High-temperature-resistant and low-expansion MEMS needle card structure with modules capable of being assembled in split mode
By designing the MEMS needle card structure of the split-assembled module, using PCB motherboard and MEMS micro-cantilever module, the problem of excessive expansion tolerance during high-temperature testing of the existing MEMS needle card probe module is solved, achieving higher test yield and competitiveness, and reducing maintenance costs.
Patent Information
- Application Number
- CN202421853550.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-02
- Publication Date
- 2025-06-06
- Estimated Expiration
- 2034-08-02
AI Technical Summary
During high-temperature testing, the existing MEMS needle card probe module has a large area size, resulting in more tolerance deformation of high-temperature expansion, with a maximum deviation of more than 50um, resulting in serious deviation of probe test and low test yield.
A MEMS needle card structure with a split-assembled module is designed, including a test assembly and a MEMS needle card assembly. The MEMS needle card assembly is removably mounted on the top of the test assembly. It adopts a PCB motherboard and a MEMS micro-cantilever module, which reduces the volume size of each module and reduces the heating area at high temperatures.
In the same 150° test environment, the temperature expansion size is much smaller than the overall module deviation size, reaching less than 20um, significantly improving the test yield and competitiveness of high-temperature testing, while reducing maintenance costs and downtime.
Smart Images
Figure CN222952404U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of MEMS pin card structures, in particular to a high temperature resistant and low expansion MEMS pin card structure with a separable assembly module. Background Art
[0002] With the rapid development of the semiconductor industry, chip manufacturing processes are constantly improving, and the requirements for testing technology are also increasing. Wafer testing, as an important part of quality control in the semiconductor manufacturing process, places higher demands on the accuracy, efficiency and reliability of testing tools. MEMS probe cards have become a key tool to meet these needs with their advantages such as ultra-high density, low contact resistance, high reliability and customizability.
[0003] With regard to the existing related technologies, the inventors believe that the following defects often exist: In the past, the MEMS needle card probe module was an integral structure. When tested at a high temperature of 150 degrees Celsius, due to the large area of the probe module, the tolerance deformation due to high temperature expansion was large, with a maximum deviation of more than 50um, resulting in serious probe test offset and low test yield.
[0004] To this end, we propose a detachable assembly module with high temperature resistance and low expansion MEMS pin card structure. Utility Model Content
[0005] In view of the fact that the above-mentioned existing MEMS needle card probe module is an integral structure, when tested at a high temperature of 150 degrees Celsius, due to the large area of the probe module, the tolerance deformation due to high temperature expansion is large, with a maximum deviation of more than 50um, resulting in serious probe test offset and low test yield, the present utility model is proposed.
[0006] Therefore, the utility model aims to provide a detachable assembly module with a high temperature resistant and low expansion MEMS needle card structure, the purpose of which is to reduce the expansion tolerance of the probe in high temperature testing.
[0007] In order to solve the above technical problems, the utility model provides the following technical solutions: a detachable assembly module high temperature resistant low expansion MEMS needle card structure, including a test component and a MEMS needle card component, the MEMS needle card component is detachably mounted on the top surface of the test component;
[0008] The MEMS needle card assembly includes a PCB motherboard, a group of MEMS micro-cantilever modules are detachably installed on the top of the PCB motherboard in a rectangular distribution, and a POGOPIN vertical signal conduction structure is installed on the top of the PCB motherboard and directly below each MEMS micro-cantilever module.
[0009] As a preferred solution of the high-temperature-resistant and low-expansion MEMS pin card structure of a detachable assembly module described in the utility model, the test assembly includes a fixing ring, a reinforcement ring is installed on the inner hole wall of the fixing ring, and the reinforcement ring is installed with a test machine socket for fixing the MEMS pin card assembly.
[0010] As a preferred solution of the high-temperature-resistant and low-expansion MEMS needle card structure of a detachable assembly module described in the utility model, the MEMS micro-cantilever module includes an MLC ceramic circuit detachably mounted on the top of a PCB motherboard, and two groups of cantilever probes are installed symmetrically and relative to each other on both sides of the top of the MLC ceramic circuit.
[0011] As a preferred solution of the high-temperature-resistant and low-expansion MEMS needle card structure of a detachable assembly module described in the utility model, a bending hole is opened at the node of the vertical end and the lateral end of the cantilever probe, and a convex needle is installed on the top of the lateral end of the cantilever probe and on the side away from the bending hole.
[0012] As a preferred solution of the high temperature resistant and low expansion MEMS needle card structure of the detachable assembly module described in the utility model, a transverse cavity groove is provided on the transverse end of the cantilever probe.
[0013] As a preferred solution of the high-temperature-resistant and low-expansion MEMS needle card structure of a detachable assembly module described in the utility model, the MEMS micro-cantilever module also includes four supporting positioning columns embedded and fixed on the top of the PCB motherboard, and cantilever probes are provided at the four corners of the top of the MLC ceramic circuit. A threaded groove is provided on the top of the supporting positioning column, and a fixing bolt is installed on the internal thread of the threaded groove.
