High-temperature quartz insulating cover for semiconductor

Abstract

The utility model relates to the technical field of quartz insulating covers, and discloses a high-temperature quartz insulating cover for a semiconductor, which comprises a touch hand area, the touch hand area comprises a triangular concave area, the top of the touch hand area is fixedly connected with a top convex body, and the inner side of the bottom of the touch hand area is fixedly connected with a quartz cover body. The triangular concave area is arranged in the middle of the outer side wall of the quartz cover body, a connecting area is arranged at the bottom of the quartz cover body, the connecting area comprises an adsorption part, and the top of the adsorption part is fixedly connected to the bottom of the quartz cover body. Friction force on the outer side is increased through the touch hand area, operation of operators in the installation and maintenance process is facilitated, the possibility of sliding and misoperation is reduced, better grabbing force is provided for the operators, operation is more accurate and stable, the sealing edge of the connecting area can provide a good sealing effect, and the service life of the operators is prolonged. And external impurities and dust are prevented from invading, internal substances are prevented from leaking, and a semiconductor production environment is kept clean and stable.

Description

Technical Field

[0001] The utility model relates to the technical field of quartz insulating covers, and particularly relates to a high-temperature quartz insulating cover for semiconductors. Background Technique

[0002] Due to the very fine and complex circuit structure inside semiconductor devices, insulating covers are needed for protection. The insulating cover can effectively isolate each component, avoid short circuits caused by accidental contact, impurities or water vapor, and thus ensure the normal operation of the circuit. When a semiconductor is working, electromagnetic signals will be generated. The insulating cover can play a shielding role, reducing the interference of external electromagnetic fields on semiconductor devices, and at the same time preventing the electromagnetic signals generated by the semiconductor itself from affecting other surrounding electronic devices. Semiconductors are usually relatively fragile and are easily damaged by external force impacts, scratches or squeezes. The insulating cover can provide a certain degree of physical protection and reduce the risk of damage.

[0003] With the increasing integration of semiconductor devices, the requirements for insulation performance are more stringent. Some insulating covers may have problems such as slight leakage or insufficient insulation resistance, and in some extreme high-temperature semiconductor manufacturing processes, existing insulating covers may not be able to withstand high temperatures for a long time, resulting in performance degradation or damage. During installation, transportation or use, they may be impacted or squeezed by external forces. The mechanical strength of some insulating covers is insufficient, and they may fall off due to the shaking during equipment operation, affecting the insulation effect. Summary of the Utility Model

[0004] The purpose of the utility model is to solve the problems that semiconductor insulating covers have slight leakage, insufficient insulation resistance, inability to withstand high temperatures for a long time, insufficient mechanical strength, and are likely to fall off due to external force impacts or equipment shaking, which may affect the insulation effect. The utility model provides a high-temperature quartz insulating cover for semiconductors.

[0005] The utility model specifically adopts the following technical solutions to achieve the above purpose:

[0006] A high-temperature quartz insulating cover for semiconductors includes a tentacle area. The tentacle area includes a triangular concave area. A top convex body is fixedly connected to the top of the tentacle area. The inner bottom of the tentacle area is fixedly connected to a quartz cover body. The triangular concave area is arranged in the middle of the outer side wall of the quartz cover body. A connection area is arranged at the bottom of the quartz cover body. The connection area includes an adsorbent, and the top of the adsorbent is fixedly connected to the bottom of the quartz cover body.

[0007] Further, the tentacle area further includes an outer tip area and an inner concave area. The inner sides of the outer tip area and the inner concave area are arranged on the upper outer segment of the quartz cover body. The tops of the outer tip area and the inner concave area are fixedly connected to the bottom end of the outer side wall of the top convex body and are integrally formed with the top convex body. The concave and convex shape reduces the contact area and increases the pressure per unit area, thereby enhancing the friction force.

