Wafer blue film puncture thimble seat

Abstract

The utility model relates to the technical field of wafer blue film puncture processing, in particular to a wafer blue film puncture ejector pin seat, which comprises an ejector pin seat main body and an ejector pin cap, an embedding groove is formed in the lower portion of the ejector pin cap, positioning grooves are evenly formed in the top end of the ejector pin base body, ejector pin bodies are arranged in the first through holes in a penetrating mode, the bottom ends of the ejector pin bodies are arranged in the corresponding positioning grooves in an extending mode, and the ejector pin bodies are placed in the first through holes according to needs. A first through hole and a positioning groove are correspondingly formed in the ejector pin base body and the ejector pin cap, the puncture position can be adjusted according to the size and the shape of a chip, the ejector pin body is placed in the first through hole, then the bottom end of the ejector pin body is inserted into the corresponding positioning groove, and the ejector pin layout can be adjusted according to use requirements in a matched mode; compared with a traditional ejector pin seat, the ejector pin seat is more convenient to use, and the application range of the ejector pin seat is effectively widened.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer blue film piercing processing, in particular to a wafer blue film piercing thimble seat. Background Technique

[0002] A wafer is a material for manufacturing chips. During the chip manufacturing process, a blue film needs to be adhered to the wafer, and then the wafer is divided and processed into chips. When the chips are packaged, the chips need to be removed from the blue film. When removing, a thimble seat and a suction nozzle are used to suck the chips away from the blue film.

[0003] A patent with the publication number of CN 215771099 U discloses a thimble seat structure for fixing thimbles, including a housing. A thimble fixing member and a movable member are arranged inside the housing. A thimble cap is also detachably and fixedly connected to the top of the housing. The thimble fixing member is fixedly connected to the movable member through a fixing screw. The movable member is slidably connected inside the housing. The hollow area designed on the movable member can increase the internal vacuum pumping space of the thimble seat through bottom vacuum access. By placing filter cotton inside the movable member, it plays a role in filtering impurities in the vacuum gas and preventing the vacuum holes from being blocked. The bottom of the movable member is connected to the vacuum, and through the hollow area and the thimble jack, the vacuum inside the thimble seat housing is pumped out, achieving the effect of adsorbing chips.

[0004] However, since the existing thimble seat can only install one thimble, when the chip size changes, other specifications of thimble seats need to be replaced, and the number of thimbles and the thimble layout cannot be adjusted according to the usage requirements, resulting in a limited scope of use. Therefore, a wafer blue film piercing thimble seat is proposed for the above problems. Content of the Utility Model

[0005] In order to make up for the deficiencies of the prior art and solve the problems existing in the prior art, the utility model proposes a wafer blue film piercing thimble seat.

[0006] The technical solution adopted by the utility model to solve its technical problems is as follows: A wafer blue film piercing thimble seat of the utility model includes a thimble seat main body and a thimble cap. A fitting groove is arranged under the thimble cap, and the thimble cap is fitted to the upper end of the thimble seat main body through the fitting groove. An installation cavity is arranged inside the thimble seat main body. Positioning grooves are evenly distributed at the top end of the thimble seat main body. First through holes corresponding to the positioning grooves are evenly distributed on the thimble cap. An adsorption component is arranged on the thimble cap.

[0007] Thimble bodies are respectively penetrated through the first through holes, and the bottom ends of the thimble bodies respectively extend into the corresponding positioning grooves, which can adjust the thimble layout according to the usage requirements. Compared with the traditional thimble seat, it is more convenient to use and effectively improves the applicable range of the thimble seat.

[0008] Preferably, two sinking grooves are symmetrically formed on the outside of the first through hole on the thimble cap. Second through holes are respectively formed through the bottoms of the two sinking grooves. On the top of the thimble seat body, two threaded holes corresponding to the two sinking grooves are symmetrically formed on the outside of the positioning groove. A fastening bolt is arranged in the second through hole, and the threaded end of the fastening bolt passes through the second through hole and is arranged in the threaded hole, so as to achieve the function of fixing the thimble cap and ensure the normal use of the device.