[0014] As a preferred solution of the high temperature resistant and low expansion MEMS pin card structure with a detachable assembly module described in the utility model, a ventilation channel is formed between two adjacent MEMS micro-cantilever modules.
[0015] Beneficial effects of the utility model:
[0016] 1. The utility model is a detachable connection between the test component and the MEMS pin card component. The two are fixed together in a split assembly manner, and can be flexibly combined and expanded according to actual needs, which improves the adaptability of the device and facilitates maintenance and upgrading. The components of the split assembly are relatively independent and can be installed separately, reducing the difficulty and time of installation. At the same time, the connection between the components is also simpler, which is convenient for subsequent maintenance and replacement.
[0017] 2. The utility model installs multiple independent MEMS micro-cantilever modules on the top of the PCB motherboard, which reduces the volume size of each MEMS micro-cantilever module and significantly reduces the heating area of a single module at high temperature, thereby reducing the expansion tolerance. Under the same 150° test environment, the temperature expansion size is much smaller than the overall module deviation size, reaching within 20um, thereby improving the client test yield and the competitiveness of high-temperature testing in the same industry.
[0018] 3. The utility model adopts a modular design. When a module fails or its performance deteriorates, it can be maintained and replaced separately without replacing the entire needle card, thereby reducing maintenance costs and downtime. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following briefly introduces the drawings required for the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:
[0020] Figure 1 It is a schematic diagram of the overall top view of the structure of a detachable assembly module high temperature resistant and low expansion MEMS pin card structure of the utility model.
[0021] Figure 2 The utility model is a cross-sectional structural schematic diagram of a test component of a detachable assembly module with a high-temperature-resistant and low-expansion MEMS pin card structure.
[0022] Figure 3 It is a top view structural schematic diagram of a MEMS pin card assembly of a detachable assembly module with a high temperature resistant and low expansion MEMS pin card structure according to the utility model.
[0023] Figure 4 It is a front view structural schematic diagram of a MEMS needle card assembly of a detachable assembly module with a high temperature resistant and low expansion MEMS needle card structure according to the utility model.
[0024] Figure 5 It is a front view structural schematic diagram of a MEMS micro cantilever module with a detachable assembly module and a high temperature resistant and low expansion MEMS pin card structure according to the utility model.
[0025] Figure 6 The utility model is a top view of the structure of a MLC ceramic circuit with a detachable assembly module and a high temperature resistant and low expansion MEMS pin card structure.
[0026] Description of reference numerals:
[0027] 1. Test assembly; 11. Fixing ring; 12. Reinforcement ring; 13. Test machine socket; 2. MEMS pin card assembly; 21. PCB motherboard; 22. MEMS micro cantilever module; 221. MLC ceramic circuit; 222. Support positioning column; 223. Cantilever probe; 224. Bending hole; 225. Horizontal cavity groove; 226. Convex needle; 227. Fixed perforation; 23. POGOPIN vertical signal conduction structure. DETAILED DESCRIPTION
[0028] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.
[0029] Reference Figure 1-6 , which is an embodiment of the utility model, provides a detachable assembly module high temperature resistant low expansion MEMS needle card structure, the detachable assembly module high temperature resistant low expansion MEMS needle card structure comprises a test component 1 and a MEMS needle card component 2, the MEMS needle card component 2 is detachably mounted on the top surface of the test component 1;
[0030] The MEMS pin card assembly 2 includes a PCB motherboard 21, and a group of MEMS micro-cantilever modules 22 are detachably installed on the top of the PCB motherboard 21 in a rectangular distribution. A POGOPIN vertical signal conduction structure 23 is installed on the top of the PCB motherboard 21 and directly below each MEMS micro-cantilever module 22. The POGOPIN vertical signal conduction structure 23 is an existing mature technology, so it will not be described in detail.
[0031] Due to the modular design, when a module fails or its performance degrades, it can be maintained and replaced individually without replacing the entire pin card, thus reducing maintenance costs and downtime.
[0032] The test assembly 1 comprises a fixing ring 11 , a reinforcing ring 12 is installed on the inner hole wall of the fixing ring 11 , and a test machine socket 13 for fixing the MEMS needle card assembly 2 is installed on the reinforcing ring 12 .
[0033] The test component 1 and the MEMS needle card component 2 are detachably connected, and the two are fixed together in a split assembly manner. They can be flexibly combined and expanded according to actual needs, which improves the adaptability of the device and facilitates maintenance and upgrades. The components of the split assembly are relatively independent and can be installed separately, reducing the difficulty and time of installation. At the same time, the connection between the components is also simpler, which is convenient for subsequent maintenance and replacement.
[0034] The MEMS micro-cantilever module 22 comprises an MLC ceramic circuit 221 detachably mounted on the top of the PCB motherboard 21 , and two groups of cantilever probes 223 are mounted on both sides of the top of the MLC ceramic circuit 221 in a symmetrical and opposite state.
