Semiconductor chip die bonding device

Abstract

The utility model relates to the technical field of semiconductor die bonding devices, and provides a semiconductor chip die bonding device, which comprises a supporting base, a driving device, a rotating device, two groups of fixing devices, a recycling device and a conveying device, the driving device is arranged on the supporting base, the input end of the rotating device is connected with the output end of the driving device, and the recycling device is arranged on the supporting base. According to the utility model, the structure is reasonable, the use is convenient, the problem of insufficient dispensing and chip installation precision in the die bonding work flow in the technical field of semiconductor chip die bonding is solved, the production efficiency is improved, the production cost is reduced, and the production efficiency is improved. And the problem that the subsequent process is affected due to the fact that residual glue drips after the dispensing head dispenses the glue is solved, and the efficiency and the accuracy of the semiconductor chip die bonding process are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chip die bonding devices, and particularly relates to a semiconductor chip die bonding device. Background Art

[0002] In the packaging process of semiconductor devices, die bonding is an extremely important link. The process of die bonding is as follows: First, the dispensing mechanism dispenses glue at the die bonding station of the substrate. Then, the die bonding swing arm of the die bonding mechanism picks up the semiconductor chip from the wafer and transfers it to the die bonding station where the glue has been dispensed to complete die bonding. In the whole process, it is necessary to continuously correct the position through the positioning device and system, which affects the efficiency. At the same time, the residual glue dripping on the dispensing mechanism will also affect the subsequent processes. Therefore, the utility model proposes a semiconductor chip die bonding device.

[0003] As disclosed in the application number: CN202310747772.0, an LED wafer die bonding device and a die bonding method, including a frame, a receiving table, a workbench, a die bonding member, and a laser member. The workbench and the receiving table are both installed on the frame, and the receiving table is located above the workbench. A wafer is received on the receiving table, and the edge of the wafer is fixedly connected to the receiving table. A PCB substrate is received on the workbench. The die bonding member is fixedly connected to the frame, and the die bonding member is located on the side of the wafer away from the workbench. The laser member is located inside the die bonding member. After driving the die bonding member to abut the chip in the wafer on the receiving table into the mounting groove on the PCB substrate, the laser member is started to burn through the blue film adhered to the chip, and then the die bonding member is driven away from the PCB substrate.

[0004] At present, the positioning efficiency of the die bonding member in the semiconductor chip die bonding device is not ideal, and the residual glue treatment of the dispensing mechanism is not in place, which greatly affects the die bonding efficiency. Summary of the Utility Model

[0005] In order to solve the problems of unsatisfactory positioning efficiency of the die bonding member and insufficient treatment of the residual glue of the dispensing mechanism, the utility model provides a semiconductor chip die bonding device to solve this problem.

[0006] To achieve the above object, the utility model provides the following technical solutions:

[0007] A semiconductor chip die bonding device, including: a support base, a driving device, a rotating device, a fixing device, a recycling device, and a conveying device. The driving device is arranged on the support base, the output end of the driving device is connected to the input end of the rotating device. There are two groups of fixing devices, and the two groups of fixing devices are respectively arranged at both ends of the rotating device. The recycling device is arranged under one group of fixing devices, and the conveying device is arranged under the recycling device.

[0008] Preferably, the support base includes a fixed base, a driving device fixing platform, a conveying device fixing platform, a support platform, and a material platform. The driving device fixing platform is fixedly arranged on the fixed base, and the driving device is installed on the driving device fixing platform. The conveying device fixing platform is fixedly arranged on one side of the driving device fixing platform, and the conveying device is arranged on the conveying device fixing platform. The support platform is arranged above the driving device, and the support platform is fixedly connected to the fixed base through a support column. The material platform is fixedly arranged on the support platform and is used in cooperation with the rotating device.

