Wafer detection platform and line width measurement machine

Abstract

The utility model discloses a wafer detection platform and a line width measuring machine. The wafer detection platform comprises a detection area and at least one PIN thimble. The detection area is located in the center of the table top of the wafer detection platform, the PIN thimbles are arranged on the periphery of the edge of the detection area on the table top of the wafer detection platform, each PIN thimble extends from the surface of the detection area in the direction perpendicular to the detection area to the direction away from the table top of the wafer detection platform, and at least one side, facing the detection area, of the end of each PIN thimble is provided with an inclined plane. And the inclined surface enables the cross section area of at least the end part of the PIN thimble to be gradually reduced along the direction far away from the detection area. When the mechanical arm control unit is aged to cause displacement deviation, the wafer placement position deviates from the detection area, the wafer is in contact with the PIN thimble on the periphery of the edge of the detection area due to the slight displacement deviation, and when the wafer falls on the inclined surface of the PIN thimble, the wafer slides to the detection area of the wafer detection platform through the inclined surface of the tip of the thimble. The improvement not only can improve the detection efficiency, but also can reduce the cost.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a wafer detection platform and a line width measurement machine. Background Art

[0002] The line width measurement machine is a precision instrument specially used to measure line width. It is widely used in many fields, especially in semiconductor manufacturing, printed circuit board (PCB) production and other industries.

[0003] When the line width measurement machine is used for a long time, it will generally face aging problems and high maintenance costs. Through research on line width measurement equipment, the inventor found that many problems of line width measurement machines come from the wafer inspection platform or the robot control unit. However, the inspection and maintenance of the robot control unit generally costs a lot of money and takes a long time, which is not conducive to reducing the inspection cost and inspection efficiency. Utility Model Content

[0004] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a wafer inspection platform and a line width measurement machine to reduce the maintenance cost of the line width measurement machine and improve the inspection efficiency.

[0005] In order to achieve the above-mentioned object and other related objects, the present invention provides a wafer inspection platform, comprising:

[0006] The testing area is located at the center of the table of the wafer testing platform, and the testing area is used to place the wafer to be tested;

[0007] At least one PIN ejector pin is arranged on the outer edge of the detection area on the table of the wafer detection platform. Each PIN ejector pin extends from the surface of the detection area in a direction perpendicular to the detection area toward the table away from the wafer detection platform. At least the end of the PIN ejector pin has a slope facing the detection area. The slope makes the cross-sectional area of ​​at least the end of the PIN ejector pin gradually decrease in the direction away from the detection area.

[0008] Optionally, the wafer inspection platform further includes:

[0009] A groove area is arranged on the table of the wafer detection platform, and the groove area includes a part of the edge of the table of the wafer detection platform, and a groove is arranged in the groove area, and the groove is sunken from the table of the wafer detection platform to the inside of the wafer detection platform;

[0010] The flattening area is located on the table of the wafer inspection platform, and is the other part of the table of the wafer inspection platform except the groove area. The inspection area partially covers the groove area and partially covers the flattening area.

[0011] Optionally, the end of each PIN ejector pin has a slope, and the slope causes at least the cross-sectional area of ​​the end of the PIN ejector pin to gradually decrease in a direction away from the detection area.

[0012] Optionally, each PIN ejector pin has an inclined surface, and the inclined surface causes a cross section of each PIN ejector pin to gradually decrease in a direction away from the detection area.

[0013] Optionally, each PIN ejector pin is in a needle tip shape, or an end of each PIN ejector pin is in a needle tip shape.

[0014] Optionally, the wafer inspection platform includes four PIN ejectors, and the four PIN ejectors are arranged at intervals around the edge of the inspection area.

[0015] Optionally, the table top of the wafer inspection platform includes a first side, a second side, a third side and a fourth side sequentially connected along a circumferential direction, the first side and the third side are arranged opposite to each other, and the second side and the fourth side are arranged opposite to each other.

[0016] Optionally, the groove area is arranged near the first edge and the second edge, and the portion where the first edge is connected to the second edge and the corresponding corner area are recessed from the table surface of the wafer inspection platform toward the inside of the wafer inspection platform to form a groove in the groove area.

[0017] According to one aspect of the utility model, a line width measurement machine is also provided, and the line width measurement machine includes the above-mentioned wafer detection platform.