[0009] Preferably, two second pin holes are symmetrically formed on the outside of the positioning groove at the top end of the thimble seat body. On the top of the fitting groove, first pin holes corresponding to the two second pin holes are symmetrically formed on the outside of the first through hole. Positioning pins are respectively arranged in the two second pin holes, and the two positioning pins respectively extend vertically upward and are arranged in the two first pin holes, so as to achieve the function of limiting and installing the thimble cap and ensure the accurate installation of the thimble body.

[0010] Preferably, the adsorption assembly includes two arc-shaped adsorption grooves. The two arc-shaped adsorption grooves are symmetrically formed on the upper surface of the thimble cap and are symmetrically arranged on the outside of the first through hole. Adsorption through grooves are respectively formed in an L shape at the bottoms of the two arc-shaped adsorption grooves, so as to achieve the function of adsorbing the blue film and ensure the normal use of the device.

[0011] Preferably, the horizontal sections of the adsorption through grooves formed in the two arc-shaped adsorption grooves are symmetrically arranged outward, and adsorption branch pipes are respectively installed at the openings of the horizontal sections of the adsorption through grooves, so as to achieve the function of communicating adsorption.

[0012] Preferably, connecting pipes are respectively installed at the other ends of the two adsorption branch pipes, and second quick connectors are respectively installed at the openings of the ends of the connecting pipes, so as to achieve the function of quick connection and improve the convenience of using the device.

[0013] The beneficial effects of the present utility model are as follows:

[0014] 1. By putting the thimble body into the first through hole as needed and correspondingly forming the first through hole and the positioning groove on the thimble seat body and the thimble cap, the puncture position can be adjusted according to the size and shape of the chip. After the thimble body is put into the first through hole, its bottom end will be inserted into the corresponding positioning groove, so as to achieve the function of adjusting the thimble layout according to the use requirements. Compared with the traditional thimble seat, it is more convenient to use and effectively improves the applicable range of the thimble seat. Description of the Drawings

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0016] Figure 1 is the first three-dimensional structure schematic diagram;

[0017] Figure 2 is the enlarged schematic diagram of the main structure of the thimble seat;

[0018] Figure 3 is the enlarged sectional view of the main structure of the thimble seat;

[0019] Figure 4 is the enlarged sectional view of the main structure of the opening method of the positioning groove;

[0020] Figure 5 is the enlarged schematic diagram of the bottom surface of the thimble cap;

[0021] Figure 6 is the enlarged schematic diagram of the upper surface of the thimble cap;

[0022] Figure 7 is the enlarged sectional view of the main structure of the thimble cap.

[0023] In the figure: 1. Thimble seat main body; 2. Thimble cap; 3. Fitting groove; 4. First through hole; 5. Positioning groove; 6. Thimble main body; 7. Sunk groove; 8. Second through hole; 9. Threaded hole; 10. Fastening bolt; 11. First pin hole; 12. Second pin hole; 13. Positioning pin; 14. Arc adsorption groove; 15. Adsorption through groove; 16. Adsorption branch pipe; 17. Connecting pipe; 18. Quick joint; 19. Installation cavity. Specific embodiments

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0025] Please refer to Figure 1-7As shown in the figure, a wafer blue film piercing thimble seat includes a thimble seat body 1 and a thimble cap 2; a fitting groove 3 is provided under the thimble cap 2, and the thimble cap 2 is fitted on the upper end of the thimble seat body 1 through the fitting groove 3. An installation cavity 19 is provided in the thimble seat body 1. Positioning grooves 5 are evenly distributed and opened at the top end of the thimble seat body 1. First through holes 4 are evenly distributed and opened on the thimble cap 2 corresponding to the positioning grooves 5. An adsorption component is provided on the thimble cap 2;

[0026] Thimble bodies 6 are respectively penetrated and arranged in the first through holes 4, and the bottom ends of the thimble bodies 6 respectively extend and are arranged in the corresponding positioning grooves 5.

