High-precision TEC temperature resistance tester
By using a combination of upper and lower semiconductor refrigerators and thermosensor controllers in the TEC temperature resistance tester, the problem of large resistance fluctuations in TEC chip test is solved, and high-precision temperature control and testing are achieved.
Patent Information
- Application Number
- CN202323601731.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-27
- Publication Date
- 2025-06-06
- Estimated Expiration
- 2033-12-27
AI Technical Summary
In the prior art, the resistance fluctuates greatly during testing of TEC chips, which affects the detection accuracy.
A high-precision TEC temperature resistance tester is designed, and high-precision temperature control is achieved by placing the TEC chip between the upper and lower semiconductor refrigerators, and using the driving cylinder down-pressing chip, combining the temperature sensor and the controller to achieve constant temperature of the upper and lower constant temperature plates.
Through fast and precise temperature control, the resistance fluctuations of the TEC chip are significantly reduced, and the accuracy and reliability of the test are improved.
Smart Images
Figure CN222952446U_ABST
Abstract
Description
Technical Field
[0001] The utility model patent relates to the technical field of TEC temperature resistance testing, and specifically, to a high-precision TEC temperature resistance tester. Background Art
[0002] TEC is the abbreviation of semiconductor refrigerator, which is based on the Peltier principle. It uses two different conductors to form a circuit and pass direct current. In addition to Joule heat, other heat will be released at the joint, while the other joint absorbs heat.
[0003] Before the TEC chip leaves the factory, it is necessary to test the TEC chip to ensure the qualified rate of the TEC chip; the test of the TEC chip is realized by the test equipment, which is more efficient; for example, the prior patent with the publication number CN217796212U discloses a semiconductor refrigeration constant temperature test machine, including a test bench, a frame is fixedly provided on the top of the test bench, a hydraulic rod is fixedly provided on the top of the frame, a cover plate is fixedly provided on the bottom end of the hydraulic rod, and a gate plate is fixedly provided on the bottom of the cover plate. By setting a clamping assembly, the clamping plate can be quickly clamped and fixed, and the clamping plate can clamp and fix the semiconductor refrigeration piece in the clamping groove on the gate plate. By setting a hydraulic rod, the hydraulic rod can control the lifting and lowering of the gate plate, which is convenient for extending the gate plate into the inner cavity of the test box, or pulling the gate plate out of the inner cavity of the test box, so as to facilitate the replacement of the semiconductor refrigeration piece fixed on the gate plate and facilitate the test operation. By controlling the gate plate to descend by the hydraulic rod, the gate plate can divide the left and right sides of the inner cavity of the test box into a heating cavity and a cooling cavity, and the cooling end and the heating end of the semiconductor refrigeration piece can be respectively tested through the heating cavity and the cooling cavity.
[0004] In the prior art, the semiconductor refrigeration plate is fixed by a gate, which is easily affected by the heating cavity and the refrigeration cavity, resulting in large fluctuations in the resistance of the semiconductor refrigeration plate, affecting the detection of the semiconductor refrigeration plate. Utility Model Content
[0005] The utility model aims to provide a high-precision TEC temperature resistance tester, aiming to solve the problem of large resistance fluctuation when testing a TEC chip in the prior art.
[0006] The utility model is implemented as follows: a high-precision TEC temperature resistance tester comprises a driving cylinder, an upper semiconductor refrigerator, a lower semiconductor refrigerator, a controller and a temperature sensor, wherein the upper semiconductor refrigerator and the lower semiconductor refrigerator are arranged correspondingly up and down, a TEC chip is placed in the lower semiconductor refrigerator, the driving cylinder is used to drive the upper semiconductor refrigerator to move downward, and the upper semiconductor refrigerator is used to press down the TEC chip; the upper semiconductor refrigerator comprises an upper constant temperature plate, the upper constant temperature plate has an upper plate opening, the lower semiconductor refrigerator comprises a lower constant temperature plate, the lower constant temperature plate has a lower plate opening, the upper plate opening and the lower plate opening are respectively embedded with the temperature sensors, the temperature sensor is electrically connected to the controller, the upper constant temperature plate and the lower constant temperature plate are respectively used to flatten and contact the TEC chip, and the two temperature sensors are respectively used to detect the temperature of the TEC chip and feed back to the controller.
