Computer case heat dissipation structure

Abstract

The utility model provides a computer case heat dissipation structure which comprises a case body, a partition plate is fixedly installed in the case body, a frame is fixedly installed between the partition plate and the top of the case body, and heat dissipation holes are formed in the back face, the right side face and the top of the case body. Mounting frames are fixedly mounted on the inner wall of the back face of the case body, the surface of the frame and the inner wall of the top of the case body, cooling fans are arranged in the mounting frames, a heat absorption mechanism is arranged in the case body, and connecting mechanisms are arranged between the mounting frames and the cooling fans. Through the use of the heat absorption mechanism, air inlet holes are uniformly distributed in the heat absorption pipe in the case body, hot air in the case can be rapidly absorbed, heat is transferred to cooling liquid passing through the interior through an internal liquid conveying pipe, meanwhile, the heat exchange area is further increased through heat dissipation fins arranged in the heat absorption pipe, and the heat dissipation efficiency is improved; and in cooperation with a plurality of heat dissipation fans inside, the heat dissipation efficiency can be greatly improved.

Description

Technical Field

[0001] The utility model relates to the field of computer chassis, and more specifically, to a heat dissipation structure for a computer chassis. Background Art

[0002] As a core component of a personal computer, the computer chassis plays a crucial role. It not only provides a safe and stable loading environment for internal precision hardware such as motherboards, processors, graphics cards, and storage devices, but also ensures the stable operation and long lifespan of the computer under high-intensity work through its sturdy shell and reasonable heat dissipation design. With the continuous improvement of computer hardware performance, components such as high-performance processors and graphics processors generate a large amount of heat during operation. If the heat cannot be dissipated in a timely and effective manner, it will lead to a decline in system stability, a shortening of hardware lifespan, and even damage.

[0003] Most traditional computer chassis heat dissipation methods rely on direct blowing by fans. However, with the continuous improvement of computer performance and the increase in hardware power consumption, the heat dissipation effect of simple direct blowing by fans is not satisfactory. During high-load operation, key components such as processors and graphics cards may still face the risk of overheating, which not only affects the performance and stability of the computer but also may shorten the service life of the hardware. In addition, most existing cooling fans are fixed to the chassis or heat dissipation module by screws. Although this connection method is stable, the installation and disassembly process is relatively cumbersome. When users perform hardware maintenance, upgrades, or dust cleaning, they need to spend extra time and effort to tighten and loosen the screws, which is not only inconvenient to operate but also may damage the fan or chassis components due to loose or over-tightened screws.

[0004] Therefore, we have made improvements and proposed a heat dissipation structure for a computer chassis. Summary of the Utility Model

[0005] Aiming at the deficiencies of the prior art, the utility model provides a heat dissipation structure for a computer chassis, which solves the problems mentioned in the background art.

[0006] To achieve the above-mentioned utility model purpose, the utility model provides the following technical solutions:

[0007] A heat dissipation structure for a computer chassis to solve the above problems.

[0008] Specifically, this application is as follows:

[0009] It includes a chassis body, a partition is fixedly installed inside the chassis body, and a frame is fixedly installed between the partition and the top of the chassis body. Heat dissipation holes are provided on the back, right side and top of the chassis body, and mounting brackets are fixedly installed on the inner wall of the back, the surface of the frame and the inner wall of the top of the chassis body. And a heat dissipation fan is arranged inside the mounting bracket. An endothermic mechanism is arranged inside the chassis body, and a connection mechanism is arranged between the mounting bracket and the heat dissipation fan;

[0010] The endothermic mechanism includes an endothermic tube, and the endothermic tube is fixedly installed on the upper surface of the partition. Air intake holes are evenly arranged on the surface of the endothermic tube, and an infusion tube is arranged inside the endothermic tube.

[0011] As a preferred technical solution of the present application, a number of heat dissipation fins are fixedly installed inside the endothermic tube, and the other ends of the number of heat dissipation fins extend into the infusion tube.

