Wafer cover plate pressing ring, metal evaporation slide glass disc and metal evaporation machine table

Abstract

The utility model provides a wafer cover plate compression ring, a metal evaporation slide tray and a metal evaporation machine table. The wafer cover plate compression ring structure comprises a frame; the slide way is located in the frame, and a limiting piece is arranged on the inner wall of the slide way; the pressing ring can move along the slide way, the first end of the pressing ring is arranged in the slide way, and the second end of the pressing ring can extend out of the frame along the slide way; the self-locking device is located in the sliding way and connected with the first end of the pressing ring, the self-locking device can slide along the sliding way so as to drive the pressing ring to move along the sliding way, and the self-locking device can be matched with the limiting piece so as to fix the extending position of the pressing ring. According to the technical scheme, the original screw fixing mode of the compression ring is canceled, the movement mode of the compression ring is changed into the telescopic mode, and the fixing mode is changed into the self-locking mode, so that the hidden crack of the wafer caused by vibration of the wafer due to screw loosening and incapability of fixing the wafer cover plate caused by rotation of the compression ring is avoided.

Description

Technical Field

[0001] The utility model relates to the field of semiconductors, in particular to a wafer cover plate pressure ring, a metal vapor deposition carrier plate and a metal vapor deposition machine. Background Art

[0002] Wafer back metal evaporation refers to a process in which a coating material (such as titanium (Ti), nickel (Ni), silver (Ag)) is evaporated and vaporized using an evaporator in a certain heating evaporation method under vacuum conditions. After vaporization, the particles fly to the back of the wafer and condense into a film on the back of the wafer. The metal evaporation process is an earlier and more widely used vapor deposition technology. Compared with the sputtering process, the metal evaporation process has the advantages of simple film formation method, high film purity and density, and unique film structure and performance.

[0003] See also Figure 1 , which is a schematic diagram of the structure of a metal vapor deposition dome in the prior art. Figure 1 As shown, the metal evaporation wafer carrier includes: a body 11, a wafer slot 12, a wafer ring 13, a cover plate 14, and a pressure ring 15. The wafer slot 12 is located on the surface of the body 11, the wafer ring 13 is arranged on the inner wall of the body 11, and the cover plate 14 is arranged on the surface of the wafer ring 13. One end of the pressure ring 15 is rotatably fixed to the surface of the body 11 by a screw 150, and the other end can be rotated and pressed onto the surface of the cover plate 14.

[0004] The process flow of metal evaporation is as follows: place the wafer ring 13 in the wafer slot 12 to be loaded; use a wiped vacuum suction pen to suck the front of the wafer, and after confirming that the suction pen sucks the wafer, slowly take the wafer out of the wafer box (Cassette) vertically; slowly and horizontally buckle the wafer with the back side facing down into the wafer slot 12 where the wafer ring 13 is placed, and confirm that the wafer lies completely flat in the wafer ring 13 before releasing the suction pen; slowly add the cover plate 14 horizontally, and ensure that each machine uses a fixed matching cover plate 14, wafer carrier and wafer ring 13; fix the cover plate 14 with the pressure ring 15, hold the empty area of ​​the Dome with the left hand, gently pull up the pressure ring 15 with the right hand, and rotate it to move it above the cover plate, then gently put it down, and release it after it touches the cover plate 13. However, during the rotation of the pressing ring 15, the screw 150 may be driven to rotate, causing the screw 150 to loosen, thereby causing the cover plate 14 to be unable to be pressed. In addition, during the rotation of the pressing ring 15, the cover plate may be scratched to increase particles to contaminate the wafer.

[0005] Therefore, how to improve and prevent the rotating pressure ring from loosening the screws and increasing the particle contamination of the wafer is a problem that needs to be solved at present. Summary of the invention

[0006] The technical problem to be solved by the utility model is how to improve and prevent the screws from loosening due to rotating the pressure ring and avoid increasing particulate matter from contaminating the wafer, and provide a wafer cover plate pressure ring, a metal vapor deposition carrier plate and a metal vapor deposition machine.

[0007] In order to solve the above problems, the utility model provides a wafer cover plate pressure ring structure, including: a frame; a slide, located in the frame, and a limiting member is provided on the inner wall of the slide; a pressure ring, the pressure ring can move along the slide, the first end of the pressure ring is provided in the slide, and the second end of the pressure ring can extend out of the frame along the slide; a self-locking device, located in the slide and connected to the first end of the pressure ring, the self-locking device can slide along the slide to drive the pressure ring to move along the slide, and the self-locking device can cooperate with the limiting member to fix the extended position of the pressure ring.

