Flexible ultrathin liquid cooling plate structure

Abstract

The utility model relates to the technical field of liquid cooling plates, provides a flexible ultrathin liquid cooling plate structure, and aims to solve the problem that an existing liquid cooling plate is generally made of metal, so that the size is not thin enough. Comprising an upper cover structure; the lower cover structure is arranged below the upper cover structure; the runner structure is arranged between the upper cover structure and the lower cover structure and is welded with the upper cover structure and the lower cover structure; the upper cover, the lower cover and the flow channel structure are all of a non-metal structure.

Description

Technical Field

[0001] This application relates to the technical field of liquid cooling plates, and more specifically, to a flexible ultra-thin liquid cooling plate structure. Background Art

[0002] With the improvement of the performance of mobile phones and tablets, the heat flux density of the CPU is also increasing. Traditional heat pipes and vapor chambers cannot meet the heat dissipation requirements. Compared with vapor chambers, liquid cooling plates can actively reduce the core temperature of the CPU, greatly improving the heat dissipation capacity of the CPU, so that the CPU can perform better. However, the existing liquid cooling plates are limited by their own materials (usually made of metal) and the limitations of the internal flow channel space, and cannot be made thinner.

[0003] Therefore, the existing technology still needs to be improved. Summary of the Utility Model

[0004] The purpose of this application is to provide a flexible ultra-thin liquid cooling plate structure to solve the problem that the existing liquid cooling plates are usually made of metal and are not thin enough in size.

[0005] To achieve the above purpose, the technical solution adopted in the embodiment of this application is:

[0006] A flexible ultra-thin liquid cooling plate structure, comprising:

[0007] An upper cover structure;

[0008] A lower cover structure, which is arranged below the upper cover structure;

[0009] A flow channel structure, which is arranged between the upper cover structure and the lower cover structure and is welded to the upper cover structure and the lower cover structure;

[0010] The upper cover, the lower cover and the flow channel structure are all arranged as non-metal structures.

[0011] According to the flexible ultra-thin liquid cooling plate structure described above, the upper cover structure includes:

[0012] A first outer layer;

[0013] A second outer layer, which is arranged below the first outer layer and is connected to the flow channel structure;

[0014] A first intermediate layer, which is arranged between the first outer layer and the second outer layer and is connected to the first outer layer and the second outer layer.

[0015] According to the flexible ultra-thin liquid cooling plate structure described above, both the first outer layer and the second outer layer are arranged as TPI layers, and the first intermediate layer is arranged as a PI layer.

[0016] According to the flexible ultra-thin liquid cooling plate structure described above, the lower cover structure includes:

[0017] A third outer layer, which is connected to the side of the flow channel structure facing away from the upper cover structure;

[0018] A fourth outer layer, which is arranged below the third outer layer;

[0019] A second intermediate layer, which is arranged between the third outer layer and the fourth outer layer and is connected to the third outer layer and the fourth outer layer.

[0020] According to the flexible ultra-thin liquid cooling plate structure described above, both the third outer layer and the fourth outer layer are set as TPI layers, and the second intermediate layer is set as a PI layer.

[0021] According to the flexible ultra-thin liquid cooling plate structure described above, the flow channel structure includes:

[0022] A fifth outer layer, which is connected to the upper cover structure;

[0023] A sixth outer layer, which is arranged below the fifth outer layer and is connected to the lower cover structure;

[0024] A third intermediate layer, which is arranged between the fifth outer layer and the sixth outer layer and is connected to the fifth outer layer and the sixth outer layer.

[0025] According to the flexible ultra-thin liquid cooling plate structure described above, both the fifth outer layer and the sixth outer layer are set as TPI layers, and the third intermediate layer is set as a PI layer.

[0026] According to the flexible ultra-thin liquid cooling plate structure described above, the upper cover structure is set as a planar structure.

[0027] According to the flexible ultra-thin liquid cooling plate structure described above, the lower cover structure is set as a planar structure.

[0028] According to the flexible ultra-thin liquid cooling plate structure described above, an input pipe orifice and an output pipe orifice are formed on the upper cover structure.

[0029] The beneficial effects of a flexible ultra-thin liquid cooling plate structure provided by this application are at least as follows:

[0030] Compared with the existing liquid cooling plate by means of metal etching, in this application, the upper cover structure, the flow channel structure and the lower cover structure made of non-metallic structures are respectively manufactured, which can realize the ultra-thin processing of the liquid cooling plate structure. Then, the three are welded and stacked (combined), which can realize the flexible ultra-thin design of the liquid cooling plate structure. The thickness of the designed flexible ultra-thin liquid cooling plate structure can be as thin as 0.2 mm at the thinnest. While reducing the thickness of the liquid cooling plate structure, it can also ensure its heat dissipation effect, and is applicable to consumer electronics such as mobile phones and tablets. Brief Description of the Drawings

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0032] Figure 1 It is a schematic structural diagram of a flexible ultra-thin liquid cooling plate structure provided by an embodiment of the present application.

