Power module heat dissipation assembly and inverter

Abstract

The utility model discloses a power module heat dissipation assembly and an inverter, and relates to the technical field of power electronics, the power module heat dissipation assembly comprises a plurality of heat dissipation units and a substrate, each heat dissipation unit comprises a heat dissipation module and a power module, the heat dissipation module is connected with the power module, and the power module of each heat dissipation unit is connected with the substrate. In the assembling process, the heat dissipation modules and the power modules can be fixed together to form the heat dissipation units, then the multiple heat dissipation modules are combined and fixed together to be connected with the substrate, or all the heat dissipation units are connected with the substrate. According to the utility model, the whole heat radiator is divided into a plurality of heat radiation modules, so that the heat radiation modules with different structures and numbers and one or more power modules can be adopted to form a smaller preassembled heat radiation unit according to actual heat radiation requirements, the processing and the carrying are convenient, the installation efficiency and the assembly precision are improved, and the cost is reduced. And the targeted arrangement of the heat dissipation module and the power module can be realized, and the heat dissipation performance is optimized.

Description

Technical Field

[0001] The utility model relates to the technical field of power electronics, and more specifically, to a power module heat dissipation assembly and an inverter. Background Art

[0002] In electric new energy vehicles and other power electronics applications, the installation problem of the power module and the radiator of the inverter is a technical challenge. The traditional installation method usually involves fastening the power module to an integral radiator by screws, and then welding a circuit board above the power module. However, the limitation of this method is that the radiator is large and bulky, which is not convenient for welding with the power module, and there are also difficulties in the assembly connection between the circuit board and the power module.

[0003] In addition, in the field of electric new energy vehicles, multiple water-cooled radiators are connected to the power module for heat dissipation. This method improves the heat dissipation efficiency through a water-cooling system, but it brings new challenges. As the number of water-cooled radiators increases, the number of pipe joints also increases, which not only increases the risk of seal failure, but also makes the installation process more complex. In addition, the water-cooled radiator usually needs to be installed and fixed in advance, and has very high requirements for the sealing of the pipe joints, which brings difficulties to the pre-fixing of multiple radiators and the plug-in installation with the circuit board.

[0004] Therefore, how to achieve the rapid installation of the power module and the radiator has become a technical problem that needs to be solved urgently by those skilled in the art. Summary of the Utility Model

[0005] In view of this, the purpose of the utility model is to provide a power module heat dissipation assembly to achieve the rapid installation of the power module and the radiator.

[0006] Another purpose of the utility model is to provide an inverter including the above power module heat dissipation assembly.

[0007] To achieve the above purpose, the utility model provides the following technical solutions:

[0008] A power module heat dissipation assembly includes:

[0009] A plurality of heat dissipation units, each including a heat dissipation module and a power module, and the heat dissipation module is connected to the power module;

[0010] A substrate, and the power modules of each heat dissipation unit are all connected to the substrate.

[0011] Optionally, in the above power module heat dissipation assembly, one heat dissipation unit includes one heat dissipation module and one or more power modules, and each power module is correspondingly arranged on the heat dissipation module.

[0012] Optionally, in the above-mentioned power module heat dissipation assembly, a plurality of the power modules are arranged flat on the heat dissipation module; and / or,

[0013] a plurality of the power modules are arranged at intervals on the heat dissipation module.

[0014] Optionally, in the above-mentioned power module heat dissipation assembly, the structures of the heat dissipation modules of different heat dissipation units are the same or different.

[0015] Optionally, in the above-mentioned power module heat dissipation assembly, one substrate is correspondingly connected to the power modules of one or more heat dissipation units.

[0016] Optionally, in the above-mentioned power module heat dissipation assembly, the substrate is connected to the power module in a plug-in manner.

[0017] Optionally, in the above-mentioned power module heat dissipation assembly, it further includes a mounting plate, and the heat dissipation modules of each heat dissipation unit are all connected to the mounting plate.

