Digital key and vehicle

Abstract

The digital key comprises a chip, an upper cover and a shell, the chip is arranged in a cavity formed by the upper cover and the shell, a cooling fin is embedded in the upper cover, the top face of the cooling fin is exposed out of the top face of the upper cover, a downwards-sunken contact part is formed on the cooling fin, and the chip is arranged in the cavity. And the contact part is tightly attached to the chip. The radiating fins are embedded into the upper cover to realize heat dissipation, the heat dissipation performance is good, the structure is simple, and the cost is low.

Description

Technical Field

[0001] The utility model relates to the technical field of digital keys, and particularly relates to a digital key and a vehicle. Background Art

[0002] A digital key is an innovative car unlocking technology. With precise Bluetooth positioning, NFC and other communication technologies, as well as a highly secure key management system, it allows users to unlock and operate cars using devices such as smartphones, NFC smart cards, smart watches and smart bracelets. This technology significantly improves the convenience of using cars. In addition, the digital key can also realize foot kick sensing and in-vehicle child presence detection, and remote automatic warning to timely protect the safety of children.

[0003] Traditional digital keys generally have no heat dissipation measures. Even if there are heat dissipation measures, the current practice is to make the upper cover entirely metal to transfer the heat of the heating chip, or to fill the gap between the heat sink and the upper cover with a silica gel pad. Regarding making the upper cover entirely metal to transfer the heat of the heating chip, there are the following defects: there are many metal parts, the cost is high and the structural weight is increased; regarding filling the gap between the heat sink and the upper cover with a silica gel pad, there are the following defects: the process is complex, the assembly structure is complex, the silica gel pad needs to be compressed to meet the waterproof requirements, and there is a risk of aging. Therefore, it is necessary to innovatively design a heat dissipation type digital key to overcome the above defects. Summary of the Utility Model

[0004] In order to solve at least one of the problems mentioned in the above background art, the utility model provides a digital key and a vehicle, which embed a heat sink into the upper cover to achieve heat dissipation, have good heat dissipation performance, and at the same time have a simple structure and low cost.

[0005] The specific technical solutions provided by the utility model are as follows:

[0006] In the first aspect, a digital key is provided, which includes a chip, an upper cover and a housing. The chip is arranged in the cavity formed by the upper cover and the housing. The upper cover is embedded with a heat sink. The top surface of the heat sink exposes the top surface of the upper cover. The heat sink is formed with a downwardly concave contact portion, and the contact portion closely adheres to the chip.

[0007] By means of the above technical solution, the utility model embeds a heat sink in the upper cover, the top surface of the heat sink exposes the top surface of the upper cover, and the contact portion of the heat sink closely adheres to the chip. In this way, when the chip generates heat, the heat can be transferred to the outside of the upper cover through the heat sink, and the heat dissipation effect is good. At the same time, the heat sink is arranged in a partial area of the upper cover without covering the entire upper cover, which reduces the part of the heat sink, making the whole digital key have a simple structure, light weight and low manufacturing cost.

[0008] As a preferred embodiment of the above scheme, the upper cover and the heat sink are integrally formed by encapsulation injection molding. According to the above scheme, the upper cover and the heat sink are integrally formed by encapsulation injection molding, so that the connection structure between the heat sink and the upper cover is simple, the assembly is convenient, and the manufacturing cost is low, and at the same time, the waterproof and dustproof effect between the upper cover and the heat sink is good and corrosion-resistant.

[0009] As a preferred embodiment of the above scheme, an extension portion is formed on the edge of the heat sink, the extension portion is embedded in the upper cover and is integrally formed with the upper cover by overmolding, the upper cover surrounds the extension portion, specifically, the upper cover surrounds the extension portion in a C-shape; the heat sink includes a main body portion whose top surface is exposed to the top surface of the upper cover, the extension portion includes a first extension portion extending obliquely downward from the main body portion and a second extension portion extending horizontally from the first extension portion, the first extension portion and the second extension portion are embedded in the upper cover and overmolded with the upper cover, and the connection between the first extension portion and the second extension portion and the upper cover forms a C-shaped structure. According to the above scheme, the upper cover surrounds the extension portion in a C-shape, so that the connection contact area between the upper cover and the heat sink is increased, thereby improving the connection strength between the heat sink and the upper cover, and making the connection between the heat sink and the upper cover more firmly.

[0010] As a preferred embodiment of the above solution, a sealant is provided at the connection between the bottom of the extension and the upper cover. According to the above solution, due to the different thermal expansion and contraction coefficients of the upper cover and the heat sink, the overmolding structure cannot ensure high-strength dustproof and waterproof between the upper cover and the heat sink, so the sealant is provided to make the connection between the upper cover and the extension reach a high-strength dustproof and waterproof level.

