Semiconductor packaging detection equipment
By designing semiconductor package detection equipment, using workbenches and component systems to move the package under the CCD camera, the shortcomings of traditional detection methods in complex structures and micro components are solved, and high accuracy and flexible adaptability are achieved.
Patent Information
- Application Number
- CN202421205036.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-29
- Publication Date
- 2025-06-03
- Estimated Expiration
- 2034-05-29
AI Technical Summary
When traditional CCD detection methods detect complex packaging structures and micro components, they lack detection and adjustment capabilities and cannot flexibly adapt to semiconductor packaging of different sizes, resulting in poor adaptability in diversified production environments.
A semiconductor package detection device is designed, including a base, a workbench, a positioning assembly, a transverse assembly and a longitudinal assembly, through which the semiconductor package is moved directly below the CCD camera and the lens barrel to achieve accurate detection.
The device can accurately detect the patch position and the amount of the solder ball of components, and is adapted to semiconductor packages of different sizes, improving detection accuracy and adaptability.
Smart Images
Figure CN222939076U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor detection, in particular to a semiconductor package detection device. Background Art
[0002] In modern electronic industry, the packaging technology of semiconductor devices is one of the key steps to ensure their performance and reliability. In the traditional semiconductor packaging process, it is usually necessary to use a CCD (Charge Coupled Device) to detect the placement position of components and the amount of solder balls.
[0003] With the development of semiconductor devices towards high density and miniaturization, the requirement for packaging accuracy is getting higher and higher. The traditional CCD detection method is more insufficient in its detection and adjustment capabilities when facing complex packaging structures and tiny components. Especially when it is necessary to adapt to semiconductor packages of different sizes, the traditional method cannot achieve flexible adjustment and adaptation, resulting in poor adaptability in diverse production environments. Summary of the Utility Model
[0004] The purpose of the utility model is to provide a semiconductor package detection device for the above deficiencies in the prior art.
[0005] The purpose of the utility model is achieved through the following technical solutions: a semiconductor package detection device, including a base; the base is movably provided with a workbench; the workbench is provided with a positioning component for positioning semiconductor packages; the base is provided with a column; the column is provided with a connecting arm; the connecting arm is provided with a CCD camera; the connecting arm is provided with a lens barrel at the bottom of the CCD camera; the lens barrel is arranged on the top of the workbench;
[0006] The base is provided with a transverse movement component for driving the workbench to move horizontally; the base is provided with a longitudinal movement component for driving the workbench to move longitudinally.
[0007] The utility model is further arranged such that the connecting arm is arranged on the column in a lifting and movable manner; a locking member is arranged between the connecting arm and the column.
[0008] The utility model is further arranged such that the lens barrel is in a frustum shape; a through hole is provided through the middle of the lens barrel; the CCD camera is arranged opposite to the through hole.
[0009] The utility model is further arranged such that a plurality of heat dissipation fins are provided on the top of the lens barrel;
[0010] The plurality of heat dissipation fins are arranged on the top of the lens barrel along the circumference with the through hole as the center of the circle.
[0011] The utility model is further arranged such that a heat dissipation water cavity is provided inside the lens barrel; the lens barrel is provided with a water inlet and a water outlet communicating with the heat dissipation water cavity.
[0012] The utility model is further configured that a turbine is rotatably arranged in the heat dissipation water chamber; and the turbine is sleeved on the outer periphery of the clearance hole.
[0013] The utility model is further configured that the transverse movement assembly includes a transverse movement seat, a transverse movement slide rail arranged on the base, a transverse movement screw rotatably arranged on the base, and a transverse movement hand wheel connected to the transverse movement screw;
[0014] The transverse seat is provided with a transverse sliding block slidably connected to the transverse sliding rail; the transverse seat is provided with a transverse nut threadedly connected to the transverse lead screw.
[0015] The utility model is further configured that the longitudinal movement assembly includes a longitudinal movement slide rail arranged on the transverse movement seat, a longitudinal movement screw rotatably arranged on the transverse movement seat, and a longitudinal movement hand wheel connected to the longitudinal movement screw;
[0016] The workbench is provided with a longitudinal sliding block slidably connected to the longitudinal sliding rail; the workbench is provided with a longitudinal nut threadedly connected to the longitudinal lead screw.
