Spraying device for diamond wire slicing machine
By installing a spray device on the diamond wire slicer, using spray water to separate adjacent silicon wafers, the problem of diamond wires being easily scratched after cutting is solved, and the output quality of the silicon wafer is improved.
Patent Information
- Application Number
- CN202421357426.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-13
- Publication Date
- 2025-06-06
- Estimated Expiration
- 2034-06-13
AI Technical Summary
When the diamond wire cuts the silicon rod, the cut silicon wafers are prone to approach each other, resulting in the diamond wires being easily scratched during the relative movement of the silicon rod.
A spray device for a diamond wire slicer is designed, including a spray assembly, a collection assembly and a controller. After the silicon rod is cut, the spray water supply unit is controlled by the controller to spray the spray water between two adjacent silicon wafers, separate the silicon wafers with water flow, and clean the attached impurities.
It effectively reduces the possibility that the diamond wire scratches the silicon wafer when the silicon rod is disengaged and improves the output quality of the silicon wafer.
Smart Images
Figure CN222945942U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of spray devices, and in particular to a spray device for a diamond wire slicer. Background Art
[0002] Silicon wafers are the main raw materials in the semiconductor and photovoltaic fields. Silicon wafers are cut from silicon rods. There are two main ways to cut silicon rods: inner circle cutting and multi-wire cutting.
[0003] The multi-wire cutting method is a cutting method that uses a high-speed moving steel wire to drive the cutting blade attached to the steel wire to rub the silicon rod, thereby cutting the silicon rod into multiple thin slices at the same time. At present, silicon rods are generally cut by diamond wire, which is made by consolidating diamond micropowder particles evenly on a mother wire (high carbon steel wire) with a certain distribution density.
[0004] When the silicon rod is cut by diamond wire, a cooling device for cooling the diamond wire is generally installed on the frame in order to cool the diamond wire. Generally, two cooling devices are provided. Both cooling devices are located above the wire mesh of the diamond wire, and the silicon rod is located between the two cooling devices.
[0005] Existing cooling devices generally include a cooling box and a guide plate. The cooling box is fixedly mounted on the frame, and the cooling box is filled with coolant. The cooling box is connected to a cooling pipeline, and the cooling pipeline is located on the side where the two cooling boxes are close to each other. The guide plate is installed on the side where the two cooling boxes are close to each other, and the side of the guide plate away from the cooling box is tilted downward, and the lowest point of the guide plate is located above the wire mesh of the diamond wire. The coolant inside the cooling box flows to the guide plate through the cooling pipeline, and the guide plate guides the coolant to the wire mesh of the diamond wire, thereby cooling the diamond wire.
[0006] With the development of the diamond wire industry, in order to maximize the output of silicon wafers, diamond wires are becoming thinner and thinner, and the cut silicon wafers are becoming thinner and thinner. After the silicon rod is cut, when the cut silicon rod is lifted up from the diamond wire mesh, the two adjacent silicon wafers tend to get close to each other. During the relative movement of the diamond wire and the silicon rod, there is a defect that the diamond wire is easy to scratch the silicon wafer. Utility Model Content
[0007] In order to reduce the possibility of the diamond wire scratching the silicon wafer when the silicon rod is separated from the wire mesh of the diamond wire, the present application provides a spray device for a diamond wire slicer.
[0008] The present application provides a spray device for a diamond wire slicer using the following technical solution:
[0009] A spray device for a diamond wire slicer comprises a frame, a cooling box mounted on the frame and a guide plate mounted on the cooling box, the spray device comprising:
[0010] A spray assembly, the spray assembly comprising a spray part installed on the side of the guide plate close to the silicon rod and a spray water supply part installed near the spray part, the spray part and the spray water supply part are connected, and the spray part is fixedly connected to the guide plate through a connecting part;
[0011] A collecting assembly, the collecting assembly being located below the wire mesh of the diamond wire;
[0012] A controller, the controller being electrically connected to the spray water supply unit;
[0013] After the silicon rod is cut, the cut silicon rod is lifted up and separated from the diamond wire, and the controller controls the spray water supply part to pass the spray water to the spray part, and the spray water is sprayed between two adjacent silicon wafers in the form of water mist through the spray part. The water flow on the two silicon wafers separates the two adjacent silicon wafers, and the impurities attached to the silicon wafers are merged into the collection component with the water flow.
[0014] Optionally, the spray part includes a spray pipe consistent with the length direction of the silicon rod and a plurality of atomizing nozzles installed on the spray pipe, each of the atomizing nozzles is connected to the spray pipe, the spray pipe is connected to the spray water supply part, and a certain gap is left between the spray pipe and the guide plate.
