Silicon wafer cutting device with protection function

Abstract

The silicon wafer cutting device with the protection function comprises a control unit, a rack, a pay-off unit, a take-up unit, a tensioning roller unit, a cutting roller unit, a plurality of guide roller units, a water cooling unit, a silicon rod mounting unit and a lifting driving unit, and the cutting roller unit comprises three rotating rollers; the cutting device further comprises a protection unit and an indicator lamp, the protection unit comprises two fixing plates and a baffle unit capable of being installed between the two fixing plates, and an induction unit is installed on one fixing plate. According to the silicon wafer cutting device, the protection unit is installed, so that the protection effect is achieved during cutting, broken diamond wires are prevented from flying out, and cooling liquid is also prevented from splashing everywhere. And the induction unit is further installed, so that it can be reminded that cutting operation is started after the baffle unit is installed, and the operation process is more standard.

Description

Technical Field

[0001] The utility model relates to the field of silicon slice cutting devices, and more specifically to a silicon slice cutting device with a protective function. Background Art

[0002] The main function of the silicon wafer cutting device is to cut silicon rods into silicon wafers, which can be used to manufacture solar panels, semiconductor devices, etc. Among them, multi-wire cutting is currently the most widely used silicon wafer cutting device.

[0003] During the silicon wafer cutting process, the diamond wire may break due to long-term use. If there is no proper protective structure, the broken diamond wire may fly out of the cutting area. And the coolant may splash out during the cutting process, and the splashing coolant may pollute the working environment. In addition, during the silicon wafer cutting process, a large amount of debris will be generated. These debris will adhere to the diamond wire and the rotating roller, affecting the cutting quality and efficiency. If the debris on the diamond wire and the rotating roller is not cleaned in time, the debris will accumulate more and more, and the impact on the cutting quality and efficiency will become more and more serious. At present, many silicon wafer cutting devices have difficulties in cleaning debris. Some equipment may need to be shut down for manual cleaning, which not only increases the workload of operators, but also reduces cutting efficiency. Utility Model Content

[0004] The utility model aims to overcome the defects of the prior art and provide a silicon wafer cutting device with a protective function.

[0005] In order to achieve the above-mentioned purpose, the utility model provides the following technical solutions: a silicon wafer cutting device with a protective function, comprising a control unit, a frame, a wire-releasing unit, a wire-reeling unit, a tensioning roller unit, a cutting roller unit, a plurality of guide roller units, a water cooling unit, a silicon rod mounting unit and a lifting drive unit for driving the silicon rod mounting unit to lift and lower, wherein the cutting roller unit comprises three rotating rollers; the cutting device also comprises a protective unit and an indicator light, wherein the protective unit comprises two fixed plates and a baffle unit that can be installed between the two fixed plates, wherein the fixed plates are connected to a first L-shaped limit rod and a second L-shaped limit rod, wherein a sensing unit is installed at one of the fixed plates, wherein the sensing unit comprises a substrate, a mounting plate connected to the substrate, and a proximity switch installed on the mounting plate , an articulated seat connected to the base plate, two rotating arms installed on the articulated seat and an induction roller installed between the two rotating arms, the articulated seat is provided with a rotating shaft, the two ends of the rotating shaft are respectively connected to the two rotating arms, a connecting plate is also connected between the two rotating arms, a spring is connected between the connecting plate and the base plate, one of the rotating arms is fixedly connected to a rotating plate, the end of the rotating plate is connected to a sensing plate that cooperates with a proximity switch, the proximity switch and the indicator light are both connected to the control unit; the baffle unit includes a baffle body, two side plates connected to the baffle body and two limit plates respectively connected to the two side plates, the limit plate has a limit through hole that cooperates with a first L-shaped limit rod and a limit recess that cooperates with a second L-shaped limit rod, and the base plate can be inserted into the limit recess.

[0006] Furthermore, it also includes a cleaning part, which includes a water pipe part, a water inlet pipe connected to the water pipe part, and a plurality of nozzles connected to the water pipe part.

[0007] This can help clean the rotating rollers and diamond wires.

[0008] Furthermore, a protective shell for protecting the sensing unit is installed at one of the limit plates, and the protective shell is made of transparent plastic. A strip plate and a strip slide rail are connected to the limit plate. The protective shell has a strip slide groove that cooperates with the strip slide rail and a limit block that can abut the end of the strip plate. The bottom of the strip plate has a strip rubber block for pressing the protective shell.

[0009] Therefore, the protective shell is used to protect the sensing unit, and the protective shell is easy to replace. The strip rubber block plays a role in pressing the protective shell, so that the position of the protective shell is more stable.

[0010] Furthermore, the baffle body has two handles.

[0011] This makes installation and removal of the baffle unit easier.