[0008] In order to solve the above problems, the utility model provides a metal vapor deposition carrier plate, comprising: a main body; a wafer groove, located on the surface of the main body, for accommodating the wafer; a wafer ring, located on the inner side of the wafer groove, for supporting the wafer; a wafer cover, arranged on the surface of the wafer ring, for protecting the wafer; a wafer cover pressure ring structure, which adopts the wafer cover pressure ring structure described in the utility model.

[0009] In order to solve the above problems, the utility model provides a metal vapor deposition machine, including the metal vapor deposition carrier plate of the utility model.

[0010] The above technical solution, by eliminating the original screw fixing method of the pressure ring, changes the movement mode of the pressure ring to a telescopic mode, and the fixing mode to a self-locking mode, avoids the screws loosening due to the rotation of the pressure ring, which makes it impossible to fix the wafer cover, and then causes the wafer to vibrate and cause wafer cracks. In addition, the above technical solution can also reduce the generation of particles caused by the pressure ring scratching the cover; the self-locking device is easy to operate, can quickly fix the pressure ring, and effectively reduce the operation time.

[0011] It should be understood that the above general description and the detailed description below are only exemplary and explanatory and cannot limit the present invention. The techniques, methods and devices known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the techniques, methods and devices should be considered as part of the authorization specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions in the specific implementation of the utility model, the following is a brief introduction to the drawings required for the description of the specific implementation. Obviously, the drawings described below are only some specific implementations of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0013] Figure 1 It is a schematic diagram of the structure of a metal vapor deposition carrier plate in the prior art.

[0014] Figure 2 It is a structural schematic diagram of an embodiment of the wafer cover plate pressure ring structure of the utility model.

[0015] Figure 3 It is a structural schematic diagram of the locked state of an embodiment of the wafer cover plate pressure ring structure of the utility model.

[0016] Figure 4 It is a structural schematic diagram of the unlocked state of an embodiment of the wafer cover plate pressure ring structure of the utility model.

[0017] Figure 5 It is a structural schematic diagram of an embodiment of the metal vapor deposition carrier plate of the utility model. DETAILED DESCRIPTION

[0018] The technical scheme in the embodiment of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.

[0019] In order to prevent the screws from loosening due to rotating the pressure ring and to avoid increasing particulate matter contaminating the wafer, the utility model provides a wafer cover plate pressure ring structure, which can effectively reduce the operation time and prevent the pressure ring from scratching the cover plate to produce particulate matter, and effectively prevent the wafer from hitting the wafer receiving ring due to loosening of the screws due to rotation, causing hidden cracks in the wafer.

[0020] Please also read Figure 2 to Figure 4 , which is a structural schematic diagram of an embodiment of the wafer cover plate pressure ring structure of the utility model; Figure 3 It is a structural schematic diagram of a locked state of an embodiment of the wafer cover plate pressure ring structure of the utility model; Figure 4 This is a schematic diagram of the unlocked state of an embodiment of the wafer cover plate pressure ring structure of the utility model. Figure 2As shown, the wafer cover plate pressure ring structure includes: a frame 21, a slide 22, a pressure ring 23, and a self-locking device 24. The slide 22 is located in the frame 21, and a limiter 220 is provided on the inner wall of the slide 22. The pressure ring 23 can move along the direction of the slide 22, the first end 231 of the pressure ring 23 is provided in the slide 22, and the second end 232 of the pressure ring 23 can extend out of the frame 21 along the slide 22. The self-locking device 24 is located in the slide 22 and is connected to the first end 231 of the pressure ring 23. The self-locking device 24 can slide along the slide 22 to drive the pressure ring 23 to move along the slide 22, and the self-locking device 24 can cooperate with the limiter 220 to fix the extended position of the pressure ring 23.

[0021] The above technical solution, by eliminating the original screw fixing method of the pressure ring, changes the movement mode of the pressure ring to a telescopic mode, and the fixing mode to a self-locking mode, avoids the screws loosening due to the rotation of the pressure ring, which makes it impossible to fix the wafer cover, and then causes the wafer to vibrate and cause wafer cracks. In addition, the above technical solution can also reduce the generation of particles caused by the pressure ring scratching the cover; the self-locking device is easy to operate, can quickly fix the pressure ring, and effectively reduce the operation time.