[0012] As a preferred technical solution of the present application, a coolant tank is arranged between the partition and the bottom of the chassis body, a water pump is fixedly installed at the bottom of the coolant tank, a connecting pipe is installed on one side surface of the water pump, and one end of the infusion tube is fixedly connected to the upper side of the water pump. The other end of the infusion tube extends into the coolant tank through the endothermic tube.

[0013] As a preferred technical solution of the present application, a micro-refrigerator is fixedly installed inside the coolant tank, and a liquid inlet pipe is fixedly installed on one side surface of the micro-refrigerator. The micro-refrigerator is connected to the connecting pipe.

[0014] As a preferred technical solution of the present application, the connection mechanism includes a chute, and the chute is arranged inside the mounting bracket. The heat dissipation fan is slidably connected to the chute, and the heat dissipation fan and the mounting bracket form a clamping mechanism.

[0015] As a preferred technical solution of the present application, connection grooves are arranged on the upper and lower side surfaces of the chute, a limiting plate is slidably connected inside the connection groove, a convex block is fixedly installed on one side surface of the limiting plate, and a spring is fixedly installed between the limiting plate and the inner wall of the connection groove. And the convex block is trapezoidally arranged. Card slots are arranged on the upper and lower side surfaces of the heat dissipation fan, and the connection mode between the convex block and the card slot is clamping connection.

[0016] Compared with the prior art, the beneficial effects of the present utility model are:

[0017] In the solution of the present application:

[0018] 1. By using the heat absorption mechanism, the intake holes are evenly distributed in the heat absorption pipes inside the chassis body, which can quickly absorb the hot air inside the chassis and transfer the heat to the coolant passing through inside through the internal liquid delivery pipe. At the same time, the heat dissipation fins arranged in the heat absorption pipes further increase the heat exchange area and improve the heat dissipation efficiency. Cooperating with multiple internal cooling fans, the heat dissipation efficiency can be greatly improved.

[0019] 2. By using the connection mechanism, the chute design in the connection mechanism enables the cooling fan to slide into place easily and achieves a firm connection through the engagement of the limiting plate and the convex block. It can simplify the installation and disassembly process of the cooling fan, improve the convenience of maintenance, and ensure the stability and reliability of the cooling fan during operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a three-dimensional structural schematic diagram of the computer chassis heat dissipation structure provided by the present application;

[0021] Figure 2 is a three-dimensional structural schematic diagram of the interior of the computer chassis heat dissipation structure provided by the present application;

[0022] Figure 3 is a cross-sectional structural schematic diagram of the side view of the chassis body of the computer chassis heat dissipation structure provided by the present application;

[0023] Figure 4 is the computer chassis heat dissipation structure provided by the present application Figure 3 an enlarged structural schematic diagram of part A therein;

[0024] Figure 5 is a structural schematic diagram of the heat absorption pipe and the liquid delivery pipe of the computer chassis heat dissipation structure provided by the present application;

[0025] Figure 6 is a structural schematic diagram of the mounting rack and the cooling fan of the computer chassis heat dissipation structure provided by the present application;

[0026] Figure 7 is a cross-sectional structural schematic diagram of the mounting rack of the computer chassis heat dissipation structure provided by the present application;

[0027] Figure 8 is the computer chassis heat dissipation structure provided by the present application Figure 7 an enlarged structural schematic diagram of part B therein.

[0028] Labels in the figure:

[0029] 1. Chassis body; 2. Partition board; 3. Frame; 4. Heat dissipation holes; 5. Mounting bracket; 6. Heat dissipation fan; 7. Heat absorption mechanism; 701. Heat absorption pipe; 702. Air inlet hole; 703. Liquid infusion pipe; 704. Heat dissipation fins; 705. Coolant tank; 706. Water pump; 707. Connecting pipe; 708. Miniature refrigerator; 709. Liquid inlet pipe; 8. Connecting mechanism; 801. Slide groove; 802. Connecting groove; 803. Limiting plate; 804. Protrusion; 805. Spring; 806. Card slot. Specific embodiments

[0030] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Apparently, the described embodiments are only a part rather than all of the embodiments of the present utility model.