[0008] Further, the side walls between the outer tip area and the inner concave area are intermittently connected together. The triangular concave area is arranged on the outer side of the bottom end of the outer tip area. The triangular concave area is arranged obliquely upward along the side wall of the outer tip area. The specific shape and inclination angle of the triangular concave area provide a fitting and stable support point for the finger.

[0009] Further, the top convex body includes a wrench and a vent hole. The outer bottom end of the wrench is fixedly connected to the top side of the tentacle area. The inner side of the wrench is integrally formed with the inner top of the quartz cover body.

[0010] Further, the vent hole is arranged on the top side of the wrench and is used to balance the pressure inside and outside the insulating cover and allow gas to flow through.

[0011] Further, the connection area further includes a sealing edge and a card slot. The sealing edge and the card slot are arranged at the bottom end of the quartz cover body. The sealing edge is arranged with one layer inside and outside the bottom end of the quartz cover body. The top end of the adsorbent is fixedly connected to the exact bottom of the bottom edge of the quartz cover body. The inner sealing edge can effectively block the leakage of internal substances and prevent the intrusion of external impurities.

[0012] Further, the inner side walls of the inner and outer sealing edges are respectively located at the inner and outer edges of the card slot, and the inner side walls of the inner and outer sealing edges are respectively located at the outer side walls of the adsorbent. The adsorbent can provide additional adsorption force, making it more firmly attached to the corresponding position during installation and use.

[0013] Further, the adsorbent includes a support column and silicone rubber. The top end of the support column is fixedly connected to the card slot, and the top side of the silicone rubber is fixedly connected to the bottom end of the support column. When the adsorbent contacts other surfaces, it can adaptively deform according to the shape and texture of the contact surface and fill in tiny gaps.

[0014] Compared with the prior art, the present utility model provides a high-temperature quartz insulating cover for semiconductors, having the following beneficial effects:

[0015] This high-temperature quartz insulating cover for semiconductors increases the friction on the outside through the tentacle area, facilitating the operation of the operator during installation and maintenance, reducing the possibility of slipping and operational errors, providing better gripping force for the operator, making the operation more precise and stable. The sealing edge in the connection area can provide good sealing effect, blocking the intrusion of external impurities and dust, while preventing internal substances from leaking, maintaining the cleanliness and stability of the semiconductor production environment. The high-temperature quartz material it uses has excellent high-temperature resistance and can work stably in the high-temperature environment during semiconductor manufacturing, effectively protecting the internal semiconductor devices from high-temperature damage and ensuring the smooth progress of the production process. The sealing performance effectively prevents current leakage and short circuits, reducing the risk of damage to semiconductor devices due to electrical failures. Description of the Drawings

[0016] Figure 1 It is a schematic diagram of the overall structure connection of this utility model;

[0017] Figure 2 It is a structural display diagram of the tentacle area of this utility model;

[0018] Figure 3 It is a bottom structural display diagram of the connection area of this utility model;

[0019] Figure 4 It is a structural display diagram of the connection area of this utility model;

[0020] Figure 5 It is a schematic diagram of the refined structure of the adsorbing part of this utility model.

[0021] In the figure: 1. Tentacle area; 11. Outer tip area; 12. Concave area; 13. Triangular concave area; 2. Top convex body; 21. Wrench; 22. Vent hole; 3. Quartz cover body; 4. Connection area; 41. Sealing edge; 42. Card slot; 43. Adsorbing part; 431. Support column; 432. Silicone rubber. Detailed Description of the Invention

[0022] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model. Embodiment 1:

[0023] As Figures 1 - 5As shown in the figure, a high-temperature quartz insulating cover for semiconductors includes a tentacle area 1. The tentacle area 1 includes a triangular concave area 13. A top convex body 2 is fixedly connected to the top of the tentacle area 1. The inner bottom of the tentacle area 1 is fixedly connected to a quartz cover body 3. The triangular concave area 13 is arranged in the middle of the outer side wall of the quartz cover body 3. A connection area 4 is arranged at the bottom of the quartz cover body 3. The connection area 4 includes an adsorbent 43. The top of the adsorbent 43 is fixedly connected to the bottom of the quartz cover body 3.