[0007] Furthermore, the upper constant temperature plate has an upper plate surface, which is used to be arranged in contact with the TEC chip, and the upper plate surface forms the upper plate opening. The temperature sensor has a temperature sensing surface, which covers the upper plate opening, and the temperature sensing surface is arranged flush with the upper plate surface. The controller is used to control the temperature of the upper plate surface to be constant at a set value.
[0008] Furthermore, the upper semiconductor refrigerator includes a first upper thermal insulation cotton, the first upper thermal insulation cotton is embedded in the upper constant temperature plate, and the first upper thermal insulation cotton is arranged in a surrounding manner along the circumference of the upper constant temperature plate.
[0009] Furthermore, the upper semiconductor refrigerator includes a second upper thermal insulation cotton, a third upper thermal insulation cotton and an upper radiator. The first upper thermal insulation cotton, the second upper thermal insulation cotton and the third upper thermal insulation cotton are arranged in sequence, the third upper thermal insulation cotton and the upper radiator are assembled, and the upper radiator is used for heat dissipation; the second upper thermal insulation cotton and the third upper thermal insulation cotton are used for thermal insulation respectively.
[0010] Furthermore, the thickness of the first upper thermal insulation cotton is greater than the thickness of the second upper thermal insulation cotton, and the thickness of the second upper thermal insulation cotton is greater than the thickness of the third upper thermal insulation cotton.
[0011] Furthermore, the upper semiconductor refrigerator includes a lifting plate and two guide rods, the lifting plate is arranged above the upper radiator, and the upper radiator and the lifting plate are installed, the driving cylinder and the lifting plate are docked, and the driving cylinder is used to drive the lifting plate to rise or fall; the upper part of the guide rod is fixed, the lower part of the guide rod is movably arranged, and the guide rod passes through the lifting plate, the two guide rods are arranged in a corresponding interval, and the upper radiator is arranged between the two guide rods.
[0012] Furthermore, the lower constant temperature plate has a lower plate surface, which is used to be arranged in contact with the TEC chip, and the lower plate surface forms the lower plate opening. The temperature sensor has a temperature sensing surface, which covers the lower plate opening, and the temperature sensing surface is arranged flush with the lower plate surface. The controller is used to control the temperature of the lower plate surface to be constant at a set value; the lower semiconductor refrigerator includes a first lower thermal insulation cotton, and the lower constant temperature plate is embedded with the first lower thermal insulation cotton, and the first lower thermal insulation cotton is arranged in a surrounding manner along the circumference of the lower constant temperature plate.
[0013] Furthermore, the lower semiconductor refrigerator includes a second lower thermal insulation cotton, a third lower thermal insulation cotton and a lower radiator, the first lower thermal insulation cotton, the second lower thermal insulation cotton and the third lower thermal insulation cotton are arranged in sequence, the third lower thermal insulation cotton and the lower radiator are assembled, and the lower radiator is used for heat dissipation; the second lower thermal insulation cotton and the third lower thermal insulation cotton are used for thermal insulation respectively.
[0014] Furthermore, the thickness of the first lower thermal insulation cotton is greater than the thickness of the second lower thermal insulation cotton, and the thickness of the second lower thermal insulation cotton is greater than the thickness of the third lower thermal insulation cotton.
[0015] Furthermore, the high-precision TEC temperature resistance tester includes a main instrument shell, a subsidiary instrument shell and a power supply unit, and the driving cylinder, the upper semiconductor refrigerator, the lower semiconductor refrigerator and the temperature sensor are respectively arranged inside the main instrument shell; the main instrument shell and the subsidiary instrument shell are assembled, and the power supply unit and the controller are respectively arranged inside the subsidiary instrument shell, and the power supply unit is used to supply DC power.