[0009] Preferably, the driving device includes a first motor, a half gear, a full gear, and a connecting shaft. The half gear is fixedly connected to the output end of the first motor, and the first motor drives the half gear to rotate. The full gear is fixedly arranged on the connecting shaft, and the full gear is meshed and connected with the half gear. The lower end of the connecting shaft is rotatably arranged on the driving device fixing platform, and the upper end of the connecting shaft is fixedly connected to the rotating device.

[0010] Preferably, the rotating device includes a rotating shaft, a support body, a cam, an operating rod, and a through hole. The lower end of the rotating shaft is fixedly connected to the upper end of the connecting shaft. The support body is sleeved on the rotating shaft, and the support body passes through the support base and is fixedly connected to the support base. The cam is fixedly arranged at the upper end of the support body, and the cam is coaxially arranged with the rotating shaft. The operating rod arranged above the cam is fixedly arranged on the upper part of the rotating shaft. The through holes are symmetrically arranged at both ends of the operating rod, and the cam is used in cooperation with the recovery device. The fixing device is arranged above the through holes.

[0011] Preferably, the recovery device includes a recovery base, a recovery bracket, a recovery plate, an arc-shaped baffle, a spring, and a support column. The recovery base is fixedly arranged below one end of the operating rod. The recovery bracket is slidably connected to the recovery base, and a recovery plate is slidably arranged inside the recovery bracket. The recovery plate is connected to the recovery plate arranged outside the recovery bracket through a support column. A spring is arranged between the plane side of the arc-shaped baffle and the outer surface of the recovery bracket, and both ends of the spring are fixedly connected to the arc-shaped baffle and the recovery bracket. The arc-shaped side of the arc-shaped baffle is used in cooperation with the cam.

[0012] Preferably, the fixing device includes fixing brackets, clamping blocks, threaded push rods, and slide rails. There are two groups of fixing brackets, clamping blocks, threaded push rods, and slide rails. The two groups of fixing brackets are symmetrically arranged above the through holes. Two groups of slide rails are fixedly arranged between the two groups of fixing brackets. The two groups of clamping blocks are slidably arranged on the slide rails. The threaded push rods pass through the threaded holes arranged on the fixing brackets and are connected to the clamping blocks.

[0013] Preferably, the conveying device includes a load support, a first rotating arm, a second rotating arm, an eccentric shaft, a connecting piece, and a second motor. The eccentric shaft is divided into two groups, and the two groups of eccentric shafts are symmetrically arranged on one side of the fixed table of the conveying device. The two groups of eccentric shafts are rotatably arranged on the fixed table of the conveying device. One end of the first rotating arm and the second rotating arm are respectively fixedly arranged in parallel on the eccentric shaft. The load support is rotatably arranged on the other ends of the first rotating arm and the second rotating arm. The connecting piece is rotatably arranged on the eccentric wheel of the eccentric shaft. The output end of the second motor is fixedly connected to the eccentric shaft. The load support bears the die bonding base.

[0014] The advantages of the present utility model are as follows: through the cooperation of the driving device, the rotating device and the conveying device, relying on the meshing connection between the half gear and the full gear, the precise positioning of the grasping mechanism and the dispensing mechanism is completed. The carrier is positioned and fixed by the cooperation of the conveying device, and the precise positioning of the entire die bonding operation is completed. The recycling device is used to recycle the residual glue on the dispensing rod, improving the efficiency of the die bonding process and ensuring that the residual glue does not affect the die bonding during the die bonding process. Description of the Drawings

[0015] The drawings constituting a part of the present utility model are used to provide a further understanding of the present utility model. The schematic embodiments and descriptions thereof of the present utility model are used to explain the present utility model and do not constitute an improper limitation to the present utility model. In the drawings:

[0016] Figure 1 is the structural schematic diagram of the present utility model;

[0017] Figure 2 is the front view of the support base and the driving device of the present utility model;

[0018] Figure 3 is the structural schematic diagram of the rotating device of the present utility model;

[0019] Figure 4 is the structural schematic diagram of the recycling device of the present utility model;

[0020] Figure 5 is the top view of the fixing device of the present utility model;

[0021] Figure 6 is the structural schematic diagram of the conveying device of the present utility model;

[0022] Figure 7 is the side cross-sectional view of the conveying device of the present utility model.

