Water temperature adjusting device for semiconductor cutting equipment
By introducing an automatic cooling structure into the water temperature adjustment device of the semiconductor cutting equipment, the problem of automatic cooling in the prior art is solved, automatic control of the cutting tool temperature is realized, and the safety and stability of the equipment are improved.
Patent Information
- Application Number
- CN202421805434.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-29
- Publication Date
- 2025-06-06
- Estimated Expiration
- 2034-07-29
AI Technical Summary
The water temperature adjustment device of existing semiconductor cutting equipment cannot automatically cool down after alarm reminding, resulting in too high cutter temperature and causing damage.
A water temperature adjustment device including a water tank, a water temperature sensor and a cooling structure is designed. When the cooling structure senses that the water temperature is too high through the water temperature sensor, it will automatically mix the cold water in the cooling box with the water in the water tank to reduce the water temperature.
It realizes that the water temperature in the water tank is automatically reduced without manual intervention, preventing the cutter temperature from being too high, and improving the safety and stability of the equipment.
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Figure CN222945938U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of semiconductor packaging, in particular to a water temperature regulating device for semiconductor cutting equipment. Background Art
[0002] Semiconductor refers to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields.
[0003] The prior art (application number: CN202220646238.1) discloses a water temperature adjustment device for semiconductor cutting equipment, the semiconductor cutting equipment includes a water tank, a spindle and a cutting tool connected to the spindle; the water temperature detection device includes: a water circuit converter connected to the water tank, having a first water outlet and a second water outlet; a first pipeline connected to the first water outlet, the other end of the first pipeline is arranged close to the spindle; a second pipeline connected to the second water outlet.
[0004] The prior art uses a temperature sensor to detect that the water temperature of the cooling cutter is too high and uses an alarm to remind the staff to cool down the temperature. Although the alarm can remind the staff, if the staff does not cool down the water temperature immediately when the alarm is sounded, the cutter will still be damaged due to overheating. Therefore, the alarm of the prior art must be cooled down immediately when the staff finds it to prevent the cutter from overheating.
[0005] In view of this, the present utility model is proposed. Utility Model Content
[0006] In order to solve the technical problem that the cooling water cannot be cooled immediately, the basic concept of the technical solution adopted by the utility model is:
[0007] The water temperature adjustment device for semiconductor cutting equipment comprises an operating table placed on the ground, a cutting table is fixedly connected to the top of the operating table, an adjustment mechanism is also fixedly connected to the top of the operating table, a cutter is fixedly connected to the wall of the adjustment mechanism, a water tank is also fixedly connected to the top of the operating table, the water tank is in the shape of a hollow rectangular box with an open top, a water pipe is also fixedly connected to the front wall of the water tank, the water pipe is in the shape of a circular pipe, the water pipe is connected to the cavity of the water tank, a water temperature sensor is fixedly connected to the cavity of the water tank, and the water temperature sensor comprises a temperature sensitive Elements, conversion elements, auxiliary power supply circuits and signal transmitters, a cooling structure is arranged in the cavity of the water tank, the cooling structure comprises a cooling box, a plug, a liquid outlet and a gate, the cooling box is fixedly connected to the inner wall of the water tank cavity, the cooling box is in the shape of a hollow rectangular box with an open top, the water temperature sensor is fixedly connected to the bottom of the side wall of the cooling box, the plug is clamped on the top of the cooling box, the liquid outlet penetrates through the front wall of the cooling box, the gate is slidably connected in the cavity of the cooling box, and the cooling structure can reduce the water temperature in the water tank cavity.
[0008] As a preferred embodiment of the utility model, the bottom size of the plug is consistent with the top opening of the cooling box, the bottom of the plug is stuck on the top opening of the cooling box, the liquid outlet is a semicircular groove with a plane facing downward, and the gate can cover the liquid outlet.
[0009] As a preferred embodiment of the utility model, the cooling structure also includes a filter frame, a rotating motor, a base block, a vertical rod, a vertical groove and a bottom groove. The filter frame is fixedly connected to the wall surface of the upper half of the cooling box cavity. The filter frame is in the shape of a rectangular frame. The base block is fixedly connected to the top opening of the cooling box. The rotating motor is fixedly connected to the top of the base block. The vertical rods are symmetrically fixedly connected to the inner wall surface of the cooling box cavity at the liquid outlet. The vertical grooves are opened on the wall surface where the symmetrical vertical rods face each other, and the bottom groove is opened at the bottom of the inner wall surface of the cooling box cavity.