[0015] Optionally, the spray water supply unit includes a water tank located near the spray unit, a water pipe with one end connected to the water tank, and a water pump installed on the water pipe, the water tank is filled with spray water, the other end of the water pipe is connected to the spray pipe, and the controller and the water pump are electrically connected.
[0016] Optionally, the connecting portion includes a positioning block installed on a side of the guide plate close to the silicon rods and a fixing plate installed on the positioning block, and an inner wall of the fixing plate is fixedly connected to a pipe wall of the spray pipe.
[0017] Optionally, the connecting portion further includes a connecting rod mounted on the positioning block and a connecting nut threadedly connected to the connecting rod, the connecting rod passes through the fixing plate, and the connecting nut is used to press the fixing plate onto the positioning block.
[0018] Optionally, a circular arc surface is provided on a side of the fixing plate close to the spray pipe, and the circular arc surface is in contact with the pipe wall of the spray pipe.
[0019] Optionally, the fixed plate includes a mounting plate and a clamping plate, wherein two mounting plates are arranged in parallel, and the two mounting plates and the corresponding clamping plates are fixedly connected at both ends, the mounting plate is fixedly mounted on the positioning block, and the clamping plate is arranged in an arc-shaped plate, and the clamping plate clamps the spray pipe.
[0020] Optionally, a plurality of limiting grooves are provided on the side wall of the clamping plate, and limiting teeth are installed on the pipe wall of the spray pipe, and the limiting teeth and the limiting grooves are plug-fitted.
[0021] In summary, the present application includes at least one of the following beneficial technical effects:
[0022] 1. After the silicon rod is cut, the silicon rod is lifted up and separated from the wire mesh of the diamond wire. The water pump passes the spray water in the water tank into the spray pipe through the water pipe, and sprays it from the atomizing nozzle onto the silicon wafer. The water flow of the spray water flows downward under the action of gravity, and the two adjacent silicon wafers are separated under the squeezing action of the spray water. At the same time, the spray water flowing downward on the silicon wafer cleans the impurities attached to the silicon wafer, thereby reducing the possibility of the diamond wire scratching the silicon wafer when the diamond wire and the silicon wafer move away from each other.
[0023] 2. When installing the spray pipe, according to the required working angle of the atomizing nozzle, the staff inserts the limiting teeth into the corresponding limiting grooves. The inner wall of the limiting groove limits the spray pipe through the limiting teeth, thereby improving the convenience of adjusting the working angle of the atomizing nozzle. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 It is a schematic diagram of the overall structure of Example 1 of the present application.
[0025] Figure 2 It is a schematic diagram of the structure of the spray assembly in Example 1 of the present application.
[0026] Figure 3 It is a schematic diagram showing the connection relationship between the spray pipe and the connecting part in Example 2 of the present application.
[0027] Description of reference numerals:
[0028] 1. Spray assembly; 11. Spray part; 111. Spray pipe; 1111. Limiting teeth; 112. Atomizing nozzle; 12. Connecting part; 121. Positioning block; 122. Fixing plate; 1221. Limiting groove; 123. Connecting rod; 124. Connecting nut; 2. Cooling assembly; 21. Cooling box; 22. Guide plate. DETAILED DESCRIPTION
[0029] The following is combined with Figure 1-Figure 3 This application is described in further detail.
[0030] The embodiment of the present application discloses a spray device for a diamond wire slicer.
[0031] Example 1
[0032] A spray device for a diamond wire slicer comprises a frame, a cooling device 2, a spray assembly 1, a collection assembly and a controller. The frame is placed on the ground, the cooling device 2 is fixedly mounted on the frame, two cooling devices 2 are provided, a silicon rod is located between the two cooling devices 2, and both cooling devices 2 are located above the wire mesh of the diamond wire.
[0033] The cooling device 2 includes a cooling box 21 and a guide plate 22. The cooling box 21 is fixedly mounted on the frame, and the cooling box 21 is filled with coolant. Each cooling box 21 is connected to a cooling pipeline, and the cooling pipeline is located on the side of the cooling box 21 close to the silicon rod. The guide plate 22 is fixedly mounted on the side of the cooling box 21 close to the silicon rod. The guide plate 22 is located below the cooling pipeline, and the side of the guide plate 22 close to the silicon rod is tilted downward. The spray assembly 1 is installed on the side of the guide plate 22 close to the silicon rod, the collection assembly is installed below the wire mesh of the diamond wire, the controller is installed on the frame, and the controller and the spray assembly 1 are electrically connected.
