Anti-deformation vertical needle card
By installing the inner heating electrode inside the PCB board, uniform heating and tension balance, the problem of poor contact caused by heat deformation under high temperature tests is solved, and the stable contact of the probe and efficient wafer testing is achieved.
Patent Information
- Application Number
- CN202421337293.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-13
- Publication Date
- 2025-06-03
- Estimated Expiration
- 2034-06-13
AI Technical Summary
Under high temperature testing conditions, the probes of the vertical probe card have poor contact due to heat deformation, resulting in chip test failure, increasing the yield loss of end customers.
Install an inner heating electrode inside the PCB board to ensure the tension of the upper and lower surfaces of the circuit adapter plate is consistent, suppress deformation, and ensure stable contact between the probe and the circuit adapter plate.
Through uniform heating and tension balance, the slight deformation caused by expansion of the circuit adapter plate due to uneven heat is avoided, the stable contact of the probe is ensured, and the defect rate of the wafer is reduced.
Smart Images
Figure CN222939171U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of needle cards, and more specifically to an anti-deformation vertical needle card. Background Art
[0002] A vertical needle card, also known as a vertical probe card, is an important interface device in semiconductor testing. It is mainly used in the wafer testing stage to perform preliminary electrical performance detection and screening through direct electrical connection with the chip under test. The design of the vertical needle card allows it to exhibit excellent performance in small-pitch, high-frequency chip testing, and is particularly suitable for logic products such as CPUs, GPUs, and various SoC products.
[0003] The core feature of the vertical needle card lies in the vertical layout of its probes and the substrate. This structure not only saves space but also increases the probe density and quantity, enabling smaller probe diameters and easier replacement. Specifically in terms of technical implementation, a vertical needle card usually consists of three main parts: a PCB board, a Space Transformer, and a Probe Head. Among them, the Space Transformer may use multi-layer organic or ceramic materials such as MLO or MLC to optimize the signal transmission path; while the probe head part contains the tiny probes that actually contact the chip under test.
[0004] In terms of application scenarios, vertical needle cards are widely used in wafer-level testing of various high-performance chips, such as smartphone processors, image sensors, and high-speed communication chips in autonomous driving vehicles. Due to the extremely high performance requirements for chips in these application fields, vertical needle cards meet these high-end testing needs with their excellent electrical performance characteristics. For example, the micro-cantilever test probe card launched by Sida Technology is specifically designed for image sensors, supporting up to 15,000 micro-cantilever test probes, which can significantly improve production efficiency and reduce testing costs.
[0005] Due to the current popularization of the new energy market, the demand for electric vehicle chips is increasing, and the application of automotive-grade chips is also becoming more and more widespread. The testing requirements for automotive-grade chips have also been correspondingly improved. In order to meet the testing needs of high-end automotive-grade chips, many chip testing manufacturers have added high and low temperature testing machines.
[0006] Previously, high-temperature testing could be handled by increasing and adjusting the physical parameters of the probes. Since the current testing temperature has increased by 50% to reach 150 degrees Celsius. The probes of the vertical probe card are double-headed contacts, which require a relatively high flatness of the PCB. Once the degree of thermal deformation during the testing process is too large, probe contact failure will occur, resulting in chip testing failure and causing yield loss for end customers. Summary of the Utility Model
[0007] To overcome the above-mentioned defects of the prior art, the present utility model provides an anti-deformation vertical pin card. By installing an inner heating electrode inside the PCB board, the surface tensions on the upper and lower surfaces of the circuit adapter board are made consistent, thereby suppressing deformation and achieving the purpose of stable testing. This avoids the situation where the circuit adapter board expands due to uneven heating and generates minute deformations, preventing poor contact between the curved probes and the circuit adapter board and resulting in an increase in the defect rate of the wafers, so as to solve the problems appearing in the above-mentioned background art.
[0008] To achieve the above object, the present utility model provides the following technical solution: An anti-deformation vertical pin card, comprising a temperature-raising component for heating a chip for detection;
[0009] The temperature-raising component includes a wafer heating chuck, a wafer component, curved probes, a ceramic component, and a circuit adapter board. The wafer component is installed on the top of the wafer heating chuck, the curved probes are installed on the top of the wafer component, the ceramic component is installed on the top of the curved probes, and the circuit adapter board is installed on the top of the ceramic component. By the combined use of the wafer heating chuck, the wafer component, the curved probes, the ceramic component, and the circuit adapter board in the temperature-raising component, the temperature of the chip can be detected, improving the detection efficiency of the chip by the staff.
