Temperature control testing device and sorting machine

Abstract

The utility model relates to a temperature control testing device and a sorting machine. The temperature control testing device comprises a testing chamber, a refrigerating chamber and a heat exchange loop connected between the testing chamber and the refrigerating chamber, a testing area is arranged in the testing chamber, the heat exchange loop is provided with a heat exchange part, the heat exchange part is arranged in the refrigerating chamber, and a cold source is arranged in the refrigerating chamber and used for injecting refrigerants into the refrigerating chamber. The temperature of the test area is reduced through heat exchange between the heat exchange loop and the test area; wherein a regeneration module for collecting a refrigerant is further connected between the refrigeration chamber and the test chamber, the regeneration module comprises a regeneration pipe and a storage unit, the two ends of the regeneration pipe are communicated with the refrigeration chamber and the storage unit respectively, and the storage unit is used for collecting the refrigerant in the refrigeration chamber. According to the temperature control testing device, the local temperature control efficiency is high, the refrigerant consumption is low, and the refrigerant can be recovered and recycled in time.

Description

Technical Field

[0001] This application relates to the field of semiconductor testing technologies, and particularly to a temperature-controlled testing device and a sorter. Background Art

[0002] After integrated circuit electronic components (ICs) are packaged, a series of tests need to be carried out to ensure product quality. Some electronic components have special usage requirements and need to be resistant to high and low temperatures. Therefore, during the testing process, it is necessary to simulate the usage environment and apply high and low temperature loads to the electronic components to verify their performance. For this purpose, the commonly used testing equipment in the industry is a three-temperature sorter, which has three testing modes: high temperature, normal temperature, and low temperature, provides a stable temperature environment during the testing process of electronic components, and stacks and classifies the tested electronic components as qualified or unqualified.

[0003] One existing temperature control method during the testing process of electronic components is Chamber temperature control. That is, circulating air and a temperature control system are arranged in a thermostatic chamber to keep the temperature in the entire chamber consistent and controllable. Among them, the temperature control system often uses liquid nitrogen as a refrigeration source, and liquid nitrogen is introduced into the thermostatic chamber to form a low-temperature environment. However, in this control method, since the thermostatic chamber requires direct refrigeration by liquid nitrogen, the consumption of liquid nitrogen is large and the gas after liquid nitrogen refrigeration is difficult to recycle in a timely manner.

[0004] In view of this, it is necessary to propose a new technical solution to overcome the deficiencies of the existing technology. Summary of the Utility Model

[0005] Based on this, this application provides a temperature-controlled testing device and a sorter, which have high local temperature control efficiency, low refrigerant consumption, and can recycle and regenerate the refrigerant in a timely manner.

[0006] For this reason, this application adopts the following technical solution: A temperature-controlled testing device suitable for performing low-temperature testing on electronic components, the temperature-controlled testing device includes a testing chamber, a refrigeration chamber, and a heat exchange circuit connected between the testing chamber and the refrigeration chamber. There is a testing area in the testing chamber, the heat exchange circuit has a heat exchange part, the heat exchange part is arranged in the refrigeration chamber, and a cold source is configured in the refrigeration chamber. The cold source is used to inject a refrigerant into the refrigeration chamber and exchange heat with the testing area through the heat exchange circuit to lower the temperature of the testing area;

[0007] Wherein, a regeneration module for collecting the refrigerant is further connected between the refrigeration chamber and the testing chamber. The regeneration module includes a regeneration pipe and a storage unit. The two ends of the regeneration pipe are respectively communicated with the refrigeration chamber and the storage unit, and the storage unit is used to collect the refrigerant in the refrigeration chamber.

[0008] In one embodiment, a vacuum pumping device for pumping the test chamber is connected to the test chamber.

[0009] In one embodiment, the cold source faces the heat exchange part to spray the refrigerant onto the heat exchange part.

[0010] In one embodiment, a pressure relief valve is provided in the refrigeration chamber.

[0011] In one embodiment, the refrigerant is liquid nitrogen, the storage unit is a nitrogen storage unit, and the nitrogen storage unit is communicated with the refrigeration chamber through the regeneration pipe to collect the nitrogen gasified from the liquid nitrogen in the refrigeration chamber for storage.

[0012] In one embodiment, the nitrogen storage unit can be controllably communicated with the test chamber to fill the test chamber with nitrogen.

[0013] In one embodiment, a warming device for heating the regeneration pipe is provided outside the regeneration pipe.

[0014] In one embodiment, the warming device is a fan that drives the room temperature air flow to blow towards the regeneration pipe.

