Electroplating anode device and electroplating device

Abstract

The electroplating anode device comprises a conductive base frame, a mounting structure and an anode mounting structure, the mounting structure comprises a first mounting piece and a second mounting piece, the first mounting piece is connected with the conductive base frame, and the first mounting piece is provided with at least two mounting parts which are arranged in parallel; a plurality of second mounting parts are arranged, and the plurality of second mounting parts are arranged on the first mounting part in an array; the anode mounting structure comprises an anode piece and a third mounting piece, the anode piece is connected with the third mounting piece, and a mounting groove is formed in the third mounting piece and / or the first mounting piece. The multiple anode mounting structures are attached to the second mounting part and mounted on the first mounting part, and the third mounting part is connected with the first mounting part in an inserted mode. The structure ensures the parallelism between the anode pieces after the anode pieces are installed, so that the productivity can be effectively improved, and the product yield is improved. And the electroplating uniformity is improved, and the yield is increased. And the maintenance cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of metal electroplating, and particularly relates to an electroplating anode device and an electroplating device. Background Art

[0002] Electroplating is the process of plating a thin layer of other metals or alloys on the surface of certain metals by using the electrolysis principle, and it is a process of making the surface of metal or other material parts adhere to a metal film by using electrolysis. During electroplating, the coating metal or other insoluble materials are used as anodes, and the workpieces to be plated are used as cathodes. The cations of the coating metal are reduced on the surface of the workpieces to be plated to form a coating. To exclude the interference of other cations and make the coating uniform and firm, a solution containing cations of the coating metal is used as the electroplating solution to keep the concentration of the cations of the coating metal unchanged. The purpose of electroplating is to deposit a metal coating on the substrate to change the surface properties or dimensions of the substrate. Electroplating can enhance the corrosion resistance of metals, increase hardness, prevent wear, improve electrical conductivity, smoothness, heat resistance and surface aesthetics.

[0003] In the existing electroplating treatment device, the anode plate is generally directly fixed on the anode housing, and it is impossible to well ensure the distance and parallelism between the metal plates. When the workpiece to be electroplated passes through the gap between the anode plates, the unreasonable distance and parallelism are likely to cause uneven electroplating, reducing the yield. Moreover, the existing anode plate cannot be disassembled. When the metal layer on the anode plate is consumed, it needs to be replaced as a whole, which is very troublesome. Summary of the Utility Model

[0004] Therefore, the technical problem to be solved by the utility model is to overcome the defects of the existing electroplating treatment device. Generally, the anode plate is directly fixed on the anode housing, and it is impossible to well ensure the distance and parallelism between the metal plates. When the workpiece to be electroplated passes through the gap between the anode plates, the unreasonable distance and parallelism are likely to cause uneven electroplating, reducing the yield. Moreover, the existing anode plate cannot be disassembled. When the metal layer on the anode plate is consumed, the staff needs to re-coat it in the electroplating tank, which is very troublesome.

[0005] For this reason, the utility model provides an electroplating anode device, including:

[0006] A conductive base frame;

[0007] An installation structure, the installation structure includes a first installation part and a second installation part. The first installation part is connected to the conductive base frame, and the first installation part includes an installation portion; several second installation parts are provided, and several second installation parts are arranged in an array on the first installation part;

[0008] Anode mounting structure, the anode mounting structure includes an anode member and a third mounting member, the anode member is connected to the third mounting member, and mounting grooves are provided on the third mounting member and / or the first mounting member;

[0009] Wherein, a plurality of the anode mounting structures are provided, and the plurality of anode mounting structures are attached to the second mounting member and mounted on the first mounting member, and the third mounting member is inserted and connected to the first mounting member.

[0010] Beneficial effects: By using the design of the mounting grooves between the first mounting member, the second mounting member and the third mounting member, the anode member is mounted on the first mounting member, ensuring the parallelism between the anode members after installation, which can effectively improve production capacity. And the flatness of the anode member is ensured, and the distance between adjacent anode members can be accurately controlled, improving product output.

[0011] Optionally, at least two first mounting grooves are provided on the side of the third mounting member away from the anode member. When the third mounting member is mounted on the first mounting member, the first mounting member is inserted into the first mounting grooves.

[0012] Beneficial effects: By providing the first mounting grooves below the third mounting member and through the cooperation of the first mounting grooves and the first mounting member, the anode member can be directly inserted into the first mounting member, ensuring parallelism and facilitating installation.