[0022] In some embodiments, the self-locking device 24 further includes: a locking member 241, an opening and closing member 242, and a connecting member 243. The locking member 241 is used to control the locking or unlocking of the self-locking device 24. The opening and closing member 242 is connected to the locking member 241, and the opening and closing member 242 can expand toward the inner wall of the slide 22 to engage the limiting member 220 when the locking member 241 controls the locking of the self-locking device 24, and retract from the inner wall of the slide 22 when the locking member 241 controls the unlocking of the self-locking device 24. The connecting member 243 is connected to the opening and closing member 242 and the first end 231 of the pressure ring 23. The connecting member 243 can fix the extended position of the pressure ring 23 when the opening and closing member 242 is engaged with the limiting member 220, and can drive the pressure ring 23 to move along the slide 22 when the opening and closing member 242 retracts from the inner wall of the slide 22 and the self-locking device 24 slides along the slide 22.

[0023] like Figure 3 As shown, in some embodiments, the locking member 241 can be pulled out in a direction away from the connecting member 243, and drive the opening and closing member 242 to expand toward the inner wall of the slideway 22 to control the locking of the self-locking device 24. When the locking member 241 is away from the connecting member 243, the opening and closing member 242 simultaneously expands toward the inner wall of the slideway 22 and clamps the limiting member 220 on the inner wall of the slideway 22, so that the movement of the pressing ring 23 is blocked, thereby fixing the extended position of the pressing ring 23.

[0024] like Figure 4 As shown, in some embodiments, the locking member 241 can be pushed back in a direction close to the connecting member 243, and drive the opening and closing member 242 to retract from the inner wall of the slideway 22, so as to control the unlocking of the self-locking device 24. When the locking member 241 approaches the connecting member 243, the expanded opening and closing member 242 retracts from the inner wall of the slideway 22, and the lock is released.

[0025] In some embodiments, the second end 232 of the pressing ring 23 can be retracted into the frame 21 along the slide 22 to protect the pressing ring 23 and save space. In other embodiments, when the pressing ring 23 is in a fully retracted state, the second end 232 of the pressing ring 23 can also be located outside the frame 21, and the pressing ring 23 does not have to be completely located in the frame.

[0026] In some embodiments, an elastic member (not shown) may also be provided on one side of the frame 21 near the first end 231 of the pressing ring 23, and the elastic member is in a stretched state when the second end 232 of the pressing ring 23 extends out of the frame 21. The elastic member can automatically pull the pressing ring 23 back into the frame 21 by elastic force after the self-locking device 24 is unlocked. In this embodiment, the elastic member is a spring.

[0027] In some embodiments, the stopper 220 is a tooth-shaped structure. In this embodiment, the tooth-shaped structure is in the shape of a regular triangle. In other embodiments, the tooth-shaped structure may also be in the shape of a regular arc or an irregular shape. The stopper 220 and the slideway 22 may be an integrally formed structure.

[0028] In some embodiments, a protrusion (not shown) that cooperates with the limit member 220 can also be set on the surface of the telescopic rod close to the inner wall of the slide 22. When the telescopic rod expands toward the inner wall of the slide 22, the protrusion and the limit member 220 are interlocked with each other to form a clamping structure, further improving the stability of the clamping between the telescopic rod and the limit member 220.

[0029] In some embodiments, the telescopic rod and the limit member 220 can be made of a material with greater surface friction; or the surface of the telescopic rod and the limit member 220 can be set to a frosted surface with greater friction to increase the friction between the telescopic rod and the limit member 220, thereby further improving the locking stability of the self-locking device.

[0030] In some embodiments, the frame 21 is a metal frame. In other embodiments, the frame 21 may also be a ceramic frame.

[0031] Based on the same inventive concept, an embodiment of the utility model further provides a metal vapor deposition carrier plate.

[0032] See also Figure 5 , which is a schematic diagram of the structure of an embodiment of the metal vapor deposition carrier plate of the utility model. Figure 5 As shown, the metal evaporation wafer carrier includes: a body 31, a wafer slot 32, a wafer receiving ring 33, a wafer cover plate 34, and a wafer cover plate pressure ring structure 35. The wafer slot 32 is located on the surface of the body 31 and is used to accommodate the wafer. The wafer receiving ring 33 is located inside the wafer slot 32 and is used to support the wafer. The wafer cover plate 34 is arranged on the surface of the wafer receiving ring 33 and is used to protect the wafer. The wafer cover plate pressure ring structure 35 adopts the present invention. Figure 2 to Figure 4 The wafer cover plate pressure ring structure is shown.