[0015] In one embodiment, a one-way valve that allows nitrogen to flow from the refrigeration chamber to the nitrogen storage unit and prevents the reverse flow of nitrogen is connected to the regeneration pipe.

[0016] The present application also adopts the following technical solution: a sorting machine, which includes an automatic sorting device and a temperature-controlled test device as described in any one of the above embodiments. The automatic sorting device classifies the electronic components according to the parameters of the electronic components measured by the temperature-controlled test device.

[0017] The temperature-controlled test device provided by the present application includes a test chamber and a refrigeration chamber. There is a heat exchange loop between the test chamber and the refrigeration chamber. The cold source injects the refrigerant into the refrigeration chamber and controls the temperature of the test chamber through the heat exchange loop. At the same time, the refrigerant in the refrigeration chamber is recycled in a timely manner through the regeneration module to solve the problem that it is difficult to recycle liquid nitrogen in time when using liquid nitrogen for direct refrigeration. Description of the Drawings

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0019] Figure 1Schematic diagram of a system of an embodiment of the temperature control test device provided in this application.

[0020] The reference numerals of each component are as follows:

[0021] 100, temperature control test device; 10, test chamber; 11, test area; 12, heating element; 13, vacuum pumping device; 20, refrigeration chamber; 21, cold source; 22, pressure relief valve; 30, heat exchange circuit; 31, circulation pipeline; 32, heat exchange section; 33, circulation pump; 34, thermal insulation jacket; 40, regeneration module; 41, storage unit; 42, controllable valve; 43, regeneration pipe; 44, check valve; 45, filter; 46, pressure sensor; 47, temperature recovery device. Detailed implementation manners

[0022] In order to make the above objects, features, and advantages of this application more obvious and understandable, the following will describe the detailed implementation manners of this application with reference to the accompanying drawings. Many specific details are set forth in the following description in order to fully understand this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of this application. Therefore, this application is not limited by the specific embodiments disclosed below.

[0023] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it can be directly on the other component or there may also be an intermediate component. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be an intermediate component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are only for the purpose of illustration and do not represent the only implementation manner.

[0024] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of this application, "a plurality" means at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0025] In this application, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may mean that the first feature is in direct contact with the second feature, or the first feature is in indirect contact with the second feature through an intermediate medium. Moreover, the first feature being "above", "over" or "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or it merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" or "underneath" the second feature may mean that the first feature is directly below or obliquely below the second feature, or it merely indicates that the first feature has a lower horizontal height than the second feature.

[0026] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as commonly understood by those skilled in the technical field to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in the specification of this application includes any and all combinations of one or more of the related listed items.

[0027] Please refer to Figure 1 As shown, this application provides a temperature control test device 100 suitable for performing low-temperature tests on electronic components. The temperature control test device includes a test chamber 10, a refrigeration chamber 20, and a heat exchange circuit 30 connected between the test chamber 10 and the refrigeration chamber 20. The test chamber 10 has a test area 11, which is an area for testing electronic components. The heat exchange circuit 30 has a heat exchange portion 32, and the heat exchange portion 32 is disposed in the refrigeration chamber 20. A cold source 21 is arranged in the refrigeration chamber 20. The cold source 21 is used to inject refrigerant into the refrigeration chamber 20, and heat exchange with the test chamber 10 through the heat exchange circuit 30 to lower the temperature of the test area 11 in the test chamber 10. A regeneration module 40 for collecting refrigerant is also connected between the refrigeration chamber 20 and the test chamber 10. The regeneration module 40 includes a regeneration pipe 43 and a storage unit 41. Both ends of the regeneration pipe 43 are respectively communicated with the refrigeration chamber 20 and the storage unit 41, and the storage unit 41 is used to collect the refrigerant in the refrigeration chamber 20.

[0028] The temperature control test device 100 provided by this application injects refrigerant into the refrigeration chamber 20 through the cold source 21 and controls the temperature of the test area 11 through the heat exchange circuit 30. At the same time, the refrigerant in the refrigeration chamber 20 is recycled in a timely manner through the regeneration module 40 to solve the problems of large consumption of liquid nitrogen and difficulty in recycling the nitrogen gas after the vaporization of liquid nitrogen existing in the existing direct liquid nitrogen refrigeration.

