Microwave switch power amplifier module shell

Abstract

The utility model relates to a microwave switch power amplifier module shell which comprises a switch power amplifier module shell body, a switch power amplifier module cover plate, a switch power amplifier module inner cover plate, a feed module cover plate, a sinking type power amplifier module small shell body and a shell bottom cover plate. The switch power amplifier module inner cover plate is fixed in the switch power amplifier module shell, the submerged power amplifier module small shell is fixed on the switch power amplifier module inner cover plate, and the feed module cover plate and the shell bottom cover plate are fixed on one end face, far away from the switch power amplifier module cover plate, of the switch power amplifier module shell. The microwave switch power amplifier module shell is good in heat dissipation effect, compact in structure, convenient to assemble and disassemble, safe and reliable, has good electromagnetic shielding performance, and is an excellent microwave switch power amplifier module shell.

Description

Technical Field

[0001] The utility model relates to a housing for a microwave switch power amplifier module, belonging to the technical field of microwave switches. Background Art

[0002] The housing of a microwave switch power amplifier module is generally a protective device used to protect the internal circuit board and components from external factors (such as dust, humid air, electromagnetic waves, etc.) and provide good heat dissipation conditions for the microwave module. It plays an important role in ensuring the safe, reliable, and stable operation of the product and improving the use efficiency. Its material is generally aluminum alloy, which has high temperature resistance and heat conduction ability, can effectively help the microwave module dissipate heat, and avoid burning out components due to overheating caused by long-term use. The microwave housing can also play a certain shielding role for external electromagnetic waves and reduce the adverse effects caused by external electromagnetic radiation.

[0003] With the development of microwave switch power amplifier modules towards miniaturization and high power, the heat dissipation is continuously increasing. Moreover, due to environmental restrictions, the product module can only dissipate heat with the system by conduction, which puts higher and higher requirements on the structure of the microwave module housing. The simple housing made of ordinary heat-conducting metal materials alone cannot meet the requirements in terms of heat dissipation effect, has general shielding effect, and is insufficient in terms of maintenance convenience, resulting in the inability to guarantee the reliability of the product. Summary of the Utility Model

[0004] The purpose of this part is to outline some aspects of the embodiments of the utility model and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this part, as well as in the abstract and the title of the utility model of this application, to avoid obscuring the purpose of this part, the abstract, and the title of the utility model. However, such simplifications or omissions cannot be used to limit the scope of the utility model.

[0005] In view of the following technical problems existing in the prior art: With the development of microwave switch power amplifier modules towards miniaturization and high power, the heat dissipation is continuously increasing. Moreover, due to environmental restrictions, the product module can only dissipate heat with the system by conduction, which puts higher and higher requirements on the structure of the microwave module housing. The simple housing made of ordinary heat-conducting metal materials alone cannot meet the requirements in terms of heat dissipation effect, has general shielding effect, and is insufficient in terms of maintenance convenience, resulting in the inability to guarantee the reliability of the product.

[0006] To solve the above technical problems, the present utility model provides the following technical solutions: A switch power amplifier module housing, comprising a switch power amplifier module housing body, a switch power amplifier module cover plate, a switch power amplifier module inner cover plate, a power feeding module cover plate, a sunken power amplifier module small housing body, and a housing bottom cover plate. The switch power amplifier module cover plate is fixed on the switch power amplifier module housing body. The switch power amplifier module inner cover plate 3 is fixed in the switch power amplifier module housing body. The sunken power amplifier module small housing body is fixed on the switch power amplifier module inner cover plate. The power feeding module cover plate and the housing bottom cover plate are fixed on one end face of the switch power amplifier module housing body far away from the switch power amplifier module cover plate.

[0007] As a preferred technical solution of a switch power amplifier module housing, the material of the sunken power amplifier module small housing body is copper, and thermal conductive silicone grease is applied when the bottom surface thereof is installed with the corresponding installation groove bottom surface of the switch power amplifier module housing body.

[0008] As a preferred technical solution of a switch power amplifier module housing, the screw holes on the switch power amplifier module inner cover plate 3 are arranged at equal distances.

[0009] As a preferred technical solution of a switch power amplifier module housing, a plurality of microstrip grooves with irregular distributions are provided inside the switch power amplifier module housing body.

[0010] As a preferred technical solution of a switch power amplifier module housing, a plurality of wire passing grooves are provided at the bottom of the switch power amplifier module housing body. The radio frequency wires in the microstrip grooves reach the bottom wire passing grooves through the wire passing holes, and the housing bottom cover plate covers the wire passing grooves.

[0011] As a preferred technical solution of a switch power amplifier module housing, there is a cavity on one side of the bottom of the switch power amplifier module housing body, and a power feeding module circuit board is installed in the cavity. The power feeding module cover plate covers the bottom cavity.