[0018] Optionally, in the above-mentioned power module heat dissipation assembly, the heat dissipation module has a heat dissipation substrate, the power module is arranged on the heat dissipation substrate, the mounting plate is connected to the heat dissipation substrate, and an avoidance hole for avoiding the power module is provided.

[0019] Optionally, in the above-mentioned power module heat dissipation assembly, mounting holes are provided on the heat dissipation substrate, and the power modules are respectively embedded in the mounting holes in a one-to-one correspondence.

[0020] Optionally, in the above-mentioned power module heat dissipation assembly, the heat dissipation module is a fin radiator, a heat pipe or a heat spreader.

[0021] An inverter includes the above-mentioned power module heat dissipation assembly.

[0022] The power module heat dissipation assembly provided by the present utility model includes heat dissipation units and a substrate. There are a plurality of heat dissipation units, and each heat dissipation unit includes a heat dissipation module and a power module, and the heat dissipation module and the power module are connected. The power modules of each heat dissipation unit are all connected to the substrate. During assembly, the heat dissipation module and the power module can be fixed together to form a heat dissipation unit first, and then a plurality of heat dissipation modules are combined and fixed together and connected to the substrate, or each heat dissipation unit is respectively connected to the substrate.

[0023] Compared with the prior art, the power module heat dissipation assembly provided by the present utility model disassembles the overall radiator into multiple heat dissipation modules, so that different structures and numbers of heat dissipation modules can be used according to actual heat dissipation requirements to form smaller pre-installed heat dissipation units with one or more power modules, which is convenient for processing and handling, improves the installation efficiency and assembly accuracy, and can achieve targeted setting of the heat dissipation module and the power module to optimize the heat dissipation performance.

[0024] The inverter provided by the present utility model includes the above-mentioned power module heat dissipation assembly, so it also has the above-mentioned beneficial effects. For other structures, reference is made to the prior art and will not be elaborated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0026] Figure 1 It is the front view of the first power module heat dissipation assembly disclosed in the embodiment of the present utility model;

[0027] Figure 2 It is the axonometric view of the first power module heat dissipation assembly disclosed in the embodiment of the present utility model;

[0028] Figure 3 It is the front view of the second power module heat dissipation assembly disclosed in the embodiment of the present utility model;

[0029] Figure 4 It is the axonometric view of the second power module heat dissipation assembly disclosed in the embodiment of the present utility model;

[0030] Figure 5 It is the axonometric view of the third power module heat dissipation assembly disclosed in the embodiment of the present utility model;

[0031] Figure 6 It is the front view of the fourth power module heat dissipation assembly disclosed in the embodiment of the present utility model;

[0032] Figure 7 It is the axonometric view of the fourth power module heat dissipation assembly disclosed in the embodiment of the present utility model;

[0033] Figure 8 It is the axonometric view of the fifth power module heat dissipation assembly disclosed in the embodiment of the present utility model.

[0034] Wherein, 1 is the heat dissipation module, 11 is the radiator, 2 is the power module, 3 is the substrate, and 4 is the mounting plate. Detailed implementation mode

[0035] The core of the present utility model is to disclose a heat dissipation component for a power module to achieve rapid installation of the power module and the radiator.

[0036] Another core of the present utility model is to disclose an inverter including the above-mentioned heat dissipation component for a power module.

[0037] Hereinafter, the embodiments will be described with reference to the drawings. In addition, the embodiments shown below do not limit the content of the utility model described in the claims in any way. In addition, all the contents of the configurations shown in the following embodiments are not limited to those necessary for the solution of the utility model described in the claims. It should be noted that for the convenience of description, only the parts related to the utility model are shown in the drawings. Without conflict, the embodiments in the present utility model and the features in the embodiments can be combined with each other.

[0038] Combined with Figures 1-8 , the heat dissipation component for a power module disclosed by the present utility model includes a heat dissipation unit and a substrate 3. There are multiple heat dissipation units, and each heat dissipation unit includes a heat dissipation module 1 and a power module 2, and the heat dissipation module 1 and the power module 2 are connected. The power modules 2 of each heat dissipation unit are all connected to the substrate 3.

