid) of the electronic device with a colloid adhesion enhancement structure provided in the first embodiment of the present application;

[0019] Figure 4 Partial structural schematic diagram (filled with colloid) of the electronic device with a colloid adhesion enhancement structure provided in the first embodiment of the present application;

[0020] Figure 5 Specific structural schematic diagram of the electronic device with a colloid adhesion enhancement structure provided in the first embodiment of the present application;

[0021] Figure 6 Front view of the partial structure of the electronic device provided in the second embodiment of the present application;

[0022] Figure 7 Cross-sectional view of the partial structure of the electronic device provided in the second embodiment of the present application. Detailed implementation manners

[0023] The embodiments of the present application will be described in detail below with reference to the accompanying drawings. It should be clear that the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts belong to the scope of protection of the present application.

[0024] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present invention.

[0025] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality" means two or more, unless otherwise specifically defined.

[0026] In the present utility model, unless otherwise clearly defined and limited, terms such as "installation", "connection", "coupling", "fixation" and the like shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral body; it may be a mechanical connection, an electrical connection, or a communication connection; it may be a direct connection, or an indirect connection through an intermediate medium, and may be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0027] To enable those skilled in the art to better understand the technical concept, implementation scheme and beneficial effects of the embodiments of the present application, the following will be described in detail through specific embodiments.

[0028] In an electronic device, a circuit module needs to be powered or transmit signals through a cable. Therefore, a cable inlet is provided on the side wall of the device body, and a cable can be passed through the cable inlet. To ensure the normal operation of the electronic device, at a position corresponding to the cable inlet inside the device body, a glue groove for accommodating a sealing colloid is provided, and a colloid adhesion enhancing structure is provided in the glue groove to enhance the adhesion of the sealing colloid in the glue groove through the colloid adhesion enhancing structure, thereby improving the sealing performance of the electronic device. Embodiment 1

[0029] Refer to Figures 1 - 5 As shown, the electronic device of this embodiment may include: a device body 1, the inside of the device body 1 has a cavity for accommodating a circuit module, a cable inlet 2 is provided on the side wall of the device body 1, and at a position corresponding to the cable inlet 2 inside the device body 1, a glue groove 3 for accommodating a sealing colloid is provided, and a colloid adhesion enhancing structure 4 is provided in the glue groove 3.

[0030] In a specific example, the electronic device may be a camera. The side wall of the device body 1 may be the housing of the device body 1 or a structural member inside the device body 1.

[0031] Refer to Figure 3 , in this embodiment, the cable inlet 2 is opened at the side of the glue groove 3, and the colloid adhesion enhancing structure 4 is arranged close to the cable inlet 2. The colloid adhesion enhancing structure 4 includes: a convex block 401 provided on the inner wall of the glue groove 3 and extending towards the inside of the glue groove 3, a hole 402 is opened on the convex block 401, and a threaded structure 403 is provided in the hole.

[0032] Refer to Figures 2 to 5 , the cable inlet 2 is opened at the side of the glue groove 3, and the colloid adhesion enhancing structure 4 is arranged close to the cable inlet, which is convenient to achieve sealing at a position close to the cable inlet 2 through the colloid adhesion enhancing structure 4, thereby improving the sealing performance of the electronic device.

[0033] The shape of the glue groove 3 can be any shape, such as a regular shape or an irregular shape. The notch of the glue groove 3 forms a certain angle with the cable inlet 2, such as a 90-degree angle.

[0034] The bump 401 in this embodiment can be of any shape, such as regular shapes like a cuboid, a cone, a cylinder, etc., or other irregular shapes.

[0035] The thread structure 403 is provided on the inner side wall of the hole 402 of the bump 401, and the bump 401 is provided on the inner wall of the glue groove 3 and extends towards the inside of the glue groove 3. In this way, it is convenient to increase the area of the thread, and further convenient to improve the sealing performance of the electronic device.

[0036] See Figure 4 When a cable 5 is inserted through the cable inlet 2 and the glue groove 3 is filled with a colloid 6, the colloid 6 adheres to the thread structure 403, and the thread structure 403 can provide more adhesion area for the colloid 6, thereby enhancing the adhesion of the colloid 6 in the glue groove 3, improving the sealing performance of the cable 5 at the cable inlet 2, and further improving the sealing performance of the electronic device.