[0012] From the above technical solutions, it can be seen that the present utility model has at least the following advantages and positive effects:

[0013] The microwave power amplifier chip is sintered together with the sunken power amplifier module small housing body through a carrier. And the material of the four groups of sunken power amplifier module small housing bodies is copper, and thermal conductive silicone grease is applied when the bottom surface thereof is installed with the corresponding installation groove bottom surface of the switch power amplifier module housing body, which can quickly conduct the heat dissipation on the power amplifier chip to the surface of the switch power amplifier module housing body and then to the system heat dissipation structure, and the heat dissipation effect is better.

[0014] The switch power amplifier module housing body is provided with two layers of cover plates, and a large number of regularly arranged screws at equal distances are arranged on the inner cover plate, which improves the electromagnetic shielding performance of the module.

[0015] The power amplifier part and the control power supply part of the module are respectively installed on the front and back sides of the switch power amplifier module housing, and the input, output and power supply interfaces are all arranged on one side panel of the module, which improves the convenience of assembly and maintenance operations. Description of the Drawings

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings. Among them:

[0017] Figure 1 is the structural schematic diagram of the device of the present invention;

[0018] Figure 2 is the internal structural schematic diagram of the present invention with the upper cover plate opened;

[0019] Figure 3 is the internal structural sectional view of the present invention;

[0020] Figure 4 is the bottom structural schematic diagram of the present invention;

[0021] Figure 5 is the side structural sectional view of the present invention;

[0022] Figure 6 is the side structural schematic diagram of the switch power amplifier module housing in the present invention;

[0023] Reference numerals: 1. Switch power amplifier module housing; 2. Switch power amplifier module cover plate; 3. Inner cover plate of the switch power amplifier module; 4. Feed power module cover plate; 5. Submerged power amplifier module small housing; 6. Bottom cover plate of the housing; 7. Feed power module circuit board; 101. Microwave power amplifier chip; 102. Modulator module; 103. Isolator module; 104. Microstrip isolator module; 105. Three-way switch module; 106. Microstrip slot. Detailed Embodiments

[0024] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, the following will make a detailed description of the specific embodiments of the present invention in conjunction with the drawings of the specification.

[0025] In the following description, many specific details are set forth in order to fully understand the present invention. However, the present invention can also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

[0026] Secondly, the so-called "one embodiment" or "embodiment" herein refers to specific features, structures or characteristics that may be included in at least one implementation manner of the present utility model. The "in one embodiment" appearing in different places in this specification does not all refer to the same embodiment, nor is it an independent or alternative embodiment that excludes other embodiments.

[0027] Thirdly, the present utility model is described in detail in conjunction with schematic diagrams. When detailing the embodiments of the present utility model, for the convenience of explanation, the cross-sectional views showing the device structure will be locally enlarged out of the general proportion, and the schematic diagrams are only examples and should not limit the protection scope of the present utility model herein. In addition, in actual production, three-dimensional spatial dimensions including length, width and depth should be included.

[0028] As Figures 1 to 6 shown, a microwave switch power amplifier module housing includes a switch power amplifier module housing 1, a switch power amplifier module cover plate 2, a switch power amplifier module inner cover plate 3, a feed module cover plate 4, four groups of sunken power amplifier module small housings 5 and six bottom cover plates 6. The switch power amplifier module cover plate 2 is fixed to the switch power amplifier module housing 1 by eight screws. The switch power amplifier module inner cover plate 3 is fixed to the switch power amplifier module housing 1 by one hundred and forty-two screws. The feed module cover plate 4 is fixed to the switch power amplifier module housing 1 by ten screws. The sunken power amplifier module small housings 5 are respectively fixed to the switch power amplifier module housing 1 by four screws. The bottom cover plates 6 are fixed to the switch power amplifier module housing 1 by twenty-eight screws, jointly forming the microwave switch power amplifier module housing structure.

[0029] The four groups of the sunken power amplifier module small housings 5 are below the switch power amplifier module inner cover plate 3. There are also two groups of modulator modules 102, two groups of isolator modules 103, two groups of microstrip isolator modules 104 and a three-way switch module 105 below the switch power amplifier module inner cover plate 3.

[0030] The four groups of the sunken power amplifier module small housings 5 contain microwave power amplifier chips 101, which are the main heat source aggregation areas. The microwave power amplifier chips 101 are sintered to the sunken power amplifier module small housings 5 through carriers, ensuring that the heat source of the module can directly conduct heat to the system heat dissipation structure unimpeded.