[0012] Furthermore, the three rotating rollers are distributed in an inverted isosceles triangle.

[0013] Therefore, the diamond wire is evenly stressed during the cutting process, which improves the cutting accuracy and stability.

[0014] Furthermore, a bearing cooperating with the rotating roller is installed on the frame.

[0015] Thereby ensuring the stable operation of the rotating roller.

[0016] Compared with the prior art, the utility model has the following beneficial effects:

[0017] 1. The silicon wafer cutting device of the present application is equipped with a protection unit, so as to play a protective role during cutting, prevent the broken diamond wire from flying out, and prevent the coolant from splashing everywhere.

[0018] 2. The silicon wafer cutting device of the present application is equipped with a sensing unit, so as to remind the user to ensure that the baffle unit is installed before starting the cutting operation, thereby making the operation process more standardized.

[0019] 3. The silicon wafer cutting device of the present application is equipped with a cleaning unit, which can spray liquid onto the rotating roller and diamond wire for cleaning, thereby ensuring cleanliness and improving cutting quality and efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A first-person perspective diagram of component separation;

[0021] Figure 2 This is an enlarged view of area A;

[0022] Figure 3 A second perspective diagram for separating components;

[0023] Figure 4 This is a first-person perspective diagram of installing a protection unit;

[0024] Figure 5 A schematic diagram showing the installation of the protection unit from the second perspective;

[0025] Figure 6 This is an enlarged view of area B;

[0026] For the convenience of illustration, the control unit, the wire-paying unit, the wire-taking unit, the tensioning roller unit, the multiple guide roller units, the water cooling unit, the lifting drive unit and the indicator lights are not drawn in the figure, and the frame is partially hidden.

[0027] Explanation of the reference numerals: 1. frame; 2. rotating roller; 3. silicon rod mounting unit; 4. fixing plate; 4.1. first L-shaped limiting rod; 4.2. second L-shaped limiting rod; 5. baffle unit; 5.1. baffle body; 5.2. side plate; 5.3. limiting plate; 5.4. limiting through hole; 5.5. limiting recess; 5.6. strip plate; 5.7. strip slide rail; 5.8. strip rubber block; 5.9. handle; 6.1. base plate; 6.2. mounting plate; 6.3. proximity switch; 6.4. hinge seat; 6.5. rotating arm; 6.6. induction roller; 6.7. spring; 6.8. induction plate; 7.1. water pipe; 7.2. water inlet pipe; 7.3. nozzle; 8. protective shell; 8.1. strip slide groove; 8.2. limiting block. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] The utility model provides Figure 1-6A silicon wafer cutting device with a protective function is shown, comprising a control unit, a frame 1, a wire-releasing unit, a wire-reeling unit, a tensioning roller unit, a cutting roller unit, a plurality of guide roller units, a water cooling unit, a silicon rod mounting unit 3 and a lifting drive unit for driving the silicon rod mounting unit 3 to rise and fall, wherein the cutting roller unit comprises three rotating rollers 2; the cutting device also comprises a protective unit and an indicator light, wherein the protective unit comprises two fixed plates 4 and a baffle unit 5 which can be installed between the two fixed plates 4, wherein the fixed plates 4 are connected with a first L-shaped limiting rod 4.1 and a second L-shaped limiting rod 4.2, wherein a sensing unit is installed at one of the fixed plates 4, wherein the sensing unit comprises a base plate 6.1, a mounting plate 6.2 connected to the base plate 6.1, a proximity switch 6.3 installed on the mounting plate 6.2, an articulated seat 6.4 connected to the base plate 6.1, two rotating arms 6.5 installed on the articulated seat 6.4, and a and an induction roller 6.6 installed between the two rotating arms 6.5. The hinge seat 6.4 has a rotating shaft, and the two ends of the rotating shaft are respectively connected to the two rotating arms 6.5. A connecting plate is also connected between the two rotating arms 6.5. A spring 6.7 is connected between the connecting plate and the base plate 6.1. One of the rotating arms 6.5 is fixedly connected to a rotating plate, and the end of the rotating plate is connected to a sensing plate 6.8 that cooperates with the proximity switch 6.3. The proximity switch 6.3 and the indicator light are both connected to the control unit; the baffle unit 5 includes a baffle body 5.1, two side plates 5.2 connected to the baffle body 5.1, and two limit plates 5.3 respectively connected to the two side plates 5.2. The limit plate 5.3 has a limit through hole 5.4 that cooperates with the first L-shaped limit rod 4.1 and a limit recess 5.5 that cooperates with the second L-shaped limit rod 4.2. The base plate 6.1 can be inserted into the limit recess 5.5.