[0018] Optionally, the wafer inspection platform is arranged on a line width measurement machine, and the line width measurement machine further comprises:

[0019] The wafer temporary storage table is set on the line width measurement machine and is separated from the wafer inspection platform;

[0020] A robotic arm control unit is arranged between the wafer inspection platform and the wafer temporary storage platform;

[0021] A robotic arm is arranged between the wafer inspection platform and the wafer temporary storage platform, and the robotic arm is controlled and connected with a robotic arm control unit;

[0022] At least one pair of sensors is arranged on the line width measuring machine and is arranged outside the edge of the wafer detection platform close to the wafer detection platform. Each pair of sensors is arranged opposite to each other, and the position connection line of each pair of sensors passes through the detection area.

[0023] Compared with the prior art, the wafer inspection platform and line width measurement machine described in the utility model have at least the following beneficial effects:

[0024] The wafer inspection platform of the utility model includes an inspection area and at least one PIN ejector. The inspection area is located at the center of the table of the wafer inspection platform, and the inspection area is used to place the wafer to be tested. The PIN ejector is arranged on the outer edge of the inspection area on the table of the wafer inspection platform, and each PIN ejector extends from the surface of the inspection area in a direction perpendicular to the inspection area to the direction away from the table of the wafer inspection platform, and at least the end of the PIN ejector has an inclined surface facing the side of the inspection area, and the inclined surface makes at least the cross-sectional area of ​​the end of the PIN ejector gradually decrease in the direction away from the inspection area. When the mechanical arm control unit ages and a displacement deviation occurs, the placement position of the wafer deviates from the inspection area, and the slight displacement deviation causes the wafer to contact the PIN ejector at the outer edge of the inspection area. When the wafer falls on the inclined surface of the PIN ejector, the wafer will slide through the inclined surface of the ejector needle tip to the inspection area of ​​the wafer inspection platform. The purpose of this modification is to avoid equipment downtime caused by slight deviation of the mechanical arm control unit on the line width measurement machine, and improve the inspection efficiency.

[0025] Moreover, when the robot control unit on the line width measurement machine slightly deviates and causes the equipment to shut down, the ball screw replacement and maintenance calibration of the robot control unit will be replaced by modification or special customization of the PIN ejector of the wafer inspection platform. The replacement and maintenance calibration of the ball screw of the robot control unit, which was originally required every year, can be relatively extended to once every 2-3 years, and the cost of each time is greater than about 93,000. The annual cost of 4 machines is expected to be about 372,000. It only costs a few hundred yuan to modify or customize the PIN ejector of the wafer inspection platform, and it is a one-time investment, and no maintenance is required in the future. Furthermore, the utility model is also conducive to reducing the maintenance cost of the line width measurement machine.

[0026] The line width measurement machine of the utility model includes the above-mentioned wafer detection platform and also has the above-mentioned technical effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a schematic diagram of the structure of a wafer inspection platform in an embodiment of the utility model;

[0028] Figure 2 This is a schematic diagram of the structure of a PIN ejector pin in an example of an embodiment of the present utility model;

[0029] Figure 3 This is a schematic diagram of the structure of a PIN ejector in another example of the embodiment of the utility model;

[0030] Figure 4 , Figure 5 This is a schematic diagram of the structure of a PIN ejector in another example of the embodiment of the present utility model;

[0031] Figure 6It is a structural schematic diagram of a line width measuring machine in an embodiment of the utility model.

[0032] List of reference numerals:

[0033] 1 Wafer inspection platform

[0034] 10. Detection Area

[0035] 11 PIN ejector

[0036] 111 bevel

[0037] 12 Groove area

[0038] 13 Leveling area

[0039] 14 First side

[0040] 15 Second side

[0041] 16 The third side

[0042] 17 The Fourth Side

[0043] 2 Wafer storage station

[0044] 3 Robotic arm control unit

[0045] 4 Robotic Arm

[0046] 5 Sensors DETAILED DESCRIPTION

[0047] The following is a specific embodiment of the present invention. People familiar with the technology can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments. The details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict.

[0048] It should be noted that the illustrations provided in the embodiments of the present invention are only used to illustrate the basic concept of the present invention in a schematic manner. Although the illustrations only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation, the form, quantity and proportion of each component can be changed at will during actual implementation, and the layout of the components may also be more complex. The structures, proportions, sizes, etc. illustrated in the drawings of the specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions that can be implemented in this application, so they have no technical substantive significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed in this application without affecting the effects and purposes that can be achieved by the present invention.