[0035] A plurality of independent MEMS micro-cantilever modules 22 are installed on the top of the PCB motherboard 21, which reduces the volume size of each MEMS micro-cantilever module 22 and significantly reduces the heating area of a single module at high temperature, thereby reducing the expansion tolerance. Under the same 150° test environment, the temperature expansion size is much smaller than the overall module deviation size and is within 20um, thereby improving the client test yield and the competitiveness of high-temperature testing in the same industry.
[0036] A bending hole 224 is formed at the node between the vertical end and the lateral end of the cantilever probe 223 , and a protruding needle 226 is installed at the top of the lateral end of the cantilever probe 223 and on a side away from the bending hole 224 .
[0037] A transverse cavity 225 is formed on the transverse end of the cantilever probe 223 .
[0038] The MEMS micro-cantilever module 22 also includes four support positioning columns 222 embedded and fixed on the top of the PCB motherboard 21. Cantilever probes 223 are provided at the four corners of the top of the MLC ceramic circuit 221. A threaded groove is provided on the top of the support positioning column 222. A fixing bolt is installed on the internal thread of the threaded groove, and the fixing bolt passes through the inside of the fixing through-hole 227. The support positioning column 222 detachably installs the MLC ceramic circuit 221 on the top of the four support positioning columns 222 through the fixing bolts threadedly installed thereon.
[0039] A ventilation channel is formed between two adjacent MEMS micro-cantilever modules 22 , which is more conducive to air flow and cools and dissipates the MEMS micro-cantilever modules 22 , further helping to reduce the expansion tolerance of the MEMS micro-cantilever modules 22 caused by high temperature.
[0040] During use, the test component 1 and the MEMS needle card component 2 are detachably connected, and the two are fixed together in a split assembly manner, which can be flexibly combined and expanded according to actual needs, thereby improving the adaptability of the device and facilitating maintenance and upgrading;
[0041] A plurality of independent MEMS micro-cantilever modules 22 are installed on the top of the PCB motherboard 21, which reduces the volume size of each MEMS micro-cantilever module 22 and significantly reduces the heating area of a single module at high temperature. Under the same 150° test environment, the temperature expansion size is much smaller than the overall module deviation size and is within 20um, thereby improving the client test yield and the competitiveness of high-temperature testing in the same industry.
[0042] It should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in the field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the utility model, which should be included in the scope of the claims of the utility model.
Claims
1. A detachable assembly module high temperature resistant low expansion MEMS pin card structure, comprising a test component (1) and a MEMS pin card component (2), characterized in that: The MEMS needle card assembly (2) is detachably mounted on the top surface of the test assembly (1); The MEMS pin card assembly (2) comprises a PCB motherboard (21), a group of MEMS micro-cantilever modules (22) are detachably mounted on the top of the PCB motherboard (21) in a rectangular arrangement, and a POGOPIN vertical signal conduction structure (23) is mounted on the top of the PCB motherboard (21) and directly below each MEMS micro-cantilever module (22).
2. The high temperature resistant and low expansion MEMS pin card structure with separable assembly module according to claim 1 is characterized by: The test assembly (1) comprises a fixing ring (11), a reinforcing ring (12) is installed on the inner hole wall of the fixing ring (11), and a test machine socket (13) for fixing the MEMS needle card assembly (2) is installed on the reinforcing ring (12).
3. The high temperature resistant and low expansion MEMS pin card structure with separable assembly module according to claim 2 is characterized by: The MEMS micro-cantilever module (22) comprises an MLC ceramic circuit (221) detachably mounted on the top of a PCB motherboard (21), and two groups of cantilever probes (223) are mounted on two sides of the top of the MLC ceramic circuit (221) in a symmetrical and opposite state.
4. The high temperature resistant and low expansion MEMS pin card structure with separable assembly module according to claim 3 is characterized by: A bending hole (224) is provided at the node between the vertical end and the lateral end of the cantilever probe (223), and a convex needle (226) is installed at the top of the lateral end of the cantilever probe (223) and on a side away from the bending hole (224).
5. The high temperature resistant and low expansion MEMS pin card structure with separable assembly module according to claim 4 is characterized by: A transverse cavity groove (225) is provided on the transverse end of the cantilever probe (223).
6. The high temperature resistant and low expansion MEMS pin card structure with separable assembly module according to claim 5, characterized in that: The MEMS micro-cantilever module (22) further comprises four support positioning columns (222) embedded and fixed on the top of the PCB motherboard (21); cantilever probes (223) are provided at the four corners of the top of the MLC ceramic circuit (221); a threaded groove is provided on the top of the support positioning column (222); and a fixing bolt is installed in the internal thread of the threaded groove.
7. The high temperature resistant and low expansion MEMS pin card structure with separable assembly module according to claim 6, characterized in that: A ventilation channel is formed between two adjacent MEMS micro-cantilever modules (22).