[0011] As a preferred embodiment of the above solution, a retaining wall is formed at the bottom of the upper cover, and the retaining wall is used to block the sealant, and the retaining wall is close to the sealant and the extension. According to the above solution, the sealant is set by dispensing, and the height of the retaining wall needs to match the height of the sealant during dispensing, so as to avoid overflow of the sealant.

[0012] As a preferred embodiment of the above scheme, a connector PIN and a circuit board are provided in the cavity, the chip is provided on the circuit board, the connector PIN is connected to the circuit board, and the connector PIN is integrally formed with the housing by overmolding. According to the above scheme, the connector PIN is integrally formed with the housing by overmolding, thus eliminating the process of welding a separate connector PIN on the circuit board, and the assembly is simple and efficient.

[0013] As a preference of the above solution, the housing includes a connecting shell at the front end. The outside of the connector PIN is arranged in the connecting shell for connecting with the wire-end connector, and the inside of the connector PIN is electrically connected to the circuit board. Specifically, the inside of the connector PIN is soldered to the circuit board. According to the above solution, the wire-end connector is connected to the outside of the connector PIN to realize power supply and signal transmission. At the same time, the wire-end connector can also achieve dust and water protection of the housing at the connecting shell.

[0014] As a preference of the above solution, the upper cover and the housing are connected together by at least one of the connection methods of welding, mortise and tenon, and interference fit. Specifically, the connection part between the upper cover and the housing is connected together by laser welding or ultrasonic welding. According to the above solution, it is necessary to achieve sealing between the upper cover and the housing. By walking around the edge joint of the upper cover and the housing through laser welding or ultrasonic welding, the connection at the joint can be realized, so that the requirements of high-strength dust and water protection can be achieved between the upper cover and the housing. In addition, a rubber ring can also be added in the middle of the joint, and then the upper cover and the housing are fixed by buckles or screws to realize sealed connection and reach the high-strength dust and water protection level.

[0015] As a preference of the above solution, a heat dissipation part is closely attached to the chip, and the contact part is closely attached to the heat dissipation part. The heat dissipation part is thermal conductive glue or a thermal conductive gasket. According to the above solution, the chip transfers heat to the heat sink through the heat dissipation part, which further improves the heat dissipation efficiency of the chip.

[0016] As a preference of the above solution, the heat sink is a metal sheet. According to the above solution, since the heat dissipation performance of the metal is good, the heat sink is in the form of a metal sheet.

[0017] In a second aspect, a vehicle is provided, including the above digital key and a wire-end connector. The digital key includes a connecting shell and a connector PIN. The wire-end connector is arranged in the connecting shell and connected to the outside of the connector PIN, and the wire-end connector can achieve dust and water protection of the connector PIN.

[0018] The digital key on the vehicle is connected to the wire-end connector of the vehicle to realize signal interaction with the vehicle. Description of the Drawings

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0020] Figure 1Schematic three-dimensional structure diagram of the present utility model;

[0021] Figure 2 is Figure 1 explosion structure diagram of;

[0022] Figure 3 is Figure 1 cross-sectional structure diagram of;

[0023] Figure 4 is Figure 3 local enlarged structure diagram of;

[0024] Figure 5 Schematic bottom surface structure diagram of the upper cover of the present utility model;

[0025] Figure 6 Schematic front view structure diagram of the present utility model;

[0026] Figure 7 Schematic welding diagram of the upper cover and the outer shell of the present utility model. Detailed implementation manners

[0027] To make the objectives, technical solutions and advantages of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Apparently, the described embodiments are only a part rather than all of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0028] The following content refers to Figures 1 to 7 .

[0029] In a first aspect, the present utility model provides a digital key, which includes a chip 1, an upper cover 2 and an outer shell 3. The chip 1 is disposed in a cavity formed by the upper cover 2 and the outer shell 3. The upper cover 2 is embedded with a heat sink 4. The top surface of the heat sink 4 exposes the top surface of the upper cover 2. The heat sink 4 is formed with a downwardly concave contact portion 41, and the contact portion 41 is closely attached to the chip 1.