[0016] Compared with the prior art, the high-precision TEC temperature resistance tester provided by the utility model places the TEC chip between the upper semiconductor refrigerator and the lower semiconductor refrigerator, and then drives the upper semiconductor refrigerator to press down the TEC chip by driving the cylinder to fix the TEC chip. Then, the controller cooperates with the temperature sensor to achieve the temperature of the upper constant temperature plate and the lower constant temperature plate to be constant at the set value, thereby achieving high-precision temperature control. Therefore, through fast and accurate temperature control, the resistance fluctuation of the TEC chip can be greatly reduced, thereby avoiding affecting the test of the TEC chip. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a three-dimensional schematic diagram of the high-precision TEC temperature resistance tester provided by the utility model;
[0018] Figure 2 It is a three-dimensional schematic diagram of the high-precision TEC temperature resistance tester provided by the utility model;
[0019] Figure 3It is a three-dimensional schematic diagram of the upper semiconductor refrigerator of the high-precision TEC temperature resistance tester provided by the utility model;
[0020] Figure 4 It is a right side schematic diagram of the upper semiconductor refrigerator of the high-precision TEC temperature resistance tester provided by the utility model;
[0021] Figure 5 It is a three-dimensional schematic diagram of the assembly of a high-precision TEC temperature resistance tester provided by the utility model. DETAILED DESCRIPTION
[0022] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.
[0023] The implementation of the present utility model is described in detail below in conjunction with specific embodiments.
[0024] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of the present utility model, it should be understood that if the terms "upper", "lower", "left", "right" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, it is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limitations on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.
[0025] Reference Figure 1-5 As shown, it is a preferred embodiment provided by the utility model.
[0026] A high-precision TEC temperature resistance tester includes a driving cylinder 2, an upper semiconductor refrigerator 1, a lower semiconductor refrigerator 3, a controller and a temperature sensor 8. The upper semiconductor refrigerator 1 and the lower semiconductor refrigerator 3 are arranged in correspondence with each other up and down, and the TEC chip is placed in the lower semiconductor refrigerator 3. The driving cylinder 2 is used to drive the upper semiconductor refrigerator 1 to move downward, and the upper semiconductor refrigerator 1 is used to press the TEC chip downward; the upper semiconductor refrigerator 1 includes an upper constant temperature plate 11, and the upper constant temperature plate 11 has an upper plate opening; the lower semiconductor refrigerator 3 includes a lower constant temperature plate, and the lower constant temperature plate has a lower plate opening. The upper plate opening and the lower plate opening are respectively embedded with temperature sensors 8, and the temperature sensor 8 is electrically connected to the controller. The upper constant temperature plate 11 and the lower constant temperature plate are respectively used to flatten and resist the TEC chip, and the two temperature sensors 8 are respectively used to detect the temperature of the TEC chip and feed back to the controller.
[0027] The above-mentioned high-precision TEC temperature resistance tester places the TEC chip between the upper semiconductor refrigerator 1 and the lower semiconductor refrigerator 3, and then drives the upper semiconductor refrigerator 1 to press down the TEC chip by driving the cylinder 2 to fix the TEC chip. Then, the controller cooperates with the temperature sensor 8 to achieve the temperature of the upper constant temperature plate 11 and the lower constant temperature plate to be constant at the set value, thereby achieving high-precision temperature control. Therefore, through fast and accurate temperature control, the resistance fluctuation of the TEC chip can be greatly reduced to avoid affecting the test of the TEC chip.
[0028] The upper thermostatic plate 11 has an upper plate surface, which is used to be arranged in contact with the TEC chip to increase the contact area between the upper plate surface and the TEC chip, achieve precise temperature control, and reduce resistance fluctuations of the TEC chip.