[0017] The utility model is further configured that the positioning assembly includes a transverse fixed block and a transverse movable block; the transverse fixed block and the transverse movable block are arranged in parallel; the workbench is provided with a transverse groove; a transverse spring is provided between the transverse groove and the transverse movable block.
[0018] The utility model is further configured that the positioning assembly includes a longitudinal fixed block and a longitudinal movable block; the longitudinal fixed block is arranged in parallel with the longitudinal movable block; the workbench is provided with a longitudinal groove; a longitudinal spring is provided between the longitudinal groove and the longitudinal movable block.
[0019] Beneficial effects of the utility model: the utility model moves the semiconductor package to the bottom of the CCD camera and the lens barrel through the lateral movement component and the longitudinal movement component, so as to accurately detect the patch position and solder ball amount of the component; thus, it can adapt to semiconductor packages of different sizes. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] The utility model is further described using the accompanying drawings, but the embodiments in the accompanying drawings do not constitute any limitation to the utility model. A person skilled in the art can obtain other drawings based on the following drawings without creative work.
[0021] Figure 1 It is a structural schematic diagram of the utility model;
[0022] Figure 2 It is a structural schematic diagram of the utility model from another perspective;
[0023] Figure 3 It is a cross-sectional view of the utility model;
[0024] Wherein: 1. Base; 11. Transverse sliding rail; 12. Transverse lead screw; 13. Transverse handwheel; 2. Workbench; 31. Column; 32. Connecting arm; 33. Locking member; 4. CCD camera; 5. Lens barrel; 51. Relief hole; 52. Heat sink; 53. Heat dissipation water cavity; 54. Turbine; 6. Transverse seat; 61. Transverse slider; 71. Longitudinal sliding rail; 72. Longitudinal lead screw; 73. Longitudinal handwheel; 74. Longitudinal slider; 81. Transverse fixed block; 82. Transverse movable block; 83. Transverse groove; 84. Transverse spring; 91. Longitudinal fixed block; 92. Longitudinal movable block; 93. Longitudinal groove; 94. Longitudinal spring. Detailed implementation manners
[0025] The present utility model will be further described in conjunction with the following embodiments.
[0026] As Figures 1 to 3 can be seen, a semiconductor package testing device described in this embodiment includes a base 1; the base 1 is movably provided with a workbench 2; the workbench 2 is provided with a positioning component for positioning a semiconductor package; the base 1 is provided with a column 31; the column 31 is provided with a connecting arm 32; the connecting arm 32 is provided with a CCD camera 4; the connecting arm 32 is provided with a lens barrel 5 at the bottom of the CCD camera 4; the lens barrel 5 is arranged on the top of the workbench 2;
[0027] The base 1 is provided with a transverse movement component for driving the workbench 2 to move horizontally; the base 1 is provided with a longitudinal movement component for driving the workbench 2 to move vertically.
[0028] Specifically, when the semiconductor package testing device described in this embodiment detects a semiconductor package, first place the semiconductor package on the positioning component of the workbench 2, and then move the semiconductor package to directly below the CCD camera 4 and the lens barrel 5 through the transverse movement component and the longitudinal movement component, so as to accurately detect the chip placement position and the amount of solder balls of the components.
[0029] In a semiconductor package testing device described in this embodiment, the connecting arm 32 is vertically movably arranged on the column 31; a locking member 33 is arranged between the connecting arm 32 and the column 31. Specifically, the above setting facilitates adjusting the height of the CCD camera 4 and the lens barrel 5; the locking member 33 can be a bolt or a quick-release member, etc.
[0030] In a semiconductor package testing device described in this embodiment, the lens barrel 5 is frustum-shaped; a relief hole 51 is provided through the middle of the lens barrel 5; the CCD camera 4 is arranged opposite to the relief hole 51. Specifically, the above setting makes the detection of the CCD camera 4 stable and reliable.
