Multi-size wafer spin-drying mechanism and wafer cleaning system

Abstract

The utility model relates to a multi-size wafer spin-drying mechanism and a wafer cleaning system, the multi-size wafer spin-drying mechanism comprises a workbench, a spin-drying assembly and a spraying assembly, the spin-drying assembly comprises a rotating motor, a main shaft, a bearing disc, a supporting column and a blocking column, and the rotating motor is connected with the bearing disc through the main shaft; the top end of the bearing disc is provided with at least one set of supporting columns capable of supporting the bottom end face of a wafer and at least one set of blocking columns capable of limiting the edge of the wafer, and the blocking columns are correspondingly arranged on one sides of the supporting columns and higher than the supporting columns. The spraying assembly comprises a swing rod air cylinder and a spraying head, the swing rod air cylinder is connected with the spraying head, and the spraying head is correspondingly arranged above the bearing disc. The multi-size wafer spin-drying mechanism and the wafer cleaning system can be used for cleaning and spin-drying wafers of various sizes or types, multiple purposes are achieved, the application range of the cleaning system is greatly widened, meanwhile, liquid splashing during spin-drying can be avoided, and the surrounding environment of equipment is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of cleaning systems, in particular to a multi-size wafer drying mechanism and a wafer cleaning system with the multi-size wafer drying mechanism. Background Art

[0002] In the existing wafer cleaning system, after the wafer is cleaned, it needs to be dried. However, the existing drying mechanism generally can only be used for wafers of one size, and its application range is relatively limited. At the same time, liquid will splash everywhere during the drying process, affecting the surrounding environment. Summary of the Utility Model

[0003] In view of the above problems, the utility model provides a multi-size wafer drying mechanism and a wafer cleaning system that can be applicable to wafers of multiple sizes or types.

[0004] The utility model is realized by the following technical solutions:

[0005] A multi-size wafer drying mechanism includes a workbench and a drying component and a spraying component arranged on the workbench;

[0006] The drying component includes a rotating motor, a main shaft, a bearing plate, a support column and a stop column. The rotating motor is connected to the bearing plate through the main shaft, and the rotating motor can drive the bearing plate to rotate axially. At least one group of support columns for supporting the bottom end face of the wafer and at least one group of stop columns for limiting the edge of the wafer are arranged at the top end of the bearing plate. The stop columns are correspondingly arranged on one side of the support columns and are higher than the support columns in height;

[0007] The spraying component includes a swing rod cylinder and a spray head. The swing rod cylinder is connected to the spray head, and the spray head is correspondingly arranged above the bearing plate. The swing rod cylinder can drive the spray head to swing.

[0008] In order to avoid liquid splashing during drying and affecting the surrounding environment, the utility model further includes a water blocking component. The water blocking component includes a water blocking cover, a lifting cylinder and a lifting cylinder. The lifting cylinder is sleeved outside the bearing plate, the water blocking cover is sleeved outside the lifting cylinder, and the lifting cylinder is connected to the lifting cylinder. The lifting cylinder can drive the lifting cylinder to move up and down.

[0009] In order to facilitate the lifting of the lifting cylinder, there are at least two lifting cylinders, and the lifting cylinders are fixed to the top end of the lifting cylinder through a connecting plate.

[0010] In order to facilitate the installation of each support column and stop column, the bearing plate is provided with a plurality of support arms extending away from the bearing plate. The support columns and stop columns are fixed to the top ends of the support arms. A row of insertion interfaces are provided at the top ends of the support arms. The bottom ends of the support columns and stop columns are inserted into the insertion interfaces, and the support columns and stop columns are arranged at intervals in turn.

[0011] Preferably, the heights of the support columns and the retaining columns gradually increase from the end close to the carrier plate to the end away from the carrier plate.

[0012] In order to prevent the wafer from shaking during spin-drying, an anti-slip friction pad is fixed to the top of the support column.