[0013] Optionally, the first mounting member further includes a mounting base, and the mounting base is connected to the conductive base frame;

[0014] Two mounting portions are provided, and the two mounting portions are oppositely arranged on both sides of the mounting base.

[0015] Beneficial effects: Two mounting portions are provided, and by using double-point positioning, it is ensured that the anode member is in a vertical state after installation, ensuring the parallelism between multiple anode members.

[0016] Optionally, a second mounting groove is provided on the side of the second mounting member close to the first mounting member, and a plugging groove is provided on the mounting portion. The second mounting groove is adapted to be plugged with the plugging groove to mount the second mounting member on the first mounting member.

[0017] Optionally, first mounting holes are provided on both sides of the third mounting member, and second mounting holes are provided on both sides of the second mounting member;

[0018] When the anode mounting structure is mounted on the mounting portion, the first mounting holes are aligned with the second mounting holes to form a mounting channel for cooperating with fasteners.

[0019] Beneficial effects: The anode component is subject to wear during production, so the electroplated metal coating has a certain lifespan. With the above installation structure and anode installation structure, which is a detachable structure, when the electroplated metal coating on the anode component is completely worn out, the bolts can be removed, and then the anode installation structure can be removed from the installation structure for repair. There is no need for overall replacement, which reduces the maintenance cost.

[0020] Optionally, the above-mentioned anode component is provided as a mesh structure.

[0021] Beneficial effects: The anode component is provided as a mesh plate structure, which facilitates the flow of the electroplating solution, improves the uniformity of metal ions in the solution, and thus achieves the effect of improving the electroplating uniformity.

[0022] Optionally, the above-mentioned conductive base frame is made of a titanium-clad copper material.

[0023] Beneficial effects: The use of the titanium-clad copper material reduces the conduction resistance value on the premise of ensuring corrosion resistance, and ensures the consistency of the electric fields of each anode mesh.

[0024] Optionally, the above-mentioned conductive base frame includes an assembly part and a power connection part. There are two power connection parts, and the two power connection parts are respectively arranged on both sides of the assembly part. The power connection part is adapted to be placed above the liquid level of the electroplating solution to be connected to a power source, and the assembly part is adapted to be placed below the liquid level of the electroplating solution.

[0025] Optionally, a first assembly hole is provided on the above-mentioned conductive base frame, and a second assembly hole is provided on the installation base. The first assembly hole is adapted to be directly opposite to the second assembly hole to form an assembly channel.

[0026] Beneficial effects: Through the above setting, when the first installation part fails and is damaged, the first installation part and the conductive base frame can be disassembled, which improves the flexibility of the entire device and facilitates the workers to disassemble and assemble.

[0027] An electroplating device includes the above-mentioned electroplating anode device.

[0028] The technical solution provided by the present utility model has the following advantages:

[0029] 1. The electroplating anode device provided by the utility model comprises a conductive base frame, an installation structure and an anode installation structure. The installation structure includes a first installation part and a second installation part. The first installation part is connected to the conductive base frame, and the first installation part is provided with at least two parallel installation parts; A plurality of second installation parts are provided, and the plurality of second installation parts are arranged in an array on the first installation part; The anode installation structure includes an anode part and a third installation part. The anode part is connected to the third installation part, and an installation groove is formed on the third installation part and / or the first installation part. A plurality of anode installation structures are provided, and the plurality of anode installation structures are attached to the second installation part and installed on the first installation part, and the third installation part is inserted and connected to the first installation part.

[0030] This structure utilizes the installation groove design among the first installation part, the second installation part and the third installation part to install the anode part on the first installation part, ensuring the parallelism among the anode parts after installation, which can effectively improve the production capacity. And it ensures the flatness of the anode part, can precisely control the distance between adjacent anode parts, and improve the product output. By fixing the second installation part and the third installation part in an array on the first installation part, it ensures that the distance between any two adjacent anode parts is the same, improves the uniformity of electroplating, and improves the yield rate. Moreover, the installation structure and the anode installation structure are detachable structures. When the electroplated metal coating on the anode part is completely consumed, the anode installation structure can be removed from the installation structure for repair without replacing the whole, reducing the maintenance cost. Description of the Drawings

[0031] In order to more clearly illustrate the specific embodiments of the present utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the prior art. Obviously, the following drawings are some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0032] Figure 1 It is a schematic diagram of the overall structure of the electroplating anode device provided in the present utility model;