[0031] A semiconductor package detection device according to this embodiment, wherein a plurality of heat sinks 52 are provided on the top of the lens barrel 5;
[0032] The plurality of heat sinks 52 are distributed along the circumference on the top of the lens barrel 5 with the relief hole 51 as the center.
[0033] Specifically, through the above settings, the lens barrel 5 can be effectively cooled, thereby ensuring the measurement accuracy.
[0034] A semiconductor package detection device according to this embodiment, wherein a water-cooling cavity 53 is provided inside the lens barrel 5; the lens barrel 5 is provided with a water inlet and a water outlet communicating with the water-cooling cavity 53. The water inlet and the water outlet are not shown in the figure. Specifically, through the above settings, a water source can be externally connected to the water inlet and the water outlet, thereby enabling water cooling of the lens barrel 5 and further improving the heat dissipation effect of the lens barrel 5.
[0035] A semiconductor package detection device according to this embodiment, wherein a turbine 54 is rotatably provided in the water-cooling cavity 53; the turbine 54 is sleeved on the outer periphery of the relief hole 51. Through the above settings, the liquid flow in the water-cooling cavity 53 can be accelerated, thereby further enhancing the heat dissipation effect of the lens barrel 5.
[0036] A semiconductor package detection device according to this embodiment, wherein the transverse movement assembly includes a transverse movement base 6, a transverse movement slide rail 11 provided on the base 1, a transverse movement lead screw 12 rotatably provided on the base 1, and a transverse movement hand wheel 13 connected to the transverse movement lead screw 12;
[0037] The transverse movement base 6 is provided with a transverse movement slider 61 slidably connected to the transverse movement slide rail 11; the transverse movement base 6 is provided with a transverse movement nut threadedly connected to the transverse movement lead screw 12.
[0038] Specifically, when the workbench 2 needs to be horizontally adjusted, by rotating the transverse movement nut, the transverse movement lead screw 12 is rotated. During the rotation of the transverse movement lead screw 12, the transverse movement base 6 can move along the transverse movement slide rail 11, thereby realizing the horizontal movement of the workbench 2.
[0039] A semiconductor package detection device according to this embodiment, wherein the longitudinal movement assembly includes a longitudinal movement slide rail 71 provided on the transverse movement base 6, a longitudinal movement lead screw 72 rotatably provided on the transverse movement base 6, and a longitudinal movement hand wheel 73 connected to the longitudinal movement lead screw 72;
[0040] The workbench 2 is provided with a longitudinal movement slider 74 slidably connected to the longitudinal movement slide rail 71; the workbench 2 is provided with a longitudinal movement nut threadedly connected to the longitudinal movement lead screw 72.
[0041] Specifically, when it is necessary to perform horizontal adjustment on the workbench 2, by rotating the longitudinal movement nut, the longitudinal movement lead screw 72 is rotated. During the rotation of the longitudinal movement lead screw 72, the workbench 2 can move along the longitudinal movement slide rail 71, thereby realizing the longitudinal movement of the workbench 2.
[0042] A semiconductor package testing device according to this embodiment, the positioning assembly includes a horizontal fixed block 81 and a horizontal movable block 82; the horizontal fixed block 81 and the horizontal movable block 82 are arranged in parallel; the workbench 2 is provided with a horizontal groove 83; a horizontal spring 84 is arranged between the horizontal groove 83 and the horizontal movable block 82.
[0043] A semiconductor package testing device according to this embodiment, the positioning assembly includes a longitudinal fixed block 91 and a longitudinal movable block 92; the longitudinal fixed block 91 and the longitudinal movable block 92 are arranged in parallel; the workbench 2 is provided with a longitudinal groove 93; a longitudinal spring 94 is arranged between the longitudinal groove 93 and the longitudinal movable block 92.
[0044] Specifically, when placing the semiconductor package, first pull the longitudinal movable block 92 and the horizontal movable block 82, then abut the adjacent two sides of the semiconductor package against the longitudinal fixed block 91 and the horizontal fixed block 81 respectively, and then release the longitudinal movable block 92 and the horizontal movable block 82. Under the action of the longitudinal spring 94 and the horizontal spring 84, the semiconductor package is fixed between the longitudinal movable block 92, the horizontal movable block 82, the longitudinal fixed block 91 and the horizontal fixed block 81, so as to be able to adapt to semiconductor packages of different sizes.
