Wafer box carrying table and semiconductor machine table
By using a combination of movable chamfered limit and sliding tracks on the wafer box stage of the semiconductor machine, the problem of high accuracy and low fault tolerance in the prior art wafer box placement position is solved, and a higher placement accuracy and fault tolerance are achieved, avoiding wafer scratches and economic losses.
Patent Information
- Application Number
- CN202421554961.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-02
- Publication Date
- 2025-06-06
- Estimated Expiration
- 2034-07-02
AI Technical Summary
The wafer box carriers of existing semiconductor machines require high accuracy and low fault tolerance, which leads to slight deviations in the machine when placing the wafer box, which can easily lead to poor wafer position, which will lead to wafer scratches and product scrapping.
A wafer box stage is designed, and a combination of a movable chamfered limit and a sliding track is used to slide along the sliding track by movable chamfered limit, thereby increasing the area of the placing area of the wafer box, and correcting the problem of poor initial position after being placed to ensure that the wafer box is in the correct position.
It improves the accuracy of the position of wafer boxes on the stage, increases the fault tolerance, avoids wafer scratches, and reduces economic losses caused by wafer scrapping.
Smart Images
Figure CN222953050U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the semiconductor field, in particular to a wafer box carrier and a semiconductor machine. Background Art
[0002] In the semiconductor field, factories usually need semiconductor wafer handling equipment during processing. Currently, wafers are usually placed in a wafer box (Cassette), and a wafer box carrier (Stage) is used to transport the wafer box to achieve wafer transportation. The wafer box placement limiter of the wafer box carrier of the existing semiconductor machine is a fixed chamfer limiter, which requires high precision and low fault tolerance for the placement of the wafer box. If the machine deviates slightly during the placement of the wafer box, it is easy to cause the wafer box to be in a bad position on the wafer box carrier, which in turn causes the robotic arm to scratch the wafer (Wafer) when taking the wafer, resulting in product scrapping and large economic losses.
[0003] Therefore, how to improve the placement accuracy of the wafer box on the wafer box carrier to avoid scratching the wafer is a problem that needs to be solved at present. Summary of the invention
[0004] The technical problem to be solved by the utility model is how to improve the placement accuracy of a wafer box on a wafer box carrier to avoid wafer scratches, and to provide a wafer box carrier and a semiconductor machine.
[0005] In order to solve the above problems, the utility model provides a wafer box carrier, comprising: a main body, a wafer box placement area is provided on the surface of the main body for placing the wafer box; at least one sliding track is provided on the surface of the main body, and the sliding track includes a first end located at the edge of the wafer box placement area and a second end away from the wafer box placement area; at least two chamfer limit parts are provided on the surface of the main body, at least one of the chamfer limit parts is a movable chamfer limit part, and the movable chamfer limit part is provided on the sliding track and can slide along the sliding track.
[0006] In some embodiments, there are two chamfering limit portions, and both of the chamfering limit portions are movable chamfering limit portions.
[0007] In some embodiments, there are two chamfer limit portions, one of which is a fixed chamfer limit portion, and the other chamfer limit portion is a movable chamfer limit portion.
[0008] In some embodiments, the wafer box carrier further includes: a power device, located below the main body and connected to the movable chamfering limiter, for driving the movable chamfering limiter to slide along the sliding track.
[0009] In some embodiments, the wafer box carrier further includes: a connecting rod, one end of which is connected to the movable chamfering limit part, and the other end is connected to a power device, and the power device drives the movable chamfering limit part to slide along the sliding track through the connecting rod.
[0010] In some embodiments, the distance between the second end of the sliding track and the edge of the wafer box placement area is 1 cm to 5 cm.
[0011] In some embodiments, the movable chamfered stopper can slide along the sliding track toward the second end of the sliding track when placing the wafer box, so as to increase the area where the wafer box can be placed.
[0012] In some embodiments, the movable chamfer stopper can slide along the slide track to the first end of the slide track after the wafer box is placed, so as to push the offset wafer box back to the wafer box placement area.
[0013] In some embodiments, the main body further has a groove in the wafer box placement area for assisting in limiting the position of the wafer box.
[0014] In order to solve the above problems, the utility model provides a semiconductor machine, including the wafer box carrier described in the utility model.
[0015] The above technical solution can increase the error tolerance when placing the wafer box by setting a movable chamfer limiter, and can also effectively correct the problem of a bad initial position of the wafer box, so that the wafer box works in the correct position every time, and prevents wafer scratches caused by the position of the robotic arm when taking the wafer, and reduces the economic losses caused by scrapped wafers. The movable chamfer limiter can slide to the second end of the sliding track before placing the wafer box, which can effectively increase the area where the wafer box can be placed. When the wafer box is placed on the wafer box carrier, even if the initial position of the wafer box is not good, the wafer box can be pushed to the correct position by sliding the movable chamfer limiter, thereby achieving the purpose of correcting the placement position of the wafer box.