[0049] After studying the line width measurement equipment, the inventor found that many alarms or downtime problems of the line width measurement machine are caused by the wafer detection platform or the robot control unit. For example, a large part of the cause of the alarm of the line width measurement machine is the aging of the ball screw of the robot control unit. The aging of the ball screw will cause its internal gap to gradually increase. The increase in this gap will affect the accuracy and stability of the robot control unit, causing it to "shift" when moving the wafer, causing the wafer to rest on the PIN ejector of the wafer detection platform, causing the sensor to alarm and causing the equipment to shut down. It needs to be sent to the supplier for calibration and maintenance every year, which is expensive and takes a long time.

[0050] In order to solve the background technology and the above-mentioned technical problems, the present embodiment provides a wafer inspection platform and a line width measurement machine, which can reduce maintenance costs and improve inspection efficiency.

[0051] The utility model is described in detail below in conjunction with specific embodiments.

[0052] Example 1

[0053] This embodiment provides a wafer inspection platform. Figure 1 The wafer inspection platform 1 includes an inspection area 10 and a PIN ejector pin 11 .

[0054] Specifically, refer to Figure 1, the detection area 10 is located at the center of the table of the wafer detection platform 1. The detection area 10 is the area where the wafer is placed when the wafer is subjected to line width detection. Optionally, the detection area 10 is circular. Optionally, the wafer detection platform 1 also includes a groove area 12 and a flat area 13, the groove area 12 is arranged on the table of the wafer detection platform 1, and includes a partial edge of the table of the wafer detection platform 1, and a groove is arranged in the groove area 12, and the groove of the groove area 12 is recessed from the table of the wafer detection platform 1 to the inside of the wafer detection platform 1. The flat area 13 is located on the table of the wafer detection platform 1, and is another part of the table of the wafer detection platform 1 except the groove area. The detection area 10 partially covers the groove area 12 and partially covers the flat area 13.

[0055] Reference Figure 1 , PIN ejector pins 11 are arranged on the periphery of the edge of the detection area 10 on the table of the wafer detection platform 1. The function of the PIN ejector pins 11 is to position or fix the wafer. When performing the detection, the detection area can be determined by the position of the PIN ejector pins 11, or the PIN ejector pins 11 can be used to limit the wafer to be tested in the detection area 10 during the wafer detection process. The number of PIN ejector pins is 1 or more, and generally the number of PIN ejector pins is two or more, so that multiple PIN ejector pins can be used to cooperate to achieve the limit of the wafer to be tested. Figure 1 In this embodiment, the table of the wafer inspection platform 1 includes four PIN ejector pins 11, and the four PIN ejector pins 11 are arranged at intervals around the periphery of the edge of the inspection area 10. Figure 1 The table surface of the wafer inspection platform 1 is sequentially connected with a first side 14, a second side 15, a third side 16 and a fourth side 17 along the circumferential direction. The first side 14 is arranged opposite to the third side 16, and the second side 15 is arranged opposite to the fourth side 17. In this embodiment, two PIN ejector pins 11 are arranged between the inspection area 10 and the fourth side 17, one PIN ejector pin 11 is arranged between the inspection area 10 and the first side 14, and the other PIN ejector pin 11 is arranged between the inspection area 10 and the corner of the second side 15 and the third side 16. The groove area 12 is arranged close to the first side 14 and the second side 15, and the portion where the first side 14 and the second side 15 are connected and the corresponding corner area are recessed from the table surface of the wafer inspection platform 1 to the inside of the wafer inspection platform 1, forming a groove of the groove area 12.