[0031] Therefore, the following detailed description of the embodiments of the present utility model is not intended to limit the scope of the claimed present utility model, but merely represents some embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts fall within the scope of protection of the present utility model.

[0032] It should be noted that, without conflict, the embodiments in the present utility model and the features and technical solutions in the embodiments may be combined with each other.

[0033] It should be noted that similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0034] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by terms such as "upper" and "lower" is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the present utility model is usually placed during use, or the orientation or positional relationship commonly understood by those skilled in the art. Such terms are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model. In addition, terms such as "first" and "second" are only used for descriptive distinction and should not be construed as indicating or implying relative importance.

[0035] To solve the technical problems in the background art, the following computer chassis heat dissipation structure is provided:

[0036] Combined with Figure 1 - Figure 8As shown in the figure, a computer case heat dissipation structure provided by the utility model includes a case body 1. A partition 2 is fixedly installed inside the case body 1, and a frame 3 is fixedly installed between the partition 2 and the top of the case body 1. Heat dissipation holes 4 are opened on the back, right side and top of the case body 1, and mounting brackets 5 are fixedly installed on the inner wall of the back of the case body 1, the surface of the frame 3 and the inner wall of the top. And a heat dissipation fan 6 is arranged inside the mounting bracket 5. An endothermic mechanism 7 is arranged inside the case body 1, and a connection mechanism 8 is arranged between the mounting bracket 5 and the heat dissipation fan 6; the endothermic mechanism 7 includes an endothermic tube 701, and the endothermic tube 701 is fixedly installed on the upper surface of the partition 2. Air intake holes 702 are evenly opened on the surface of the endothermic tube 701, and an infusion tube 703 is arranged inside the endothermic tube 701.

[0037] In this embodiment: Inside the case body 1, through the fixedly installed partition 2 and frame 3, an orderly layout space can be provided for the hardware. At the same time, heat dissipation holes 4 are opened on the back, right side and top of the case body 1 to optimize air circulation. The mounting brackets 5 are fixed on the inner wall of the case, the surface of the frame 3 and the top of the case, and the heat dissipation fans 6 configured inside can accelerate the discharge of heat inside the case body 1; the endothermic mechanism 7 arranged inside the case body 1 can efficiently absorb the heat inside the case through the endothermic tube 701 fixed on the partition 2 and the air intake holes 702 evenly distributed on its surface, and conduct the heat to the coolant inside the infusion tube 703 through the internal infusion tube 703 for absorption to achieve the purpose of heat dissipation.

[0038] Reference Figure 5 , on the basis of the above embodiment, in order to improve the heat absorption capacity of the endothermic tube 701, the following design is given in this embodiment:

[0039] As a preferred implementation manner, a plurality of heat dissipation fins 704 are fixedly installed inside the endothermic tube 701, and the other ends of the plurality of heat dissipation fins 704 extend into the inside of the infusion tube 703.

[0040] In this embodiment: By fixedly installing a plurality of heat dissipation fins 704 inside the endothermic tube 701, these heat dissipation fins 704 can increase the surface area of heat exchange. The other ends of the heat dissipation fins 704 extend into the inside of the infusion tube 703, which can more effectively transfer the absorbed heat to the coolant, can greatly improve the heat conduction efficiency of the endothermic tube 701, and thus achieve higher heat dissipation performance.

[0041] Reference Figure 1 - Figure 4 , on the basis of the above embodiment, in order to realize the recycling of the coolant and continuously take away the heat inside the case body 1, the following design is given in this embodiment:

[0042] As a preferred embodiment, a coolant tank 705 is provided between the partition 2 and the bottom of the chassis body 1, and a water pump 706 is fixedly installed at the bottom of the coolant tank 705. A connecting pipe 707 is installed on one side surface of the water pump 706, and one end of the infusion pipe 703 is fixedly connected to the upper side of the water pump 706, and the other end of the infusion pipe 703 extends into the interior of the coolant tank 705 through the heat absorption pipe 701.