[0029] The upper plate surface forms an upper plate opening, the temperature sensor 8 has a temperature sensing surface, the temperature sensing surface covers the upper plate opening, and the temperature sensing surface is arranged flush with the upper plate surface, and the controller is used to control the temperature of the upper plate surface to be constant at a set value; in this way, the temperature sensor 8 and the upper constant temperature plate 11 are synchronously in contact with the TEC chip, and the temperature sensor 8 synchronously detects and feeds back the temperature of the TEC chip and the upper constant temperature plate 11.
[0030] The upper semiconductor refrigerator 1 includes a first upper thermal insulation cotton 12, and the first upper thermal insulation cotton 12 is embedded in the upper constant temperature plate 11, and the first upper thermal insulation cotton 12 is arranged along the circumference of the upper constant temperature plate 11; under the action of the first upper thermal insulation cotton 12, it has an insulation effect on the surrounding of the upper constant temperature plate 11, reduces the influence of the external temperature on the upper constant temperature plate 11, realizes precise temperature control, and reduces the resistance fluctuation of the TEC chip.
[0031] The upper semiconductor refrigerator 1 includes a second upper thermal insulation cotton 13, a third upper thermal insulation cotton 14 and an upper radiator 15. The first upper thermal insulation cotton 12, the second upper thermal insulation cotton 13 and the third upper thermal insulation cotton 14 are stacked in sequence, the third upper thermal insulation cotton 14 and the upper radiator 15 are assembled, and the upper radiator 15 is used for heat dissipation; the second upper thermal insulation cotton 13 and the third upper thermal insulation cotton 14 are used for heat insulation respectively.
[0032] In this way, under the cooperation of the second upper insulation cotton 13 and the third upper insulation cotton 14, the first upper insulation cotton 12 is coordinated to perform multi-layer insulation, enhance the insulation effect, avoid the influence of external temperature on the upper constant temperature plate 11, and achieve precise temperature control.
[0033] The thickness of the first upper thermal insulation cotton 12 is greater than the thickness of the second upper thermal insulation cotton 13 , and the thickness of the second upper thermal insulation cotton 13 is greater than the thickness of the third upper thermal insulation cotton 14 ; so that the first upper thermal insulation cotton 12 has sufficient thermal insulation effect.
[0034] The upper semiconductor refrigerator 1 includes a lifting plate 4 and two guide rods 5. The lifting plate 4 is arranged above the upper radiator 15, and the upper radiator 15 and the lifting plate 4 are installed. The driving cylinder 2 is docked with the lifting plate 4, and the driving cylinder 2 is used to drive the lifting plate 4 to rise or fall. The upper part of the guide rod 5 is fixed, the lower part of the guide rod 5 is movable, and the guide rod 5 passes through the lifting plate 4. The two guide rods 5 are arranged in a corresponding interval, and the upper radiator 15 is arranged between the two guide rods 5.
[0035] Under the action of the two guide rods 5, the lifting plate 4 is guided when it rises or falls, so as to avoid shaking of the lifting plate 4 when it moves, thereby improving the moving stability of the lifting plate 4 and thus improving the moving stability of the upper semiconductor refrigerator 1.
[0036] The lower thermostatic plate has a lower plate surface, which is used to be arranged in contact with the TEC chip, and the lower plate surface forms a lower plate opening. The temperature sensor 8 has a temperature sensing surface, which covers the lower plate opening, and the temperature sensing surface and the lower plate surface are arranged flush. The controller is used to control the temperature of the lower plate surface to be constant at a set value; in this way, the temperature sensor 8 and the lower thermostatic plate are synchronously in contact with the TEC chip, and the temperature sensor 8 synchronously detects and feeds back the temperatures of the TEC chip and the lower thermostatic plate.
[0037] The lower semiconductor refrigerator 3 includes a first lower thermal insulation cotton, the first lower thermal insulation cotton is embedded in the lower constant temperature plate, and the first lower thermal insulation cotton is arranged along the circumference of the lower constant temperature plate.
