Preheating tool for electronic component

Abstract

The utility model provides a preheating tool for an electronic component. The preheating tool comprises more than two heat conduction metal plates, a base and a separation frame body, the heat conduction metal plates are arranged on the base, and a gap is reserved between every two adjacent heat conduction metal plates. A heating module and a temperature sensing module are respectively arranged below each heat conducting metal plate; the heating module is connected with the power supply through the switch module; the switch module is in signal connection with the temperature sensing module; the separation frame body comprises a frame body and a plurality of separation strips; the frame body is matched with the edge position of each heat-conducting metal plate so as to separate the heating area above each heat-conducting metal plate; and each dividing strip is fixedly or detachably connected with the frame body so as to divide the heating area above the heat-conducting metal plate into heating units. According to the preheating tool, preheating at various temperatures can be achieved at the same time, and classified isolated heating of different types of electronic components at the same heating temperature can be achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic component preheating, and more specifically to a preheating tool for electronic components. Background Art

[0002] The electronic component preheating tool is mainly used to ensure that the electronic components can be preheated to a set temperature before manual welding of special electronic components, to avoid damage such as cracks in the electronic components due to thermal shock during welding, and to help remove the oxide layer on the surface of the electronic components, creating better conditions for welding, thereby improving the reliability of welding.

[0003] The problems existing in the existing electronic component preheating tooling are as follows:

[0004] (1) Some existing preheating tools can only achieve a single preheating temperature and cannot meet the needs of multiple preheating temperatures;

[0005] (2) The electronic component placement area of ​​the preheating tooling is not separated, and placing multiple electronic components together is prone to confusion; or the partition structure cannot be adjusted, and the placement requirements for large-volume electronic components or electronic components with high usage requirements cannot be met. Utility Model Content

[0006] The purpose of the utility model is to overcome the shortcomings and deficiencies in the prior art and to provide a preheating tool for electronic components; the preheating tool can achieve preheating of multiple temperatures at the same time, and can also achieve classified and isolated heating of different types of electronic components at the same heating temperature.

[0007] In order to achieve the above-mentioned purpose, the utility model is implemented by the following technical scheme: a preheating tool for electronic components, comprising two or more heat-conducting metal plates, a base and a partition frame; each heat-conducting metal plate is respectively arranged on the base, and a gap is left between adjacent heat-conducting metal plates; a heating module and a temperature sensing module are respectively arranged under each heat-conducting metal plate; the heating module is connected to a power supply through a switch module; the switch module is connected to the temperature sensing module signal;

[0008] The partition frame includes a frame and a plurality of partition strips; the frame matches the edge position of each heat-conducting metal plate to separate the upper heating area of ​​each heat-conducting metal plate; each partition strip is fixedly or detachably connected to the frame to divide the upper heating area of ​​the heat-conducting metal plate into heating units.

[0009] The working principle of the preheating tool of the utility model is: electronic components that need to be heated are classified and placed in the heating units of the heat-conducting metal plate; different types of electronic components with the same heating temperature can be placed in different heating units of the same heat-conducting metal plate; the heating module heats the heat-conducting metal plate so that the heat-conducting metal plate transfers heat to the electronic components to achieve preheating of the electronic components; the temperature of the heat-conducting metal plate is detected by the temperature sensing module and compared with the set temperature to switch the heating module, thereby achieving control of the heating temperature.

[0010] The preheating tool of the utility model can realize preheating at multiple temperatures at the same time, and can also realize classified isolation heating of different types of electronic components at the same heating temperature. The partition bar is detachably connected to the frame, and the size of the heating unit can be adjusted to meet the different requirements of the volume and quantity of electronic components, and has good versatility.

[0011] Preferably, each partition strip is detachably connected to the frame, which means that: each side of the frame is provided with at least one card slot;

[0012] When the partition bar is only in the upper heating zone of a single heat-conducting metal plate, two ends of the partition bar are respectively provided with a clamping position, and the two ends of the partition bar are clamped in the first clamping slot through the clamping position to realize installation with the frame;

[0013] When the partition bar spans over the upper heating zones of more than two heat-conducting metal plates, the two ends of the partition bar are respectively provided with clamping positions, and the middle of the partition bar and the intersection with the frame are provided with a second clamping groove; the partition bar is respectively clamped in the first clamping groove through the clamping position and the second clamping groove to realize installation with the frame;

[0014] The top or bottom of each partition bar is provided with a three-way clamping groove; the partition bars are mutually clamped and fixed by the three-way clamping groove.