[0037] Compared with the conventional glue groove, the thread structure 403 in this embodiment increases the length and area of the sealing path. Even if there is a disconnection between the colloid and the glue groove 3, it greatly increases the resistance to the penetration of foreign substances and improves the reliability of the operation of the electronic device.

[0038] See Figure 4 In this embodiment, the glue groove 3 is of an irregular shape, and the bonding areas of the side walls of the glue groove 3 with the colloid 6 are inconsistent. And the cable inlet 2 is opened on the side of the glue groove 3. Due to the existence of the cable inlet 2, the bonding force between the side wall where the cable inlet 2 is located and the colloid 6 is further weakened. When the colloid 6 cures and shrinks, the circumferential force distribution between the colloid 6 and the side wall of the glue groove 3 is uneven, and the colloid 6 is prone to cracking on the side wall corresponding to the cable inlet 2, resulting in sealing failure. In this embodiment, a hole 402 is opened on the bump 401, and a thread structure 403 is arranged in the hole 402, which can enhance the adhesion of the colloid, thereby improving the uneven circumferential force state and effectively solving the problem of sealing failure caused by colloid cracking.

[0039] See Figure 5 In a specific embodiment, the length L of the thread structure 403 is at least 3 times the pitch; the thread profile is trapezoidal, and the bottom width D of the thread groove is at least 0.125 times the pitch.

[0040] The length L of the thread structure 403 is at least 3 times the pitch P, that is, the thread structure 403 includes at least 3 turns of threads.

[0041] The length L of the thread structure 403 is at least three times the pitch P, and the width D at the bottom of the tooth groove is at least 0.125 times the pitch P. In this way, the sealing performance between the colloid 6 and the glue groove 2 can be effectively improved. Further, the length L of the pitch is greater than 8 mm, and the width D at the bottom of the tooth groove is not less than 0.3 mm.

[0042] See Figure 3 and Figure 4 , the thread structure 403 of the colloid adhesion enhancement structure 4 can start from one end of the bump 401 close to the cable inlet 2 and extend a preset length along the length direction of the bump 401, which is convenient for making full use of the length of the bump 401, lengthening the length of the colloid adhesion enhancement structure 4, and further improving the sealing performance.

[0043] The notch of the bump 401 and the glue groove 3 can be flush, or can have a preset distance from the notch of the glue groove 3. See Figure 3 and Figure 4 , in this embodiment, the notch of the bump 401 and the glue groove 3 have a preset distance. In this way, the colloid 6 can not only adhere to the inner wall of the glue groove 3, but also adhere to the periphery of the bump 401, thereby increasing the adhesion area of the colloid 6 and improving the sealing performance.

[0044] See Figure 3 and Figure 4 , for the electronic device of this embodiment, an internal thread for threaded connection with the cable connection part 7 can also be provided on the inner wall of the cable inlet 2; the inner diameter and pitch of this internal thread are consistent with the inner diameter and pitch of the thread structure 403 of the colloid adhesion enhancement structure 4, which is convenient for obtaining the internal thread for threaded connection with the cable connection part 7 on the inner wall of the cable inlet 3 and the thread structure 403 of the colloid adhesion enhancement structure 4 through one processing.

[0045] As an alternative solution, the inner diameter of the internal thread on the inner wall of the cable inlet 2 in the above embodiment is smaller than the inner diameter of the thread structure 403 of the colloid adhesion enhancement structure 4, which can increase the contact path between the colloid 6 and the thread structure 403 and further improve the sealing performance.

[0046] See Figure 4 , in this embodiment, the cable 5 extends into the device body 1 from the cable inlet 2 and is electrically connected to a circuit module (not shown in the figure). The cable 5 is threadedly connected to the internal thread on the inner wall of the cable inlet 2 through the external thread on the outer periphery of the cable connection part 7. The colloid 6 is filled in the glue groove 3 and covers the colloid adhesion enhancement structure 4.

