Evaporation mechanism and evaporation device

Abstract

The utility model discloses an evaporation mechanism and an evaporation device, and belongs to the technical field of evaporation equipment. The winding mechanism is used for conveying a plated object and comprises a main roller, and the main roller is arranged corresponding to the evaporation source; wherein at least one first roller is further arranged on the side face of the main roller, the main roller, the first rollers and a plated object are jointly limited to be an evaporation area, and target material steam generated by the evaporation source can act on the plated object in the evaporation area. According to the evaporation mechanism, the evaporation area limited by the evaporation area is generated based on the first roller, the plated object, the main roller and the evaporation source, the material utilization rate is guaranteed, and meanwhile the winding effect can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of vacuum evaporation equipment, in particular to an evaporation mechanism and an evaporation device. Background Art

[0002] In the evaporation coating operation, the evaporated metal vapor will not only adhere to the target substrate, but also adhere to the structure around the evaporation source. Therefore, in order to protect the mechanism and components of the device, a baffle is set in the space around the evaporation source for shielding and protection in the prior art.

[0003] Setting a baffle will consume part of the target material vapor generated by evaporation, thereby reducing the utilization rate of the raw material.

[0004] In response to the above problems, in the prior art, Patent Document 1 discloses a vapor deposition mechanism, comprising: a vapor deposition source; and a winding assembly for transporting an object to be plated, wherein the winding assembly is located on the evaporation side of the vapor deposition source and is spaced apart from the vapor deposition source; wherein the winding assembly comprises a main roller and an auxiliary roller, wherein the main roller, the auxiliary roller and the vapor deposition source jointly define a vapor deposition area, and the vapor deposition source can act on the object to be plated that is in contact with the main roller and the auxiliary roller in the vapor deposition area.

[0005] The above-mentioned evaporation mechanism structure uses two groups of rollers to limit the evaporation area, which will cause the two groups of rollers to be set closely, and the auxiliary roller needs to be close to the evaporation source, which will form a larger wrap angle, resulting in the tension being difficult to control during the winding process and prone to wrinkling.

[0006] Therefore, further improvement is needed.

[0007] Patent document 1: CN220685227U. Utility Model Content

[0008] The utility model aims to solve one of the technical problems in the related art at least to a certain extent. To this end, one purpose of the utility model is to provide a vapor deposition mechanism, which can improve the winding effect while ensuring the material utilization rate, based on the vapor deposition area defined by the first roller, the object to be plated, the main roller and the evaporation source to generate the evaporation area.

[0009] Another object of the present application is to provide a vapor deposition device comprising the above-mentioned components.

[0010] The technical solution of the utility model is as follows:

[0011] A vapor deposition mechanism, comprising:

[0012] Evaporation source;

[0013] and a winding mechanism for conveying the plated object, which includes a main roller, which is arranged corresponding to the evaporation source;

[0014] Among them, at least one first roller is also arranged on the side of the main roller, and the main roller, the first roller and the object to be plated are collectively defined as a vapor deposition area, and the target material vapor generated by the evaporation source can act on the object to be plated in the vapor deposition area.

[0015] Based on the above technical solution, the evaporation area formed by the roller structure and the object to be plated can cover the evaporation area generated by the evaporation source. Therefore, the baffle is not needed. Since part of the object to be plated in the evaporation area is exposed in the evaporation area, the target material is fully utilized, and the interval between the rollers is larger, which can reduce the size of the wrap angle and avoid affecting the winding effect due to excessive wrap angle.

[0016] Furthermore, the area defined by the two end points of the evaporation source along the radial section of the roller body, the extended line of the tangent of the outer surface of the main roller and the side of the main roller away from the evaporation source is set as the layout area, and the second roller is arranged in the layout area corresponding to the first roller for conducting the plated object.

[0017] Based on the above technical solution, a second roller is arranged in the layout area, which can reduce the influence of the target material vapor on the second roller, and the position can be flexibly set and the wrap angle can be adjusted.

[0018] Furthermore, a distance L1 between a line connecting the center points of the main roller and the first roller and an intersection point of the roller body is ≥30 mm.

[0019] Based on the above technical solution, there is a sufficient gap between the plated objects passing through the first roller and the second roller, and the wrap angle between the first roller and the second roller can also be reduced.

[0020] Furthermore, a distance L2 between a line connecting the center points of the second roller and the main roller and an intersection point of the roller body is ≥30 mm.

[0021] Based on the above technical solution, the wrap angles of the main roller and the second roller can be reduced.

[0022] Furthermore, a vertical distance L3 between the evaporation source and the lowest point of the first roller is ≥30 mm.