[0023] Description of the Reference Numerals:

[0024] 1. Support base; 2. Driving device; 3. Rotating device; 4. Fixing device; 5. Recycling device; 6. Conveying device; 11. Fixed base; 12. Driving device fixing platform; 13. Conveying device fixing platform; 14. Support platform; 15. Material platform; 21. First motor; 22. Half gear; 23. Full gear; 24. Connecting shaft; 31. Rotating shaft; 32. Support body; 33. Cam; 34. Operating rod; 35. Through hole; 41. Fixed bracket; 42. Clamping block; 43. Threaded push rod; 44. Slide rail; 51. Recycling base; 52. Recycling bracket; 53. Recycling plate; 54. Arc-shaped baffle; 55. Spring; 56. Support pillar; 61. Carrying bracket; 62. First rotating arm; 63. Second rotating arm; 64. Eccentric shaft; 65. Connecting piece; 66. Second motor. Detailed implementation manners

[0025] Example 1, in combination with Figure 1 for description:

[0026] A semiconductor chip die bonding device, characterized in that it includes: a support base 1, a driving device 2, a rotating device 3, a fixing device 4, a recycling device 5 and a conveying device 6. The driving device 2 is arranged on the support base 1, the output end of the driving device 2 is connected to the input end of the rotating device 3, there are two groups of fixing devices 4, and the two groups of fixing devices 4 are respectively arranged at both ends of the rotating device 3. The recycling device 5 is arranged on the lower side of one of the groups of fixing devices 4, and the conveying device 6 is arranged below the recycling device 5.

[0027] Set like this, fix the support base 1 through screws, etc. After fixing, connect the driving device 2 with the support base 1. The gear is rotationally connected, and the motor is fixedly connected. Fix the output end of the driving device 2 and the input end of the rotating device 3 through a shaft pin. There are two groups of fixing devices 4, and the two groups of fixing devices 4 are respectively arranged at both ends of the rotating device 3 and are fixed on the rotating device 3 through screws. A recycling device 5 is fixedly arranged at the bottom of any one of the groups of fixing devices 4. The conveying device 6 is arranged on the support base 1 and is aligned with the recycling device 5.

[0028] Example 2, on the basis of Example 1, in combination with Figure 2 for description:

[0029] The support base 1 includes: a fixed base 11, a driving device fixing table 12, a conveying device fixing table 13, a support platform 14, and a material table 15. The driving device fixing table 12 is fixedly arranged on the fixed base 11, the driving device 2 is installed on the driving device fixing table 12, the conveying device fixing table 13 is fixedly arranged on one side of the driving device fixing table 12, the conveying device 6 is arranged on the conveying device fixing table 13, the support platform 14 is arranged on the driving device 2, the support platform 14 is fixedly connected to the fixed base 11 through a pillar, the material table 15 is fixedly arranged on the support platform 14, and the material table 15 is used in cooperation with the rotating device 3.

[0030] With such an arrangement, the driving device 2 and the conveying device 3 are fixed in place, the die bonding part is placed in the material table, which is convenient for positioning and grasping, and the fixed base is positioned through the positioning of the conveying device 3 to ensure the positioning effect of the die bonding process.

[0031] Embodiment 3, on the basis of Embodiment 2, in combination with Figure 2 is described as follows:

[0032] The driving device 2 includes: a first motor 21, a half gear 22, a full gear 23, and a connecting shaft 24. The half gear 22 is fixedly connected to the output end of the first motor 21, and the first motor 21 drives the half gear 22 to rotate. The full gear 23 is fixedly arranged on the connecting shaft 24, the full gear 23 is meshed and connected with the half gear 22, the lower end of the connecting shaft 24 is rotatably arranged on the driving device fixing table 12, and the upper end of the connecting shaft 24 is fixedly connected to the rotating device 3.