[0010] As a preferred embodiment of the utility model, the inner wall of the filter frame is fixedly connected with a grid for filtering, the wall of the plug is provided with a rectangular notch adapted for the rotating motor, the rotating motor can be within the rectangular notch of the wall of the plug, the wall of each vertical rod is provided with a vertical groove, and the bottom groove is located between the symmetrical vertical rods.
[0011] As a preferred embodiment of the utility model, the cooling structure also includes a driving rod, a driving pattern, a driven rod, a driving groove and a vertical block. The driving rod is rotatably connected to the bottom of the base block, the top of the driving rod can pass through the base block and be connected to the bottom output end of the rotating motor, the driving rod is cylindrical, the driving pattern is fixedly connected to the outer arc wall of the driving rod, the driven rod is rotatably connected to the top of the gate, the driven rod is also cylindrical, the driving groove is opened on the outer arc surface of the driven rod, and the vertical blocks are symmetrically fixedly connected on both sides of the gate.
[0012] As a preferred embodiment of the present utility model, the gate can slide vertically between symmetric vertical rods. The symmetric vertical blocks slide respectively in the vertical grooves on the wall surfaces of the symmetric vertical rods. The driving pattern is in the shape of a spiral thread, the driving groove is a spiral groove adapted to the driving pattern, the driving pattern can enter the driving groove, and the side wall surface of the driving rod can contact the side wall surface of the driven rod.
[0013] As a preferred embodiment of the present utility model, a sliding cover is slidably connected to the top of the water tank. Symmetric sliding rods are fixedly connected to the two side wall surfaces of the water tank. A sliding groove is opened at the bottom of the side wall surface of the sliding rod, and sliding blocks are respectively fixedly connected to the two bottom parts of the sliding cover.
[0014] As a preferred embodiment of the present utility model, a rectangular groove adapted to the size of the plug is opened on the wall surface of the sliding cover. The sliding cover is in a U-shaped with the opening facing downwards. The inner wall surface of the opening of the sliding cover can block the top opening of the water tank. The sliding blocks are arranged at both ends of the bottom of the sliding cover, and the sliding blocks can slide in the sliding grooves.
[0015] The present utility model has the following beneficial effects compared with the prior art:
[0016] 1. By setting the cooling structure, it can prevent the water temperature in the water tank cavity from being too high in time. Because when the water temperature sensor in the cooling structure senses that the water temperature is too high, the gate will mix the water in the cooling tank cavity and the water in the water tank cavity to reduce the water temperature in the water tank cavity. And in this process, no manual intervention is required. Compared with the prior art, this solution can reduce the water temperature in time and prevent the temperature of the cutting knife from being too high.
[0017] 2. By setting the square grid on the wall surface of the filter frame, it can filter the cooling tank cavity when adding water, preventing the liquid outlet at the bottom of the cooling tank from being blocked by sundries when flowing water, resulting in the failure of the device operation, thereby improving the stability of the device.
[0018] The following further describes in detail the specific embodiments of the present utility model with reference to the accompanying drawings. Description of the Drawings
[0019] In the drawings:
[0020] Figure 1 is the three-dimensional view of the present utility model;
[0021] Figure 2 is the three-dimensional view of the water tank and the cutting knife of the present utility model connected by a water pipe;
[0022] Figure 3 is the exploded view of the water tank and the sliding cover of the present utility model;
[0023] Figure 4 is the connection schematic diagram of the cooling tank and the plug of the present utility model;
[0024] Figure 5 This is a cross-sectional view of the cooling box of the utility model;
[0025] Figure 6 It is a connection diagram of the driving rod and the driven rod of the utility model.
[0026] In the figure: 20, operating table; 21, cutting table; 22, adjusting mechanism; 23, cutting knife; 24, water tank; 25, water pipe; 26, sliding cover; 27, sliding rod; 28, sliding groove; 29, sliding block; 30, water temperature sensor; 31, cooling box; 32, plug; 33, filter frame; 34, rotating motor; 35, base block; 36, liquid outlet; 37, vertical rod; 38, vertical groove; 39, bottom groove; 40, driving rod; 41, driving pattern; 42, driven rod; 43, driving groove; 44, gate; 45, vertical block. DETAILED DESCRIPTION
[0027] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. The following embodiments are used to illustrate the utility model.