[0023] Based on the above technical solution, a certain gap is retained, which can appropriately keep away from the evaporation zone to avoid scalding the plated object, and is also conducive to the spreading of target material vapor; since there is a larger distance between the first roller and the main roller, the longitudinal distance is relatively larger, so the vertical distance from the evaporation source can be relatively smaller, and the layout space is more compact.

[0024] Furthermore, the first roller is arranged on a side of the second roller away from the main roller, so that a longitudinal distance L4 between center points of the first roller and the second roller is ≥5 mm.

[0025] Based on the above technical solution, the longitudinal distance between the first roller and the second roller is controlled, so as to control the size of the wrap angle and avoid excessively large wrap angle caused by too small a distance.

[0026] Further, the main roller can be configured as a cooling roller;

[0027] And / or, the first roller can also be provided as an auxiliary cooling roller.

[0028] Based on the above technical solution, it can be ensured that the film surface in the evaporation area is within a relatively normal temperature range and is not prone to film breakage. At the same time, the deposited target material can be cooled and crystallized on the plated object.

[0029] Furthermore, two groups of first rollers are arranged on both sides of the main roller.

[0030] Based on the above technical solution, two groups of first rollers are provided, so that the evaporation area can be limited to a relatively smaller range, and the utilization rate of the target material is higher.

[0031] The present application also discloses a vapor deposition device based on the above components. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0033] Figure 1 A structural schematic diagram of a vapor deposition mechanism;

[0034] Figure 2 for Figure 1 Schematic diagram of the arrangement of the second roller slightly offset toward the vertical center line of the main roller;

[0035] Figure 3 It is a schematic diagram of the structure of the evaporation mechanism with two groups of first rollers.

[0036] In the figure:

[0037] 10-evaporation source; 11-projection line; 100-layout area;

[0038] 20 - object to be plated; 21 - main roller; 22 - first roller; 23 - second roller; 24 - third roller. DETAILED DESCRIPTION

[0039] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0040] Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0041] This is to avoid the problem in the prior art that other rollers on the side of the main roller are in close contact, causing the wrap angle to be too large, thus affecting the winding.

[0042] Reference Figure 1-2 In some embodiments of the present application, a vapor deposition mechanism is disclosed, comprising:

[0043] An evaporation source 10 generates an evaporation zone that is substantially fan-shaped; the evaporation source 10 may be an evaporation boat or a crucible;

[0044] and, a winding mechanism for conveying the plated object 20, comprising a main roller 21, the main roller 21 being arranged corresponding to the evaporation source 10; Figure 1 It is shown that the evaporation source 10 is symmetrically arranged about the vertical center line of the main roller 21. Of course, the evaporation source can be arranged appropriately offset from the center line;

[0045] Among them, at least one first roller 22 is also arranged on the side of the main roller 21, and the main roller 21, the first roller 22 and the object 20 to be plated are collectively defined as a vapor deposition area, and the target material vapor generated by the evaporation source can act on the object 20 to be plated in the vapor deposition area; specifically, the object to be plated in the vapor deposition area includes the object to be plated on the drum part, and the object to be plated in a suspended state, that is, the above-mentioned actable object to be plated includes the object to be plated attached to the first roller 22 and the main roller 21, and also includes the part of the object to be plated between the first roller 22 and the main roller 21 and output from the main roller 21. In order to make the object to be plated output from the main roller 21 in a basically horizontal suspended state, a third roller 24 can also be arranged to keep the object to be plated in the vapor deposition area horizontal.

[0046] In some embodiments of the present application, the object to be plated may be a composite current collector.

[0047] Since the above-mentioned evaporation area can cover the evaporation area generated by the evaporation source 10, a baffle is not needed. At the same time, since part of the plated object in the evaporation area is exposed in the evaporation area, the target material is fully utilized, and the interval between the rollers is larger, which can reduce the size of the wrap angle and avoid affecting the winding effect due to excessive wrap angle.

[0048] In order to form the above-mentioned evaporation area, the area defined by the two end points of the evaporation source 10 along the radial cross-section of the roller body, the extended line of the tangent of the main roller 21, and the side of the main roller 21 away from the evaporation source 10 is set as the layout area 100, and the second roller 23 is arranged in the layout area 100 corresponding to the first roller 22 for the conduction of the plated object 20; due to the shielding of the main roller 21 in this area, the second roller 23 will not be affected by the target material vapor, and the second roller 23 has a larger layout space, and the position can be flexibly set and the wrap angle can be adjusted.

[0049] At this time, the distance L1 between the line O1O2 connecting the center points of the main roller 21 and the first roller 22 and the intersection of the roller bodies is ≥30 mm, so that there is enough gap between the plated objects passing through the first roller 22 and the second roller, and the wrap angle of the first roller 22 and the second roller 23 can also be reduced.

