Novel 3DVC radiator

Abstract

The utility model relates to a novel 3DVC radiator, which is designed for solving the technical problem of inconvenience in production and assembly caused by the fact that plate bodies and heat pipes extending into fin modules of the existing similar products are few and capillary structure design is adopted, especially the heat pipes inserted into fins and cover plate structure design are not good enough. An outwards-turned structure and an inwards-turned structure are formed on the top plate face of a cover plate of the radiator, a heat pipe turned-over edge is formed on a pipe opening in one end of a heat pipe, and the heat pipe turned-over edge of the heat pipe is arranged in through holes in the inwards-turned structure and the outwards-turned structure of the cover plate in a sleeved mode and welded to the inwards-turned structure and the outwards-turned structure of the cover plate. An inner cavity of the bottom plate is communicated with a pipe cavity of the heat pipe and is provided with a working medium; the key point is that the inner cavity of the bottom plate is provided with a bottom cavity inner capillary structure body, the bottom cavity inner capillary structure body is sintered on the surface of the inner cavity of the bottom plate, is sintered on a supporting column of the inner cavity of the bottom plate and is sintered on the bottom plate surface of the cover plate at the same time, and the bottom cavity inner capillary structure body is a three-dimensional annular capillary structure body; the capillary structure in the bottom cavity and the capillary structure in the heat pipe of the heat pipe are connected into an integrated structure.

Description

Technical Field

[0001] The utility model relates to a vapor chamber with fins and is a novel 3DVC radiator. Background Art

[0002] With the rapid development of electronic devices, the operating capacity of electronic devices is getting stronger and stronger, and the heat generated during operation is also increasing. Therefore, vapor chambers (VC for short) are widely used as radiators in high-power or high-integration electronic products. When used properly, a vapor chamber (VC) can be simply understood as a component with a very high thermal conductivity coefficient; it has the following advantages: low space requirements, large contact area, and fast thermal response. These characteristics are applied to radiators to reduce thermal diffusion resistance and hot spots. According to the application of the vapor chamber (VC), it can be divided into 2DVC radiators and 3DVC radiators. The 2DVC radiator is a plate-type radiator that realizes heat conduction in a two-dimensional plane. The 3DVC radiator is to inlay heat pipes in the radiator, and evenly distribute the heat of the chip on the radiator substrate or fins. At this time, because the heat pipes are connected to the fins, the heat can be more effectively dissipated into the air through the entire radiator, realizing heat conduction in a three-dimensional plane. Such 3DVC radiators, such as the application number 202022461602.0 disclosed in the Chinese patent literature, the authorization announcement date is July 9, 2021, and the utility model name is "A low-air-volume high-power radiator"; however, the above radiators rarely adopt a capillary structure in the wall. Such as the application number 201020547839.4 disclosed in the Chinese patent literature, the authorization announcement date is April 20, 2021, and the utility model name is "A vapor chamber with support columns"; a support column is provided in the chamber of the vapor chamber, a first capillary structure with a plurality of through holes is provided on one side of the chamber, a second capillary structure is provided at the base of the cavity and covers the inner wall surface of the base; however, the capillary structure of the above vapor chamber is rarely used in the heat pipes of 3DVC radiators, and the structural design of the heat pipes and covers inserted with fins is not good enough, resulting in inconvenient production and assembly. Summary of the Invention

[0003] To overcome the above deficiencies, the purpose of the utility model is to provide a novel 3DVC radiator to the field, so as to solve the technical problems that the plate body of existing similar products and the heat pipes extending into the fin module rarely adopt a capillary structure design at the same time, the heat dissipation effect and thermal conductivity need to be further improved, especially the structural design of the heat pipes and covers inserted with fins is not good enough, resulting in inconvenient production and assembly. Its purpose is achieved through the following technical solutions.

[0004] A new type of 3DVC radiator, which includes a bottom plate, a cover plate, heat pipes and a fin module; the cover plate is arranged at the plate opening on the top of the bottom plate and welded together, and the heat pipes arranged equidistantly on the top plate surface of the cover plate are inserted into the fin module and welded together; the top plate surface of the cover plate forms an outward-turning structure and an inward-concave structure, one end of the heat pipe forms a heat pipe flange, and the heat pipe flange of the heat pipe is sleeved in the through holes at the inward-concave structure and the outward-turning structure of the cover plate and welded together; the inner cavity of the bottom plate communicates with the lumen of the heat pipe and is provided with a working medium; the key point of its structural design is that the inner cavity of the bottom plate is provided with a capillary structure in the bottom cavity, the capillary structure in the bottom cavity is sintered on the inner surface of the inner cavity of the bottom plate, and the support columns sintered in the inner cavity of the bottom plate are also sintered on the bottom plate surface of the cover plate, forming a three-dimensional ring-shaped capillary structure; the capillary structure in the bottom cavity is connected with the capillary structure in the heat pipe of the heat pipe into an integrated structure. Thus, the heat pipe of the radiator passes through the heat pipe flange of the cover plate and is then sleeved in the through holes at the inward-concave structure and the outward-turning structure of the cover plate, which facilitates the welding of the two together, increases the structural strength of the combination of the heat pipe and the bottom cavity of the bottom plate, and at the same time, the capillary structure in the bottom cavity of the bottom plate and the capillary structure in the heat pipe are connected together into an integrated structure, improving and accelerating the return water efficiency in the bottom cavity.

