Wafer sorting device
By designing a wafer sorting device including cleaning boxes, suction cups and ultrasonic cleaning technology, the problem of automatic sorting of wafers in the prior art is solved, automatic cleaning and sorting is realized, and efficiency and quality are improved.
Patent Information
- Application Number
- CN202420038360.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-08
- Publication Date
- 2025-06-06
- Estimated Expiration
- 2034-01-08
AI Technical Summary
The existing wafer measurement and sorting device cannot automatically perform wafer sorting, resulting in manual participation, resulting in wasted time and low sorting efficiency.
A wafer sorting device including a cleaning box, a liquid inlet pipe, a cleaning liquid tank, a qualified product collection box and a failed product collection box are designed. The cleaning liquid is pumped into the cleaning box through a liquid extraction pump, and the suction cup is moved using a drive motor and threaded rod system. Combined with ultrasonic cleaning technology, it automatically cleans and sorts the wafers.
Automatic cleaning and sorting of wafers is realized, wafer sorting efficiency is improved, manual participation is reduced, and processing quality is improved.
Smart Images

Figure CN222953031U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer processing and production, in particular to a wafer sorting device. Background Art
[0002] A wafer is a silicon chip used in circuit manufacturing. Because of its round shape, it is called a wafer. After the wafer is produced, its thickness needs to be measured so that the wafer can be sorted according to the measurement results.
[0003] The existing patent number CN218424254U discloses a wafer measurement and sorting device, which aims to solve the technical problem that the existing wafer measurement and sorting device cannot automatically sort the measured wafers after measuring the wafers, so manual participation is required for wafer sorting, which causes a waste of time and is not conducive to improving the wafer sorting efficiency. The solution of the prior art is: a wafer measurement and sorting device, including a base, the bottom of the base is fixedly connected with legs, the bottom of the legs is provided with a pad, the lower surface of the base is provided with a qualified product collection box, a sorting box and a defective product collection box, the interior of the base is respectively provided with through holes communicating with the qualified product collection box, the sorting box and the defective product collection box, the upper surface of the base is respectively provided with detection components arranged between the through holes, the upper surface of the base is respectively fixedly connected with a left side plate and a right side plate on both sides of the upper surface of the base, a guide rod is fixedly connected between the left side plate and the right side plate, a slide plate is slidably connected to the outer side of the guide rod, an electric push rod fixedly connected to the right side plate is fixedly connected to the right side of the slide plate, an electric lifting rod is provided at the bottom of the slide plate, a gripping mechanism is provided at the lower side of the electric lifting rod, and a controller and a display screen are respectively provided on the left side of the left side plate.
[0004] Disadvantages of the patents in the prior art: The patents in the prior art cannot clean the wafers, and the surface of the wafers will be contaminated with dust during processing. Failure to clean the dust will affect the further processing of the wafers. Utility Model Content
[0005] The technical problem to be solved by the utility model is to overcome the above technical defects and provide a wafer sorting device that can clean wafers.
[0006] In order to solve the above problems, the technical solution of the utility model is: a wafer sorting device, comprising a shell, a cleaning box is fixedly connected to the inner bottom end of the shell, a liquid inlet pipe is connected through the inner wall of one side of the cleaning box, a cleaning liquid tank is provided at the other end of the liquid inlet pipe, the cleaning liquid tank is fixedly connected to the inner bottom end of the shell, a qualified product collection box is fixedly connected to the inner bottom end of the shell, a failed product collection box is fixedly connected to the side of the inner bottom end of the shell away from the qualified product collection box, a detection component is fixedly connected to the qualified product collection box and the outside of the failed product collection box, and the detection component is fixedly connected to the inner bottom end of the shell.
[0007] Furthermore, a motor seat is fixedly connected to the outer wall of one side of the shell, a driving motor is connected to the motor seat, a first bevel gear is fixedly connected to the output end of the driving motor, a second bevel gear is meshed with one side of the first bevel gear, a threaded rod is fixedly connected to one side of the second bevel gear, and the threaded rod is rotatably connected to both sides of the shell.
[0008] Furthermore, a slider is threadedly connected on the threaded rod, a connecting column is fixedly connected to the lower side of the slider, a mounting shell is fixedly connected to the lower side of the connecting column, a cylinder is fixedly connected to the inner side of the mounting shell, and the output end of the cylinder extends to the outer side of the mounting shell and is fixedly connected to a suction cup.
[0009] Furthermore, a baffle is fixedly connected to the inner side of the cleaning box, a hollow groove is provided in the center of the baffle, and an ultrasonic generator and an ultrasonic transducer are respectively provided on the inner wall of the upper side of the cleaning box.
[0010] Furthermore, a controller is fixedly connected to a side wall of one side of the shell, and a display screen is fixedly connected to an end of the side wall of one side of the shell away from the controller.