[0038] Under the action of the first lower insulation cotton, the lower constant temperature plate is insulated, the influence of the external temperature on the lower constant temperature plate is reduced, precise temperature control is achieved, and the resistance fluctuation of the TEC chip is reduced.
[0039] The lower semiconductor refrigerator 3 includes a second lower thermal insulation cotton, a third lower thermal insulation cotton and a lower radiator. The first lower thermal insulation cotton, the second lower thermal insulation cotton and the third lower thermal insulation cotton are stacked in sequence, the third lower thermal insulation cotton and the lower radiator are assembled, and the lower radiator is used for heat dissipation; the second lower thermal insulation cotton and the third lower thermal insulation cotton are used for heat insulation respectively.
[0040] In this way, under the cooperation of the second and third insulation cottons, the first insulation cotton is coordinated to perform multi-layer insulation, enhance the insulation effect, avoid the influence of external temperature on the lower constant temperature plate, and achieve precise temperature control.
[0041] The thickness of the first lower thermal insulation cotton is greater than the thickness of the second lower thermal insulation cotton, and the thickness of the second lower thermal insulation cotton is greater than the thickness of the third lower thermal insulation cotton; so that the first lower thermal insulation cotton has sufficient thermal insulation effect.
[0042] The high-precision TEC temperature resistance tester includes a main instrument shell, a sub-instrument shell and a power supply unit 7. The driving cylinder 2, the upper semiconductor refrigerator 1, the lower semiconductor refrigerator 3 and the temperature sensor 8 are respectively arranged inside the main instrument shell; the main instrument shell and the sub-instrument shell are assembled, the power supply unit 7 and the controller are respectively arranged inside the sub-instrument shell, and the power supply unit 7 is used to supply DC power.
[0043] In this way, it is convenient for the controller to control the upper semiconductor refrigerator 1 and the lower semiconductor refrigerator 3 to achieve precise temperature control and reduce the resistance fluctuation of the TEC chip.
[0044] The controller model is PR59, and the controller is preset with a control program. The control program combines the PID algorithm to achieve that the temperatures of the upper constant temperature plate 11 and the lower constant temperature plate are constant at the set value, and the deviation is no more than ±0.1°C; accurate temperature control is achieved to reduce the resistance fluctuation of the TEC chip.
[0045] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. High-precision TEC temperature resistance tester, It is characterized in that It includes a driving cylinder, an upper semiconductor refrigerator, a lower semiconductor refrigerator, a controller and a temperature sensor. The upper semiconductor refrigerator and the lower semiconductor refrigerator are arranged correspondingly up and down, and the TEC chip is placed in the lower semiconductor refrigerator. The driving cylinder is used to drive the upper semiconductor refrigerator to move downward, and the upper semiconductor refrigerator is used to press down the TEC chip; the upper semiconductor refrigerator includes an upper constant temperature plate, and the upper constant temperature plate has an upper plate opening; the lower semiconductor refrigerator includes a lower constant temperature plate, and the lower constant temperature plate has a lower plate opening. The upper plate opening and the lower plate opening are respectively embedded with the temperature sensors, and the temperature sensor is electrically connected to the controller. The upper constant temperature plate and the lower constant temperature plate are respectively used to flatten and contact the TEC chip, and the two temperature sensors are respectively used to detect the temperature of the TEC chip and feed back to the controller.
2. The high-precision TEC temperature resistance tester as claimed in claim 1, It is characterized in that The upper constant temperature plate has an upper plate surface, which is arranged to be in contact with the TEC chip, and the upper plate surface forms the upper plate opening. The temperature sensor has a temperature sensing surface, which covers the upper plate opening, and the temperature sensing surface is arranged flush with the upper plate surface. The controller is used to control the temperature of the upper plate surface to be constant at a set value.