[0024] As Figures 1 - 2 shown in the figure, the tentacle area 1 further includes an outer tip area 11 and an inner concave area 12. The inner sides of the outer tip area 11 and the inner concave area 12 are arranged on the upper half of the outer side of the quartz cover body 3. The tops of the outer tip area 11 and the inner concave area 12 are fixedly connected to the bottom end of the outer side wall of the top convex body 2 and are integrally formed with the top convex body 2. During the operation, the palm area of the operator can be located at the outer tip area 11 and the inner concave area 12. When the protruding part of the outer tip area 11 comes into contact with the outside world, it can provide a clear resistance point, while the inner concave area 12 forms a sunken space in between, making the contact surface no longer flat and smooth. When the insulating cover comes into contact with or rubs against other objects, the concave-convex shape reduces the contact area and increases the pressure per unit area, thereby enhancing the frictional force. The operator can hold the insulating cover more firmly, reducing the risk of slipping and improving the safety and accuracy of the operation.

[0025] As Figures 1 - 2 shown in the figure, the side walls of the outer tip area 11 and the inner concave area 12 are intermittently connected together. The triangular concave area 13 is arranged outside the bottom end of the outer tip area 11. The triangular concave area 13 is arranged obliquely upward along the side wall of the outer tip area 11. The specific shape and inclination angle of the triangular concave area 13 provide a fitting and stable support point for the fingers. When the fingers are inserted into it, the edge of the concave area can effectively limit the sliding of the fingers, enabling the fingers to be more stably fixed in the predetermined position. This downward inclination angle further enhances the stability of grasping. It allows the fingers to naturally conform to the inclination direction of the concave area when applying force, thereby transmitting the force more effectively to the object being grasped. This not only increases the grasping force but also reduces the fatigue of the fingers during the force application process. In situations where precise operation is required and high grasping stability is demanded, such as installing or adjusting semiconductor components in a narrow space, a reliable grasping force can ensure that the operator accurately controls the position and posture of the insulating cover, avoiding operation errors caused by unstable grasping. Even when the hand is affected by sweat, grease or other adverse factors, the downward-inclined triangular concave area can still provide sufficient frictional force and support force, ensuring the safety and efficiency of the operation.

[0026] As Figure 1As shown, the top protrusion 2 includes a handle 21 and a vent 22. The outer side of the bottom end of the handle 21 is fixedly connected to the top side of the tentacle area 1, and the inner side of the handle 21 and the inner side of the top of the quartz cover body 3 are integrally formed. The vent 22 is arranged on the top side of the handle 21 to balance the pressure inside and outside the insulating cover and allow gas to circulate. Embodiment 2:

[0027] like Figure 1 , Figure 3 and Figure 4 As shown, the connection area 4 also includes a sealing edge 41 and a card slot 42. The sealing edge 41 and the card slot 42 are arranged at the bottom end of the quartz cover body 3. The sealing edge 41 is arranged at the bottom end of the quartz cover body 3 and has a layer inside and outside. The top of the adsorbent 43 is fixedly connected to the bottom of the bottom edge of the quartz cover body 3. The inner side walls of the inner and outer sealing edges 41 are respectively located at the inner and outer edges of the card slot 42. The inner side walls of the inner and outer sealing edges 41 are respectively located at the outer side walls of the adsorbent 43. The inner sealing edge can effectively block the leakage of internal substances and prevent the invasion of external impurities, thereby providing reliable protection for the internal semiconductor devices. The adsorbent 43 can provide additional adsorption force, so that it is more firmly attached to the corresponding position during installation and use. In some environments where vibration or impact may exist, the adsorbent 43 can effectively reduce the shaking of the quartz cover body 3 to ensure its normal operation.