[0005] The capillary structure in the bottom cavity and the capillary structure in the heat pipe are any one of sintered powder, woven mesh, grid body or fiber body, and the capillary structure in the bottom cavity and the capillary structure in the heat pipe are the same or different capillary structures.

[0006] The support columns of the bottom plate are arranged in an array at the bottom of the inner cavity of the bottom plate. Thereby increasing the strength and stability of the bottom plate and the cover plate in supporting the fin module.

[0007] The working medium is filled into the bottom cavity of the bottom plate through the orifice at the tail of the protrusion in the opening groove on one side of the bottom plate. The capillary structure in the bottom cavity of the bottom plate and the opening on one side of the cover plate correspond to the opening at the tail. The outer diameter of the bottom plate is integrally aligned with the outer diameter of the fin module. The above-mentioned tail is a plug column, which extends out of one side of the bottom plate for sealing after the working medium is filled.

[0008] The boss at the bottom of the bottom plate is thermally connected to the heat source.

[0009] The thickness of the inner end of the heat pipe at the top inside the heat pipe is greater than the thickness of the inner wall, and the outer diameter of the end of the heat pipe at the inner end is conical. Thereby facilitating the conical processing of the outer diameter of the end of the heat pipe and the insertion of the end of the heat pipe into the fin module.

[0010] Extension grooves with open communication are respectively arranged on one side of the heat pipes in the fin module. Thereby further improving the air circulation and heat transfer at the heat pipe in the fin module.

[0011] The structure of the utility model is reasonably designed, with good heat dissipation and heat conduction effects, low production costs, and convenient processing and production. It not only meets the heat dissipation requirements of high power, greatly reduces the temperature of the heat source, but also has a mature production process and strong reliability, making it suitable for large-scale promotion. It is suitable for use as a new type of 3DVC radiator for the heat dissipation application requirements of ultra-high power devices and for the further improvement of similar products. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is an exploded structural schematic diagram of an embodiment of the utility model.

[0013] Figure 2 is Figure 1 the three-dimensional structural schematic diagram after assembly.

[0014] Figure 3 is Figure 2 the main structural schematic diagram, with the fin module omitted in the figure.

[0015] Figure 4 is Figure 2 the sectional structural schematic diagram, with part A framed in the figure.

[0016] Figure 5 is Figure 4 the enlarged view of part A.

[0017] Reference numerals and names of the drawings: 1, bottom plate; 2, cover plate; 3, capillary structure in the bottom cavity; 4, heat pipe; 101, support column; 102, mouse tail; 201, outward turning structure; 202, inward concave structure; 401, capillary structure inside the heat pipe; 402, heat pipe flanging; 403, inner end of the heat pipe; 5, fin module; 501, extension groove. EMBODIMENT

[0018] Now, in conjunction with the drawings, the structure and use of the utility model will be further described. As Figures 1-5As shown, the radiator includes a bottom plate 1, a cover plate 2, a capillary structure 3 in the bottom cavity, heat pipes 4 and a fin module 5. The cover plate is arranged at the plate opening on the top of the bottom plate and welded together. The heat pipes equidistantly arranged on the top plate surface of the cover plate are inserted into the fin module and welded together. An outward-turning structure 201 and an inward-concave structure 202 are formed on the top plate surface of the cover plate. One end orifice of the heat pipe forms a heat pipe flanging 402. The heat pipe flanging of the heat pipe is sleeved in the through holes at the inward-concave structure and the turning structure of the cover plate and welded together. The inner cavity of the bottom plate communicates with the lumen of the heat pipe and is provided with a working medium. The inner cavity of the bottom plate is provided with the capillary structure in the bottom cavity. The capillary structure in the bottom cavity is sintered on the inner surface of the inner cavity of the bottom plate, and on the support columns 101 in the inner cavity of the bottom plate, and at the same time sintered on the bottom plate surface of the cover plate, being a three-dimensional ring-shaped capillary structure. The capillary structure in the bottom cavity and the capillary structure 401 in the heat pipe lumen of the heat pipe are connected into an integral structure. The support columns of the bottom plate are arranged in an array in the inner cavity of the bottom plate. The capillary structure in the bottom cavity and the capillary structure in the heat pipe lumen are any one of sintered powder, woven mesh, grid body or fiber body, and the capillary structure in the bottom cavity and the capillary structure in the heat pipe lumen are the same or different capillary structures.