[0056] Each PIN ejector pin 11 extends from the surface of the detection area 10 in a direction perpendicular to the detection area 10 toward the table direction away from the wafer detection platform 1, and at least the end of the PIN ejector pin 11 has a bevel 111 facing the detection area 10. The bevel 11 makes at least the cross-sectional area of ​​the end of the PIN ejector pin 11 gradually decrease in the direction away from the detection area 10. Optionally, the PIN ejector pin is detachably connected to the wafer detection platform, for example, by a threaded connection, so as to facilitate the replacement of the PIN ejector pin. When the robot control unit ages and a displacement deviation occurs, the wafer placement position deviates from the detection area 10. The slight displacement deviation causes the wafer to contact the PIN ejector pin 11 at the edge of the detection area 10. When the wafer falls on the bevel of the PIN ejector pin 11, the wafer will slide through the bevel of the ejector pin tip to the detection area 10 of the wafer detection platform 1. The purpose of this modification is to avoid equipment downtime caused by slight deviation of the robot control unit on the line width measurement machine, and improve the detection efficiency. In addition, when the robot control unit on the line width measurement machine slightly deviates and causes the equipment to shut down, the ball screw replacement and maintenance calibration of the robot control unit will be replaced by modification or special customization of the PIN ejector 11 of the wafer inspection platform 1. The replacement and maintenance calibration of the ball screw of the robot control unit, which was originally required every year, can be relatively extended to once every 2-3 years, with a cost of more than 93,000 yuan each time, and the estimated cost of 4 machines is about 372,000 yuan per year. Modification or special customization of the PIN ejector 11 of the wafer inspection platform only costs a few hundred yuan each, and it is a one-time investment and does not require maintenance in the future.

[0057] It should be noted that as long as the side of the PIN ejector facing the detection area has an inclined surface, the wafer can slide back to the detection area with the help of the inclined surface, and the technical effect of the utility model can be achieved. The inclined surface can be located at the end of the PIN ejector or at the entire PIN ejector. The utility model has no restrictions on the size of the inclined surface and the specific structural design relative to the PIN ejector.

[0058] In one example, refer to Figure 2 The end of each PIN ejector pin 11 has a slope 111 , and the slope 111 makes at least the cross-sectional area of ​​the end of the PIN ejector pin 11 gradually decrease along the direction away from the detection area 10 .

[0059] In another example, referring to Figure 3 Each PIN ejector pin 11 has an inclined surface 111 , and the inclined surface 111 makes the cross-sectional area of ​​each PIN ejector pin 11 gradually decrease along the direction away from the detection area 10 .

[0060] In yet another example, referring to Figure 4 and Figure 5Each PIN ejector pin 11 is in the shape of a needle tip, or the end of each PIN ejector pin 11 is in the shape of a needle tip. This design does not need to consider the direction of the PIN ejector pin 11 during installation, and the installation is more convenient.

[0061] It should be noted that the above Figure 2-5 The attached figure shows a structure where the PIN ejector pin is exposed above the wafer inspection platform surface. The PIN ejector pin also includes a connection structure with the wafer inspection platform surface below. Figure 2-5 Not shown in .

[0062] Example 2

[0063] This embodiment provides a line width measurement device, which includes the wafer inspection platform in Embodiment 1. The same technical effects as in Embodiment 1 are also achieved.

[0064] In a specific example, referring to Figure 6 In addition to the wafer detection platform in Example 1, the line width measurement device also includes a wafer temporary storage table 2, a robot control unit 3, a robot 4 and at least one pair of sensors 5.

[0065] Among them, the wafer temporary storage table 2 is arranged on the line width measurement machine, and is arranged at a distance from the wafer detection platform 1. The wafer temporary storage table 2 is used to receive and temporarily store external wafers. The robot control unit 3 is arranged between the wafer detection platform 1 and the wafer temporary storage table 2, and is used to control the up and down and pendulum movement of the robot 3. The robot 4 is arranged between the wafer detection platform 10 and the wafer temporary storage table 2. The robot 4 is controlled and connected with the robot control unit 3, and is used to transfer the wafers on the wafer temporary storage table 2 to the wafer detection platform 1. At least one pair of sensors is arranged on the line width measurement machine, and is arranged outside the edge of the wafer detection platform 1 close to the wafer detection platform 1. The two sensors 5 are arranged oppositely, and the position connection line of the two sensors 5 passes through the detection area 10. The sensor 5 is used to monitor whether the wafer is placed flat in the detection area 10. When the wafer is placed in the inspection area on the wafer inspection platform 1, the two sensors 5 send signals for each other to feedback. When the wafer is placed on the PIN ejector pin 11 due to position displacement, the mutual feedback signals between the two sensors 5 are interrupted and the machine alarms.