[0047] The colloid 6 of this embodiment is filled in the glue groove 3 and covers the colloid adhesion enhancement structure 4, which can improve the sealing performance between the colloid 6 and the glue groove 3, and further facilitate improving the sealing performance of the electronic device of this embodiment.

[0048] In other embodiments, the thread structure 403 in the colloid adhesion enhancement structure in this embodiment can also be replaced with a convex structure, or a concave structure, or a combination of convex and concave structures. That is, the colloid adhesion enhancement structure 4 can also include: a convex block 401 provided on the inner wall of the glue groove 3 and extending towards the inside of the glue groove, a hole 402 is provided on the convex block 401, and other convex and / or concave structures other than the thread structure are provided in the hole 402.

[0049] As an alternative solution, the convex block 401 can be replaced with a cantilever, and convex and / or concave structures are provided on the cantilever. It can be understood that only a convex structure can be provided on the cantilever, or only a concave structure can be provided, or both a convex structure and a concave structure can be provided. That is, the colloid adhesion enhancement structure 4 can also include: a cantilever provided on the inner wall of the glue groove 2 and extending towards the inside of the glue groove 2, and convex and / or concave structures provided on the cantilever.

[0050] The convex structure can be a regular or irregular convex block, such as a square convex block, a long convex block, a triangular convex block, a T-shaped convex block, an inverted L-shaped convex block, etc. The concave structure can be grooves, pores or slits with the same or different depths and sizes.

[0051] In the case where the colloid adhesion enhancement structure 4 includes a cantilever, the thread structure on the cantilever can be provided in the middle section of the cantilever, or at one end of the cantilever. In one embodiment, the thread structure on the cantilever starts from one end of the cantilever close to the cable inlet and extends a preset length along the length direction of the cantilever, so as to make full use of the length of the cantilever, lengthen the length of the colloid adhesion enhancement structure, and further improve the sealing performance.

[0052] In order to further increase the colloid adhesion area, in this embodiment, a colloid adhesion enhancement structure (not shown in the figure), such as a convex or concave groove, is also provided on the end face of the cable connection part 7 facing the inside of the glue groove 3. The colloid covers this colloid adhesion enhancement structure. In this way, the colloid not only covers the colloid adhesion enhancement structure on the boss or the cantilever, but also can cover the colloid adhesion enhancement structure on the end face of the cable connection part 7, thereby increasing the colloid adhesion area and improving the sealing performance.

[0053] Embodiment Two

[0054] See Figure 6 and Figure 7 , the structure of the electronic device in this embodiment is similar to that of the electronic device in Embodiment One, and the main difference lies in the different colloid adhesion enhancement structures. See Figure 7 , in this embodiment, the colloid adhesion enhancement structure 4 includes a thread structure 403 provided on the inner wall of the glue groove 3, that is, the thread structure 403 is directly provided on the inner wall of the glue groove 3.

[0055] In this embodiment, when the colloid 6 is provided in the glue tank 3, the colloid 6 adheres to the thread structure 403 on the inner wall of the glue tank 3, and the thread structure 403 can provide more adhesion area for the colloid 6, thereby enhancing the adhesion of the colloid 6 in the glue tank 3, and further improving the sealing performance of the electronic device.

[0056] The shape of the glue tank can be columnar, the cable inlet is arranged at the bottom of the glue tank, and the side wall of the glue tank is a cylindrical surface, so that the glue bonding and shrinkage forces are uniform. However, when the surface energy of the glue tank surface is low due to oil pollution or plastic material reasons, in the related art, there will also be a problem that the glue detaches from the glue tank surface and causes poor airtightness. To solve the above problems, in this embodiment, a thread structure 403 is arranged on the cylindrical surface of the side wall of the glue tank 3. In this way, the bonding area can be increased under the same height dimension, and the phenomenon of glue cracking can be reduced.

[0057] See Figure 7 , on the inner wall of the cable inlet 2, there is an internal thread for threaded connection with the cable connection part, and the inner diameter of this internal thread is smaller than the inner diameter of the thread structure 403 of the colloid adhesion enhancement structure. In other words, the inner diameter of the thread structure 403 of the colloid adhesion enhancement structure is larger than the inner diameter of the internal thread on the inner wall of the cable inlet 2 for threaded connection with the cable connection part. This can increase the sealing path at the connection position between the cable inlet 2 and the glue tank 3, which is beneficial to improving the sealing performance.