[0030] The upper cover 2 and the heat sink 4 are integrally formed by overmolding. Integrally forming the upper cover 2 and the heat sink 4 by overmolding makes the connection structure between the heat sink 4 and the upper cover 2 simple, convenient to assemble, and low in manufacturing cost. At the same time, it has good waterproof and dustproof effects and corrosion resistance between the upper cover 2 and the heat sink 4. Overmolding generally refers to silicone overmolding. The silicone overmolding process means that during the injection molding process, a silicone material is injected into an already injection-molded plastic product to form a two-color or multi-color product. This process mainly includes the following steps: First, a main body part of a plastic product is manufactured through one injection molding; then, the silicone material is injected into certain areas of the main body part to wrap the main body part to form an overmolding effect; finally, through a curing process, a silicone overmolding product is formed. The heat sink 4 is a metal sheet, specifically aluminum alloy. Since metal has good heat dissipation performance, the heat sink is in the form of a metal sheet. A heat dissipation component 5 is closely attached to the chip 1, the contact part 41 is closely attached to the heat dissipation component 5, and the heat dissipation component 5 is a thermal conductive adhesive or a thermal conductive gasket. The chip 1 transfers heat to the heat sink 4 through the heat dissipation component 5, which further improves the heat dissipation efficiency of the chip 1. The upper cover 2 in this embodiment is a plastic upper cover, and the plastic upper cover and the metal heat sink are integrally formed by overmolding.

[0031] An extension part 42 is formed at the edge of the heat sink 4. The extension part 42 is embedded in the upper cover 2 and integrally formed with the upper cover 2 by overmolding. The upper cover 2 surrounds the extension part 42 in a C shape; the heat sink 4 includes a main body part 43 whose top surface is exposed above the top surface of the upper cover. The extension part 42 includes a first extension part 421 extending obliquely downward from the main body part 43 and a second extension part 422 extending horizontally from the first extension part 421. The first extension part 421 and the second extension part 422 are embedded in the upper cover 2 and integrally formed with the upper cover 2 by overmolding. A C-shaped structure is formed at the connection between the first extension part 421 and the second extension part 422 and the upper cover 2. The upper cover 2 surrounding the extension part 42 in a C shape increases the connection contact area between the upper cover 2 and the heat sink 4, thereby improving the connection strength between the heat sink 4 and the upper cover 2 and making the combination between the heat sink 4 and the upper cover 2 more firm.

[0032] A sealant 6 is provided at the connection between the bottom of the extension part 42 and the upper cover 2. Since the coefficients of thermal expansion and contraction of plastic and metal are different, the structure of overmolding cannot ensure high-strength dust and water protection between the upper cover 2 and the heat sink 4. Therefore, the sealant 6 is provided to make the connection part between the upper cover 2 and the extension part 42 reach a high-strength dust and water protection level. After the heat sink 4 and the upper cover 2 are integrally formed by overmolding, the sealant 6 is applied at the joint between the extension part 42 and the upper cover 2. A retaining wall 21 for the sealant 6 is formed at the bottom of the upper cover 2, and the retaining wall 21 closely adheres to the sealant 6 and the extension part 42. The sealant 6 is applied by dispensing. The height of the retaining wall 21 needs to match the height of the sealant 6 during dispensing, which can avoid glue overflow. Dispensing is a process, also known as glue application, coating, potting, dripping, etc. It is to apply, pot, or drip electronic glue, oil, or other liquids onto products to make the products play roles such as adhesion, potting, insulation, fixation, and smooth surface. The high-strength dust and water protection level in this embodiment is the IP67 standard. The IP67 standard refers to the protection safety level. IP is the abbreviation of Ingress Protection Rating (or International Protection code), which defines the protection ability of an interface against liquid and solid particles. Two digits follow IP. The first digit is the solid protection level, ranging from 0 to 6, indicating the protection against large particle foreign objects to dust; the second digit is the liquid protection level, ranging from 0 to 8, indicating the protection against vertical water droplets to the pressure at the bottom of the water. The larger the number, the stronger the ability. The explanation of IP67 is protection against dust inhalation (overall prevention of contact, protection against dust penetration); protection against short-term immersion (anti-immersion).

[0033] A connector PIN 7 and a circuit board 8 are provided in the cavity. The chip 1 is disposed on the circuit board 8. The connector PIN 7 is connected to the circuit board 8, and the connector PIN 7 is integrally formed with the housing 3 by overmolding. The connector PIN 7 is integrally formed with the housing 3 by overmolding, which eliminates the process of separately welding the connector PIN 7 to the circuit board 8, with simple assembly and high efficiency. The housing 3 includes a connection shell 31 at the front end. The outside of the connector PIN 7 is disposed in the connection shell 31 for connection with a wire-end connector, and the inside of the connector PIN 7 is welded to the circuit board 8. The wire-end connector is connected to the outside of the connector PIN 7 to achieve power supply and signal transmission. At the same time, the wire-end connector can also achieve dust and water protection of the housing 3 at the connection shell 31.