[0033] With such an arrangement, the first motor 21 is fixed, then the output end of the first motor 21 is fixedly connected to the half gear 22, the half gear 22 is rotatably connected to the driving device fixing table 12, the full gear 23 is rotatably connected to the driving device fixing table 12, the full gear 23 is meshed and connected with the half gear 22, the full gear 23 is fixedly connected to the lower end of the connecting shaft 24, and the upper end of the connecting shaft 24 is fixedly connected to the input end of the rotating device 3 through a shaft pin, so that the connecting shaft 24 can drive the rotating device 3 to rotate on the driving device fixing table 12. 180° of the half gear 22 is the toothed part, and the other 180° is the toothless part.

[0034] Embodiment 4, on the basis of Embodiment 3, in combination with Figure 3 is described as follows:

[0035] The rotating device 3 includes: a rotating shaft 31, a support 32, a cam 33, an operating rod 34, and a through hole 35. The lower end of the rotating shaft 31 is fixedly connected to the upper end of the connecting shaft 24. The support 32 is sleeved on the rotating shaft 31, passes through the support base 1, and is fixedly connected to the support base 1. The cam 33 is fixedly arranged at the upper end of the support 32 and is coaxially arranged with the rotating shaft 31. The operating rod 34 arranged above the cam 33 is fixedly arranged on the upper part of the rotating shaft 31. The through holes 35 are symmetrically arranged at both ends of the operating rod 34. The cam 33 is used in cooperation with the recycling device 5, and the fixing device 4 is arranged above the through hole.

[0036] With such an arrangement, after fixedly connecting the input end of the rotating shaft 31 to the connecting shaft 24, the rotating shaft 31 is passed through the support platform 14, and the support 32 is sleeved on the rotating shaft 31. The support 32 is fixedly connected to the support platform 14. The cam 33 is coaxially arranged with the rotating shaft 31 and is fixedly connected to the support 32, so that the convex direction of the cam 33 faces the fixing table 13 of the conveying device. The cam 33 is used in cooperation with the recycling device 5. The operating rod 34 is placed on the upper end of the cam 33 and is fixedly connected to the rotating shaft 31. The through holes 35 are symmetrically arranged at both ends of the operating rod 34. When any end of the operating rod 34 is above the negative film carried by the loading bracket 61, the toothed part end point of the half gear 22 of the driving device 2 meshes with the full gear 23. During use, when the half gear 22 meshes with the full gear 23, the rotating device 3 rotates accordingly. When the half gear 22 does not mesh with the full gear 23, the rotating device 3 does not rotate, and the dispensing mechanism and the grasping mechanism work.

[0037] Embodiment 5, on the basis of Embodiment 4, in combination with Figure 4 is described as follows:

[0038] The recycling device 5 includes: a recycling base 51, a recycling bracket 52, a recycling plate 53, an arc-shaped baffle 54, a spring 55, and a support column 56. The recycling base 51 is fixedly arranged below one end of the operating rod 34. The recycling bracket 52 is slidably connected to the recycling base 51. A recycling plate 53 is slidably arranged inside the recycling bracket 52. The recycling plate 53 is connected to the recycling plate 53 arranged outside the recycling bracket 52 through a support column 56. A spring 55 is arranged between the plane side of the arc-shaped baffle 54 and the outer surface of the recycling bracket 52. Both ends of the spring 55 are fixedly connected to the arc-shaped baffle 54 and the recycling bracket 52. The arc surface side of the arc-shaped baffle 54 is used in cooperation with the cam 33.

