Combined integrated circuit board with high heat dissipation performance

Abstract

The utility model relates to the field of circuit boards, and discloses a high-performance heat dissipation combined integrated circuit board, which comprises components and an integrated circuit board, a metal heat absorption plate and a metal heat dissipation plate are inserted into the integrated circuit board through a metal heat absorption plate bump corresponding to a metal heat dissipation connection groove, and a heat conduction insulation plate clamps the integrated circuit board. When the integrated circuit board works, generated heat is absorbed and dissipated by a device designed below the circuit board, high-performance heat dissipation can be carried out on the circuit board by utilizing the principle, the integrated circuit board is clamped and tightly attached by the heat conduction insulating plate, so that the heat conduction efficiency is improved, and the stability is improved; wherein the high-heat-transfer medium nanofluid is injected to cooperate with the metal heat absorption plate to absorb a large amount of exported heat, and is combined with the metal heat dissipation plate to dissipate the heat absorbed by the metal heat absorption plate, so that the heat can be quickly dissipated, and the problem that the service life of the circuit board is shortened due to the fact that a large amount of heat generated during high-power work cannot be dissipated in time is prevented.

Description

Technical Field

[0001] The utility model relates to the field of circuit boards, and specifically relates to a combined integrated circuit board with high-performance heat dissipation. Background Technique

[0002] Due to the very high density of components in the traditional integrated circuit board, the generated heat is relatively concentrated, and its own heat dissipation ability is poor. External heat dissipation technology needs to be used for processing, which also increases the manufacturing cost. At the same time, when working at high power, more heat will be generated. If the heat dissipation is not timely, it will lead to a reduction in the service life of the integrated circuit board and components. For this reason, we propose a combined integrated circuit board with high-performance heat dissipation. Content of the Utility Model

[0003] Aiming at the deficiencies of the prior art, the utility model provides a combined integrated circuit board with high-performance heat dissipation, and solves the above problems.

[0004] Technical Solution

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solution: A combined integrated circuit board with high-performance heat dissipation, including components and an integrated circuit board. Various components are distributed on the upper surface of the integrated circuit board. The lower end of the integrated circuit board is closely attached to the upper end of a heat-conducting insulating board. The heat-conducting insulating board is connected to a metal heat-absorbing plate, and the metal heat-absorbing plate is connected to a metal heat-dissipating plate.

[0006] Preferably, fixing blocks are provided at the four ends on both sides of the upper part of the heat-conducting insulating board. The circuit board and the heat-conducting insulating board are fixed and clamped through the fixing blocks, so as to improve the heat conduction efficiency and stability.

[0007] Preferably, a nanofluid cavity is opened inside the heat-conducting insulating board. Injecting a high-heat-transfer medium nanofluid into the nanofluid cavity will greatly improve the heat conduction efficiency from the circuit board.

[0008] Preferably, a heat-conducting insulating board connection convex block is provided at the lower end of the heat-conducting insulating board, and a metal heat-absorbing plate connection groove is opened at the upper end of the metal plate heat-absorbing plate. The heat-conducting insulating board connection convex block is inserted into the corresponding metal heat-absorbing plate connection groove to fix the heat-conducting insulating board and the metal heat-absorbing plate.

[0009] Preferably, a metal heat-absorbing plate connection convex block is provided at the lower end of the metal plate heat-absorbing plate, and a metal heat-dissipation connection groove is opened at the upper end of the metal heat-dissipating plate. The metal heat-absorbing plate and the metal heat-dissipating plate are inserted and matched through the metal heat-absorbing plate convex block corresponding to the metal heat-dissipation connection groove.

[0010] Compared with the prior art, the utility model provides a combined integrated circuit board with high-performance heat dissipation, and has the following beneficial effects:

[0011] 1. For the combined integrated circuit board with high-performance heat dissipation, the heat-conducting insulating board clamps the integrated circuit board, and the heat generated when the integrated circuit board works is absorbed and dissipated by the device designed under the circuit board.

[0012] 2. For the combined integrated circuit board with high-performance heat dissipation, the heat-conducting insulating board clamps and tightly adheres to the integrated circuit board to improve the heat conduction efficiency and stability. Inside the heat-conducting insulating board, a nanofluid cavity is provided, and injecting a high heat-transfer medium nanofluid into the nanofluid cavity will greatly improve the heat conduction efficiency from the circuit board. Cooperating with the metal heat absorption plate to absorb a large amount of heat conducted out, combined with the metal heat dissipation plate to dissipate the heat absorbed by the metal heat absorption plate, it is beneficial to quickly dissipate the heat and prevent the reduction of the circuit board's lifespan caused by the failure to timely dissipate a large amount of heat generated during high-power operation. Description of the Drawings

[0013] Figure 1 Schematic diagram of the circuit board structure of the present utility model;

[0014] Figure 2 Schematic diagram of the circuit board structure of the present utility model;

[0015] Figure 3 Cross-sectional view of the structure of the present utility model;

[0016] Figure 4 Schematic diagram of the heat-conducting insulating board of the present utility model;

[0017] Figure 5 For Figure 4 Partial enlarged view of A in;

[0018] Figure 6 For Figure 5 Front view of;

[0019] Figure 7 Schematic diagram of the metal heat absorption plate of the present utility model;

[0020] Figure 8 For Figure 7 Partial enlarged view of C in;

[0021] Figure 9 For Figure 8 Axonometric view of;

[0022] Figure 10 Schematic diagram of the metal heat dissipation plate of the present utility model;

[0023] Figure 11 For Figure 10 Partial enlarged view of E in.