[0015] The dividing strips of this arrangement can be easily installed and removed, thereby increasing the convenience of adjusting the number and size of the heating units.

[0016] Preferably, the card slot 1 of the frame is located at the top of the frame and opens upward; the card slot 2 of the dividing strip is located at the bottom of the dividing strip and opens downward; the card slot 3 located at the top of the dividing strip opens upward, and the card slot 3 located at the bottom of the dividing strip opens downward.

[0017] Preferably, the gap between adjacent heat-conducting metal plates is 0.5 mm to 1 mm. This gap range can not only meet the insulation requirements, but also ensure the compactness of the preheating tooling structure, and increase the effective heating space under the same volume conditions.

[0018] Preferably, the heat-conducting metal plate is arranged on the base through a mounting column; an installation space is reserved between the heat-conducting metal plate and the base; and the heating module and the temperature sensing module are respectively located in the installation space.

[0019] Preferably, the heating module refers to a PTC heating module; the PTC heating modules are respectively arranged on the bottom of each heat-conducting metal plate.

[0020] Preferably, the temperature sensing module includes an NTC temperature sensor; the NTC temperature sensor is respectively disposed on the bottom of each heat-conducting metal plate and does not touch the heating module.

[0021] Preferably, it also includes a display module; the display module is signal-connected to each temperature sensing module respectively.

[0022] Compared with the prior art, the utility model has the following advantages and beneficial effects:

[0023] 1. The preheating tool of the utility model can realize preheating at multiple temperatures at the same time, and can also realize classified isolation heating of different types of electronic components at the same heating temperature; the size of the heating unit can be adjusted to meet the different requirements of the volume and quantity of electronic components, and has good versatility;

[0024] 2. The number and size of the heating units of the preheating tool of the utility model can be easily adjusted;

[0025] 3. The preheating tool of the utility model has a compact structure, which is conducive to reducing the volume and can be placed on the welding operation table, making it easy to take and place the preheated electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is one of the structural schematic diagrams of the preheating tooling for electronic components of the utility model;

[0027] Figure 2 This is the second structural schematic diagram of the preheating tooling for electronic components of the utility model;

[0028] Figure 3 This is a schematic diagram of the structure of the preheating tooling for electronic components of the utility model after the base is hidden;

[0029] Figure 4 This is a schematic diagram of electrical connections of a preheating tool for electronic components of the utility model;

[0030] Figure 5 It is a structural schematic diagram of a partition frame of a preheating tool for electronic components in Example 2;

[0031] Among them, 1 is the base, 2 is the heat-conducting metal plate, 3 is the frame, 4 is the dividing strip, 5 is the heating unit, 6 is the mounting column, 7 is the display module, 8 is the heating module, 9 is the temperature sensor module, 10 is the wiring harness, 11 is the card slot one, 12 is the card slot two, 13 is the card slot three, and 14 is the card position. DETAILED DESCRIPTION

[0032] The present invention will be described in further detail below in conjunction with the accompanying drawings and specific implementations.

[0033] Embodiment 1

[0034] This embodiment is a preheating tool for electronic components, the structure is as follows Figures 1 to 3 As shown, it includes four heat-conducting metal plates 2, a base 1 and a partition frame. In this embodiment, the four heat-conducting metal plates 2 are arranged in a field shape; in actual applications, other arrangements can be used; the number of heat-conducting metal plates can also be two, three, five, six, or even more.

[0035] Each heat-conducting metal plate 2 is disposed on the base 1, and a gap is left between adjacent heat-conducting metal plates 2; the gap between adjacent heat-conducting metal plates 2 is preferably 0.5 mm to 1 mm. This gap range can not only meet the insulation requirements, but also ensure the compactness of the preheating tooling structure, and increase the effective heating space under the same volume conditions.