[0031] The four groups of the sunken power amplifier module small housings 5 are made of red copper. When the bottom surface thereof is installed with the corresponding installation groove bottom surface of the switch power amplifier module housing 1, thermal conductive silicone grease is applied, which can quickly conduct the heat dissipation on the power amplifier chips to the surface of the switch power amplifier module housing 1.

[0032] A large number of screw holes on the inner cover plate 3 of the switching power amplifier module are basically arranged regularly and equidistantly, aiming to isolate the internal microstrip circuit board of the housing from external electromagnetic interference.

[0033] There are a series of abnormally distributed microstrip grooves 106 inside the housing 1 of the switching power amplifier module, with a groove width of 3.2 mm and a groove depth of 3 mm. Several wire passing holes are scattered in the microstrip grooves 106, and the microstrip circuit board is sintered in the microstrip grooves 106.

[0034] There are six wire passing grooves at the bottom of the housing 1 of the switching power amplifier module. The RF wires in the microstrip grooves 106 reach the bottom wire passing grooves through the wire passing holes, and the six bottom cover plates 6 of the housing cover the six wire passing grooves.

[0035] There is a cavity on one side of the bottom of the housing 1 of the switching power amplifier module, and the feed module circuit board 7 is installed in the cavity. The feed module cover plate 4 covers the bottom cavity. The power amplifier part and the control feed part of the module are respectively installed on the front and back sides of the housing 1 of the switching power amplifier module, improving the convenience of installation and maintenance.

[0036] There are four mounting bosses on the top of the housing 1 of the switching power amplifier module, which are connected and installed through the inner cover plate 3 of the switching power amplifier module and the cover plate 2 of the switching power amplifier module. There is one mounting hole on each of the two side surfaces of the housing 1 of the switching power amplifier module for connection and installation with the cover plate.

[0037] The three sides of the microstrip wire groove inside the housing 1 of the switching power amplifier module, the RF hole position, and the bottom surface and surrounding surfaces of the isolator installation groove all adopt gold plating technology, improving the welding performance and reliability and facilitating subsequent sintering.

[0038] The input, output, and power interfaces of the housing 1 of the switching power amplifier module are all arranged on one side panel of the module, facilitating the assembly operation.

[0039] There are six mounting bosses on the front and back of the housing 1 of the switching power amplifier module, with a boss thickness of 5 mm and a diameter of the boss mounting hole of 3.5 mm, which can ensure the firm installation of the module.

[0040] From the above description, it can be seen that the utility model has good heat dissipation effect, compact structure, convenient installation and disassembly, safety and reliability, and good electromagnetic shielding performance, and is an excellent housing for microwave switching power amplifier modules.

[0041] It should be noted that the above embodiments are only used to illustrate the technical solutions of the utility model rather than to limit them. Although the utility model has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the utility model can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the utility model, and they should all be covered within the scope of the claims of the utility model.

Claims

1. A microwave switch power amplifier module housing, characterized in that: The invention comprises a switch power amplifier module housing (1), a switch power amplifier module cover plate (2), a switch power amplifier module inner cover plate (3), a feed module cover plate (4), a small sunken power amplifier module housing (5) and a housing bottom cover plate (6), wherein the switch power amplifier module cover plate (2) is fixed to the switch power amplifier module housing (1), the switch power amplifier module inner cover plate (3) is fixed in the switch power amplifier module housing (1), the small sunken power amplifier module housing (5) is fixed to the switch power amplifier module inner cover plate (3), and the feed module cover plate (4) and the housing bottom cover plate (6) are fixed to an end surface of the switch power amplifier module housing (1) away from the switch power amplifier module cover plate (2).

2. The microwave switch power amplifier module housing according to claim 1, characterized in that: The material of the submerged power amplifier module small housing (5) is red copper, and its bottom surface is coated with thermal conductive silicone grease when it is installed with the bottom surface of the corresponding installation groove of the switch power amplifier module housing (1).

3. The microwave switch power amplifier module housing according to claim 1, characterized in that: The screw holes on the inner cover plate (3) of the switch power amplifier module are arranged at equal distances.

4. The microwave switch power amplifier module housing according to claim 1, characterized in that: A plurality of microstrip slots (106) distributed in a special shape are provided inside the switch power amplifier module housing (1).

5. The microwave switch power amplifier module housing according to claim 1, characterized in that: The bottom of the switch power amplifier module housing (1) is provided with a plurality of wire slots, and the radio frequency wires in the microstrip slot (106) reach the bottom wire slots from the wire holes, and the housing bottom cover (6) covers the wire slots.

6. The microwave switch power amplifier module housing according to claim 1, characterized in that: The switch power amplifier module housing (1) has a cavity at one side of the bottom, in which a feed module circuit board (7) is installed, and the feed module cover (4) covers the bottom cavity.

Images