[0024] In the figure: 1 - component; 2 - integrated circuit board; 3 - thermally conductive insulating plate; 4 - nanofluid cavity; 5 - metal heat absorption plate; 6 - metal heat dissipation plate; 7 - fixing block; 8 - thermally conductive insulating plate connection bump; 9 - metal heat absorption plate connection groove; 10 - metal heat absorption plate connection bump; 11 - metal heat dissipation connection groove. Detailed implementation mode

[0025] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0026] Please refer to Figure 1-11 , a combined integrated circuit board with high-performance heat dissipation, including a component 1 and an integrated circuit board 2. Various components 1 are distributed on the upper surface of the integrated circuit board 2. The lower end of the integrated circuit board 2 is closely attached to the upper end of the thermally conductive insulating plate 3. The thermally conductive insulating plate 3 is connected to the metal heat absorption plate 5, and the metal heat absorption plate 5 is connected to the metal heat dissipation plate 6.

[0027] Fixing blocks 7 are provided at the four ends on both sides of the upper part of the thermally conductive insulating plate 3. The circuit board 2 and the thermally conductive insulating plate 3 are fixed and clamped by the fixing blocks 7 to improve the heat conduction efficiency and stability.

[0028] A nanofluid cavity 4 is opened inside the thermally conductive insulating plate 3. Injecting a high heat transfer medium nanofluid into the nanofluid cavity 4 will greatly improve the heat conduction efficiency from the circuit board.

[0029] A thermally conductive insulating plate connection bump 8 is provided at the lower end of the thermally conductive insulating plate 3. A metal heat absorption plate connection groove 9 is opened at the upper end of the metal plate heat absorption plate 5. The thermally conductive insulating plate connection bump 8 is inserted into the corresponding metal heat absorption plate connection groove 9 to fix the thermally conductive insulating plate 3 and the metal heat absorption plate 5.

[0030] A metal heat absorption plate connection bump 10 is provided at the lower end of the metal plate heat absorption plate 5. A metal heat dissipation connection groove 11 is opened at the upper end of the metal heat dissipation plate 6. The metal heat absorption plate 5 and the metal heat dissipation plate 6 are inserted and matched through the metal heat absorption plate bump 10 corresponding to the metal heat dissipation connection groove 11.

[0031] Working principle: The thermally conductive insulating plate clamps the integrated circuit board. When the integrated circuit board works, the heat generated is absorbed and dissipated by the device designed under the circuit board. Using this principle, high-performance heat dissipation of the circuit board can be achieved.

[0032] The heat-conducting and insulating board clamps and closely adheres to the integrated circuit board to improve the heat-conducting efficiency and stability. Inside the heat-conducting and insulating board, a nanofluid cavity is provided. Injecting a high-heat-transfer medium nanofluid into the nanofluid cavity will greatly improve the heat-conducting efficiency from the circuit board. Cooperating with the metal heat-absorbing plate to absorb a large amount of heat conducted out and combining with the metal heat-dissipating plate to dissipate the heat absorbed by the metal heat-absorbing plate is beneficial to quickly dissipate the heat and prevent the reduction of the circuit board's lifespan caused by the failure to timely dissipate a large amount of heat generated during high-power operation.

[0033] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-performance heat dissipation combined integrated circuit board, comprising components (1) and an integrated circuit board (2), characterized in that: Various components (1) are distributed on the upper surface of the integrated circuit board (2); the lower end of the integrated circuit board (2) is tightly attached to the upper end of the heat-conducting insulating plate (3); the heat-conducting insulating plate (3) is connected to the metal heat-absorbing plate (5); and the metal heat-absorbing plate (5) is connected to the metal heat-dissipating plate (6).

2. A high performance heat dissipation modular integrated circuit board according to claim 1, characterized in that: Four ends of both sides of the upper part of the heat-conducting insulating plate (3) are provided with fixing blocks (7), and the circuit board (2) and the heat-conducting insulating plate (3) are fixed and clamped by the fixing blocks (7).

3. A high performance heat dissipation modular integrated circuit board according to claim 2, characterized in that: A nanofluid cavity (4) is provided inside the heat-conducting insulating plate (3), wherein a high heat transfer medium nanofluid is injected into the nanofluid cavity (4).

4. A high performance heat dissipation modular integrated circuit board according to claim 3, characterized in that: A heat-conducting insulating plate connecting protrusion (8) is provided at the lower end of the heat-conducting insulating plate (3), a metal heat-absorbing plate connecting groove (9) is provided at the upper end of the metal heat-absorbing plate (5), and the heat-conducting insulating plate connecting protrusion (8) is inserted into the corresponding metal heat-absorbing plate connecting groove (9) to fix the heat-conducting insulating plate (3) and the metal heat-absorbing plate (5).

5. The high performance heat dissipation modular integrated circuit board according to claim 4, characterized in that: The lower end of the metal plate heat absorbing plate (5) is provided with a metal heat absorbing plate connecting protrusion (10), and the upper end of the metal heat dissipating plate (6) is provided with a metal heat dissipating connecting groove (11). The metal heat absorbing plate (5) and the metal heat dissipating plate (6) are plugged into and matched with each other through the metal heat absorbing plate protrusion (10) corresponding to the metal heat dissipating connecting groove (11).

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