[0033] The frame 21 of the wafer cover plate pressure ring structure is arranged on the surface of the main body 31, and the second end 232 of the pressure ring 23 of the wafer cover plate pressure ring structure extends out of the frame 21 toward the wafer cover plate 34 to fix the wafer cover plate 34, and the self-locking device 24 of the wafer cover plate pressure ring structure can cooperate with the limit member 220 to fix the extended position of the pressure ring 23.

[0034] In some embodiments, the wafer receiving ring 33 is fixed to the inner side of the wafer slot 32 via a threaded connector.

[0035] In some embodiments, the body 31 is hemispherical, the thickness of the body 31 is set to 3 mm, and the diameter of the body 31 is set to 580 mm.

[0036] When the metal vapor deposition carrier is in use, first, the wafer receiving ring 33 is placed inside the wafer groove 32 and fixed by the threaded connector, the wafer is taken out with a vacuum suction pen, slowly and horizontally placed in the wafer groove 32, and covered with the wafer cover 34; then, the second end 232 of the pressing ring 23 of the wafer cover pressing ring structure is pulled out toward the wafer cover 34, so that the second end 232 of the pressing ring 23 extends out of the frame 21 to a specified position and presses the wafer cover 34, at this time, the locking member 241 of the self-locking device 24 is pushed in a direction away from the connecting member 243 of the self-locking device 24, so that the opening and closing member 242 of the self-locking device 24 expands toward the inner wall of the slide 22, and clamps the limit member 220 on the inner wall of the slide 22, so that the movement of the pressing ring 23 is blocked, and then the extended position of the pressing ring 23 is fixed, so that the wafer cover is fixed by the wafer cover pressing ring structure.

[0037] When the wafer needs to be removed after the metal evaporation process is completed, the locking member 241 is pushed toward the connecting member 243 to retract the opening and closing member 242 away from the inner wall of the slide 22, unlocking the pressure ring 23, and the second end 232 of the pressure ring 23 is pushed toward the first end 231 of the pressure ring 23 to return the pressure ring 23 to the frame, thereby releasing the wafer cover plate pressure ring structure from fixing the wafer cover plate.

[0038] The above technical solution, by eliminating the original screw fixing method of the pressure ring, changes the movement mode of the pressure ring to a telescopic mode, and the fixing mode to a self-locking mode, avoids the screws loosening due to the rotation of the pressure ring, which makes it impossible to fix the wafer cover, and then causes the wafer to vibrate and cause wafer cracks. In addition, the above technical solution can also reduce the generation of particles caused by the pressure ring scratching the cover; the self-locking device is easy to operate, can quickly fix the pressure ring, and effectively reduce the operation time.

[0039] Based on the same inventive concept, an embodiment of the present utility model further provides a metal vapor deposition machine. The metal vapor deposition machine comprises: a metal vapor deposition wafer carrier plate; the metal vapor deposition wafer carrier plate adopts Figure 5 The metal vapor deposited wafer tray shown.

[0040] In this embodiment, the metal evaporation machine can hold three metal evaporation wafer carriers, and each metal evaporation wafer carrier can hold up to 8 6-inch wafers. During the process, if a metal evaporation wafer carrier is not fully loaded, a wafer that has been tested by process control is used as a dummy wafer to fill the vacancy.

[0041] The above technical solution, by eliminating the original screw fixing method of the pressure ring, changes the movement mode of the pressure ring to a telescopic mode, and the fixing mode to a self-locking mode, avoids the screws loosening due to the rotation of the pressure ring, which makes it impossible to fix the wafer cover, and then causes the wafer to vibrate and cause wafer cracks. In addition, the above technical solution can also reduce the generation of particles caused by the pressure ring scratching the cover; the self-locking device is easy to operate, can quickly fix the pressure ring, and effectively reduce the operation time.

[0042] It should be noted that references in the specification to "an embodiment", "an embodiment", "an exemplary embodiment", "some embodiments", etc. indicate that the described embodiment may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases do not necessarily refer to the same embodiment. In addition, when a particular feature, structure, or characteristic is described in conjunction with an embodiment, whether or not explicitly described, it is within the knowledge of a technician in the relevant art to implement such feature, structure, or characteristic in conjunction with other embodiments.