[0033] Figure 2 It is a schematic side view of the upper cover structure of a flexible ultra-thin liquid cooling plate structure provided by an embodiment of the present application.

[0034] Figure 3 It is a schematic side view of the lower cover structure of a flexible ultra-thin liquid cooling plate structure provided by an embodiment of the present application.

[0035] Figure 4 It is a schematic side view of the flow channel structure of a flexible ultra-thin liquid cooling plate structure provided by an embodiment of the present application.

[0036] Among them, the reference numerals in the drawings are as follows:

[0037] 1. Upper cover structure; 11. First outer layer; 12. Second outer layer; 13. First intermediate layer; 2. Lower cover structure; 21. Third outer layer; 22. Fourth outer layer; 23. Second intermediate layer; 3. Flow channel structure; 31. Fifth outer layer; 32. Sixth outer layer; 33. Third intermediate layer. Detailed Embodiments

[0038] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the following further details the present application in conjunction with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0039] It should be noted that when a component is referred to as "fixed to" or "disposed on" another component, it can be directly or indirectly located on that other component. When a component is referred to as "connected to" another component, it can be directly or indirectly connected to that other component. The orientations or positions indicated by the terms "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientations or positions shown in the drawings, and are only for convenience of description and should not be construed as limitations on the technical solution of the present invention. The terms "first" and "second" are only used for convenience of description and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of technical features. The meaning of "a plurality" is two or more, unless otherwise specifically defined.

[0040] With the improvement of the performance of mobile phones and tablets, the heat flux density of the CPU is also increasing. Traditional heat pipes and vapor chambers cannot meet the heat dissipation requirements. Compared with vapor chambers, liquid cooling plates can actively reduce the core temperature of the CPU, greatly improving the heat dissipation capacity of the CPU, so that the CPU can perform better. However, the existing liquid cooling plates are limited by their own materials (usually made of metal) and the limitations of the internal flow channel space, and cannot be made thinner.

[0041] For this reason, referring to Figure 1 , an embodiment of the present application provides a flexible ultra-thin liquid cooling plate structure, including an upper cover structure 1, a lower cover structure 2, and a flow channel structure 3. The lower cover structure 2 is disposed below the upper cover structure 1, and the flow channel structure 3 is disposed between the upper cover structure 1 and the lower cover structure 2 and is connected to the upper cover structure 1 and the lower cover structure 2. The upper cover, the lower cover, and the flow channel structure 3 are all made of non-metallic structures.

[0042] Compared with the existing liquid cooling plates manufactured by metal etching, in this embodiment, the upper cover structure 1, the flow channel structure 3, and the lower cover structure 2 made of non-metallic structures are manufactured separately, which can achieve ultra-thin processing of the liquid cooling plate structure. Then, the three are welded and stacked (combined), which can achieve a flexible ultra-thin design of the liquid cooling plate structure. The thickness of the designed flexible ultra-thin liquid cooling plate structure can be as thin as 0.2 mm, which can ensure its heat dissipation effect while reducing the thickness of the liquid cooling plate structure, and is applicable to consumer electronics such as mobile phones and tablets.

[0043] Optionally, referring to Figure 1In one embodiment, the upper cover structure 1 is configured as a planar structure, and an input pipe port and an output pipe port are provided on the upper cover structure 1, and the input pipe port and the output pipe port are both used to install corresponding connecting pipes, so that the external liquid coolant can pass through the connecting pipe located at the input pipe port through the input pipe port and flow into the flow channel structure 3, and pass through the connecting pipe located at the output pipe port through the output pipe port and flow out of the flow channel structure 3.

[0044] Optional, see Figure 2 In one embodiment, the upper cover structure 1 includes a first outer layer 11, a second outer layer 12 and a first middle layer 13, the second outer layer 12 is arranged below the first outer layer 11 and connected to the flow channel structure 3, the first middle layer 13 is arranged between the first outer layer 11 and the second outer layer 12, and connected to the first outer layer 11 and the second outer layer 12.

[0045] The first outer layer 11 and the second outer layer 12 are both configured as TPI (thermoplastic polyimide) layers, and the first intermediate layer 13 is configured as PI (polyimide) layer.

[0046] Optional, see Figure 1 In one embodiment, the lower cover structure 2 is configured as a planar structure.

[0047] Optional, see Figure 3 In one embodiment, the lower cover structure 2 includes a third outer layer 21, a fourth outer layer 22 and a second middle layer 23, the third outer layer 21 is welded to the side of the flow channel structure 3 facing away from the upper cover structure 1, that is, the third outer layer 21 is welded to the sixth outer layer 32, the fourth outer layer 22 is arranged below the third outer layer 21, the second middle layer 23 is arranged between the third outer layer 21 and the fourth outer layer 22, and is connected to the third outer layer 21 and the fourth outer layer 22.

[0048] The third outer layer 21 and the fourth outer layer 22 are both configured as TPI layers, and the second intermediate layer 23 is configured as a PI layer.