[0036] The partition frame includes a frame 3 and a plurality of partition bars 4; the frame 3 matches the edge position of each heat-conducting metal plate 2 to separate the upper heating area of ​​each heat-conducting metal plate 2; each partition bar 4 is fixedly connected to the frame 3 to divide the upper heating area of ​​the heat-conducting metal plate 2 into heating units 5.

[0037] The heat-conducting metal plate 2 is arranged on the base 1 through the mounting column 6; an installation space is reserved between the heat-conducting metal plate 2 and the base 1. A heating module 8 and a temperature sensing module 9 are respectively arranged under each heat-conducting metal plate 2; the heating module 8 and the temperature sensing module 9 are respectively located in the installation space.

[0038] The heating module 8 is preferably a PTC heating module; the PTC heating modules are respectively attached to the bottom of each heat-conducting metal plate 2. The temperature sensing module 9 preferably includes an NTC temperature sensor; the NTC temperature sensor is respectively attached to the bottom of each heat-conducting metal plate 2 and does not touch the heating module 8. The heating module 8 is connected to the power supply through the switch module; the switch module is connected to the temperature sensing module 9 by signal. The heating module 8, the switch module, the temperature sensing module 9 and other modules are connected by a wiring harness 10. The switch module can use a relay.

[0039] The preheating tool also includes a display module 7 and buttons; the display module 7 is respectively connected 10 to each temperature sensor module 9 by signals.

[0040] The working principle of the preheating tool of the utility model is: the electronic components that need to be heated are classified and placed in the heating units 5 of the heat-conducting metal plate 2; different types of electronic components with the same heating temperature can be placed in different heating units 5 of the same heat-conducting metal plate 2; the heating module 8 heats the heat-conducting metal plate 2 so that the heat-conducting metal plate 2 transfers heat to the electronic components to achieve preheating of the electronic components; the temperature of the heat-conducting metal plate 2 is detected by the temperature sensing module 9 and compared with the set temperature to switch the heating module 8, thereby achieving control of the heating temperature.

[0041] The preheating tool of the utility model can realize preheating of multiple temperatures at the same time, and can also realize classified isolation heating of different types of electronic components at the same heating temperature.

[0042] like Figure 4 As shown, the electrical connection of the heat-conducting metal plate, the heating module, the temperature sensing module and the display module is as follows: 220V AC power supply, after rectification and filtering to obtain relatively smooth DC power, and then step down to obtain a stable, low-voltage DC power supply for the single-chip microcomputer and other modules. The heating module controls the power supply through the relay switch; when low-voltage DC power passes through, the heating module generates heat and transfers the heat to the heat-conducting metal plate, and the temperature sensing module senses the heating temperature. The set temperature can be input to the single-chip microcomputer through a button, and the method can adopt the existing technology. The display module can display the heating temperature sensed by each temperature sensing module. The single-chip microcomputer controls the relay switch according to the comparison between the set temperature and the temperature sensed by the temperature sensing module. When the temperature sensed by the temperature sensing module is lower than the set temperature, the single-chip microcomputer controls the relay to close, 220V AC enters the heating module, and the heating module starts heating; when the temperature sensed by the temperature sensing module is higher than or equal to the set temperature, the single-chip microcomputer controls the relay to disconnect, and the heating module stops heating.

[0043] Embodiment 2

[0044] This embodiment is a preheating tool for electronic components, which is different from the first embodiment in that: in this embodiment, each partition bar 4 is detachably connected to the frame 3, such as Figure 5 Specifically, each side of the frame 3 is provided with one or more card slots 11; the card slots 11 of the frame 3 are located at the top of the frame 3 and open upward.