[0050] The distance L2 between the line O1O3 connecting the center points of the second roller 23 and the main roller 21 and the intersection point of the roller body is ≥30 mm, so that the wrap angle between the main roller 21 and the second roller 23 can be reduced.

[0051] The vertical distance L3 between the lowest point of the evaporation source 10 and the first roller 22 is ≥30mm. Keeping a certain gap can, on the one hand, keep away from the evaporation zone appropriately to avoid scalding the plated object 20, and also facilitate the spreading of the target material vapor; because there is a larger distance between the first roller and the main roller 21 (the longitudinal distance is relatively larger), the vertical distance from the evaporation source 10 can be relatively smaller, and the layout space is more compact.

[0052] The first roller 22 is preferably arranged on the outside of the tangent line of the main roller 21 and the two end points of the radial cross section of the roller body of the evaporation source 10 (the side away from the main roller 21), so that the longitudinal spacing L4 between the center points of the first roller 22 and the second roller 23 is ≥5mm; controlling the longitudinal spacing between the two roller bodies can control the size of the wrap angle to avoid excessive wrap angle caused by too small a spacing.

[0053] In addition, considering the need to cool the film surface, the main roller 21 can be set as a cooling roller; at the same time, considering that the evaporation source 10 is close to the first roller 22, the first roller 22 can also be set as an auxiliary cooling roller. In this way, the film surface is ensured to be within a relatively normal temperature range and is not prone to film breakage. At the same time, the deposited target material can be cooled and crystallized on the plated object.

[0054] In some embodiments of the present application, two sets of first rollers 22 are provided. Figure 3 , the first roller 22 is respectively arranged at the feeding and discharging ends of the main roller 1; at this time, the evaporation area includes the area defined by the main roller 21 and the first rollers 22 on both sides, and the object 20 to be plated between the main roller 21 and the first roller 22 and the evaporation source 10, and the objects to be plated include the first roller 22, the objects to be plated attached to the main roller 21, and also include the objects to be plated between the first roller 22 and the main roller 21.

[0055] By providing two sets of first rollers, the evaporation area can be limited to a relatively smaller range, thereby achieving a higher utilization rate of the target material.

[0056] The present application also discloses a vapor deposition device based on the above components.

[0057] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or conventionally expressed in the prior art, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0058] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists, A and B exist at the same time, and B exists. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0059] The term "multiple" as used in the present application refers to more than two (including two). Similarly, the term "multiple groups" refers to more than two groups (including two groups), and the term "multiple sheets" refers to more than two sheets (including two sheets).

[0060] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A vapor deposition mechanism, comprising: Evaporation source; and a winding mechanism for conveying the plated object, which includes a main roller, which is arranged corresponding to the evaporation source; The invention is characterized in that at least one first roller is arranged on the side of the main roller, and the main roller, the first roller and the object to be plated are jointly defined as a vapor deposition area, and the target material vapor generated by the evaporation source can act on the object to be plated in the vapor deposition area.

2. The vapor deposition mechanism according to claim 1, characterized in that: Two groups of first rollers are arranged on both sides of the main roller.

3. The vapor deposition mechanism according to claim 1 or 2, characterized in that: The area defined by the two end points of the evaporation source along the radial section of the roller body, the extended line of the tangent of the outer surface of the main roller and the side of the main roller away from the evaporation source is set as the layout area. The second roller is arranged in the layout area corresponding to the first roller for conducting the plated object.

4. The vapor deposition mechanism according to claim 3, characterized in that: The distance L1 between the line connecting the center points of the main roller and the first roller and the intersection point of the roller body is ≥30mm.

5. The vapor deposition mechanism according to claim 3, characterized in that: The distance L2 between the line connecting the center points of the second roller and the main roller and the intersection point of the roller body is ≥30mm.

6. The vapor deposition mechanism according to claim 3, characterized in that: The vertical distance L3 between the evaporation source and the lowest point of the first roller is ≥30 mm.

7. The vapor deposition mechanism according to claim 3, characterized in that: The first roller is arranged on a side of the second roller away from the main roller, so that the longitudinal distance L4 between the center points of the first roller and the second roller is ≥5 mm.

8. The evaporation mechanism according to any one of claims 4 to 7, characterized in that: The main roll is configured as a cooling roll.

9. The vapor deposition mechanism according to claim 8, characterized in that: The first roll is provided as a cooling roll.

10. A vapor deposition device, characterized in that: It comprises the evaporation mechanism as claimed in claim 9.

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