[0033] Figure 2 It is a schematic diagram of the structure of the conductive base frame and the installation structure provided in the present utility model;

[0034] Figure 3 It is a schematic diagram of the structure of the conductive base frame and the first installation part provided in the present utility model;

[0035] Figure 4 It is a side view of the first installation part provided in the present utility model;

[0036] Figure 5 It is a front view of the anode part provided in the present utility model;

[0037] Figure 6 This is the front view of the second mounting member provided in the present utility model;

[0038] Explanation of reference numerals in the drawings:

[0039] 1 - Conductive base frame; 11 - First assembly hole;

[0040] 2 - Mounting structure; 21 - First mounting member; 211 - Mounting base; 212 - Mounting portion; 213 - Insertion slot; 22 - Second mounting member; 221 - Second mounting slot; 222 - Second mounting hole;

[0041] 3 - Anode mounting structure; 31 - Anode member; 32 - Third mounting member; 321 - First mounting slot; 322 - First mounting hole. Detailed implementation manners

[0042] Next, the technical solutions of the present utility model will be described clearly and completely with reference to the accompanying drawings. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0043] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0044] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "mount", "connect", and "couple" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0045] In addition, the technical features involved in different embodiments of the present utility model described below can be combined with each other as long as they do not conflict with each other.

[0046] Embodiment 1

[0047] This embodiment provides a plating anode device, as Figures 1 to 6 shown, including: a conductive base frame 1, a mounting structure 2, and an anode mounting structure 3.

[0048] As Figures 1 to 3 shown, the overall shape of the conductive base frame 1 is U-shaped. The bottom plate of the conductive base frame 1 is an assembly part, and the two top ends are power connection parts. The power connection parts are adapted to be placed above the plating solution level to be connected to a power source, and the assembly part is adapted to be placed below the plating solution level. A number of first assembly holes 11 are arrayed at the central position along the length direction of the assembly part.

[0049] As Figures 1 to 3 shown, the mounting structure 2 includes a first mounting member 21 and a second mounting member 22. The bottom end of the first mounting member 21 is a mounting base 211. The mounting base 211 is a horizontally mounted plate, and the length of the mounting base 211 is shorter than the length of the bottom plate of the conductive base frame 1. A number of second assembly holes are also arrayed along the length direction of the mounting base 211. A mounting portion 212 is vertically fixed on each of the two long sides of the mounting base 211. The mounting portion 212 is a vertically placed plate. The two mounting portions 212 and a mounting base 211 form a U-shaped structure. A number of insertion slots 213 are vertically formed on the mounting portion 212. The number of insertion slots 213 is arrayed at intervals along the length direction. The number of insertion slots 213 on the two mounting portions 212 is symmetrically arranged, and the interval distance between any two adjacent insertion slots 213 on the same mounting portion 212 is the same. Two second mounting slots 221 are provided corresponding to the two mounting portions 212 below the second mounting member 22, and two first mounting holes 322 are symmetrically formed on both sides of the second mounting member 22.

[0050] As Figure 5 shown, the anode mounting structure 3 includes an anode member 31 and a third mounting member 32 which are fixedly connected up and down. Two first mounting slots 321 are provided corresponding to the two mounting portions 212 on one side of the third mounting member 32 close to the mounting portion 212, and first mounting holes 322 are respectively provided corresponding to the second mounting holes 222 on both sides of the third mounting member 32.