[0027] Two counterbores 7 are symmetrically opened on the thimble cap 2 outside the first through holes 4. Second through holes 8 are respectively penetrated and opened at the bottoms of the two counterbores 7. Two threaded holes 9 corresponding to the two counterbores 7 are symmetrically opened on the top of the thimble seat body 1 outside the positioning grooves 5. A fastening bolt 10 is provided in the second through hole 8, and the threaded end of the fastening bolt 10 penetrates through the second through hole 8 and is arranged in the threaded hole 9.

[0028] Two second pin holes 12 are symmetrically opened on the top end of the thimble seat body 1 outside the positioning grooves 5. First pin holes 11 corresponding to the two second pin holes 12 are symmetrically opened at the top inside the fitting groove 3 outside the first through holes 4. Positioning pins 13 are respectively arranged in the two second pin holes 12, and the two positioning pins 13 respectively extend vertically upward and are arranged in the two first pin holes 11.

[0029] The adsorption component includes two arc-shaped adsorption grooves 14. The two arc-shaped adsorption grooves 14 are symmetrically opened on the upper surface of the thimble cap 2 and are symmetrically arranged outside the first through holes 4. Adsorption through grooves 15 are respectively opened in an L shape at the bottom of the two arc-shaped adsorption grooves 14.

[0030] The horizontal sections of the adsorption through grooves 15 opened in the two arc-shaped adsorption grooves 14 are symmetrically arranged outward, and adsorption branch pipes 16 are installed at the openings of the horizontal sections of the adsorption through grooves 15.

[0031] The other ends of the two adsorption branch pipes 16 are respectively installed with connecting pipes 17, and second quick connectors 18 are installed at the openings of the ends of the connecting pipes 17.

[0032] During operation, since only one ejector pin can be installed in the existing ejector pin base, when the chip size changes, it is necessary to replace the ejector pin base of other specifications, and the number of ejector pins and the layout of the ejector pins cannot be adjusted according to the usage requirements, resulting in a limited scope of use. In this solution, the air extraction and injection device is connected to the two connecting pipes 17 through the quick connectors 18 respectively. The ejector pin base in this solution is installed on the lifting device in the die bonder. According to the need, the ejector pin body 6 is placed into the first through hole 4. And by correspondingly opening the first through hole 4 and the positioning groove 5 on the ejector pin base body 1 and the ejector pin cap 2, the puncture position can be adjusted according to the chip size and chip shape. After the ejector pin body 6 is placed into the first through hole 4, its bottom end will be inserted into the corresponding positioning groove 5. First, control the device to move the ejector pin base under the blue film. Then, use the air extraction and injection device to extract air through the connecting pipe 17 and the adsorption branch pipe 16, extract the air between the arc-shaped adsorption groove 14 and the blue film, and adsorb the blue film on the surface of the ejector pin cap 2 for the next chip picking operation. Move the vacuum suction nozzle above the chip through the swing arm and adsorb the chip through the suction nozzle. Then, when controlling the device to lift upward, when the ejector pin body 6 moves upward, its top end will lift the blue film upward. Under the lifting action of the ejector pin body 6, the chip adhered to the blue film will be lifted, and cooperate with the suction nozzle to remove the chip from the blue film for packaging. The cooperation achieves the ability to adjust the ejector pin layout according to the usage requirements, is more convenient to use compared with the traditional ejector pin base, and effectively improves the applicable range of the ejector pin base.