[0028] like Figure 1 and Figure 2 As shown, a water temperature adjustment device for semiconductor cutting equipment includes an operating table 20 placed on the ground, a cutting table 21 is fixedly connected to the top of the operating table 20, an adjusting mechanism 22 is also fixedly connected to the top of the operating table 20, a cutter 23 is fixedly connected to the wall of the adjusting mechanism 22, a water tank 24 is also fixedly connected to the top of the operating table 20, the water tank 24 is in the shape of a hollow rectangular box with an open top, a water pipe 25 is also fixedly connected to the front wall of the water tank 24, the water pipe 25 is in the shape of a circular tube, the water pipe 25 is connected to the cavity of the water tank 24, a water temperature sensor 30 is fixedly connected to the cavity of the water tank 24, the water temperature sensor 30 is a non-contact temperature sensor in the prior art, including: a temperature sensitive element, a conversion element, an auxiliary power supply circuit and a signal transmitter, the adjusting mechanism 22 is a mechanical arm in the prior art that can drive the cutter to move horizontally, vertically and telescopically, including: a mechanical arm body and a joint, the cutter 23 is driven to rotate by a high-speed rotating motor, and the adjusting mechanism 22, the water temperature sensor 30 and the motor of the cutter 23 are all electrically connected to the corresponding power supply;
[0029] It is worth noting that the outer wall of the water temperature sensor 30 is made of waterproof and anti-corrosion material and the cavity thereof is sealed. This is an existing technology and will not be described in detail here.
[0030] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6As shown, a cooling structure is provided in the cavity of the water tank 24, and the cooling structure includes a cooling box 31, a plug 32, a liquid outlet 36 and a gate 44. The cooling box 31 is fixedly connected to the inner wall of the cavity of the water tank 24, and the cooling box 31 is in the shape of a hollow rectangular box with an open top. The water temperature sensor 30 is fixedly connected to the bottom of the side wall of the cooling box 31, the plug 32 is clamped on the top of the cooling box 31, the liquid outlet 36 penetrates through the front wall of the cooling box 31, and the gate 44 is slidably connected in the cavity of the cooling box 31. The cooling structure can reduce the water temperature in the cavity of the water tank 24.
[0031] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, the bottom size of the plug 32 is consistent with the top opening of the cooling box 31, the bottom of the plug 32 is stuck on the top opening of the cooling box 31, the liquid outlet 36 is a semicircular groove with a plane facing downward, and the gate 44 can block the liquid outlet 36. The cooling structure also includes a filter frame 33, a rotating motor 34, a base block 35, a vertical rod 37, a vertical groove 38 and a bottom groove 39. The filter frame 33 is fixedly connected to the wall surface of the upper half of the cavity of the cooling box 31. The filter frame 33 is in a rectangular frame shape, and the base block 35 is fixedly connected to the top of the cooling box 31. At the opening, the rotating motor 34 is fixedly connected to the top of the base block 35, the vertical rods 37 are symmetrically fixedly connected to the inner wall of the cooling box 31 at the liquid outlet 36, the vertical grooves 38 are opened on the wall where the symmetrical vertical rods 37 face each other, the bottom grooves 39 are opened at the bottom of the inner wall of the cooling box 31, the inner wall of the filter frame 33 is fixedly connected with a grid for filtering, the wall of the plug 32 is opened with a rectangular notch adapted to the rotating motor 34, and the rotating motor 34 can be in the rectangular notch of the wall of the plug 32, each vertical rod 38 is opened. 7 are provided with vertical grooves 38, the bottom grooves 39 are located between the symmetrical vertical rods 37, the cooling structure also includes a driving rod 40, a driving groove 41, a driven rod 42, a driving groove 43 and a vertical block 45, the driving rod 40 is rotatably connected to the bottom of the base block 35, the top of the driving rod 40 can pass through the base block 35 and be connected to the bottom output end of the rotating motor 34, the driving rod 40 is cylindrical, the driving groove 41 is fixedly connected to the outer arc wall of the driving rod 40, the driven rod 42 is rotatably connected to the top of the gate 44, and the driven rod 42 is rotatably connected to the top of the gate 44. The rod 42 is also cylindrical, the driving groove 43 is provided on the outer arc surface of the driven rod 42, the vertical blocks 45 are symmetrically fixedly connected on both sides of the gate 44, the gate 44 can slide vertically between the symmetrical vertical rods 37, the symmetrical vertical blocks 45 slide in the vertical grooves 38 on the wall surfaces of the symmetrical vertical rods 37 respectively, the driving pattern 41 is in the shape of a spiral pattern, the driving groove 43 is a spiral groove adapted to the driving pattern 41, the driving pattern 41 can enter the driving groove 43, and the side wall surface of the driving rod 40 can contact the side wall surface of the driven rod 42;