[0029] Please continue to refer to Figure 1As shown, in this embodiment, the electronic component to be tested is placed on the test area 11 and tested by the test indenter. In this embodiment, the heat exchange circuit 30 has a heat exchanger that exchanges heat with the electronic component to be tested, and the heat exchanger forms the test area 11. The test area 11 is composed of a heat conduction plate with excellent heat conduction performance, so as to facilitate the timely transfer of heat, improve the temperature control efficiency and accuracy. A heating element 12 is also provided in the test chamber 10. The heating element 12 heats the test area 11, and the heat exchange circuit 30 reduces the temperature of the test area 11 through heat exchange. Through the confrontation between cold and heat, precise temperature control is achieved to meet the test conditions at different temperatures. The heating element 12 can be a heating wire, a heating tube, a heating film, etc. The test chamber 10 is connected to a vacuum pumping device 13 for evacuating the test chamber 10. Before using the test chamber 10 for testing, start the vacuum pumping device 13 to discharge the air inside the test chamber 10 to the outside of the test chamber 10 and introduce an inert gas to reduce the dew point inside the test chamber 10. The vacuum pumping device 13 is arranged outside the test chamber 10. In one embodiment, the vacuum pumping device 13 includes an air pump.

[0030] In this embodiment, the refrigeration chamber 20 is another chamber different from the test chamber 10. The refrigeration chamber 20 is a relatively enclosed chamber, and the cold source 21 injects refrigerant into the refrigeration chamber 20 to cool a part of the heat exchange circuit 30 located in the refrigeration chamber 20. In this embodiment, the refrigerant injected by the cold source 21 into the refrigeration chamber 20 is liquid nitrogen. In other embodiments, it can also be other refrigerants. Further, a pressure relief valve 22 is also provided in the refrigeration chamber 20. The pressure relief valve 22 is used to open when the pressure in the refrigeration chamber 20 is too high to release the pressure and ensure the pressure safety in the refrigeration chamber 20. In this embodiment, the heat exchange part 32 included in the heat exchange circuit 30 is located in the refrigeration chamber 20, and the cold source 21 is directly opposite to the heat exchange part 32 to spray the refrigerant onto the heat exchange part 32, having high heat exchange efficiency.

[0031] In this embodiment, the heat exchange circuit 30 includes a circulation pipeline 31 and a circulation pump 33 connected to the circulation pipeline 31. The circulation pipeline 31 forms a circulation loop between the refrigeration chamber 20 and the test chamber 10. The part of the circulation pipeline 31 located in the refrigeration chamber 20 extends repeatedly and tortuously to form a heat exchange part 32. The circulation pipeline 31 is filled with a coolant. The circulation pump 33 drives the coolant to flow. When the coolant flows to the heat exchange part 32, it is cooled by the refrigerant sprayed by the cold source 21 and then flows to the test chamber 10 under the drive of the circulation pump 33 to reduce the temperature of the test area 11 in the test chamber 10. The heat exchange part 32 is a tortuous pipeline, which can increase the heat exchange area, enabling the coolant in the circulation pipeline 31 to be quickly cooled to a lower temperature state. The heat exchange part 32 can also directly adopt a heat exchanger. The coolant in the circulation pipeline 31 can be media such as ammonia, freon, and cooling oil. A heat preservation sleeve 34 is also provided on the part of the circulation pipeline 31 between the refrigeration chamber 20 and the test chamber 10. The heat preservation sleeve 34 is made of a heat-insulating material to reduce the heat exchange between the circulation pipeline 31 and the outside world and reduce the cold loss. Figure 1 A small section of the heat preservation sleeve 34 is schematically drawn in Figure 1 . It can be understood that the heat preservation sleeve 34 can cover the entire part of the circulation pipeline 31 outside the refrigeration chamber 20 and the test chamber 10.

[0032] In an embodiment of the present application, liquid nitrogen is used as the refrigerant of the cold source 21, and the coolant in the heat exchange circuit 30 is used as an intermediate medium to cool the test area 11 of the test chamber 10. It can quickly cool the test area 11 of the electronic component, has high efficiency in local temperature control, and can reduce the consumption of liquid nitrogen.