[0039] During assembly, the heat dissipation module 1 and the power module 2 can be first fixed together to form a heat dissipation unit, and then multiple heat dissipation modules 1 can be combined and fixed together and connected to the substrate 3, or each heat dissipation unit can be respectively connected to the substrate 3.

[0040] Compared with the prior art, the present utility model disassembles the overall radiator into multiple heat dissipation modules 1, so that different structures and numbers of heat dissipation modules 1 can be used according to actual heat dissipation requirements to form smaller pre-assembled heat dissipation units with one or more power modules 2, which is convenient for processing and handling, improves the installation efficiency and assembly accuracy, and can realize the targeted setting of the heat dissipation module 1 and the power module 2 to optimize the heat dissipation performance.

[0041] Specifically, combined with Figures 1-4 , a heat dissipation unit may include one heat dissipation module 1 and one or more power modules 2, that is, in one heat dissipation unit, one or more power modules 2 may be correspondingly arranged on one heat dissipation module 1.

[0042] Among them, multiple power modules 2 can be arranged flat on the heat dissipation module 1. Further, in order to ensure the heat dissipation efficiency, multiple power modules 2 are arranged at intervals on the heat dissipation module 1, and the intervals between the power modules 2 can ventilate and dissipate heat to improve the heat dissipation efficiency.

[0043] The number of substrates 3 can be one or more. One substrate 3 can be correspondingly connected to the power modules 2 of one or more heat dissipation units. The substrate 3 is usually a circuit board. The heat dissipation module 1 and the power module 2 are usually connected by welding, and the power module 2 and the substrate 3 are usually connected by plugging. In addition, the heat dissipation module 1 and the power module 2, as well as the power module 2 and the substrate 3, can also be connected by bonding, screwing, clamping and other means.

[0044] It can be understood that the above heat dissipation module 1 is not limited to ordinary radiators, heat pipe radiators or VC heat spreader radiators, and various radiators can be cooled by air cooling or water cooling.

[0045] Combined Figure 3 and Figure 4 , the structures of the heat dissipation modules 1 of different heat dissipation units can be the same or different to achieve targeted settings and meet the heat dissipation requirements of different power modules 2. For example, for some power modules 2 with higher heat dissipation requirements, the corresponding heat dissipation module 1 can select a radiator with stronger heat dissipation ability (the fin radiator 11 with more dense heat dissipation fins).

[0046] To ensure the heat dissipation efficiency, a large contact area needs to be maintained between each power module 2 and the heat dissipation module 1. Therefore, the direction perpendicular to the extension plane of the substrate 3 is defined as the vertical direction. In each heat dissipation unit, the projected area of the heat dissipation module 1 in the vertical direction is larger than the projected area of the power module 2 in the vertical direction, and the projection of the heat dissipation module 1 in the vertical direction coincides with the projected area of the power module 2 in the vertical direction, so as to ensure the fitting area between the power module 2 and the heat dissipation module 1 and improve the heat dissipation efficiency.

[0047] Furthermore, when the heat dissipation module 1 is a fin radiator, the heat dissipation module 1 has a heat dissipation substrate. The power module 2 is arranged on the first side of the heat dissipation substrate, and heat dissipation fins are arranged on the second side of the heat dissipation substrate. And mounting holes for each power module 2 to be correspondingly embedded are arranged on the first side of the heat dissipation substrate. The arrangement of the mounting holes facilitates the positioning of the power module 2 on the heat dissipation module 1 and can make the power module 2 closer to the heat dissipation fins, shorten the heat dissipation path and enhance the heat dissipation effect.

[0048] The power module heat dissipation assembly disclosed by the present utility model can pre-assemble a part of the heat dissipation units and the substrate 3 together, and then install another part of the heat dissipation units and the substrate 3 according to actual needs.