[0043] In this embodiment: By adding a coolant tank 705 between the partition 2 and the bottom of the chassis body 1, and fixedly installing a water pump 706 at the bottom of the coolant tank 705, and connecting the water pump 706 to the infusion pipe 703 through the connecting pipe 707, a complete coolant circulation loop can be formed; specifically, one end of the infusion pipe 703 is fixedly connected to the upper side of the water pump 706, and the other end passes through the heat absorption pipe 701 and extends into the interior of the coolant tank 705, so that the water pump 706 can pump the coolant out of the coolant tank 705, transport it through the infusion pipe 703 to the heat absorption pipe 701 for heat exchange, and then send the heated coolant back to the coolant tank 705 for cooling treatment.

[0044] Reference Figure 3 and Figure 4 , on the basis of the above embodiment, in order to be able to cool the heated coolant, the following design is given in this embodiment:

[0045] As a preferred embodiment, a micro-refrigerator 708 is fixedly installed inside the coolant tank 705, and a liquid inlet pipe 709 is fixedly installed on one side surface of the micro-refrigerator 708, and the micro-refrigerator 708 is connected to the connecting pipe 707.

[0046] In this embodiment: By fixedly installing a micro-refrigerator 708 inside the coolant tank 705, and connecting the micro-refrigerator 708 to the connecting pipe 707 through the liquid inlet pipe 709 fixedly installed on one side surface, a closed-loop system for cooling the coolant is formed. When the heated coolant flows back from the heat absorption pipe 701 to the coolant tank 705, it will be cooled by the micro-refrigerator 708, and then re-enter the heat absorption pipe 701 through the connecting pipe 707 and the infusion pipe 703 for the next round of heat exchange, which can significantly improve the cooling efficiency of the coolant and ensure that the temperature inside the chassis body 1 can be continuously and stably maintained at a lower level.

[0047] Reference Figure 1 - Figure 8 , on the basis of the above embodiment, in order to be able to facilitate the installation and disassembly of the cooling fan 6, the following design is given in this embodiment:

[0048] As a preferred embodiment, the connecting mechanism 8 includes a chute 801, and the chute 801 is opened inside the mounting bracket 5. The cooling fan 6 is slidably connected to the chute 801, and the cooling fan 6 and the mounting bracket 5 form a clamping mechanism.

[0049] In this embodiment: By opening the chute 801 inside the mounting bracket 5, the cooling fan 6 is slidably connected to this chute 801. At the same time, a clamping mechanism is also formed between the cooling fan 6 and the mounting bracket 5, making the installation and disassembly process of the cooling fan 6 extremely simple. Just slide the cooling fan 6 along the chute 801 to the designated position and then fix it through the clamping mechanism, without the need to use any tools or complex operation steps.

[0050] Reference Figure 6 - Figure 8 , on the basis of the above embodiment, in order to be able to fix and limit the cooling fan 6, the following design is given in this embodiment:

[0051] As a preferred embodiment, connection grooves 802 are opened on both the upper and lower surfaces of the chute 801, and a limiting plate 803 is slidably connected inside the connection groove 802. A convex block 804 is fixedly installed on one side surface of the limiting plate 803. A spring 805 is fixedly installed between the limiting plate 803 and the inner wall of the connection groove 802, and the convex block 804 is trapezoidally arranged. Card slots 806 are opened on both the upper and lower surfaces of the cooling fan 6, and the connection method between the convex block 804 and the card slot 806 is a clamping connection.

[0052] In this embodiment: Connection grooves 802 are respectively opened on both the upper and lower surfaces of the chute 801, and slidable limiting plates 803 are arranged inside these connection grooves 802. A trapezoidal convex block 804 is fixedly installed on one side surface of the limiting plate 803, and a spring 805 is installed between the limiting plate 803 and the inner wall of the connection groove 802, enabling the limiting plate 803 and the convex block 804 on its upper side to automatically reset when not affected by external forces; Card slots 806 matching the convex block 804 are respectively provided on both the upper and lower sides of the cooling fan 6. During installation, after the cooling fan 6 slides along the chute 801 to the in-place position, the inclined surface of the trapezoidal convex block 804 will contract inward due to the extrusion of the cooling fan 6 until it is completely clamped into the card slot 806, and the installation can be completed. It can ensure the stable installation of the cooling fan 6 without external forces. During disassembly, just slide the cooling fan 6, and by squeezing the inclined surface of the trapezoidal convex block 804, make the convex block 804 slide downward. At this time, the convex block 804 is not engaged with the card slot 806, facilitating the removal of the cooling fan 6.