[0045] When the partition bar 4 is only in the upper heating zone of a single heat-conducting metal plate 2, the two ends of the partition bar 4 are respectively provided with a clamping position 14, and the two ends of the partition bar 4 are clamped in the clamping slot 1 11 through the clamping position 14 to achieve installation with the frame 3. When the partition bar 4 spans the upper heating zone of more than two heat-conducting metal plates 2, the two ends of the partition bar 4 are respectively provided with a clamping position 14, and a clamping slot 2 12 is provided at the intersection of the middle part of the partition bar 4 and the frame 3; the clamping slot 2 12 of the partition bar 4 is located at the bottom of the partition bar 4 and opens downward; the partition bar 4 is respectively clamped in the clamping slot 1 11 through the clamping position 14 and the clamping slot 2 12 to achieve installation with the frame 3; the top or bottom of each partition bar 4 is spaced apart with a clamping slot 3 13; the clamping slot 3 13 located at the top of the partition bar 4 opens upward, and the clamping slot 3 13 located at the bottom of the partition bar 4 opens downward; the partition bars 4 are clamped and fixed to each other through the clamping slot 3 13.

[0046] The partition bar 4 is detachably connected to the frame 3, and the size of the heating unit 5 can be adjusted to meet the different requirements of the volume and quantity of electronic components, and has good versatility. In addition, the partition bar can be easily installed and removed, thereby improving the convenience of the operation of adjusting the number and size of the heating units.

[0047] The rest of the structure of this embodiment is the same as that of the first embodiment.

[0048] The above embodiments are preferred implementation modes of the present invention, but the implementation modes of the present invention are not limited by the above embodiments. Any other changes, modifications, substitutions, combinations, and simplifications that do not deviate from the spirit and principle of the present invention should be equivalent replacement methods and are included in the protection scope of the present invention.

Claims

1. A preheating tool for electronic components, characterized in that: It comprises two or more heat-conducting metal plates, a base and a partition frame; each heat-conducting metal plate is respectively arranged on the base, and a gap is left between adjacent heat-conducting metal plates; a heating module and a temperature sensing module are respectively arranged under each heat-conducting metal plate; The heating module is connected to the power supply through the switch module; the switch module is connected to the temperature sensor module signal; The partition frame includes a frame and a plurality of partition strips; the frame matches the edge position of each heat-conducting metal plate to separate the upper heating area of ​​each heat-conducting metal plate; each partition strip is fixedly or detachably connected to the frame to divide the upper heating area of ​​the heat-conducting metal plate into heating units.

2. The preheating tool for electronic components according to claim 1, characterized in that: Each partition strip is detachably connected to the frame, which means that: each side of the frame is provided with at least one card slot; When the partition bar is only in the upper heating zone of a single heat-conducting metal plate, two ends of the partition bar are respectively provided with a clamping position, and the two ends of the partition bar are clamped in the first clamping slot through the clamping position to realize installation with the frame; When the partition bar spans over the upper heating zones of more than two heat-conducting metal plates, the two ends of the partition bar are respectively provided with clamping positions, and the middle of the partition bar and the intersection with the frame are provided with a second clamping groove; the partition bar is respectively clamped in the first clamping groove through the clamping position and the second clamping groove to realize installation with the frame; The top or bottom of each partition bar is provided with a three-way clamping groove; the partition bars are mutually clamped and fixed by the three-way clamping groove.

3. The preheating tool for electronic components according to claim 2, characterized in that: The card slot 1 of the frame is located at the top of the frame and opens upward; the card slot 2 of the partition strip is located at the bottom of the partition strip and opens downward; the card slot 3 located at the top of the partition strip opens upward, and the card slot 3 located at the bottom of the partition strip opens downward.

4. The preheating tool for electronic components according to claim 1, characterized in that: The gap between adjacent heat-conducting metal plates is 0.5 mm to 1 mm.

5. The preheating tool for electronic components according to any one of claims 1 to 4, characterized in that: The heat-conducting metal plate is arranged on the base through a mounting column; An installation space is reserved between the heat-conducting metal plate and the base; the heating module and the temperature sensing module are respectively located in the installation space.

6. The preheating tool for electronic components according to claim 5, characterized in that: The heating modules are PTC heating modules; the PTC heating modules are respectively arranged on the bottom of each heat-conducting metal plate.

7. The preheating tool for electronic components according to claim 5, characterized in that: The temperature sensing module includes an NTC temperature sensor; the NTC temperature sensor is respectively arranged on the bottom of each heat-conducting metal plate and does not touch the heating module.

8. The preheating tool for electronic components according to any one of claims 1 to 4, characterized in that: It also includes a display module; the display module is respectively connected to the signals of each temperature sensor module.

Images