[0028] like Figure 1 , Figures 3 - 5 As shown, the adsorption member 43 includes a support column 431 and a silicone rubber 432. The top of the support column 431 is fixedly connected to the card slot 42, and the top side of the silicone rubber 432 is fixedly connected to the bottom of the support column 431. The silicone rubber 432 has excellent elasticity and adsorption properties, and its soft texture can form a good fit with the contact surface, thereby generating a strong adsorption force. In actual applications, when the adsorption member 43 contacts other surfaces, the silicone rubber 432 plays a role first. It can adaptively deform according to the shape and texture of the contact surface, fill tiny gaps, increase the contact area, and thus enhance the adsorption effect. The material of the silicone rubber 432 can maintain good performance in a wide temperature range of -60°C to 250°C, has good electrical insulation, weather resistance and physiological inertness, and can maintain a good shape under high temperature conditions.

Claims

1. A high temperature quartz insulating cover for semiconductors, comprising a tentacle region (1), characterized in that: The tentacle area (1) comprises a triangular concave area (13), the top of the tentacle area (1) is fixedly connected to a top protrusion (2), the bottom inner side of the tentacle area (1) is fixedly connected to a quartz cover body (3), the triangular concave area (13) is arranged in the middle of the outer wall of the quartz cover body (3), the bottom of the quartz cover body (3) is provided with a connection area (4), the connection area (4) comprises an adsorption member (43), and the top of the adsorption member (43) is fixedly connected to the bottom of the quartz cover body (3).

2. A semiconductor high temperature quartz insulating cover according to claim 1, characterized in that: The tentacle area (1) further comprises an outer tip area (11) and an inner concave area (12), wherein the inner sides of the outer tip area (11) and the inner concave area (12) are arranged on the outer upper half of the quartz cover body (3), and the top ends of the outer tip area (11) and the inner concave area (12) are fixedly connected to the bottom end of the outer side wall of the top protrusion (2) and are integrally formed with the top protrusion (2).

3. A semiconductor high temperature quartz insulating cover according to claim 2, characterized in that: The side walls of the outer tip area (11) and the inner concave area (12) are arranged at intervals and connected together, and the triangular concave area (13) is arranged outside the bottom end of the outer tip area (11), and the triangular concave area (13) is arranged upward along the side wall of the outer tip area (11) in an inclined shape.

4. A semiconductor high temperature quartz insulating cover according to claim 1, characterized in that: The top protrusion (2) comprises a knob (21) and a vent hole (22); the outer side of the bottom end of the knob (21) is fixedly connected to the top side of the tentacle area (1); the inner side of the knob (21) and the inner side of the top of the quartz cover (3) are integrally formed.

5. A semiconductor high temperature quartz insulating cover according to claim 4, characterized in that: The vent hole (22) is arranged on the top side of the screw handle (21).

6. A semiconductor high temperature quartz insulating cover according to claim 1, characterized in that: The connection area (4) further comprises a sealing edge (41) and a slot (42), wherein the sealing edge (41) and the slot (42) are arranged at the bottom end of the quartz cover body (3), and the sealing edge (41) is arranged at a layer inside and outside the bottom end of the quartz cover body (3), and the top end of the adsorption member (43) is fixedly connected to the bottom of the bottom edge of the quartz cover body (3).

7. A semiconductor high temperature quartz insulating cover according to claim 6, characterized in that: The inner side walls of the inner and outer layers of the sealing edges (41) are respectively located at the inner and outer edges of the slot (42), and the inner side walls of the inner and outer layers of the sealing edges (41) are respectively located at the outer side walls of the adsorption component (43).

8. A semiconductor high temperature quartz insulating cover according to claim 7, characterized in that: The adsorption member (43) comprises a support column (431) and silicone rubber (432), the top end of the support column (431) is fixedly connected to the card slot (42), and the top side of the silicone rubber (432) is fixedly connected to the bottom end of the support column (431).

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