[0051] When assembling the electroplating anode device, first assemble the mounting structure 2. A number of second mounting members 22 are respectively inserted into the insertion slots 213 of the mounting portion 212 in a one-to-one correspondence. Specifically, the two second mounting slots 221 on the second mounting member 22 are respectively inserted into the corresponding two insertion slots 213 to mount the second mounting member 22 on the mounting portion 212, ensuring that the second mounting member 22 is vertically mounted. After the installation is completed, the distance between any two adjacent second mounting members 22 is the same, and any two second mounting members 22 are parallel to each other. Next, mount the mounting structure 2 on the conductive base frame 1. Lay the mounting structure 2 along the length direction of the conductive base frame 1 on the upper surface of the conductive base frame 1. At this time, the second assembly holes on the mounting base 211 and the first assembly holes 11 on the conductive base frame 1 are correspondingly arranged to form an assembly channel. Use bolts to penetrate the assembly channel to mount the mounting structure 2 on the conductive base frame 1. Finally, insert the two first mounting slots 321 on the third mounting member 32 into the two mounting portions 212 respectively. A number of third mounting members 32 and a number of second mounting members 22 are arranged in a one-to-one correspondence. Any one of the third mounting members 32 is arranged on the left or right side of the second mounting member 22, ensuring that the interval between any two anode members 31 is the same. At this time, the two first mounting holes 322 on each third mounting member 32 are arranged opposite to the two second mounting holes 222 of the corresponding second mounting member 22 to form an installation channel. Use bolts to penetrate the installation channel to fix the anode mounting structure 3 on the mounting structure 2. At this time, the anode mounting structure 3 is completed, and the entire anode member 31 is in a vertical state. By using the precise slot design on the third mounting member 32 and the second mounting member 22 and the U-shaped slot setting of the first mounting member 21, the three are mounted together, ensuring the parallelism between the anode members 31 after installation, which can effectively improve the production capacity. And it ensures the flatness of the anode member 31, can accurately control the distance between adjacent anode members 31, and improves the product output. By fixing the second mounting member 22 and the third mounting member 32 in an array on the first mounting member 21, ensuring that the distance between any two adjacent anode members 31 is the same, improving the uniformity of electroplating and the yield rate. Moreover, the mounting structure 2 and the anode mounting structure 3 are detachable structures. When the electroplated metal coating on the anode member 31 is consumed, the bolts can be removed, so that the anode mounting structure 3 can be removed from the mounting structure 2 for repair without replacing the whole, reducing the maintenance cost.

[0052] In other feasible embodiments, there are three installation methods for the third mounting member 32 and the first mounting slot 321. The first method is to only open the first mounting slot 321 on the third mounting member 32 without opening a mounting slot on the first mounting member 21; the second method can be that no mounting slot is opened on the third mounting member 32, and a mounting slot is opened on the first mounting member 21; the third method is to open mounting slots on both the third mounting member 32 and the first mounting member 21, and the two are inserted into each other.

[0053] The third mounting member 32 is for sheet metal processing. The third mounting member 32 and the anode member 31 are connected by welding, which is easy to fit onto the anode member 31, ensuring accurate installation and reducing the distance requirement between the anode meshes.

[0054] In this embodiment, as Figure 5 shown, the anode member 31 is provided with a mesh plate structure, which is convenient for the flow of the electroplating solution, improves the uniformity of metal ions in the solution, and thus achieves the effect of improving the electroplating uniformity; the surface of the anode member 31 is coated with a noble metal coating to maintain the activity of the anode member 31. During the production process, there is loss, so the electroplated metal coating has a certain service life. Using the above installation structure 2 and anode installation structure 3, which are detachable structures. When the electroplated metal coating on the anode member 31 is completely worn out, the bolts can be removed, and then the anode installation structure 3 can be removed from the installation structure 2 for repair, without replacing the whole, reducing the maintenance cost.

[0055] In this embodiment, the material of the conductive base frame 1 is made of titanium-clad copper material. The use of titanium-clad copper material reduces the resistance value of the conductor on the premise of ensuring corrosion resistance, ensuring that the electric fields of all anode meshes are consistent; the conductive base frame 1 is designed in a U shape, and the power connection part can be led out of the electroplating liquid surface; bilateral conduction can further improve the consistency of the electric fields between all anode meshes.

[0056] In other feasible embodiments, as Figure 4 shown, and through holes are also provided between any two adjacent insertion slots 213 on one mounting portion 212, which reduces the weight of the whole device, is convenient for the flow of the electroplating solution, improves the uniformity of metal ions in the solution, and thus achieves the effect of improving the electroplating uniformity.

[0057] The working principle of the electroplating anode device provided in this embodiment is specifically as follows:

[0058] First, assemble the mounting structure 2. The two second mounting grooves 221 on several second mounting members 22 are respectively inserted into the corresponding two insertion grooves 213 to mount the second mounting members 22 on the mounting portion 212, ensuring that the second mounting members 22 are vertically mounted. After the installation is completed, the distance between any two adjacent second mounting members 22 is the same, and any two second mounting members 22 are parallel to each other. Next, mount the mounting structure 2 on the conductive base frame 1. Lay the mounting structure 2 along the length direction of the conductive base frame 1 on the upper surface of the conductive base frame 1. At this time, the second assembly holes on the mounting base 211 and the first assembly holes 11 on the conductive base frame 1 are correspondingly arranged to form an assembly channel. Use bolts to penetrate the assembly channel to mount the mounting structure 2 on the conductive base frame 1. Finally, the two first mounting grooves 321 on the third mounting member 32 are respectively inserted into the two corresponding mounting portions 212. Several third mounting members 32 are arranged in one-to-one correspondence with several second mounting members 22. Use bolts to penetrate the mounting channel to fix the anode mounting structure 3 on the mounting structure 2. Connect the power supply to the power connection terminal at the top of the conductive base frame 1 to perform electroplating work.