[0039] Set up in this way, the recycling base 51 is fixed to the bottom of any through hole 35 by screws. The recycling base 51 is slidably connected to the recycling bracket 52. A recycling plate 53 is slidably arranged inside the recycling bracket 52. The recycling plate 53 is fixedly connected to the flat end of the arc-shaped baffle 54 outside the recycling bracket 52 through a support column 56. The arc surface of the arc-shaped baffle 54 is tangent to the cam 33 in the rotating device 3. A spring 55 is arranged between the flat end of the arc-shaped baffle 54 and the outer shell of the recycling bracket 52. Both ends of the spring 55 are fixed to the arc-shaped baffle 54 and the recycling bracket 52. During actual operation, when the arc-shaped baffle 54 is tangent to the highest point of the cam 33, the cam 33 pushes the recycling plate 53 to open outward to the limit position, enabling the dispensing mechanism to perform dispensing. When the arc-shaped baffle 54 leaves the highest point of the cam 33, the spring 55 starts to restore the position of the recycling plate 53, and the recycling plate 53 blocks the dispensing mechanism to recycle the dripping residual glue.

[0040] Embodiment Six, on the basis of Embodiment Four, in combination with Figure 5 it is described as follows:

[0041] The fixing device 4 includes: a fixing bracket 41, clamping blocks 42, a threaded push rod 43, and a slide rail 44. There are two sets of the fixing bracket 41, clamping blocks 42, threaded push rod 43, and slide rail 44. The two sets of fixing brackets 41 are symmetrically arranged above the operating rod 34. Two sets of slide rails 44 are fixedly arranged between the two sets of fixing brackets 41. The two sets of clamping blocks 42 are slidably arranged on the slide rails 44. The threaded push rod 43 passes through the threaded hole arranged on the fixing bracket 41 and is connected to the clamping block 42.

[0042] Set up in this way, the fixing bracket 41 is fixedly arranged at both ends of the through hole 35 and connected through the slide rail 44. The two clamping blocks 42 are symmetrically placed between the fixing brackets, making the clamping blocks 42 slidably connected to the slide rail 44. The threaded push rod 43 is abutted against the clamping block 42 through the threaded hole on the fixing bracket 41. During actual use, the dispensing mechanism and the grasping mechanism are placed in the fixing device 4. The dispensing mechanism should cooperate with the recycling device 5. By adjusting the threaded push rod 43 to push the clamping block 42, the dispensing mechanism and the grasping mechanism are fixed by the clamping block 42. In different application scenarios, the dispensing mechanism and the grasping mechanism can be replaced. For example, in the die bonding of LED chips, the dispensing mechanism can be replaced with a laser fixing mechanism.

[0043] Embodiment Seven, on the basis of Embodiment Six, in combination with Figure 6 and Figure 7 it is described as follows:

[0044] The transfer device 6 includes: a carrier bracket 61, a first rotating arm 62, a second rotating arm 63, an eccentric shaft 64, a connecting piece 65, and a second motor 66. The eccentric shaft 64 is divided into two groups, and the two groups of eccentric shafts 64 are symmetrically arranged on one side of the transfer device fixed platform 13. The two groups of eccentric shafts 64 are rotatably arranged with the transfer device fixed platform 13. One end of the first rotating arm 62 and the second rotating arm 63 are respectively fixedly arranged in parallel on the eccentric shaft 64. The carrier bracket 61 is rotatably arranged on the other ends of the first rotating arm 62 and the second rotating arm 63. The connecting piece 65 is rotatably arranged on the eccentric wheel of the eccentric shaft 64. The output end of the second motor 66 is fixedly connected to the eccentric shaft 64. The die bonding base is carried on the carrier bracket 61.