[0045] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than limiting the protection scope of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the essence and scope of the technical solutions of the present invention.
Claims
1. A semiconductor packaging testing device, characterized in that: The invention comprises a base (1); the base (1) is movably provided with a workbench (2); the workbench (2) is provided with a positioning component for positioning a semiconductor package; the base (1) is provided with a column (31); the column (31) is provided with a connecting arm (32); the connecting arm (32) is provided with a CCD camera (4); the connecting arm (32) is provided with a lens barrel (5) at the bottom of the CCD camera (4); the lens barrel (5) is provided on the top of the workbench (2); The base (1) is provided with a transverse movement component for driving the workbench (2) to move transversely; the base (1) is provided with a longitudinal movement component for driving the workbench (2) to move longitudinally.
2. A semiconductor packaging testing device according to claim 1, characterized in that: The connecting arm (32) is movably arranged on the column (31) for lifting; a locking piece (33) is arranged between the connecting arm (32) and the column (31).
3. The semiconductor packaging testing equipment according to claim 1, characterized in that: The lens barrel (5) is in the shape of a truncated cone; a clearance hole (51) is provided through the middle of the lens barrel (5); and the CCD camera (4) is arranged opposite to the clearance hole (51).
4. The semiconductor packaging testing equipment according to claim 3, characterized in that: A plurality of heat sinks (52) are provided on the top of the lens barrel (5); A plurality of heat sinks (52) are arranged on the top of the lens barrel (5) distributed along the circumference with the clearance hole (51) as the center of the circle.
5. The semiconductor packaging testing equipment according to claim 3, characterized in that: A heat dissipation water cavity (53) is provided in the lens barrel (5); and a water inlet and a water outlet communicated with the heat dissipation water cavity (53) are provided in the lens barrel (5).
6. The semiconductor packaging testing equipment according to claim 5, characterized in that: A turbine (54) is rotatably arranged in the heat dissipation water chamber (53); the turbine (54) is sleeved on the outer periphery of the clearance hole (51).
7. The semiconductor packaging testing equipment according to claim 1, characterized in that: The transverse movement assembly comprises a transverse movement seat (6), a transverse movement slide rail (11) arranged on the base (1), a transverse movement screw (12) rotatably arranged on the base (1), and a transverse movement hand wheel (13) connected to the transverse movement screw (12); The transverse seat (6) is provided with a transverse sliding block (61) slidably connected to the transverse sliding rail (11); the transverse seat (6) is provided with a transverse nut threadedly connected to the transverse lead screw (12).
8. The semiconductor packaging testing equipment according to claim 1, characterized in that: The longitudinal movement assembly comprises a longitudinal movement slide rail (71) arranged on the transverse movement seat (6), a longitudinal movement screw (72) rotatably arranged on the transverse movement seat (6), and a longitudinal movement hand wheel (73) connected to the longitudinal movement screw (72); The workbench (2) is provided with a longitudinal movement slider (74) slidably connected to the longitudinal movement slide rail (71); the workbench (2) is provided with a longitudinal movement nut threadedly connected to the longitudinal movement lead screw (72).
9. The semiconductor packaging testing equipment according to claim 1, characterized in that: The positioning assembly comprises a transverse fixed block (81) and a transverse movable block (82); the transverse fixed block (81) and the transverse movable block (82) are arranged in parallel; the workbench (2) is provided with a transverse groove (83); and a transverse spring (84) is provided between the transverse groove (83) and the transverse movable block (82).
10. The semiconductor packaging testing equipment according to claim 1, characterized in that: The positioning assembly comprises a longitudinal fixed block (91) and a longitudinal movable block (92); the longitudinal fixed block (91) and the longitudinal movable block (92) are arranged in parallel; the workbench (2) is provided with a longitudinal groove (93); and a longitudinal spring (94) is provided between the longitudinal groove (93) and the longitudinal movable block (92).