[0066] In this example, refer to Figure 6 , the wafer to be tested is placed on the wafer temporary storage table 2. When the line width detection on the wafer is required, the robot control unit 3 controls the robot 4 to move to the wafer temporary storage table 2. The robot 4 clamps the wafer on the wafer temporary storage table 2 and moves to the position corresponding to the detection area 10 of the wafer detection platform 1 to place the wafer to be tested. The sensor 5 set on the wafer detection platform 1 senses the placement position of the wafer and determines whether the wafer is placed in the detection area 10 and whether it is placed flat. If a position offset occurs, an alarm will be issued, or the machine will shut down. Reference Figure 1-6 In this embodiment, the inclined surface structure of the PIN ejector pin 11 arranged at the outer edge of the detection area 10 can make the wafer slide to the detection area 10 even if the position of the wafer is slightly shifted due to aging of the robot arm control unit 3, thereby avoiding alarms or downtime and improving detection efficiency. The ejector pin structure setting can also reduce the maintenance cost of replacing or repairing the robot arm control unit 3.

[0067] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the technology may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed in the present invention shall still be covered by the claims of the present invention.

Claims

1. A wafer inspection platform, characterized in that: include: A testing area, located at the center of the table of the wafer testing platform, and the testing area is used to place the wafer to be tested; At least one PIN ejector pin is arranged on the outer edge of the detection area on the table of the wafer detection platform, each of the PIN ejector pins extends from the surface of the detection area in a direction perpendicular to the detection area toward a direction away from the table of the wafer detection platform, and at least the end of the PIN ejector pin has a slope facing the detection area, and the slope makes the cross-sectional area of ​​at least the end of the PIN ejector pin gradually decrease in the direction away from the detection area.

2. The wafer inspection platform according to claim 1, characterized in that: The wafer inspection platform also includes: A groove area is arranged on the table of the wafer detection platform, and the groove area includes a part of the edge of the table of the wafer detection platform, and a groove is arranged in the groove area, and the groove is recessed from the table of the wafer detection platform to the inside of the wafer detection platform; The flattening area is located on the table of the wafer detection platform, and is another part of the table of the wafer detection platform except the groove area. The detection area partially covers the groove area and partially covers the flattening area.

3. The wafer inspection platform according to claim 1, characterized in that: The end of each PIN ejector pin has a slope, and the slope makes at least the cross-sectional area of ​​the end of the PIN ejector pin gradually decrease along the direction away from the detection area.

4. The wafer inspection platform according to claim 1, characterized in that: Each of the PIN ejector pins has an inclined surface, and the inclined surface causes the cross section of each of the PIN ejector pins to gradually decrease in a direction away from the detection area.

5. The wafer inspection platform according to claim 1, characterized in that: Each of the PIN ejector pins is in the shape of a needle tip, or an end of each of the PIN ejector pins is in the shape of a needle tip.

6. The wafer inspection platform according to claim 1, characterized in that: The wafer inspection platform includes four PIN ejectors, which are arranged at intervals around the edge of the inspection area.

7. The wafer inspection platform according to claim 2, characterized in that: The table top of the wafer inspection platform includes a first side, a second side, a third side and a fourth side which are sequentially connected along a circumferential direction, the first side and the third side are arranged opposite to each other, and the second side and the fourth side are arranged opposite to each other.

8. The wafer inspection platform according to claim 7, characterized in that: The groove area is arranged close to the first side and the second side, and the portion where the first side is connected to the second side and the corresponding corner area are recessed from the table surface of the wafer inspection platform toward the inside of the wafer inspection platform to form a groove in the groove area.

9. A line width measuring machine, characterized in that: The line width measurement machine comprises a wafer detection platform, and the wafer detection platform is the wafer detection platform according to any one of claims 1-8.

10. The line width measuring machine according to claim 9, characterized in that: The wafer inspection platform is arranged on the line width measurement platform, and the line width measurement platform further comprises: A wafer temporary storage platform is arranged on the line width measurement machine platform and is spaced apart from the wafer detection platform; A robot control unit is arranged between the wafer inspection platform and the wafer temporary storage platform; A robotic arm is arranged between the wafer inspection platform and the wafer temporary storage platform, and the robotic arm is controlled and connected to a robotic arm control unit; At least one pair of sensors is arranged on the line width measurement machine and is arranged outside the edge of the wafer detection platform close to the wafer detection platform. Each pair of sensors is arranged opposite to each other, and the position line of each pair of sensors passes through the detection area.

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