[0013] The present utility model also provides a wafer cleaning system, which has the above multi-size wafer spin-drying mechanism.

[0014] The beneficial effects of the present utility model are as follows: Through the specially designed spin-drying assembly, the multi-size wafer spin-drying mechanism and the wafer cleaning system can clean and spin-dry wafers of various sizes or types during use, realizing multi-purpose use of one machine, greatly improving the applicable range of the cleaning system. At the same time, through the specially designed lifting water-blocking assembly, liquid splashing during spin-drying can be avoided, ensuring the surrounding environment of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a three-dimensional structural schematic diagram of the multi-size wafer spin-drying mechanism of the present utility model;

[0016] Figure 2 is a three-dimensional structural schematic diagram of the carrier plate of the present utility model;

[0017] Figure 3 is a structural schematic diagram of the multi-size wafer spin-drying mechanism of the present utility model during use. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0018] The following describes in detail the preferred embodiments of the present utility model with reference to the accompanying drawings, so that the advantages and features of the present utility model can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present utility model. In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "top", "bottom", "side", "end", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model.

[0019] Embodiment 1:

[0020] As Figure 1 shown, a multi-size wafer spin-drying mechanism includes a workbench 1 and a spin-drying assembly, a spraying assembly, and a water-blocking assembly arranged on the workbench 1.

[0021] Specifically, the spin-drying assembly includes a rotary motor 2, a main shaft 3, a carrier plate 4, support columns 5 and stop columns 6. The rotary motor 2 is connected to the carrier plate 4 through the main shaft 3. The rotary motor 2 is arranged at the bottom end of the workbench 1, and the carrier plate 4 is arranged at the top end of the main shaft 3. The rotary motor 2 can drive the carrier plate 4 to rotate axially. A plurality of groups (two groups in the figure) of support columns 5 capable of supporting the bottom end face of the wafer and a plurality of groups of stop columns 6 capable of limiting the edge of the wafer are arranged at the top end of the carrier plate 4. The stop columns 6 are correspondingly arranged on one side (outer side) of the support columns 5 and are higher than the support columns 5.

[0022] Specifically, the spraying assembly includes a swing rod cylinder 7 and a spray head 8. The swing rod cylinder 7 is connected to the spray head 8. The spray head 8 is correspondingly arranged above the carrier plate 5, and the swing rod cylinder 7 can drive the spray head 8 to swing.

[0023] Specifically, the water-blocking assembly includes a water-blocking cover 9, a lifting cylinder 10 and a lifting cylinder 11. The water-blocking cover 9 and the lifting cylinder 10 are fixed to the top surface of the workbench 1. The lifting cylinder 10 is sleeved outside the carrier plate 4, and the water-blocking cover 9 is sleeved outside the lifting cylinder 10. The lifting cylinder 11 is connected to the lifting cylinder 10. There are two lifting cylinders 11. The lifting cylinders 11 are fixed to the top end of the lifting cylinder 10 through a connecting plate 12. The lifting cylinder 11 can drive the lifting cylinder 10 to move up and down.

[0024] Specifically, in combination with Figure 2 As shown, a plurality of support arms 13 extending away from the carrier plate 4 are integrally formed on the outer end face of the carrier plate 4. The support columns 5 and the stop columns 6 are fixed to the top ends of the support arms 13. An anti-slip friction pad 15 is fixed to the top end of the support column 5. A row of insertion interfaces 14 is formed at the top end of the support arm 13. The bottom ends of the support columns 5 and the stop columns 6 are inserted into the insertion interfaces 14. The support columns 5 and the stop columns 6 are arranged at intervals in sequence. A plurality of groups of support columns 5 and stop columns 6 form a plurality of concentric circles, and the heights of the support columns 5 and the stop columns 6 gradually increase from the end close to the carrier plate 4 to the end far from the carrier plate 4, that is, gradually increase from the inside to the outside.