[0045] With such a setting, one end of the eccentric shaft 64 passes through the transfer device fixed platform 13, with the side having the eccentric wheel facing outward. The first rotating arm 62 and the second rotating arm 63 are rotatably arranged on one end of the eccentric shaft 64. The two groups of first rotating arms 62 and second rotating arms 63 are kept parallel and rotatably connected to the carrier bracket 61. The carrier bracket 61 is in a horizontal state. The connecting piece 65 is rotatably arranged on the eccentric wheels of the two groups of eccentric shafts 64. The output end of the second motor 66 is fixedly arranged on one end of any eccentric shaft 64. During actual operation, when the eccentric shaft 64 rotates, it drives the other eccentric shaft 64 to rotate through the connecting piece 65. The two eccentric shafts 64 simultaneously drive the first rotating arm 62 and the second rotating arm 63 to rotate, causing the carrier bracket 61 to follow the rotation. When the carrier bracket 61 is at the highest point, the die bonding base can be lifted. As the carrier bracket 61 rotates, the die bonding base is moved to the right. The carrier bracket 61 continues to rotate, and the die bonding base is placed on the transfer device fixed platform 13. In this way, the die bonding base and the die bonding component are repeatedly transported from left to right.

[0046] Working principle of the present utility model: The semi-gear 22 fixedly connected to the first motor 21 drives the full gear 23 meshed therewith, so that the full gear 23 and the connecting shaft 24 drive the rotating shaft 31 and the operating rod 34 to rotate, adjusting the positions of the dispensing mechanism and the grasping mechanism fixed on the operating rod 34 by the fixing device 4. When the dispensing mechanism is above the die bonding base carried by the carrier bracket 61, the cam 33 presses against the arc-shaped baffle 54 to compress the spring 55, causing the recovery plate 53 to move, making room for the dispensing mechanism to work. After the dispensing mechanism leaves above the die bonding base carried by the carrier bracket 61, the spring 55 resumes its original state, causing the recovery plate 53 to block below the dispensing mechanism to collect the residual glue. When the grasping mechanism is above the material table 15, the grasping mechanism grabs the material placed in the material table 15. After the operating rod 34 rotates again, the grasping mechanism above the die bonding base carried by the carrier bracket 61 places the material down for die bonding. After the die bonding is completed, with the movement of the first rotating arm 62 and the second rotating arm 63, the carrier bracket 61 lifts and moves the die bonded component to transport the die bonded component away. The structure of the present utility model is reasonable and convenient to use, solving the problems of insufficient dispensing and chip mounting accuracy in the die bonding process in the technical field of semiconductor chip die bonding, and solving the problem that the dispensing head drips residual glue after dispensing, affecting subsequent processes, improving the efficiency and accuracy of the semiconductor chip die bonding process.

[0047] For those skilled in the art, the present utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the present utility model; therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present utility model. Any reference signs in the claims should not be regarded as limiting the claims involved.

[0048] The above is only the preferred embodiment of the present utility model, and is not used to limit the present utility model. Any minor modifications, equivalent replacements, and improvements made to the above embodiments based on the technical essence of the present utility model should be included in the protection scope of the technical solution of the present utility model.

Claims

1. A semiconductor chip bonding device, characterized in that: include: A support base (1), a driving device (2), a rotating device (3), a fixing device (4), a recovery device (5) and a conveying device (6), wherein the driving device (2) is arranged on the support base (1), the output end of the driving device (2) is connected to the input end of the rotating device (3), the fixing device (4) is provided with two groups, and the two groups of fixing devices (4) are respectively arranged at two ends of the rotating device (3), the recovery device (5) is arranged on the lower side of one group of the fixing devices (4), and the conveying device (6) is arranged below the recovery device (5).

2. A semiconductor chip bonding device according to claim 1, characterized in that: The support base (1) comprises: a fixed base (11), a driving device fixed platform (12), a conveying device fixed platform (13), a support platform (14) and a material platform (15); the driving device fixed platform (12) is fixedly arranged on the fixed base (11); the driving device (2) is installed on the driving device fixed platform (12); the conveying device fixed platform (13) is fixedly arranged on one side of the driving device fixed platform (12); the conveying device (6) is arranged on the conveying device fixed platform (13); the support platform (14) is arranged above the driving device (2); the support platform (14) and the fixed base (11) are fixedly connected by pillars; the material platform (15) is fixedly arranged on the support platform (14); and the material platform (15) is used in conjunction with the rotating device (3).