[0011] Furthermore, legs are fixedly connected around the bottom end of the shell.
[0012] Furthermore, a liquid pump is provided on the liquid inlet pipeline.
[0013] Furthermore, the electric controller is electrically connected to the display screen, and the electric controller is electrically connected to the detection component.
[0014] Compared with the existing technology, the utility model has the following advantages: the utility model places the wafers to be sorted at the bottom of the cleaning box through the cleaning box, and pumps the cleaning liquid in the cleaning liquid box into the cleaning box through the liquid pump, so that the cleaning liquid soaks the wafers and eliminates the dust on the surface of the wafers. Then, the threaded rod is driven to rotate by the driving motor, and the transmission slider moves on the threaded rod. When it moves to the upper side of the cleaning box, the cylinder is started to drive the suction cup to move downward, and the wafer is washed to the upper end of the inner side of the cleaning box. The wafer is ultrasonically cleaned by the ultrasonic generator and the ultrasonic transducer, and the dirt in the tiny gaps on the surface of the wafer is quickly cleaned. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 The utility model is a three-dimensional wafer sorting device Figure 1 .
[0016] Figure 2 The utility model is a three-dimensional wafer sorting device Figure 2 .
[0017] Figure 3 The utility model is a three-dimensional wafer sorting device Figure 3 .
[0018] As shown in the figure: 1. Shell; 2. Cleaning box; 3. Liquid inlet pipe; 4. Cleaning liquid tank; 5. Qualified product collection box; 6. Unqualified product collection box; 7. Detection component; 8. Motor seat; 9. Drive motor; 10. First bevel gear; 11. Second bevel gear; 12. Threaded rod; 13. Liquid pump; 14. Slider; 15. Connecting column; 16. Mounting shell; 17. Cylinder; 18. Suction cup; 19. Baffle; 20. Empty slot; 21. Ultrasonic generator; 22. Ultrasonic transducer; 23. Controller; 24. Display screen; 25. Leg. DETAILED DESCRIPTION
[0019] The specific implementation of the utility model is further described below in conjunction with the accompanying drawings, wherein the same parts are represented by the same reference numerals.
[0020] It should be noted that the words "front", "rear", "left", "right", "up" and "down" used in the following description refer to directions in the drawings, and the words "inside" and "outside" refer to directions toward or away from the geometric center of a specific component, respectively.
[0021] In order to make the contents of the present invention more clearly understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention.
[0022] like Figures 1 to 3As shown, a wafer sorting device comprises a shell 1, a cleaning box 2 is fixedly connected to the inner bottom end of the shell 1, a liquid inlet pipe 3 is connected through the inner wall of one side of the cleaning box 2, a cleaning liquid tank 4 is provided at the other end of the liquid inlet pipe 3, the cleaning liquid tank 4 is fixedly connected to the inner bottom end of the shell 1, a qualified product collection box 5 is fixedly connected to the inner bottom end of the shell 1, a defective product collection box 6 is fixedly connected to the inner bottom end of the shell 1 away from the qualified product collection box 5, a detection component 7 is fixedly connected to the outer side of the qualified product collection box 5 and the defective product collection box 6, and the detection component 7 is fixedly connected to the inner bottom end of the shell 1. The detection component 7 is used to detect the wafers, and the qualified wafers are placed in the qualified product collection box 5, and the defective wafers are placed in the defective product collection box 6.
[0023] A motor seat 8 is fixedly connected to the outer wall of one side of the housing 1, and a driving motor 9 is connected to the motor seat 8. A first bevel gear 10 is fixedly connected to the output end of the driving motor 9. A second bevel gear 11 is meshed with one side of the first bevel gear 10, and a threaded rod 12 is fixedly connected to one side of the second bevel gear 11. The threaded rod 12 is rotatably connected to both sides of the housing 1. A slider 14 is threadedly connected to the threaded rod 12, and a connecting column 15 is fixedly connected to the lower side of the slider 14. A mounting shell 16 is fixedly connected to the lower side of the connecting column 15. A cylinder 17 is fixedly connected to the inner side of the mounting shell 16, and a suction cup 18 is fixedly connected to the output end of the cylinder 17 extending to the outer side of the mounting shell 16. The first bevel gear 10 is driven to rotate by the driving motor 9, and the second bevel gear 11 is driven to rotate, which drives the threaded rod 12 to start rotating, and drives the slider 14 threadedly connected thereto to start moving horizontally.