[0010] Outside the temperature-raising component, there is a function component for preventing deformation;
[0011] The function component includes a PCB board. The PCB board is arranged on the top of the temperature-raising component. An inner heating electrode is embedded in the top of the PCB board. The PCB board is arranged on the top of the circuit adapter board. By installing an inner heating electrode inside the PCB board, the surface tensions on the upper and lower surfaces of the circuit adapter board are made consistent, thereby suppressing deformation and achieving the purpose of stable testing, avoiding the situation where the circuit adapter board expands due to uneven heating and generates minute deformations.
[0012] In a preferred embodiment, the cross-section of the inner heating electrode is annular. By setting the inner heating electrode as an arc shape, the heat distribution can be made more uniform, and thus the circuit adapter board can also be heated more evenly, avoiding the situation of deformation due to uneven heating.
[0013] In a preferred embodiment, a fixing member is installed outside the circuit adapter board. The fixing member is installed at the bottom of the PCB board. By the connection between the fixing member and the PCB board, the connection stability and tightness between the circuit adapter board and the PCB board can be ensured, avoiding the situation where the circuit adapter board is skewed or collapses.
[0014] In a preferred embodiment, a metal reinforcement plate is provided on the top of the PCB board. By the provision of the metal reinforcement plate, the vertical pin card can be placed, thereby facilitating the temperature-raising component to detect the chip and ensuring the stability of the chip during detection.
[0015] In a preferred embodiment, a plurality of connection holes are provided in the outer ring of the metal reinforcing plate, and the plurality of connection holes are evenly spaced. Through the plurality of connection holes on the metal reinforcing plate, it is convenient for the staff to operate the connection between the metal reinforcing plate and the equipment, and improve the convenience of the staff to install the metal reinforcing plate.
[0016] Technical effects and advantages of the present utility model:
[0017] By installing an inner layer heating electrode inside the PCB board, the surface tension of the upper and lower surfaces of the circuit transfer board is made consistent, so as to suppress deformation, achieve the purpose of stable testing, avoid the occurrence of slight deformation caused by the uneven heating and expansion of the circuit transfer board, and avoid the situation that the contact between the curved probe and the circuit transfer board is poor, resulting in an increase in the defective rate of the wafer. Description of the drawings
[0018] Figure 1 is a schematic diagram of the overall structure of the present utility model;
[0019] Figure 2 is of the present utility model Figure 1 enlarged view of part A;
[0020] Figure 3 is of the present utility model Figure 1 enlarged view of part B;
[0021] Figure 4 is of the present utility model Figure 1 enlarged view of part C;
[0022] Figure 5 is a top view of the inner layer heating electrode of the present utility model.
[0023] Reference numerals are: 1, PCB board; 2, inner layer heating electrode; 3, wafer heating suction cup; 4, wafer component; 5, curved probe; 6, ceramic component; 7, circuit transfer board; 8, fixing component; 9, metal reinforcing plate; 10, connection hole. Specific embodiments
[0024] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.
[0025] Referring to the attached Figures 1-5 drawings, the present utility model provides an anti-deformation vertical pin card, including a temperature-raising component for heating the chip for detection;
[0026] For facilitating the heating detection of the chip, as Figure 1 、 2 and shown in 4, the temperature-raising component includes a wafer heating chuck 3, a wafer component 4, a curved probe 5, a ceramic component 6 and a circuit adapter board 7. The wafer component 4 is installed on the top of the wafer heating chuck 3, the curved probe 5 is installed on the top of the wafer component 4, the ceramic component 6 is installed on the top of the curved probe 5, and the circuit adapter board 7 is installed on the top of the ceramic component 6. By the cooperative use of the wafer heating chuck 3, the wafer component 4, the curved probe 5, the ceramic component 6 and the circuit adapter board 7 in the temperature-raising component, the temperature of the chip can be detected, and the detection efficiency of the chip by the staff can be improved.
[0027] A functional component for preventing deformation is provided outside the temperature-raising component;
[0028] To ensure the uniform heating of the circuit adapter board 7 and avoid the situation of deformation due to uneven heating, as Figure 1 、 3 、4 and 5 shown, the functional component includes a PCB board 1. The PCB board 1 is arranged on the top of the temperature-raising component, an inner-layer heating electrode 2 is embedded on the top of the PCB board 1, and the PCB board 1 is arranged on the top of the circuit adapter board 7.