[0059] Embodiment 2

[0060] An electroplating device includes a body and the electroplating anode device in any one of the embodiments in Embodiment 1 mounted on the body. It includes the mounting structure 2 and the anode mounting structure 3 in the above-mentioned Embodiment 1. Therefore, it has all the beneficial effects of the above electroplating anode device. After the anode member 31 is mounted, the parallelism between the anode members 31 is ensured, which can effectively improve the production capacity and increase the product output. The uniformity of electroplating is improved, and the yield is increased. The maintenance cost is reduced.

[0061] Obviously, the above embodiments are merely examples given for clear illustration and are not limitations on the implementation manners. For those of ordinary skill in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to enumerate all the implementation manners here. And the obvious changes or modifications derived therefrom are still within the protection scope of the present invention.

Claims

1. An electroplating anode device, characterized in that: include: Conductive base frame (1); A mounting structure (2), the mounting structure (2) comprising a first mounting member (21) and a second mounting member (22), the first mounting member (21) being connected to the conductive base frame (1), the first mounting member (21) comprising a mounting portion (212); a plurality of second mounting members (22) are provided, and the plurality of second mounting members (22) are arranged in an array on the first mounting member (21); an anode mounting structure (3), the anode mounting structure (3) comprising an anode member (31) and a third mounting member (32), the anode member (31) being connected to the third mounting member (32), and a mounting groove being provided on the third mounting member (32) and / or the first mounting member (21); There are a plurality of anode mounting structures (3), and the plurality of anode mounting structures (3) are mounted on the first mounting member (21) in a manner conforming to the second mounting member (22), and the third mounting member (32) is plug-connected to the first mounting member (21).

2. The electroplating anode device according to claim 1, characterized in that: At least two first mounting grooves (321) are provided on a side of the third mounting member (32) away from the anode member (31); when the third mounting member (32) is mounted on the first mounting member (21), the first mounting member (21) is inserted into the first mounting grooves (321).

3. The electroplating anode device according to claim 1, characterized in that: The first mounting member (21) further comprises a mounting base (211), wherein the mounting base (211) is connected to the conductive base frame (1); Two mounting portions (212) are provided, and the two mounting portions (212) are arranged oppositely on two sides of the mounting base (211).

4. The electroplating anode device according to claim 2, characterized in that: A second mounting groove (221) is provided on a side of the second mounting member (22) close to the first mounting member (21), and a plug-in groove (213) is provided on the mounting portion (212), wherein the second mounting groove (221) is adapted to be plugged into the plug-in groove (213) so as to mount the second mounting member (22) on the first mounting member (21).

5. The electroplating anode device according to claim 1, characterized in that: The third mounting member (32) has first mounting holes (322) on both sides, and the second mounting member (22) has second mounting holes (222) on both sides; When the anode mounting structure (3) is mounted on the mounting portion (212), the first mounting hole (322) and the second mounting hole (222) are directly opposite to each other to form a mounting channel that cooperates with a fastener.

6. The electroplating anode device according to any one of claims 1 to 5, characterized in that: The anode member (31) is configured as a mesh structure.

7. The electroplating anode device according to any one of claims 1 to 5, characterized in that: The conductive base frame (1) is made of titanium-clad copper material.

8. The electroplating anode device according to any one of claims 1 to 5, characterized in that: The conductive base frame (1) comprises an assembly part and a power connection part, wherein two power connection parts are provided and the two power connection parts are respectively provided on both sides of the assembly part, the power connection part is suitable for being placed above the liquid level of the electroplating liquid to be connected to a power source, and the assembly part is suitable for being placed below the liquid level of the electroplating liquid.

9. The electroplating anode device according to claim 3, characterized in that: The mounting portion is provided with a first assembly hole (11), the mounting base (211) is provided with a second assembly hole, and the first assembly hole (11) is suitable for facing the second assembly hole to form an assembly channel.

10. An electroplating device, characterized in that: An electroplating anode device comprising any one of claims 1-9.

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