[0033] Working principle: The air extraction and injection device is connected to the two connecting pipes 17 through the quick connectors 18 respectively. The ejector pin base in this solution is installed on the lifting device in the die bonder. According to the need, the ejector pin body 6 is placed into the first through hole 4. And by correspondingly opening the first through hole 4 and the positioning groove 5 on the ejector pin base body 1 and the ejector pin cap 2, the puncture position can be adjusted according to the chip size and chip shape. After the ejector pin body 6 is placed into the first through hole 4, its bottom end will be inserted into the corresponding positioning groove 5. First, control the device to move the ejector pin base under the blue film. Then, use the air extraction and injection device to extract air through the connecting pipe 17 and the adsorption branch pipe 16, extract the air between the arc-shaped adsorption groove 14 and the blue film, and adsorb the blue film on the surface of the ejector pin cap 2 for the next chip picking operation. Move the vacuum suction nozzle above the chip through the swing arm and adsorb the chip through the suction nozzle. Then, when controlling the device to lift upward, when the ejector pin body 6 moves upward, its top end will lift the blue film upward. Under the lifting action of the ejector pin body 6, the chip adhered to the blue film will be lifted, and cooperate with the suction nozzle to remove the chip from the blue film for packaging. The cooperation achieves the ability to adjust the ejector pin layout according to the usage requirements, is more convenient to use compared with the traditional ejector pin base, and effectively improves the applicable range of the ejector pin base.

[0034] The above has shown and described the basic principles, main features and advantages of the present utility model. Those skilled in the art should understand that the present utility model is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and these changes and improvements all fall within the scope of the present utility model claimed.

Claims

1. A wafer blue film puncture ejector seat, characterized in that: The invention comprises an ejector seat body (1) and an ejector cap (2); an engaging groove (3) is arranged at the bottom of the ejector cap (2), and the ejector cap (2) is engaged with the upper end of the ejector seat body (1) through the engaging groove (3); an installation cavity (19) is arranged in the ejector seat body (1); positioning grooves (5) are evenly distributed on the top of the ejector seat body (1); a through hole (4) is evenly distributed on the ejector cap (2) corresponding to the positioning groove (5); and an adsorption component is arranged on the ejector cap (2); The first through holes (4) are each provided with an ejector body (6) extending therethrough, and the bottom ends of the ejector bodies (6) are respectively extended and arranged in the corresponding positioning grooves (5).

2. A wafer blue film puncture ejector seat according to claim 1, characterized in that: The ejector cap (2) has two recessed grooves (7) symmetrically formed on the outside of the No. 1 through hole (4), and the bottoms of the two recessed grooves (7) are respectively penetrated by No. 2 through holes (8). The top of the ejector seat body (1) has two threaded holes (9) symmetrically formed on the outside of the positioning groove (5) and corresponding to the two recessed grooves (7), and a fastening bolt (10) is arranged in the No. 2 through hole (8), and the threaded end of the fastening bolt (10) passes through the No. 2 through hole (8) and is arranged in the threaded hole (9).

3. A wafer blue film puncture ejector seat according to claim 1, characterized in that: The top of the ejector seat body (1) is located outside the positioning groove (5) and is symmetrically provided with two No. 2 pin holes (12); the top of the interlocking groove (3) is located outside the No. 1 through hole (4) and is symmetrically provided with a No. 1 pin hole (11) corresponding to the two No. 2 pin holes (12); a positioning pin (13) is respectively provided in the two No. 2 pin holes (12), and the two positioning pins (13) are respectively extended vertically upward and provided in the two No. 1 pin holes (11).

4. The wafer blue film puncture ejector seat according to claim 1, characterized in that: The adsorption assembly comprises two arc-shaped adsorption grooves (14), the two arc-shaped adsorption grooves (14) are symmetrically arranged on the upper surface of the ejector cap (2) and symmetrically arranged outside the No. 1 through hole (4), and the inner bottoms of the two arc-shaped adsorption grooves (14) are respectively provided with adsorption through grooves (15) in an L shape.

5. The wafer blue film puncture ejector seat according to claim 4, characterized in that: The horizontal sections of the adsorption channels (15) opened by the two arc-shaped adsorption grooves (14) are symmetrically arranged outwards, and adsorption branch pipes (16) are installed at the openings of the horizontal sections of the adsorption channels (15).

6. A wafer blue film puncture ejector seat according to claim 5, characterized in that: The other ends of the adsorption branch pipes (16) on both sides are respectively installed with connecting pipes (17), and the end openings of the connecting pipes (17) are both installed with No. 2 quick connectors (18).

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