[0029] Specifically, by installing the inner-layer heating electrode 2 inside the PCB board 1, the upper and lower surface tensions of the circuit adapter board 7 are made consistent, so as to suppress deformation and achieve the purpose of stabilizing the test of the curved probe 5, and avoid the situation of slight deformation caused by the expansion of the circuit adapter board 7 due to uneven heating.
[0030] To enable better heat distribution, as Figure 5 shown, the cross-section of the inner-layer heating electrode 2 is annular. By setting the inner-layer heating electrode 2 as an arc shape, the heat distribution can be made more uniform, and thus the circuit adapter board 7 can also be heated more uniformly, avoiding the situation of deformation due to uneven heating.
[0031] To ensure the installation stability of the circuit adapter board 7, as Figure 1 and 2 shown, a fixing member 8 is installed outside the circuit adapter board 7, and the fixing member 8 is installed at the bottom of the PCB board 1. By the connection between the fixing member 8 and the PCB board 1, the connection stability and connection tightness between the circuit adapter board 7 and the PCB board 1 can be ensured, and the situation of the circuit adapter board 7 being skewed or collapsing can be avoided.
[0032] For facilitating the placement detection of the chip, as Figure 1As shown in the figure, a metal reinforcement plate 9 is provided on the top of the PCB board 1. Through the setting of the metal reinforcement plate 9, the vertical pin card can be placed, so that the temperature-raising component can detect the chip, ensuring the stability of the chip during detection. A plurality of connection holes 10 are formed in the outer circle of the metal reinforcement plate 9, and the plurality of connection holes 10 are evenly spaced. Through the plurality of connection holes 10 on the metal reinforcement plate 9, it is convenient for the staff to operate the connection between the metal reinforcement plate 9 and the device, improving the convenience of the staff to install the metal reinforcement plate 9.
[0033] The staff places the chip on the top of the metal reinforcement plate 9 for detection. Then, with the cooperation of the wafer heating chuck 3, the wafer component 4, the curved probe 5, the ceramic component 6 and the circuit adapter board 7 in the temperature-raising component, the temperature of the chip can be detected. The circuit adapter board 7 will generate a small deformation due to thermal expansion, avoiding poor contact between the curved probe and the circuit adapter board 7, which may lead to an increase in the defect rate of the wafer. Therefore, in the present utility model, an inner-layer heating electrode 2 is installed inside the PCB board 1, so that the upper and lower surface tensions of the circuit adapter board 7 are consistent, thereby suppressing deformation and achieving the purpose of stable testing, and effectively improving the practicality of the present utility model.
[0034] Finally: The above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.
Claims
1. A deformation-resistant vertical needle clamp, characterized in that: including a heating component for heating the chip for testing; The heating component comprises a wafer heating chuck (3), a wafer piece (4), a curved probe (5), a ceramic component (6) and a circuit adapter board (7), wherein the wafer piece (4) is mounted on the top of the wafer heating chuck (3), the curved probe (5) is mounted on the top of the wafer piece (4), the ceramic component (6) is mounted on the top of the curved probe (5), and the circuit adapter board (7) is mounted on the top of the ceramic component (6); The heating component is provided with a functional component for preventing deformation outside. The functional component comprises a PCB board (1), the PCB board (1) is arranged on the top of the heating component, an inner layer heating electrode (2) is embedded on the top of the PCB board (1), and the PCB board (1) is arranged on the top of the circuit adapter board (7).
2. The anti-deformation vertical pin clamp according to claim 1, characterized in that: The inner layer heating electrode (2) has a ring-shaped cross section.
3. The anti-deformation vertical pin clamp according to claim 1, characterized in that: A fixing component (8) is installed on the outside of the circuit adapter board (7), and the fixing component (8) is installed on the bottom of the PCB board (1).
4. The anti-deformation vertical pin clamp according to claim 1, characterized in that: A metal reinforcement plate (9) is provided on the top of the PCB board (1).
5. The anti-deformation vertical pin clamp according to claim 4, characterized in that: The outer ring of the metal reinforcing plate (9) is provided with a plurality of connection holes (10), and the plurality of connection holes (10) are evenly spaced and distributed.