[0030] The silicon wafer cutting device also includes a cleaning part, which includes a water pipe part 7.1, a water inlet pipe 7.2 connected to the water pipe part 7.1, and a plurality of nozzles 7.3 connected to the water pipe part 7.1; a protective shell 8 for protecting the sensing unit is installed at one of the limit plates 5.3, and the protective shell 8 is made of transparent plastic. A strip plate 5.6 and a strip slide rail 5.7 are connected to the limit plate, and the protective shell 8 has a strip slide groove 8.1 that cooperates with the strip slide rail 5.7 and a limit block 8.2 that can abut the end of the strip plate 5.6, and the bottom of the strip plate 5.6 has a strip rubber block 5.8 for pressing the protective shell 8; the baffle body 5.1 has two handle parts 5.9; the three rotating rollers 2 are distributed in an inverted isosceles triangle; the frame 1 is installed with a bearing that cooperates with the rotating roller 2.

[0031] Working principle: The silicon wafer cutting device of the present application is equipped with a protection unit, which plays a protective role during cutting, prevents broken diamond wires from flying out, and prevents coolant from splashing everywhere. It is also equipped with a sensing unit, which can remind you to install the baffle unit before starting the cutting operation, making the operation process more standardized. In addition, a cleaning unit is also installed, which can spray liquid on the rotating roller and diamond wire for cleaning, thereby ensuring cleanliness and improving cutting quality and efficiency.

[0032] Specifically, the baffle unit is placed between the two fixed plates to ensure that the limiting through hole on the limiting plate cooperates with the first L-shaped limiting rod, and the limiting recess cooperates with the second L-shaped limiting rod. When the baffle unit moves, the sensing roller is pressed down, indicating that the baffle unit is installed properly. At this time, the sensing plate will move relative to the proximity switch, thereby triggering the signal change of the proximity switch, so that the control unit controls the indicator light to light up, thereby starting the cutting operation, so that the worker's operation is more standardized.

[0033] Although the present invention has been illustrated and described with respect to preferred embodiments, it should be understood by those skilled in the art that various changes and modifications may be made to the present invention without departing from the scope of the present invention as defined by the claims.

Claims

1. A silicon wafer cutting device with a protective function, characterized in that: The invention comprises a control unit, a frame, a wire-releasing unit, a wire-retrieving unit, a tensioning roller unit, a cutting roller unit, a plurality of guide roller units, a water cooling unit, a silicon rod mounting unit and a lifting drive unit for driving the silicon rod mounting unit to rise and fall, wherein the cutting roller unit comprises three rotating rollers; the cutting device further comprises a protection unit and an indicator light, wherein the protection unit comprises two fixed plates and a baffle unit which can be installed between the two fixed plates, wherein the fixed plates are connected with a first L-shaped limiting rod and a second L-shaped limiting rod, wherein a sensing unit is installed at one of the fixed plates, wherein the sensing unit comprises a base plate, a mounting plate connected with the base plate, a proximity switch installed with the mounting plate, an articulated seat connected with the base plate, and two baffle units installed with the articulated seat. A rotating arm and an induction roller installed between the two rotating arms, the hinge seat is provided with a rotating shaft, the two ends of the rotating shaft are respectively connected to the two rotating arms, a connecting plate is also connected between the two rotating arms, a spring is connected between the connecting plate and the base plate, one of the rotating arms is fixedly connected to a rotating plate, the end of the rotating plate is connected to a sensing plate that cooperates with a proximity switch, the proximity switch and the indicator light are both connected to the control unit; the baffle unit includes a baffle body, two side plates connected to the baffle body and two limit plates respectively connected to the two side plates, the limit plate has a limit through hole that cooperates with a first L-shaped limit rod and a limit recess that cooperates with a second L-shaped limit rod, and the base plate can be inserted into the limit recess.

2. The silicon wafer cutting device with protection function according to claim 1, characterized in that: The utility model also comprises a cleaning part, which comprises a water pipe part, a water inlet pipe connected to the water pipe part, and a plurality of nozzles connected to the water pipe part.

3. The silicon wafer cutting device with protection function according to claim 1, characterized in that: A protective shell for protecting the sensing unit is installed at one of the limit plates, and the protective shell is made of transparent plastic. A strip plate and a strip slide rail are connected to the limit plate. The protective shell has a strip slide groove that cooperates with the strip slide rail and a limit block that can abut the end of the strip plate. The bottom of the strip plate has a strip rubber block for pressing the protective shell.

4. The silicon wafer cutting device with protection function according to claim 1, characterized in that: The baffle body is provided with two handles.

5. The silicon wafer cutting device with protection function according to claim 1, characterized in that: The three rotating rollers are distributed in the shape of an inverted isosceles triangle.

6. The silicon wafer cutting device with protection function according to claim 1, characterized in that: The frame is provided with a bearing matched with the rotating roller.

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