[0016] It should be understood that the above general description and the detailed description below are only exemplary and explanatory and cannot limit the present invention. The techniques, methods and devices known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the techniques, methods and devices should be considered as part of the authorization specification. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the technical solutions in the specific implementation of the utility model, the following is a brief introduction to the drawings required for the description of the specific implementation. Obviously, the drawings described below are only some specific implementations of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0018] Figure 1 This is a structural schematic diagram of an embodiment of the wafer box carrier of the utility model, in which the movable chamfering limiter is located at the second end of the sliding track.
[0019] Figure 2 This is a schematic structural diagram of an embodiment of the wafer box carrier of the utility model, in which the movable chamfering limiter is located at the first end of the sliding track.
[0020] Figure 3 A schematic structural diagram of another embodiment of the wafer box carrier of the present invention. DETAILED DESCRIPTION
[0021] The technical scheme in the embodiment of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.
[0022] Please also read Figure 1-2 ,in, Figure 1 This is a schematic structural diagram of an embodiment of the wafer box carrier of the utility model, in which the movable chamfering limiter is located at the second end of the sliding track; Figure 2 This is a schematic diagram of the structure of the movable chamfering stopper of an embodiment of the wafer box carrier of the utility model located at the second end of the sliding track, wherein the invisible part is drawn with dotted lines. Figure 1-2 As shown, the wafer box carrier includes: a body 11, at least one sliding rail 12, and at least two chamfering stoppers. A wafer box placement area 110 is provided on the surface of the body 11 for placing a wafer box 19. The sliding rail 12 is provided on the surface of the body 11, and the sliding rail 12 includes a first end 121 located at the edge of the wafer box placement area 110 and a second end 122 away from the wafer box placement area 110. The chamfering stoppers are provided on the surface of the body 11, and at least one of the chamfering stoppers is a movable chamfering stopper 131, and the movable chamfering stopper 131 is provided on the sliding rail 12 and can slide along the sliding rail 12.
[0023] The above technical solution can increase the fault tolerance when placing the wafer box by setting a movable chamfer limit part, and can also effectively correct the problem of a bad initial position of the wafer box, so that the wafer box can work in the correct position every time, and prevent the wafer from being scratched due to the position of the robot arm when taking the wafer, thereby reducing the economic losses caused by wafer scrapping.
[0024] exist Figure 1-2 In the embodiment shown, there are two chamfering limit parts, and both of them are movable chamfering limit parts 131. In other embodiments, there may be three, four or more chamfering limit parts to make the limit more accurate and avoid deviation; each of the chamfering limit parts is a movable chamfering limit part 131, which is arranged on the sliding track 12 and can slide along the sliding track 12.
[0025] In some embodiments, the wafer box carrier also includes: a power device 14. The power device 14 is located below the main body 11 and is connected to the movable chamfering limiter 131, and is used to drive the movable chamfering limiter 131 to slide along the sliding rail 12. In this embodiment, the power device 14 is a stepper motor. In other embodiments, the power device 14 can also be a cylinder. The sliding of the movable chamfering limiter 131 is controlled by setting the power device 14, and the open position is the position before the wafer box 19 is placed, that is, the movable chamfering limiter 131 slides along the sliding rail 12 to the position of the second end 122 of the sliding rail 12, as shown in FIG. Figure 1 The closed position is the working position of the wafer box 19, that is, the movable chamfering stopper 131 slides along the sliding track 12 to the position of the first end 121 of the sliding track 12, such as Figure 2 Furthermore, in the process that the movable chamfering stopper 131 slides along the slide track 12 to the first end 121 of the slide track 12 , the position of the wafer box 19 can also be corrected.
[0026] In some embodiments, the wafer box carrier further includes: a connecting rod 15. One end of the connecting rod 15 is connected to the movable chamfering limiter 131, and the other end is connected to the power device 14, and the power device 14 drives the movable chamfering limiter 131 to slide along the sliding track 12 through the connecting rod 15. In this embodiment, the connecting rod 15 is a telescopic rod, and the telescopic rod can be extended and retracted along the sliding direction of the movable chamfering limiter 131 under the drive of the power device 14. In other embodiments, the connecting rod 15 can also be a ball screw.
[0027] In some embodiments, the distance between the second end 122 of the slide track 12 and the edge of the wafer box placement area 110 is 1 cm to 5 cm. In this embodiment, the distance between the second end 122 of the slide track 12 and the edge of the wafer box placement area 110 is 2 cm. In other embodiments, the distance between the second end 122 of the slide track 12 and the edge of the wafer box placement area 110 can also be 1 cm, 3 cm, 4 cm or 5 cm.