[0034] After the diamond wire has finished cutting the silicon rod, when the cut silicon rod is lifted up and separated from the wire mesh of the diamond wire, the controller controls the spray assembly 1 to spray water on the silicon rod after cutting, and the spray water is sprayed between two adjacent silicon wafers, and the spray water flows on the silicon wafers. When the spray water flows between two adjacent silicon wafers, the spray water separates the two adjacent silicon wafers that are close to each other, and takes away the impurities attached to the silicon wafers, and merges into the collection assembly, and is collected by the collection assembly. By spraying water, the two adjacent silicon wafers are separated, and the impurities on the silicon wafers are taken away from the silicon wafers, so as to reduce the possibility of the diamond wire scratching the silicon wafer when the silicon rod is separated from the wire mesh of the diamond wire.
[0035] The spray assembly 1 includes a spray portion 11 , a spray water supply portion and a connection portion 12 .
[0036] The spray part 11 is installed on the side of the guide plate 22 close to the silicon rod. The spray part 11 includes a spray pipe 111 and an atomizing nozzle 112. The length direction of the spray pipe 111 is consistent with the length direction of the silicon rod. A plurality of atomizing nozzles 112 are provided, and the plurality of atomizing nozzles 112 are evenly distributed along the length direction of the spray pipe 111, and each atomizing nozzle 112 is connected to the inside of the spray pipe 111.
[0037] The spray water supply unit includes a water tank, a water pipe and a water pump. The water tank is placed near the frame, and the water tank is filled with spray water. One end of the water pipe is connected to the water tank, and the other end of the water pipe is connected to the spray pipe 111. In order to facilitate the placement of the spray pipe 111, the water pipe is a hose. The water pump is fixedly installed on the water pipe, and the water pump and the water pipe are connected.
[0038] When it is necessary to spray water on the cut silicon rods, the water pump passes the spray water in the water tank into the spray pipe 111 through the water pipe, and sprays the spray water between two adjacent silicon wafers through the atomizing nozzle 112 installed on the spray pipe 111.
[0039] Two connecting parts 12 are provided, and the two connecting parts 12 are respectively located at two ends of the guide plate 22 close to the silicon rod.
[0040] The connecting part 12 includes a positioning block 121, a fixing plate 122, a connecting rod 123 and a connecting nut 124. The positioning block 121 is fixedly mounted on the guide plate 22. One end of the connecting rod 123 is fixedly mounted on a side of the positioning block 121 away from the guide plate 22, and the connecting nut 124 is threadedly connected to the connecting rod 123.
[0041] The connecting rod 123 penetrates the fixing plate 122 . When the fixing plate 122 is installed on the positioning block 121 , the fixing plate 122 is pressed onto the positioning block 121 by the connecting nut 124 after the connecting rod 123 penetrates the fixing plate 122 .
[0042] The fixing plate 122 is fixedly connected to the pipe wall of the spray pipe 111. In the embodiment of the present application, the fixing plate 122 is welded to the pipe wall of the spray pipe 111. In order to improve the position accuracy of the welding fixing plate 122 and the pipe wall of the spray pipe 111, a circular arc surface is provided on one side of the fixing plate 122 close to the pipe wall of the spray pipe 111. The pipe wall of the spray pipe 111 and the circular arc surface of the fixing plate 122 fit together, and the spray pipe 111 is positioned by the circular arc surface on the fixing plate 122.
[0043] After the spray pipe 11 is fixedly mounted on the positioning block 121 through the fixing plate 122 , a certain gap is left between the spray pipe 11 and the guide plate 22 to facilitate the flow of the coolant on the guide plate 22 .
[0044] The collecting assembly is arranged in a groove shape, and the opening of the collecting assembly faces upward. The collecting assembly is located below the wire mesh of the diamond wire. The spray water is collected by the collecting assembly, thereby improving the cleanliness of the working environment and facilitating the recycling of the spray water.
[0045] The implementation principle of a spray device for a diamond wire slicer in the embodiment of the present application is as follows: after rotating the spray pipe 111 and adjusting the working angle of the atomizing nozzle 11, the spray pipe 111 is fixedly mounted on the positioning block 121 through the fixing plate 122. After the silicon rod is cut, when the silicon rod is lifted upward away from the wire mesh of the diamond wire, the controller passes the spray water inside the water tank into the spray pipe 111 through the water pipe through the water pump, and sprays it out from the atomizing nozzle 112 on the spray pipe 111. The water mist sprayed by the atomizing nozzle 112 reduces the impact force on the silicon wafer, and further reduces the possibility of the silicon wafer falling due to excessive force. The atomized spray water converges between two adjacent silicon wafers, separates the two silicon wafers close to each other through the tension of the water, separates the impurities attached to the silicon wafer from the silicon wafer, and collects the spray water through the collecting component, so as to facilitate the recycling of the spray water. The spraying water separates the two silicon wafers that are close to each other, thereby increasing the distance between the diamond wire and the two adjacent silicon wafers. Therefore, when the silicon rod is lifted, the possibility of the diamond wire scratching the silicon wafer is reduced.