[0033] In this embodiment, the regeneration module 40 collects the refrigerant in the refrigeration chamber 20, warms it up and stores it. For the embodiment where the refrigerant is liquid nitrogen, the regeneration module 40 collects and stores the nitrogen gas formed after the heat exchange part 32 is cooled by liquid nitrogen, and this nitrogen gas can be introduced into the test chamber 10 as a protective gas. Specifically, in this embodiment, the regeneration module 40 includes a regeneration pipe 43 and a storage unit 41. One end of the regeneration pipe 43 is connected to the refrigeration chamber 20, and the other end is connected to the storage unit 41. A filter 45 and a pressure sensor 46 are provided at the end of the regeneration pipe 43 connected to the refrigeration chamber 20 to filter impurities in the nitrogen gas and monitor the pressure in the regeneration pipe 43. A one-way valve 44 that allows nitrogen gas to flow from the refrigeration chamber 20 to the storage unit 41 and prevents the reverse flow of nitrogen gas is connected to the regeneration pipe 43. The storage unit 41 is a nitrogen gas storage unit, and the nitrogen gas storage unit is connected to the refrigeration chamber 20 through the regeneration pipe 43 to collect and store the nitrogen gas after the liquid nitrogen in the refrigeration chamber 20 is vaporized. A warming device 47 for heating the regeneration pipe 43 is also provided outside the regeneration pipe 43. The warming device 47 can enable the relatively cold nitrogen gas to be better warmed up to room temperature so that the nitrogen gas can be stored at room temperature. In this embodiment, the warming device 47 is a fan that drives the room temperature air flow to blow towards the regeneration pipe 43; in other embodiments, the warming device 47 can also adopt an electric heating component, etc. The nitrogen gas storage unit can be controllably connected to the test chamber 10 to fill the test chamber 10 with nitrogen gas. The nitrogen gas storage unit and the test chamber 10 are connected through a pipeline, and a controllable valve 42 is provided on this pipeline. When it is necessary to introduce nitrogen gas into the test chamber 10, the controllable valve 42 is controlled to open to introduce the nitrogen gas collected and stored in the nitrogen gas storage unit into the test chamber 10. By filling the test chamber 10 with nitrogen gas, the dew point in the test chamber 10 can be reduced to prevent the electronic components from condensing. Moreover, this nitrogen gas is regenerated from the liquid nitrogen refrigerant and does not require additional setting. Compared with the traditional solution that requires a drying unit, the cost of the equipment is reduced.

[0034] The use of an embodiment of the temperature control test device 100 provided by this application is as follows: The temperature control test device 100 is started, and the vacuum pumping device 13 is turned on to discharge the air inside the test chamber 10 to the outside of the chamber, and the test chamber 10 is in a negative pressure state; the cold source 21 in the refrigeration chamber 20 sprays liquid nitrogen into the heat exchange part 32 of the heat exchange circuit 30 to cool the coolant in the circulation pipeline 31. The circulation pump 33 operates to transport the cooled coolant to the test chamber 10, and through heat conduction, the test area 11 in the test chamber 10 reaches an extremely low temperature state; in this state, the heating element 12 is started, and through the confrontation between cold and heat, precise temperature control of the test area 11 is achieved; during the circulation of the coolant, the liquid nitrogen in the refrigeration chamber 20 continuously vaporizes, causing the pressure in the refrigeration chamber 20 to continuously increase. When the set pressure value is reached, nitrogen will be transported to the storage unit 41 through the regeneration pipe 43. The vaporized nitrogen undergoes convective heat transfer by the fan blowing when passing through the regeneration pipe 43, enabling the colder nitrogen to better return to room temperature so that the nitrogen can be stored at room temperature; the storage unit 41 is connected to the test chamber 10 through pipelines and the controllable valve 42. The controllable valve 42 is controlled to open to transport nitrogen to the test chamber 10. After that, the inside of the test chamber 10 is filled with nitrogen, the dew point will decrease, and it is not easy to frost or condense inside the test chamber 10. Since the nitrogen is obtained from the refrigeration chamber 20, during the refrigeration process, the nitrogen can be continuously regenerated through the regeneration module 40, realizing automatic collection and continuous output to the test chamber 10; the electronic components can complete the test in the above environment of the test chamber 10.

[0035] After the test is completed, the test tray containing the electronic components will leave the test area 11. Since the inside of the test chamber 10 is filled with nitrogen at this time, the electronic components in the low-temperature state will not frost or condense due to leaving the test area 11; at the same time, because the inside of the test chamber 10 is at room temperature at this time, combined with the fan, the electronic components can be quickly heated to room temperature, reducing the risk of frosting and condensation. During the process of the electronic components entering and leaving the test chamber 10, the test chamber 10 will communicate with the outside humid air. However, since the nitrogen filled in the test chamber 10 increases the pressure inside the test chamber 10, the environment inside the test chamber 10 is a positive pressure environment greater than the external air pressure. Therefore, the external humid air will not enter the test chamber 10 during the process of the test tray entering and leaving, ensuring the stable state inside the test chamber 10.