[0032] When in use, the semiconductor to be cut is placed on the cutting table 21, and then the adjustment mechanism 22 is used to drive the cutter 23 to cut the semiconductor. Before the device is turned on, water is added to the cavity of the water tank 24 to reduce the temperature of the cutter 23. Then, the plug 32 is pulled out from the top of the cooling box 31 and cooling water with a lower temperature is added to the cavity of the cooling box 31. Then, the plug 32 is inserted into the top of the cooling box 31. At this time, the power of the device is turned on. A water pump is also installed in the cavity of the water tank 24 to transport water to the water pipe 25. The water pump is also connected to the power supply. When the cutter 23 is driven by the motor to rotate and is driven by the adjusting mechanism 22 to cut the semiconductor on the top of the cutting table 21, the water pump in the water tank 24 cavity will transport water to the water pipe 25. At this time, the water will flow over the rotating cutter 23 because the other end of the water pipe 25 is fixedly connected to the wall of the adjusting mechanism 22 above the cutter 23, thereby reducing the temperature of the cutter 23. When the water temperature sensor 30 detects that the water temperature in the water tank 24 cavity is too high, the water temperature sensor 30 will send a signal to turn on the power to the rotating motor 34, and the rotating The motor 34 will drive the driving rod 40 to rotate when receiving the start signal from the water temperature sensor 30, and the driving rod 40 will drive the driven rod 42 to rotate through the driving groove 41 and the driving groove 43 during the rotation. When the driven rod 42 rotates, it will drive the gate 44 to slide upward due to the adaptation of the driving groove 41 and the driving groove 43. The gate 44 will slide between the symmetrical vertical rods 37, and the gate 44 will drive the vertical block 45 to slide in the vertical groove 38 at the same time. When the gate 44 slides upward to When the temperature of the water in the cooling box 31 is at the highest point, the water with a lower temperature in the cavity will flow out from the liquid outlet 36 and merge with the water in the cavity of the water tank 24, thereby reducing the temperature of the water in the cavity of the water tank 24. When the temperature of the water in the cavity of the water tank 24 is reduced to a safe value, the water temperature sensor 30 will allow the rotating motor 34 to drive the driving rod 40 to rotate in another direction, thereby sliding the gate 44 downward to its original position through the driven rod 42. The bottom and both sides of the gate 44 are equipped with sealing strips, and the bottom of the gate 44 will enter the bottom groove 39, thereby completing the cooling of the water in the cavity of the water tank 24.
[0033] To sum up, by setting up a cooling structure, it is possible to timely prevent the temperature of the water in the water tank 24 from being too high. Because when the cooling structure senses that the water temperature is too high through the water temperature sensor 30, it will cause the gate 44 to mix the water in the cooling box 31 cavity and the water in the water tank 24 cavity, thereby reducing the water temperature in the water tank 24 cavity, and no manual intervention is required in this process. Compared with the prior art, this solution can timely reduce the water temperature and prevent the temperature of the cutter 23 from being too high, and at the same time can also replenish the water in the water tank 24 to a certain extent.
[0034] It should be noted that the cooling box 31 itself adopts a heat-insulating structure (similar to the principle of a thermos cup), so that the increase in the water temperature in the water tank 24 will not affect the temperature of the cooling water in the cooling box 31.
[0035] like Figure 1 , Figure 2 and Figure 3 As shown in Figure 2 and Figure 3 , a sliding cover 26 is slidably connected to the top of the water tank 24. Slide bars 27 are symmetrically and fixedly connected to the side walls of the water tank 24. A chute 28 is provided at the bottom of the side wall of the slide bar 27. Sliders 29 are respectively fixedly connected to the two bottom sides of the sliding cover 26. A rectangular groove adapted to the size of the plug 32 is provided on the wall surface of the sliding cover 26. The sliding cover 26 is in a U-shaped with the opening facing downward. The inner wall surface of the opening of the sliding cover 26 can block the top opening of the water tank 24. The sliders 29 are arranged at both ends of the bottom of the sliding cover 26, and the sliders 29 can slide in the chute 28;
[0036] During specific use, the sliding cover 26 can slide on the top of the water tank 24. When adding water to the cavity of the water tank 24, the sliding cover 26 can be slid. And when adding water to the cavity of the cooling tank 31, there is no need to slide the sliding cover 26. The plug 32 can be directly pulled out from the top of the cooling tank 31. When adding water to the cavity of the cooling tank 31, the square grid on the wall surface of the filter frame 33 will filter the water flow;
[0037] In summary, by setting the square grid on the wall surface of the filter frame 33, the water can be filtered when adding water to the cavity of the cooling tank 31, preventing the liquid outlet 36 at the bottom of the cooling tank 31 from being blocked by sundries when flowing water, resulting in the failure of the device operation, thereby improving the stability of the device.