[0049] To facilitate the installation of each heat dissipation unit on the substrate 3, each heat dissipation unit can be pre-assembled together. In one embodiment, the power module heat dissipation assembly further includes a mounting plate 4, and the heat dissipation modules 1 of each heat dissipation unit are all connected to the mounting plate 4. During installation, each heat dissipation unit can be fixed together through the mounting plate 4 first, and then the power modules 2 are adjusted and welded on each heat dissipation module 1 respectively to achieve the pre-assembly of multiple heat dissipation units. Finally, each heat dissipation unit and the substrate 3 are assembled.

[0050] Specifically, the above-mentioned mounting plate 4 can be one or more. When there are multiple mounting plates 4, each mounting plate 4 can be respectively connected between two adjacent heat dissipation modules 1, and at this time, the mounting plate 4 and the heat dissipation module 1 can be hingedly connected so that the mounting plate 4 can adapt to the connection of heat dissipation modules 1 in different planes.

[0051] For the convenience of assembly, when all the heat dissipation modules 1 are in the same mounting plane, the mounting plate 4 is preferably one. Combining Figure 6 and Figure 7 , the mounting plate 4 can specifically be connected to the side surface of each heat dissipation module 1 where the power module 2 is installed, and corresponding avoidance holes are provided on the mounting plate 4 to avoid the connection part of the power module 2 and the heat dissipation module 1.

[0052] The above-mentioned mounting plate 4 can be prepared from metal materials with good thermal conductivity such as copper, so that a certain amount of heat conduction can also be carried out at the contact part between the heat dissipation module 1 and the mounting plate 4, and the mounting plate 4 can directly dissipate heat into the air.

[0053] The inverter disclosed in the present invention includes the above-mentioned power module heat dissipation assembly, so it also has the above-mentioned beneficial effects. Other structures refer to the prior art and will not be elaborated here.

[0054] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be obvious to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. The specific technical means in some embodiments can be partially or wholly combined into another embodiment on the premise that it is not explicitly excluded by another embodiment. Therefore, the present invention will not be limited to these embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A power module heat dissipation component, characterized in that: include: A plurality of heat dissipation units, comprising a heat dissipation module (1) and a power module (2), wherein the heat dissipation module (1) and the power module (2) are connected; A base plate (3), to which the power modules (2) of each of the heat dissipation units are connected.

2. The power module heat dissipation assembly according to claim 1, characterized in that: One of the heat dissipation units comprises one of the heat dissipation modules (1) and one or more of the power modules (2), and each of the power modules (2) is correspondingly arranged on the heat dissipation module (1).

3. The power module heat dissipation assembly according to claim 2, characterized in that: A plurality of the power modules (2) are arranged flat on the heat dissipation module (1); and / or, The plurality of power modules (2) are arranged at intervals on the heat dissipation module (1).

4. The power module heat dissipation assembly according to claim 1, characterized in that: The structures of the heat dissipation modules (1) of different heat dissipation units are the same or different.

5. The power module heat dissipation assembly according to claim 1, characterized in that: One of the substrates (3) is correspondingly connected to one or more of the heat dissipation units.

6. The power module heat dissipation assembly according to claim 1, characterized in that: The substrate (3) is plug-connected to the power module (2).

7. The power module heat dissipation assembly according to any one of claims 1 to 6, characterized in that: It also comprises a mounting plate (4), and the heat dissipation modules (1) of each heat dissipation unit are connected to the mounting plate (4).

8. The power module heat dissipation assembly according to claim 7, characterized in that: The heat dissipation module (1) comprises a heat dissipation substrate, the power module (2) is arranged on the heat dissipation substrate, the mounting plate (4) is connected to the heat dissipation substrate and is provided with an avoidance hole for avoiding the power module (2).

9. The power module heat dissipation assembly according to claim 8, characterized in that: The heat dissipation substrate is provided with mounting holes, and the power modules (2) are embedded in the mounting holes in a one-to-one correspondence.

10. The power module heat dissipation assembly according to any one of claims 1 to 6, characterized in that: The heat dissipation module (1) is a fin heat sink, a heat pipe or a temperature equalizing plate.

11. An inverter, characterized in that: It comprises a power module heat dissipation assembly as described in any one of claims 1 to 10.

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