[0034] The connection between the upper cover 2 and the housing 3 is connected together by laser welding or ultrasonic welding. A seal needs to be achieved between the upper cover 2 and the housing 3. By laser welding or ultrasonic welding, a circle is made at the edge joint of the upper cover 2 and the housing 3, as Figure 7As shown by the arrow on [the relevant part], the connection at the seam is achieved, enabling the upper cover 2 and the outer shell 3 to meet the high-strength dust and water protection requirements. Additionally, a rubber ring can be added in the middle of the seam, and then the upper cover 2 and the outer shell 3 are fixed by buckles or screws to achieve a sealed connection and reach the IP67 dust and water protection level.

[0035] In this utility model, the upper cover 2 is embedded with the heat sink 4. The top surface of the heat sink 4 is exposed above the top surface of the upper cover 2, and the contact part of the heat sink 4 closely adheres to the chip 1. In this way, when the chip 1 generates heat, the heat can be transferred outside the upper cover 2 through the heat sink 4, with good heat dissipation effect. At the same time, the heat sink 4 is arranged in a partial area of the upper cover 2 without covering the entire upper cover 2, which reduces the part of the heat sink 4, making the entire digital key simple in structure, light in weight, and low in manufacturing cost.

[0036] In a second aspect, this utility model provides a vehicle, including the above-mentioned digital key and a wire-end connector. The digital key includes a connection shell and connector PIN pins. The wire-end connector is arranged inside the connection shell and is externally connected to the connector PIN pins. The wire-end connector can achieve dust and water protection for the connector PIN pins and inside the digital key.

[0037] The digital key on the vehicle of this utility model is connected to the wire-end connector of the vehicle to achieve signal interaction with the vehicle. The digital key arranged on the vehicle can achieve IP67 dust and water protection and has good heat dissipation performance. The digital key can achieve the key management function of the vehicle, allowing users to unlock and operate the vehicle using devices such as smartphones, NFC smart cards, smart watches, and smart bracelets. At the same time, the digital key can also achieve foot-kick sensing of the vehicle and detection of the presence of children inside the vehicle, and remotely give an automatic warning to timely protect the safety of children.

[0038] Although the preferred embodiments in the embodiments of this utility model have been described, those skilled in the art can make additional changes and modifications once they know the basic creative concept. Therefore, the appended claims are intended to be interpreted to include the preferred embodiments as well as all changes and modifications falling within the scope of the embodiments of this utility model.

[0039] Obviously, those skilled in the art can make various changes and modifications to this utility model without departing from the spirit and scope of this utility model. In this way, if these modifications and variations of this utility model fall within the scope of the claims of this utility model and their equivalent technologies, this utility model also intends to include these modifications and variations.

Claims

1. A digital key, comprising a chip, an upper cover and a shell, wherein the chip is arranged in a cavity formed by the upper cover and the shell, characterized in that: A heat sink is embedded in the upper cover, the top surface of the heat sink is exposed from the top surface of the upper cover, and the heat sink is formed with a contact portion that is recessed downwards, and the contact portion is tightly attached to the chip.

2. The digital key according to claim 1, characterized in that: The upper cover and the heat sink are integrally formed by overmolding.

3. The digital key according to claim 2, characterized in that: An extension portion is formed on the edge of the heat sink, the extension portion is embedded in the upper cover and is integrally formed with the upper cover by overmolding, and the upper cover surrounds the extension portion.

4. The digital key according to claim 3, characterized in that: A sealant is provided at the connection between the bottom of the extension part and the upper cover.

5. The digital key according to claim 4, characterized in that: A retaining wall is formed on the bottom of the upper cover, and the retaining wall is used to block the sealant, and the retaining wall is closely attached to the sealant and the extension part.

6. The digital key according to claim 1, characterized in that: A connector PIN pin and a circuit board are arranged in the cavity, the chip is arranged on the circuit board, the connector PIN pin is connected to the circuit board, and the connector PIN pin is integrally formed with the housing through overmolding.

7. The digital key according to claim 6, characterized in that: The housing comprises a connection shell at the front end, the outside of the connector PIN pin is arranged in the connection shell for connecting with the line end connector, and the inside of the connector PIN pin is electrically connected with the circuit board.

8. The digital key according to claim 1, characterized in that: The upper cover and the outer shell are connected together by at least one connection method including welding, mortise and tenon joints, and interference fit.

9. The digital key according to claim 1, characterized in that: A heat sink is closely attached to the chip, the contact portion is closely attached to the heat sink, and the heat sink is a heat conductive adhesive or a heat conductive pad.

10. A vehicle, characterized in that: It comprises a digital key as described in any one of claims 1 to 9 and a wire end connector, the digital key comprises a connecting shell and a connector PIN pin, the wire end connector is arranged in the connecting shell and connected to the outside of the connector PIN pin, and the wire end connector can realize dustproof and waterproof properties of the connector PIN pin.

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