3. A semiconductor chip bonding device according to claim 2, characterized in that: The driving device (2) comprises: a first motor (21), a half gear (22), a full gear (23) and a connecting shaft (24); the half gear (22) is fixedly connected to the output end of the first motor (21); the first motor (21) drives the half gear (22) to rotate; the full gear (23) is fixedly arranged on the connecting shaft (24); the full gear (23) is meshingly connected with the half gear (22); the lower end of the connecting shaft (24) is rotatably arranged on a driving device fixing platform (12); and the upper end of the connecting shaft (24) is fixedly connected to the rotating device (3).

4. A semiconductor chip bonding device according to claim 3, characterized in that: The rotating device (3) comprises: a rotating shaft (31), a support body (32), a cam (33), an operating rod (34) and a through hole (35); the lower end of the rotating shaft (31) is fixedly connected to the upper end of the connecting shaft (24); the support body (32) is sleeved on the rotating shaft (31); the support body (32) passes through the support base (1) and is fixedly connected to the support base (1); the cam (33) is fixedly arranged on the upper end of the support body (32); the cam (33) and the rotating shaft (31) are coaxially arranged; the operating rod (34) arranged above the cam (33) is fixedly arranged on the upper part of the rotating shaft (31); the through holes (35) are symmetrically arranged at both ends of the operating rod (34); the cam (33) is used in conjunction with the recovery device (5); and the fixing device (4) is arranged on the upper side of the through hole.

5. A semiconductor chip bonding device according to claim 4, characterized in that: The recovery device (5) comprises: a recovery base (51), a recovery bracket (52), a recovery plate (53), an arc-shaped baffle (54), a spring (55) and a support (56); the recovery base (51) is fixedly arranged below one end of the operating rod (34); the recovery bracket (52) is slidably connected to the recovery base (51); a recovery plate (53) is slidably arranged inside the recovery bracket (52); the recovery plate (53) is connected to a recovery plate (53) arranged outside the recovery bracket (52) through a support (56); a spring (55) is arranged between a plane side of the arc-shaped baffle (54) and an outer surface of the recovery bracket (52); two ends of the spring (55) are fixedly connected to the arc-shaped baffle (54) and the recovery bracket (52); and the arc-surface side of the arc-shaped baffle (54) cooperates with the cam (33) for use.

6. The semiconductor chip bonding device according to claim 4, characterized in that: The fixing device (4) comprises: a fixing bracket (41), a clamping block (42), a threaded push rod (43) and a slide rail (44); the fixing bracket (41), the clamping block (42), the threaded push rod (43) and the slide rail (44) are provided in two groups; the two groups of fixing brackets (41) are symmetrically arranged above the operating rod (34); two groups of slide rails (44) are fixedly arranged between the two groups of fixing brackets (41); the two groups of clamping blocks (42) are slidably arranged on the slide rails (44); and the threaded push rod (43) passes through a threaded hole provided on the fixing bracket (41) and is connected to the clamping block (42).

7. The semiconductor chip bonding device according to claim 2, characterized in that: The conveying device (6) comprises: a carrier (61), a first rotating arm (62), a second rotating arm (63), an eccentric shaft (64), a connecting piece (65) and a second motor (66). The eccentric shaft (64) is divided into two groups. The two groups of eccentric shafts (64) are symmetrically arranged on one side of the conveying device fixed platform (13). The two groups of eccentric shafts (64) are rotatably arranged with the conveying device fixed platform (13). One end of the first rotating arm (62) and the second rotating arm (63) are respectively and parallelly fixed on the eccentric shaft (64). The carrier (61) is rotatably arranged on the other end of the first rotating arm (62) and the second rotating arm (63). The connecting piece (65) is rotatably arranged on the eccentric wheel of the eccentric shaft (64). The output end of the second motor (66) is fixedly connected to the eccentric shaft (64). The carrier (61) carries a solid crystal base.

Images