[0049] Optional, see Figure 4 In one embodiment, the flow channel structure 3 includes a fifth outer layer 31, a sixth outer layer 32 and a third middle layer 33, the fifth outer layer 31 is welded to the second outer layer 12, the sixth outer layer 32 is arranged below the fifth outer layer 31 and welded to the third outer layer 21, and the third middle layer 33 is arranged between the fifth outer layer 31 and the sixth outer layer 32, and is connected to the fifth outer layer 31 and the sixth outer layer 32.

[0050] Among them, both the fifth outer layer 31 and the sixth outer layer 32 are set as TPI layers, and the third intermediate layer 33 is set as a PI layer.

[0051] A manufacturing method of a flexible ultra-thin liquid cooling plate structure can specifically be as follows: Select a PI double-sided copper-clad material, form an upper cover structure 1 and a lower cover structure 2 through die cutting or laser cutting, then process the intermediate flow channel structure 3 through die cutting or laser processing, stack the upper cover structure 1, the lower cover structure 2 and the flow channel structure 3 together, and bond the upper cover structure 1, the flow channel structure 3 plate and the lower cover structure 2 through a molecular diffusion welding process to form a sealed cavity of a flexible liquid cooling plate. Then, weld a micro water pump, inject liquid under vacuum, and perform high-frequency welding or ultrasonic sealing at the tail to form a complete miniature flexible ultra-thin liquid cooling plate structure.

[0052] In summary, a flexible ultra-thin liquid cooling plate structure provided by the present application includes an upper cover structure 1, a lower cover structure 2 and a flow channel structure 3. The lower cover structure 2 is arranged below the upper cover structure 1, the flow channel structure 3 is arranged between the upper cover structure 1 and the lower cover structure 2 and is connected to the upper cover structure 1 and the lower cover structure 2. The upper cover, the lower cover and the flow channel structure 3 are all arranged as non-metal structures. Compared with the existing liquid cooling plate formed by metal etching, in the present application, the upper cover structure 1, the flow channel structure 3 and the lower cover structure 2 made of non-metal structures are manufactured separately, which can achieve ultra-thin processing of the liquid cooling plate structure. Then, the three are welded and stacked (bonded) to achieve a flexible ultra-thin design of the liquid cooling plate structure. The thickness of the designed flexible ultra-thin liquid cooling plate structure can be as thin as 0.2 mm, which can ensure its heat dissipation effect while reducing the thickness of the liquid cooling plate structure, and is applicable to consumer electronics such as mobile phones and tablets.

[0053] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A flexible ultra-thin liquid cooling plate structure, characterized in that: include: Upper cover structure; A lower cover structure, which is arranged below the upper cover structure; A flow channel structure, which is disposed between the upper cover structure and the lower cover structure and is welded to the upper cover structure and the lower cover structure; The upper cover, the lower cover and the flow channel structure are all configured as non-metal structures.

2. The flexible ultra-thin liquid cooling plate structure according to claim 1, characterized in that: The upper cover structure comprises: first outer layer; a second outer layer, which is disposed below the first outer layer and connected to the flow channel structure; The first middle layer is disposed between the first outer layer and the second outer layer and connected to the first outer layer and the second outer layer.

3. The flexible ultra-thin liquid cooling plate structure according to claim 2, characterized in that: The first outer layer and the second outer layer are both configured as TPI layers, and the first intermediate layer is configured as a PI layer.

4. The flexible ultra-thin liquid cooling plate structure according to claim 1, characterized in that: The lower cover structure comprises: a third outer layer connected to a side of the flow channel structure facing away from the upper cover structure; a fourth outer layer, which is disposed below the third outer layer; The second middle layer is disposed between the third outer layer and the fourth outer layer and connected to the third outer layer and the fourth outer layer.

5. The flexible ultra-thin liquid cooling plate structure according to claim 4, characterized in that: The third outer layer and the fourth outer layer are both configured as TPI layers, and the second intermediate layer is configured as a PI layer.

6. The flexible ultra-thin liquid cooling plate structure according to claim 1, characterized in that: The flow channel structure comprises: a fifth outer layer connected to the upper cover structure; a sixth outer layer, which is disposed below the fifth outer layer and connected to the lower cover structure; The third middle layer is arranged between the fifth outer layer and the sixth outer layer, and is connected to the fifth outer layer and the sixth outer layer.

7. The flexible ultra-thin liquid cooling plate structure according to claim 6, characterized in that: The fifth outer layer and the sixth outer layer are both configured as TPI layers, and the third intermediate layer is configured as a PI layer.

8. The flexible ultra-thin liquid cooling plate structure according to claim 1, characterized in that: The upper cover structure is configured as a planar structure.

9. The flexible ultra-thin liquid cooling plate structure according to claim 1, characterized in that: The lower cover structure is configured as a planar structure.

10. The flexible ultra-thin liquid cooling plate structure according to claim 1, characterized in that: The upper cover structure is provided with an input pipe opening and an output pipe opening.

Images