[0046] Example 2
[0047] The difference between this embodiment and embodiment 1 is that the fixing plate 122 includes a mounting plate and a clamping plate. Two mounting plates are provided, and the two mounting plates are parallel to each other. The clamping plate is provided in an arc shape, and the two ends of the clamping plate correspond to the two mounting plates one by one, and the mounting plate and the clamping plate are integrally formed.
[0048] When installing the spray pipe 111 , the spray pipe 111 is placed on a clamping plate, and the spray pipe 111 is initially clamped and positioned by the clamping plate.
[0049] In order to adjust the working angle of the spray pipe 111, the clamping plate is provided with a plurality of limit grooves 1221, and the clamping plate is provided with scale marks corresponding to the limit grooves 1221. The outer wall of the spray pipe 111 is fixedly mounted with limit teeth 1111, and the limit teeth 1111 and the limit grooves 1221 are plugged and matched.
[0050] The implementation principle of Example 2 is as follows: when installing the spray pipe 111, the spray pipe 111 is placed on the clamping plate, and the staff places the limiting teeth 1111 in the corresponding limiting grooves 1221 with reference to the scale marks, so as to adjust the working angle of the atomizing nozzle 112 on the spray pipe 111. Then, the mounting plate is fixedly mounted on the positioning block 121 to complete the installation of the spray pipe 111.
[0051] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.
Claims
1. A spray device for a diamond wire slicing machine, comprising a frame, a cooling box (21) mounted on the frame, and a guide plate (22) mounted on the cooling box (21), characterized in that: The spray device comprises: A spray assembly (1), the spray assembly (1) comprising a spray portion (11) installed on a side of the guide plate (22) close to the silicon rod and a spray water supply portion installed near the spray portion (11), the spray portion (11) and the spray water supply portion being communicated with each other, and the spray portion (11) being fixedly connected to the guide plate (22) via a connecting portion (12); A collecting assembly, the collecting assembly being located below the wire mesh of the diamond wire; A controller is electrically connected to the spray water supply unit.
2. The spray device for a diamond wire slicer according to claim 1, characterized in that: The spraying part (11) comprises a spraying pipe (111) which is consistent with the length direction of the silicon rod and a plurality of atomizing nozzles (112) installed on the spraying pipe (111), each of the atomizing nozzles (112) is connected to the spraying pipe (111), the spraying pipe (111) is connected to the spraying water supply part, and a certain gap is left between the spraying pipe (111) and the guide plate (22).
3. The spray device for a diamond wire slicer according to claim 2, characterized in that: The spray water supply unit comprises a water storage tank located near the spray part (11), a water pipe with one end connected to the water storage tank, and a water pump installed on the water pipe. The water storage tank is filled with spray water. The other end of the water pipe is connected to the spray pipe (111). The controller is electrically connected to the water pump.
4. The spray device for a diamond wire slicer according to claim 3, characterized in that: The connecting portion (12) comprises a positioning block (121) mounted on a side of the guide plate (22) close to the silicon rod and a fixing plate (122) mounted on the positioning block (121); the inner wall of the fixing plate (122) is fixedly connected to the pipe wall of the spray pipe (111).
5. The spray device for a diamond wire slicer according to claim 4, characterized in that: The connecting portion (12) further comprises a connecting rod (123) mounted on the positioning block (121) and a connecting nut (124) threadedly connected to the connecting rod (123); the connecting rod (123) passes through the fixing plate (122); and the connecting nut (124) is used to press the fixing plate (122) onto the positioning block (121).
6. The spray device for a diamond wire slicer according to claim 4, characterized in that: A circular arc surface is provided on one side of the fixing plate (122) close to the spray pipe (111), and the circular arc surface is in contact with the pipe wall of the spray pipe (111).
7. The spray device for a diamond wire slicer according to claim 4, characterized in that: The fixing plate comprises a mounting plate and a clamping plate, wherein two mounting plates are arranged in parallel, and the two mounting plates and the corresponding clamping plates are fixedly connected at both ends, and the mounting plate is fixedly mounted on the positioning block (121), and the clamping plate is arranged in an arc-shaped plate, and the clamping plate clamps the spray pipe (111).
8. The spray device for a diamond wire slicer according to claim 7, characterized in that: A plurality of limiting grooves (1221) are provided on the side wall of the clamping plate, and limiting teeth (1111) are installed on the pipe wall of the spray pipe (111), and the limiting teeth (1111) and the limiting grooves (1221) are plug-fitted.