[0036] As can be seen from the above description of the specific embodiments, the temperature control test device 100 provided by the present application includes a test chamber 10 and a refrigeration chamber 20. There is a heat exchange circuit 30 between the test chamber 10 and the refrigeration chamber 20. The cold source 21 injects refrigerant into the refrigeration chamber 20 and controls the temperature of the test chamber 10 through the heat exchange circuit 30. At the same time, the refrigerant in the refrigeration chamber 20 is recycled in a timely manner through the regeneration module 40 to solve the problems of difficult timely recycling of liquid nitrogen and frosting and dew condensation when directly using liquid nitrogen for refrigeration. The present application uses liquid nitrogen as the cold source and uses the coolant in the heat exchange circuit 30 as an intermediate medium to cool the test area 11 of the test chamber 10, which can quickly cool the area where the electronic components are located and consume less liquid nitrogen. By setting the regeneration module 40, the nitrogen gas vaporized after refrigeration can be collected and reused. By collecting the vaporized liquid nitrogen, it can be automatically replenished into the nitrogen storage unit to achieve automatic replenishment of nitrogen without external filling. During low-temperature testing, nitrogen gas is filled inside the test chamber 10, which can reduce the dew point of the test chamber 10 and prevent frosting and dew condensation from occurring in the test area 11. The filling of nitrogen gas keeps the pressure inside the test chamber 10 always greater than the external atmospheric pressure, preventing the entry of external humid air when the electronic components enter and exit the test chamber 10, and further avoiding frosting and dew condensation phenomena, without the need to configure a dryer.

[0037] The present application also provides a sorting machine, which includes an automatic sorting device and the temperature control test device 100 described in any of the above embodiments. The automatic sorting device classifies the electronic components according to the parameters of the electronic components measured by the temperature control test device 100. Since the sorting machine provided by the present application includes the above-mentioned temperature control test device 100, it of course has the above-mentioned beneficial effects.

[0038] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0039] The above embodiments only represent several implementation manners of the present application. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several deformations and improvements can be made, and these all belong to the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A temperature control test device, suitable for low temperature testing of electronic components, characterized in that: The temperature control test device comprises a test chamber, a refrigeration chamber and a heat exchange circuit connected between the test chamber and the refrigeration chamber, wherein the test chamber has a test area, the heat exchange circuit has a heat exchange part, the heat exchange part is arranged in the refrigeration chamber, a cold source is arranged in the refrigeration chamber, the cold source is used to inject refrigerant into the refrigeration chamber, and heat exchange with the test area through the heat exchange circuit to reduce the temperature of the test area; A regeneration module for collecting the refrigerant is also connected between the refrigeration chamber and the test chamber. The regeneration module includes a regeneration pipe and a storage unit. Both ends of the regeneration pipe are connected to the refrigeration chamber and the storage unit respectively. The storage unit is used to collect the refrigerant in the refrigeration chamber.

2. The temperature control test device according to claim 1, characterized in that: The test chamber is connected to a vacuum pumping device for vacuuming the test chamber.

3. The temperature control test device according to claim 1, characterized in that: The cold source faces the heat exchange part to spray the refrigerant on the heat exchange part.

4. The temperature control test device according to claim 1, characterized in that: The refrigeration chamber is provided with a pressure relief valve.

5. The temperature control test device according to any one of claims 1 to 4, characterized in that: The refrigerant is liquid nitrogen, the storage unit is a nitrogen storage unit, and the nitrogen storage unit is connected to the refrigeration chamber through the regeneration pipe to collect and store nitrogen gas after the liquid nitrogen in the refrigeration chamber is gasified.

6. The temperature control test device according to claim 5, characterized in that: The nitrogen storage unit may be controllably communicated with the test chamber to fill the test chamber with nitrogen.

7. The temperature control test device according to claim 5, characterized in that: A temperature recovery device for heating the regeneration tube is arranged outside the regeneration tube.

8. The temperature control test device according to claim 7, characterized in that: The temperature recovery device is a fan that drives the room temperature airflow to blow toward the regeneration pipe.

9. The temperature control test device according to claim 5, characterized in that: The regeneration pipe is connected with a one-way valve which allows nitrogen to flow from the refrigeration chamber to the nitrogen storage unit and prevents nitrogen from flowing in the opposite direction.

10. A sorting machine, characterized in that: It comprises an automatic sorting device and a temperature control testing device as described in any one of claims 1 to 9, wherein the automatic sorting device classifies the electronic components according to the parameters of the electronic components measured by the temperature control testing device.

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