[0043] Typically, a term can be understood at least in part from usage in context. For example, the term "one or more" as used herein depends at least in part on the context and can be used to describe any feature, structure or characteristic in a singular sense, or can be used to describe a combination of features, structures or features in a plural sense. Similarly, terms such as "one", "a" or "the" can also be understood to express singular usage or to express plural usage, depending at least in part on the context. In addition, the term "based on" can be understood to not necessarily be intended to express a set of exclusive factors, but can alternatively, also at least in part depending on the context, allow for the presence of other factors that are not necessarily explicitly described. It should also be noted in this specification that "connected / coupled" refers not only to the direct coupling of one component to another component, but also to the indirect coupling of one component to another component through an intermediate component.

[0044] It should be noted that the terms "including" and "having" and their variations involved in the documents of the present utility model are intended to cover non-exclusive inclusions. The terms "first", "second", etc. are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. Unless the context clearly indicates otherwise, it should be understood that the data used in this way can be interchanged under appropriate circumstances. In addition, the embodiments of the present utility model and the features in the embodiments can be combined with each other unless there is a conflict. In addition, in the above description, the description of well-known components and technologies is omitted to avoid unnecessary confusion of the concepts of the present utility model. In the above-mentioned embodiments, each embodiment focuses on the differences from other embodiments, and the same / similar parts between the embodiments can be referred to each other.

[0045] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A wafer cover plate pressure ring structure, characterized in that: include: frame; A slideway is located in the frame, and a limit piece is provided on the inner wall of the slideway; A pressure ring, the pressure ring can move along the slide, a first end of the pressure ring is arranged in the slide, and a second end of the pressure ring can extend out of the frame along the slide; A self-locking device is located in the slide and connected to the first end of the pressure ring. The self-locking device can slide along the slide to drive the pressure ring to move along the slide, and the self-locking device can cooperate with the limiting member to fix the extended position of the pressure ring.

2. The wafer cover plate pressure ring structure according to claim 1, characterized in that: The self-locking device further comprises: A locking member, used to control the locking or unlocking of the self-locking device; an opening and closing member connected to the locking member, wherein the opening and closing member can expand toward the inner wall of the slideway to engage the limiting member when the locking member controls the locking of the self-locking device, and can retract from the inner wall of the slideway when the locking member controls the unlocking of the self-locking device; A connecting member is connected to the opening and closing member and the first end of the pressure ring. The connecting member can fix the extended position of the pressure ring when the opening and closing member is engaged with the limiting member, and can drive the pressure ring to move along the slide when the opening and closing member retracts from the inner wall of the slide and the self-locking device slides along the slide.

3. The wafer cover plate pressure ring structure according to claim 2, characterized in that: The locking member can be pulled out in a direction away from the connecting member, and drive the opening and closing member to expand toward the inner wall of the slideway, so as to control the locking of the self-locking device.

4. The wafer cover plate pressure ring structure according to claim 2, characterized in that: The locking member can be pushed back in a direction close to the connecting member, and drive the opening and closing member to retract from the inner wall of the slideway, so as to control the unlocking of the self-locking device.

5. The wafer cover plate pressure ring structure according to claim 1, characterized in that: The limiting member is a tooth-shaped structure.

6. The wafer cover plate pressure ring structure according to claim 1, characterized in that: The frame is a metal frame.

7. The wafer cover plate pressure ring structure according to claim 1, characterized in that: The second end of the pressure ring can be retracted into the frame along the slideway.

8. A metal evaporation carrier plate, characterized in that: include: ontology; A wafer groove, located on the surface of the body, for accommodating a wafer; A wafer support ring, located inside the wafer groove and used for supporting the wafer; A wafer cover plate, disposed on the surface of the wafer ring, for protecting the wafer; The wafer cover plate pressing ring structure adopts the wafer cover plate pressing ring structure as claimed in any one of claims 1 to 7.

9. The metal vapor deposition carrier plate according to claim 8, characterized in that: The wafer receiving ring is fixed to the inner side of the wafer slot through a threaded connector.

10. A metal evaporation machine, characterized in that: It comprises the metal vapor deposition carrier plate as described in any one of claims 8 to 9.

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