[0024] A baffle 19 is fixedly connected to the inner side of the cleaning box 2, and a slot 20 is provided in the center of the baffle 19. An ultrasonic generator 21 and an ultrasonic transducer 22 are provided on the inner wall of the upper side of the cleaning box 2. When the suction cup 18 moves to the top of the cleaning box 2, the suction cup 18 is driven by the cylinder 17 to extend into the wafer on the bottom side of the cleaning box 2, and moves to the upper end of the inner side of the cleaning box 2, and the dust in the gap of the wafer surface is cleaned by the ultrasonic generator 21 and the ultrasonic transducer 22. A controller 23 is fixedly connected to the side wall of one side of the shell 1, and a display screen 24 is fixedly connected to the end of the side wall of one side of the shell 1 away from the controller 23. Legs 25 are fixedly connected around the bottom of the shell 1. A liquid pump 13 is provided on the liquid inlet pipe 3. The cleaning liquid in the cleaning liquid tank 4 is pumped into the bottom of the cleaning box 2 through the liquid inlet pipe 3 by the liquid pump 13. The electric controller 23 is electrically connected to the display screen 24, and the electric controller 23 is electrically connected to the detection component 7.
[0025] In specific use, the first bevel gear 10 is driven to rotate by the driving motor 9, and the second bevel gear 11 is driven to rotate, which drives the threaded rod 12 to start rotating, and the slider 14 threadedly connected thereto starts to move horizontally. The cleaning liquid in the cleaning liquid tank 4 is pumped into the bottom of the cleaning box 2 through the liquid inlet pipe 3 by the liquid pump 13. When the suction cup 18 moves to the top of the cleaning box 2, the suction cup 18 is driven by the cylinder 17 to extend into the wafer on the bottom side of the cleaning box 2, and moves to the upper end of the inner side of the cleaning box 2. The dust in the gap on the surface of the wafer is cleaned by the ultrasonic generator 21 and the ultrasonic transducer 22. After cleaning, the suction cup 18 is driven to the top of the detection component 7 by the driving motor 9, and the wafer is measured by the detection component 7. The qualified wafers are placed in the qualified product collection box 5, and the unqualified wafers are placed in the unqualified product collection box 6. The work is completed.
[0026] The above description of the utility model and its implementation methods is not restrictive. The drawings show only one implementation method of the utility model, and the actual structure is not limited thereto. In short, if ordinary technicians in this field are inspired by it and design structural methods and embodiments similar to the technical solution without creativity without departing from the purpose of the invention of the utility model, they should all fall within the protection scope of the utility model.
Claims
1. A wafer sorting device, comprising a housing (1), characterized in that: A cleaning box (2) is fixedly connected to the inner bottom end of the shell (1); a liquid inlet pipe (3) is connected and penetrated through the inner wall of one side of the cleaning box (2); a cleaning liquid tank (4) is provided at the other end of the liquid inlet pipe (3); the cleaning liquid tank (4) is fixedly connected to the inner bottom end of the shell (1); a qualified product collection box (5) is fixedly connected to the inner bottom end of the shell (1); a failed product collection box (6) is fixedly connected to the inner bottom end of the shell (1) away from the qualified product collection box (5); a detection component (7) is fixedly connected to the outer side of the qualified product collection box (5) and the failed product collection box (6); the detection component (7) is fixedly connected to the inner bottom end of the shell (1).
2. A wafer sorting device according to claim 1, characterized in that: A motor seat (8) is fixedly connected to an outer wall of one side of the housing (1); a driving motor (9) is connected to the motor seat (8); a first bevel gear (10) is fixedly connected to an output end of the driving motor (9); a second bevel gear (11) is meshed with one side of the first bevel gear (10); a threaded rod (12) is fixedly connected to one side of the second bevel gear (11); and the threaded rod (12) is rotatably connected to two sides of the housing (1).
3. A wafer sorting device according to claim 2, characterized in that: A slider (14) is threadedly connected to the threaded rod (12), a connecting column (15) is fixedly connected to the lower side of the slider (14), a mounting shell (16) is fixedly connected to the lower side of the connecting column (15), a cylinder (17) is fixedly connected to the inner side of the mounting shell (16), and an output end of the cylinder (17) extends to the outer side of the mounting shell (16) and is fixedly connected to a suction cup (18).
4. The wafer sorting device according to claim 1, characterized in that: A baffle (19) is fixedly connected to the inner side of the cleaning box (2), a hollow groove (20) is provided in the center of the baffle (19), and an ultrasonic generator (21) and an ultrasonic transducer (22) are respectively provided on the inner wall of the upper side of the cleaning box (2).
5. The wafer sorting device according to claim 1, characterized in that: An electric controller (23) is fixedly connected to a side wall of one side of the housing (1), and a display screen (24) is fixedly connected to an end of the side wall of one side of the housing (1) away from the controller (23).
6. The wafer sorting device according to claim 1, characterized in that: Support legs (25) are fixedly connected around the bottom end of the housing (1).
7. The wafer sorting device according to claim 1, characterized in that: The liquid inlet pipeline (3) is provided with a liquid extraction pump (13).
8. The wafer sorting device according to claim 5, characterized in that: The electric controller (23) is electrically connected to the display screen (24), and the electric controller (23) is electrically connected to the detection component (7).