[0053] The above is the working process of the entire device, and the content not described in detail in this specification belongs to the prior art well-known to those skilled in the art.

[0054] The above embodiments are only used to illustrate the present utility model and not to limit the technical solutions described by the present utility model. Although this specification has described the present utility model in detail with reference to the above respective embodiments, the present utility model is not limited to the above specific embodiments. Therefore, any modification or equivalent replacement of the present utility model; and all technical solutions and their improvements that do not depart from the spirit and scope of the utility model are covered by the scope of the claims of the present utility model.

Claims

1. A computer case heat dissipation structure, comprising a case body (1), characterized in that: A partition (2) is fixedly installed inside the chassis body (1), and a frame (3) is fixedly installed between the partition (2) and the top of the chassis body (1); the back, right side and top of the chassis body (1) are provided with heat dissipation holes (4); a mounting frame (5) is fixedly installed on the back inner wall of the chassis body (1), the surface of the frame (3) and the top inner wall; a cooling fan (6) is arranged inside the mounting frame (5); a heat absorption mechanism (7) is arranged inside the chassis body (1); and a connecting mechanism (8) is arranged between the mounting frame (5) and the cooling fan (6); The heat absorption mechanism (7) comprises a heat absorption tube (701), and the heat absorption tube (701) is fixedly mounted on the upper surface of the partition (2), the surface of the heat absorption tube (701) is evenly provided with air inlet holes (702), and a liquid infusion tube (703) is arranged inside the heat absorption tube (701).

2. A computer case heat dissipation structure according to claim 1, characterized in that: A plurality of heat dissipation fins (704) are fixedly installed inside the heat absorption tube (701), and the other ends of the plurality of heat dissipation fins (704) extend to the inside of the infusion tube (703).

3. The computer case heat dissipation structure according to claim 1, characterized in that: A coolant tank (705) is provided between the partition (2) and the bottom of the chassis body (1), and a water pump (706) is fixedly installed at the bottom of the coolant tank (705); a connecting pipe (707) is installed on a surface of one side of the water pump (706), and one end of the infusion pipe (703) is fixedly connected to the upper side of the water pump (706), and the other end of the infusion pipe (703) extends to the interior of the coolant tank (705) through the heat absorption pipe (701).

4. A computer case heat dissipation structure according to claim 3, characterized in that: A micro refrigerator (708) is fixedly installed inside the cooling liquid tank (705), and a liquid inlet pipe (709) is fixedly installed on a side surface of the micro refrigerator (708), and the micro refrigerator (708) is connected to the connecting pipe (707).

5. The computer case heat dissipation structure according to claim 1, characterized in that: The connection mechanism (8) comprises a slide groove (801), and the slide groove (801) is arranged inside the mounting frame (5), the cooling fan (6) is slidably connected to the slide groove (801), and the cooling fan (6) and the mounting frame (5) form a locking mechanism.

6. A computer case heat dissipation structure according to claim 5, characterized in that: The upper and lower surfaces of the slide groove (801) are both provided with connecting grooves (802), and the connection groove (802) is internally slidably connected to a limit plate (803), and a protrusion (804) is fixedly installed on one side surface of the limit plate (803), a spring (805) is fixedly installed between the limit plate (803) and the inner wall of the connection groove (802), and the protrusion (804) is arranged in a trapezoidal shape, and the upper and lower surfaces of the heat dissipation fan (6) are both provided with a clamping groove (806), and the connection method of the protrusion (804) and the clamping groove (806) is a clamping connection.

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