[0038] Working principle: Place the semiconductor to be cut on the cutting table 21, and then cooperate with the adjustment mechanism 22 to drive the cutter 23 to cut the semiconductor. Before the device is turned on, add water to the cavity of the water tank 24 to reduce the temperature of the cutter 23, then pull out the plug 32 from the top of the cooling box 31 and add cooling water with a lower temperature to the cavity of the cooling box 31, and then insert the plug 32 into the top of the cooling box 31. At this time, turn on the power of the device. A water pump that transports water to the water pipe 25 is also installed in the cavity of the water tank 24, and the water pump is also electrically connected to the power supply. Then, when the cutter 23 is driven by the motor to rotate and is driven by the regulating mechanism 22 to cut the semiconductor on the top of the cutting table 21, the water pump in the water tank 24 cavity will deliver water to the water pipe 25. At this time, the water will flow over the rotating cutter 23 because the other end of the water pipe 25 is fixedly connected to the wall of the regulating mechanism 22 above the cutter 23, thereby reducing the temperature of the cutter 23. When the water temperature sensor 30 detects that the water temperature in the water tank 24 cavity is too high, the water temperature sensor 30 will send a signal to turn on the power to the rotating motor 34, and the rotating motor 34 will turn on the power. The motor 34 will drive the driving rod 40 to rotate when receiving the start signal from the water temperature sensor 30, and the driving rod 40 will drive the driven rod 42 to rotate through the driving groove 41 and the driving groove 43 during the rotation. When the driven rod 42 rotates, it will drive the gate 44 to slide upward due to the adaptation of the driving groove 41 and the driving groove 43. The gate 44 will slide between the symmetrical vertical rods 37, and the gate 44 will drive the vertical block 45 to slide in the vertical groove 38 at the same time. When the gate 44 slides upward to the maximum When at a high position, water with a lower temperature in the cooling box 31 will flow out from the liquid outlet 36 and merge with the water in the water tank 24, thereby lowering the water temperature in the water tank 24. When the water temperature in the water tank 24 is reduced to a safe value, the water temperature sensor 30 will allow the rotating motor 34 to drive the driving rod 40 to rotate in the other direction, thereby sliding the gate 44 downward to its original position through the driven rod 42. Sealing strips are installed on the bottom and both sides of the gate 44. The bottom of the gate 44 will enter the bottom groove 39, thereby completing the cooling of the water in the water tank 24.
[0039] In addition, preferably, when the cooling box 31 is installed in the water tank 24, the height of the bottom of the cooling box 31 is higher than the highest water level in the water tank 24 (and more preferably, higher than the water level after the low-temperature water in the cooling box 31 is added to the water tank 24), so as to avoid excessive total water volume entering the cooling box 31 when the high-temperature water and the low-temperature water are mixed. Figure 4 The opposite aspect ratio, that is, the width is longer and the height is shorter.
[0040] It is understood that the present invention is described by some embodiments, and those skilled in the art are aware that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present invention. In addition, under the teachings of the present invention, these features and embodiments may be modified to adapt to specific circumstances and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the scope of protection of the present invention.
Claims
1. A water temperature adjustment device for semiconductor cutting equipment, comprising an operating table (20) placed on the ground, a cutting table (21) fixedly connected to the top of the operating table (20), an adjusting mechanism (22) fixedly connected to the top of the operating table (20), a cutter (23) fixedly connected to the wall of the adjusting mechanism (22), a water tank (24) fixedly connected to the top of the operating table (20), the water tank (24) being in the shape of a hollow rectangular box with an open top, a water pipe (25) fixedly connected to the front wall of the water tank (24), the water pipe (25) being in the shape of a circular tube, the water pipe (25) being connected to the cavity of the water tank (24), and a water temperature sensor (30) fixedly connected to the cavity of the water tank (24); characterized in that: A cooling structure is arranged in the cavity of the water tank (24), and the cooling structure comprises a cooling box (31), a plug (32), a liquid outlet (36) and a gate (44). The cooling box (31) is fixedly connected to the inner wall surface of the cavity of the water tank (24). The cooling box (31) is in the shape of a hollow rectangular box with an open top. The water temperature sensor (30) is fixedly connected to the bottom of the side wall surface of the cooling box (31). The plug (32) is clamped on the top of the cooling box (31). The liquid outlet (36) penetrates and is opened on the front wall surface of the cooling box (31). The gate (44) is slidably connected in the cavity of the cooling box (31).