3. The high-precision TEC temperature resistance tester as claimed in claim 2, It is characterized in that The upper semiconductor refrigerator comprises a first upper thermal insulation cotton, the first upper thermal insulation cotton is embedded in the upper constant temperature plate, and the first upper thermal insulation cotton is arranged in a surrounding manner along the circumference of the upper constant temperature plate.
4. The high-precision TEC temperature resistance tester as claimed in claim 3, It is characterized in that The upper semiconductor refrigerator includes a second upper thermal insulation cotton, a third upper thermal insulation cotton and an upper radiator. The first upper thermal insulation cotton, the second upper thermal insulation cotton and the third upper thermal insulation cotton are arranged in sequence, the third upper thermal insulation cotton and the upper radiator are assembled, and the upper radiator is used for heat dissipation; the second upper thermal insulation cotton and the third upper thermal insulation cotton are used for thermal insulation respectively.
5. The high-precision TEC temperature resistance tester as claimed in claim 4, It is characterized in that The thickness of the first upper thermal insulation cotton is greater than the thickness of the second upper thermal insulation cotton, and the thickness of the second upper thermal insulation cotton is greater than the thickness of the third upper thermal insulation cotton.
6. The high-precision TEC temperature resistance tester as claimed in claim 4, It is characterized in that The upper semiconductor refrigerator includes a lifting plate and two guide rods. The lifting plate is arranged above the upper radiator, and the upper radiator and the lifting plate are installed. The driving cylinder is docked with the lifting plate, and the driving cylinder is used to drive the lifting plate to rise or fall. The upper part of the guide rod is fixed, the lower part of the guide rod is movable, and the guide rod passes through the lifting plate. The two guide rods are arranged in a corresponding interval, and the upper radiator is arranged between the two guide rods.
7. The high-precision TEC temperature resistance tester according to any one of claims 1 to 5, It is characterized in that The lower constant temperature plate has a lower plate surface, which is arranged to be in contact with the TEC chip, and the lower plate surface forms the lower plate opening. The temperature sensor has a temperature sensing surface, which covers the lower plate opening, and the temperature sensing surface and the lower plate surface are arranged flush, and the controller is used to control the temperature of the lower plate surface to be constant at a set value; the lower semiconductor refrigerator includes a first lower thermal insulation cotton, the lower constant temperature plate is embedded with the first lower thermal insulation cotton, and the first lower thermal insulation cotton is arranged to surround the circumference of the lower constant temperature plate.
8. The high-precision TEC temperature resistance tester as claimed in claim 7, It is characterized in that The lower semiconductor refrigerator includes a second lower thermal insulation cotton, a third lower thermal insulation cotton and a lower radiator. The first lower thermal insulation cotton, the second lower thermal insulation cotton and the third lower thermal insulation cotton are arranged in sequence, the third lower thermal insulation cotton and the lower radiator are assembled, and the lower radiator is used for heat dissipation; the second lower thermal insulation cotton and the third lower thermal insulation cotton are used for thermal insulation respectively.
9. The high-precision TEC temperature resistance tester as claimed in claim 8, It is characterized in that The thickness of the first lower thermal insulation cotton is greater than the thickness of the second lower thermal insulation cotton, and the thickness of the second lower thermal insulation cotton is greater than the thickness of the third lower thermal insulation cotton.
10. The high-precision TEC temperature resistance tester according to any one of claims 1 to 5, It is characterized in that The high-precision TEC temperature resistance tester comprises a main instrument housing, a sub-instrument housing and a power supply unit, wherein the driving cylinder, the upper semiconductor refrigerator, the lower semiconductor refrigerator and the temperature sensor are respectively arranged inside the main instrument housing; The main instrument housing and the auxiliary instrument housing are assembled and arranged, the power supply component and the controller are respectively arranged inside the auxiliary instrument housing, and the power supply component is used to supply a DC power supply.
Citation Information
Patent Citations
Semiconductor refrigeration constant-temperature testing machine
CN217796212U