[0019] The above-mentioned working medium is filled into the bottom cavity of the bottom plate through the orifice at the tail 102 protruding from the opening groove on one side of the bottom plate. The capillary structure in the bottom cavity of the bottom plate and the openings on one side of the cover plate correspond to the openings at the tail. The outer diameter of the bottom plate is integrally aligned with the outer diameter of the fin module. The boss at the bottom of the bottom plate is thermally connected to the heat source. The thickness at the inner end 403 of the heat pipe at the top inside the heat pipe is greater than the thickness at the inner wall. The outer diameter of the heat pipe end at the inner end of the heat pipe is conical. Extension grooves with communicating openings are respectively arranged on one side of the heat pipes in the fin module.

[0020] The radiator is thermally connected to the heat source through the boss at the bottom of the bottom plate. Heat is conducted to the inside of the bottom cavity of the radiator through the boss of the bottom plate. The heat transfer working medium inside the bottom cavity is heated and evaporated into gas. The gas rises into the heat pipe and is then conducted to the fin module through the inner wall of the heat pipe. Appropriate air volume is provided externally to enable the fin module to exchange heat with the air and thus take away the heat. After the heat of the gas working medium in the heat pipe is taken away, the gas working medium becomes a liquid working medium and then flows back to the heat source covering area inside the bottom cavity through the capillary structure in the heat pipe and the capillary structure in the bottom cavity, and so on in a cycle.

Claims

1. A novel 3DVC heat sink, comprising a base plate (1), a cover plate (2), a heat pipe (4) and a fin module (5); the cover plate is arranged at a plate opening at the top of the base plate and welded together, and the heat pipes arranged equidistantly on the top plate surface of the cover plate are inserted into the fin module and welded together; the top plate surface of the cover plate forms an outward-turned structure (201) and an inward-turned structure (202), and the pipe opening at one end of the heat pipe forms a heat pipe flange (402), and the heat pipe flange of the heat pipe is sleeved inside the through holes at the inward-turned structure and the outward-turned structure of the cover plate and welded together; the inner cavity of the base plate is communicated with the tube cavity of the heat pipe and is provided with a working medium; characterized in that The inner cavity of the bottom plate (1) is provided with a bottom cavity capillary structure (3), the bottom cavity capillary structure is sintered to the inner cavity surface of the bottom plate, sintered to the support column (101) of the inner cavity of the bottom plate, and sintered to the bottom plate surface of the cover plate (2), forming a three-dimensional ring-shaped capillary structure; the bottom cavity capillary structure and the heat pipe capillary structure (401) of the heat pipe (4) are connected to form an integrated structure.

2. The novel 3DVC heat sink according to claim 1 is characterized in that The capillary structure (3) in the bottom cavity and the capillary structure (401) in the heat pipe are any one of sintered powder, woven mesh, grid body or fiber body, and the capillary structure (3) in the bottom cavity and the capillary structure (401) in the heat pipe are the same or different capillary structures.

3. The novel 3DVC heat sink according to claim 1 is characterized in that The support columns (101) of the bottom plate (1) are arranged in an array at the bottom of the inner cavity of the bottom plate.

4. The novel 3DVC heat sink according to claim 1 is characterized in that The working fluid is filled into the bottom cavity of the bottom plate through the orifice at the protruding rat tail (102) in the opening groove on one side of the bottom plate (1); the capillary structure (3) in the bottom cavity of the bottom plate and the opening on one side of the cover plate (2) correspond to the opening at the rat tail at the bottom; the outer diameter of the bottom plate is aligned with the outer diameter of the fin module (5).

5. The novel 3DVC heat sink according to claim 1 is characterized in that The boss at the bottom of the base plate (1) is thermally connected to a heat source.

6. The novel 3DVC heat sink according to claim 1 is characterized in that The thickness of the heat pipe inner end (403) at the inner top of the heat pipe (4) is greater than the thickness at the inner wall, and the outer diameter of the heat pipe end at the heat pipe inner end is tapered.

7. The novel 3DVC heat sink according to claim 1 is characterized in that One side of the heat pipe (4) in the fin module (5) is respectively provided with an extension groove (501) with openings communicating with each other.

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