2. The water temperature adjustment device for semiconductor cutting equipment according to claim 1, characterized in that: The bottom size of the plug (32) is consistent with the top opening of the cooling box (31), the bottom of the plug (32) is stuck on the top opening of the cooling box (31), the liquid outlet (36) is a semicircular groove with a plane facing downward, and the gate (44) can cover the liquid outlet (36).
3. The water temperature adjustment device for semiconductor cutting equipment according to claim 1, characterized in that: The cooling structure further comprises a filter frame (33), a rotating motor (34), a base block (35), a vertical rod (37), a vertical groove (38) and a bottom groove (39); the filter frame (33) is fixedly connected to the wall surface of the upper part of the cavity of the cooling box (31); the filter frame (33) is in the shape of a rectangular frame; the base block (35) is fixedly connected to the top opening of the cooling box (31); the rotating motor (34) is fixedly connected to the top of the base block (35); the vertical rods (37) are symmetrically fixedly connected to the cavity wall surface of the cooling box (31) at the liquid outlet (36); the vertical grooves (38) are arranged on the wall surface of the symmetrical vertical rods (37) facing each other; and the bottom groove (39) is arranged at the bottom of the cavity wall surface of the cooling box (31).
4. The water temperature adjustment device for semiconductor cutting equipment according to claim 3, characterized in that: The inner wall surface of the filter frame (33) is fixedly connected with a grid for filtering, the wall surface of the plug (32) is provided with a rectangular notch adapted for the rotating motor (34), and the rotating motor (34) can be in the rectangular notch of the wall surface of the plug (32), and the wall surface of each vertical rod (37) is provided with a vertical groove (38), and the bottom groove (39) is located between the symmetrical vertical rods (37).
5. The water temperature adjustment device for semiconductor cutting equipment according to claim 3, characterized in that: The cooling structure further includes a driving rod (40), a driving thread (41), a driven rod (42), a driving groove (43) and a vertical block (45). The driving rod (40) is rotatably connected to the bottom of the base block (35). The top of the driving rod (40) can pass through the base block (35) and be connected to the bottom output end of the rotating motor (34). The driving rod (40) is cylindrical. The driving thread (41) is fixedly connected to the outer arc wall surface of the driving rod (40). The driven rod (42) is rotatably connected to the top of the gate (44). The driven rod (42) is also cylindrical. The driving groove (43) is formed in the outer arc surface of the driven rod (42). The vertical blocks (45) are symmetrically and fixedly connected to both sides of the gate (44).
6. The water temperature adjustment device for semiconductor cutting equipment according to claim 5, characterized in that: The gate (44) can vertically slide between the symmetric vertical rods (37). The symmetric vertical blocks (45) slide in the vertical grooves (38) on the wall surfaces of the symmetric vertical rods (37) respectively. The driving thread (41) is in a spiral shape. The driving groove (43) is a spiral groove adapted to the driving thread (41). The driving thread (41) can enter the driving groove (43). The side wall surface of the driving rod (40) can contact the side wall surface of the driven rod (42).
7. The water temperature adjustment device for semiconductor cutting equipment according to claim 1, characterized in that: A sliding cover (26) is slidably connected to the top of the water tank (24). Slide rods (27) are symmetrically and fixedly connected to both side wall surfaces of the water tank (24). A sliding groove (28) is formed at the bottom of the side wall surface of the slide rod (27). Sliders (29) are respectively fixedly connected to both bottom sides of the sliding cover (26).
8. The water temperature adjustment device for semiconductor cutting equipment according to claim 7, characterized in that: A rectangular groove adapted to the size of the plug (32) is formed in the wall surface of the sliding cover (26). The sliding cover (26) is in a U-shaped with the opening facing downwards. The inner wall surface of the opening of the sliding cover (26) can cover the top opening of the water tank (24). The sliders (29) are arranged at both ends of the bottom of the sliding cover (26). The sliders (29) can slide in the sliding grooves (28).
Citation Information
Patent Citations
Water temperature detection device for semiconductor cutting equipment
CN217777412U