[0058] In other embodiments, the colloid adhesion enhancement structure may include: a recessed structure provided on the inner wall of the glue tank; or a protruding structure provided on the inner wall of the glue tank; or a protruding structure and a recessed structure provided on the inner wall of the glue tank. The protruding structure can be a regular or irregular convex block, such as a square convex block, a long convex block, a triangular convex block, a T-shaped convex block, an inverted L-shaped convex block, etc. The recessed structure can be grooves, pores or slits with the same or different depths and sizes.

[0059] To further increase the colloid adhesion area, in this embodiment, a colloid adhesion enhancement structure (not shown in the figure), such as a protrusion or a groove, is also provided on the end face of the cable connection part 7 facing the inside of the glue tank 3. The colloid covers this colloid adhesion enhancement structure, which can further increase the colloid adhesion area and improve the sealing performance.

[0060] The above is only an exemplary description. It can be understood that the colloid adhesion enhancement structure 4 can also be any other structure that can enhance the adhesion of the inner wall of the glue tank 2 to the colloid.

[0061] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the said element.

[0062] Each embodiment in this specification is described in a related manner. For the same or similar parts among the embodiments, reference can be made to each other, and the key point of each embodiment is to illustrate the differences from other embodiments.

[0063] The above is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present application should be covered by the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An electronic device, characterized in that: include: The device body has a cavity inside for accommodating the circuit module, a cable inlet is provided on the side wall of the device body, and a glue groove for accommodating the sealing glue is provided at a position inside the device body corresponding to the cable inlet; Wherein, a colloid adhesion enhancement structure is provided in the glue groove.

2. The electronic device according to claim 1, characterized in that: The colloid adhesion enhancement structure includes: a protrusion and / or a recessed structure arranged on the inner wall of the glue groove.

3. The electronic device according to claim 1, characterized in that: The colloid adhesion enhancement structure comprises: a convex block provided on the inner wall of the glue groove and extending toward the inside of the glue groove, a hole formed on the convex block, and a convex and / or concave structure provided in the hole; or, The colloid adhesion enhancement structure includes: a cantilever provided on the inner wall of the glue groove and extending toward the inside of the glue groove, and a protrusion and / or a recessed structure provided on the cantilever.

4. The electronic device according to claim 3, characterized in that: The convex and concave structures are Thread structure.

5. The electronic device according to claim 4, characterized in that: The cable inlet is opened on the side or bottom of the glue groove, and the glue adhesion enhancement structure is arranged close to the cable inlet.

6. The electronic device according to claim 5, characterized in that: An internal thread for threaded connection with the cable connecting part is provided on the inner wall of the cable entrance; the inner diameter and pitch of the internal thread are consistent with the inner diameter and pitch of the thread structure of the colloid adhesion enhancing structure, or the inner diameter of the internal thread is smaller than the inner diameter of the thread structure of the colloid adhesion enhancing structure.

7. The electronic device according to claim 6, characterized in that: Also includes: A cable, the cable extends from the cable inlet into the interior of the device body and is electrically connected to the circuit module, the cable being threadedly connected to the internal thread on the inner wall of the cable inlet through the external thread on the outer periphery of the cable connecting portion; The colloid is poured into the glue groove and covers the colloid adhesion enhancement structure.

8. The electronic device according to claim 3, characterized in that: There is a preset distance between the outer periphery of the protrusion or the outer periphery of the cantilever and the notch of the glue groove.

9. The electronic device according to claim 4, characterized in that: The thread structure of the colloid adhesion enhancement structure starts from the end of the protrusion or the cantilever close to the cable inlet and extends along the length direction of the cantilever by a preset length.

10. The electronic device according to claim 7, characterized in that: A colloid adhesion enhancement structure is also provided on the end surface of the cable connection portion facing the inside of the glue groove; the colloid covers the colloid adhesion enhancement structure.

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