[0025] During use, in combination with Figure 3 As shown, the wafer 16 that has been cleaned at the previous process station is sent to the corresponding support column 5 by a manipulator. Wafers 16 of different sizes (6 inches and 8 inches) are supported by different groups of support columns 5, and the edge of the wafer 16 is blocked by the outer stop columns 6. The two lifting cylinders 11 act simultaneously to lift the lifting cylinder 10. Then, the swing cylinder 7 of the spraying assembly acts, and the spray head 8 rotates to the center position of the wafer 16. Subsequently, the rotary motor 2 drives the carrier plate 4 to rotate to brush-dry the wafer 16. At the same time, the spray head 8 first sprays pure water and then sprays nitrogen after a few seconds until the spin-drying is completed.

[0026] Embodiment 2:

[0027] This embodiment provides a wafer cleaning system, and the wafer cleaning system is provided with the above multi-size wafer drying mechanism.

[0028] In the description of the embodiments of the present invention, unless otherwise clearly defined and limited, the terms "installation", "connection", "connection", "setting", "provided with", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0029] Finally, it should be noted that the above embodiments are only specific embodiments of the present invention, which are used to illustrate the technical solutions of the present invention, rather than to limit them. The protection scope of the present invention is not limited thereto. Although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: any person skilled in the art within the technical scope disclosed by the present invention can still modify the technical solutions recorded in the foregoing embodiments, or can easily think of changes, or equivalently replace some of the technical features; and these modifications, changes or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be covered by the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. A multi-size wafer drying mechanism, comprising a workbench and a drying component and a spray component arranged on the workbench, characterized in that: The spin-drying assembly includes a rotating motor, a main shaft, a carrier plate, a supporting column and a blocking column. The rotating motor is connected to the carrier plate through the main shaft. The rotating motor can drive the carrier plate to rotate axially. The top of the carrier plate is provided with at least one group of supporting columns capable of supporting the bottom end surface of the wafer, and at least one group of blocking columns capable of limiting the edge of the wafer. The blocking columns are correspondingly arranged on one side of the supporting columns and are higher than the supporting columns. The spray assembly includes a swing rod cylinder and a spray head. The swing rod cylinder is connected to the spray head. The spray head is correspondingly arranged above the carrying plate. The swing rod cylinder can drive the spray head to swing.

2. The multi-size wafer drying mechanism according to claim 1, characterized in that: It also includes a water retaining assembly, which includes a water retaining cover, a lifting cylinder and a lifting cylinder. The lifting cylinder is sleeved outside the carrying plate, the water retaining cover is sleeved outside the lifting cylinder, and the lifting cylinder is connected to the lifting cylinder. The lifting cylinder can drive the lifting cylinder to move up and down.

3. The multi-size wafer drying mechanism according to claim 2, characterized in that: There are at least two lifting cylinders, and the lifting cylinders are fixed to the top of the lifting cylinder through a connecting plate.

4. The multi-size wafer drying mechanism according to claim 1, characterized in that: The carrying plate is provided with a plurality of supporting arms extending in a direction away from the carrying plate, and the supporting columns and the blocking columns are fixed at the top ends of the supporting arms.

5. The multi-size wafer drying mechanism according to claim 4, characterized in that: A row of plug-in interfaces is arranged at the top of the support arm, and the bottom ends of the support column and the blocking column are plugged into the plug-in interfaces, and the support column and the blocking column are arranged in sequence and at intervals.

6. The multi-size wafer drying mechanism according to claim 5, characterized in that: The heights of the support columns and the blocking columns gradually increase from one end close to the carrying plate to the other end far away from the carrying plate.

7. The multi-size wafer drying mechanism according to claim 1, characterized in that: An anti-skid friction pad is fixed on the top of the support column.

8. A wafer cleaning system, characterized in that: The wafer cleaning system has a multi-size wafer drying mechanism as described in any one of claims 1-7.

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