[0028] like Figure 1 As shown, in some embodiments, the movable chamfer limit portion 131 can slide along the sliding track 12 to the second end 122 of the sliding track 12 when placing the wafer box 19, so as to increase the placement area of the wafer box 19 and increase the fault tolerance when placing the wafer box 19.
[0029] like Figure 2 As shown, in some embodiments, the movable chamfer limit portion 131 can slide along the sliding track 12 to the first end 121 of the sliding track 12 after the wafer box 19 is placed, so as to push the offset wafer box 19 back to the wafer box placement area 110, effectively correcting the problem of the bad initial position of the wafer box 19, so that the wafer box 19 works in the correct position every time, eliminating wafer scratches caused by the position of the robot arm when taking the wafer, and reducing the economic losses caused by wafer scrapping.
[0030] In some embodiments, the body 11 further has a groove (not shown) in the wafer box placement area 110 for assisting in limiting the position of the wafer box 19 .
[0031] See also Figure 3 , which is a structural schematic diagram of another embodiment of the wafer box carrier described in the present invention, wherein the invisible parts are drawn with dotted lines. Figure 3 The embodiment shown is Figure 1-2 The embodiment shown is different in that there are two chamfering limit parts, one of which is a fixed chamfering limit part 330, and the other chamfering limit part is a movable chamfering limit part 331, and the movable chamfering limit part 331 is disposed on the sliding track 32 and can slide along the sliding track 32. In other embodiments, there may be three chamfering limit parts, one of which is a fixed chamfering limit part 330, and the other two chamfering limit parts are movable chamfering limit parts 331; or there may be four chamfering limit parts, two of which are fixed chamfering limit parts 330, and the other two chamfering limit parts disposed opposite to the two fixed chamfering limit parts 330 are movable chamfering limit parts 331.
[0032] In some embodiments, the movable chamfer limit portion 331 can slide along the sliding track 32 toward the second end 322 of the sliding track 32 when placing the wafer box 39, so as to increase the placement area of the wafer box 39 and increase the fault tolerance when placing the wafer box 39.
[0033] In some embodiments, the movable chamfer limit portion 331 can slide along the sliding track 32 to the first end 321 of the sliding track 32 after the wafer box 39 is placed, so as to push the offset wafer box 39 back to the wafer box placement area 310, effectively correcting the problem of the wafer box 39 having a bad initial position, so that the wafer box 39 works in the correct position every time, eliminating wafer scratches caused by the position of the robot arm when taking the wafer, and reducing the economic losses caused by wafer scrapping.
[0034] Based on the same inventive concept, an embodiment of the present invention further provides a semiconductor machine. The semiconductor machine described in the present invention comprises: a wafer box carrier; wherein the wafer box carrier adopts the present invention Figure 1 to Figure 3 The wafer box carrier shown is described in detail above and will not be repeated here.
[0035] The above technical solution, by redesigning the chamfering limiter of the wafer box carrier, slots outward at the original position of the wafer box carrier fixed chamfer, and adds a sliding track, the open position is the position before the wafer box is placed, that is, the position where the movable chamfering limiter slides along the sliding track to the second end 122 of the sliding track; the closed position is the working position of the wafer box, that is, the position where the movable chamfering limiter slides along the sliding track to the first end of the sliding track. In addition, in the process of the movable chamfering limiter sliding along the sliding track to the first end of the sliding track, the purpose of correcting the position of the wafer box can also be achieved. The sliding chamfering limiter can slide to the second end of the sliding track before placing the wafer box, which can effectively increase the area where the wafer box can be placed. When the wafer box is placed on the wafer box carrier, even if the initial position of the wafer box is not good, the wafer box can be pushed to the correct position by sliding the movable chamfering limiter, thereby achieving the purpose of correcting the placement position of the wafer box.
[0036] It should be noted that references in the specification to "an embodiment", "an embodiment", "an exemplary embodiment", "some embodiments", etc. indicate that the described embodiment may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases do not necessarily refer to the same embodiment. In addition, when a particular feature, structure, or characteristic is described in conjunction with an embodiment, whether or not explicitly described, it is within the knowledge of a technician in the relevant art to implement such feature, structure, or characteristic in conjunction with other embodiments.
[0037] Typically, a term can be understood at least in part from usage in context. For example, the term "one or more" as used herein depends at least in part on the context and can be used to describe any feature, structure or characteristic in a singular sense, or can be used to describe a combination of features, structures or features in a plural sense. Similarly, terms such as "one", "a" or "the" can also be understood to express singular usage or to express plural usage, depending at least in part on the context. In addition, the term "based on" can be understood to not necessarily be intended to express a set of exclusive factors, but can alternatively, also at least in part depending on the context, allow for the presence of other factors that are not necessarily explicitly described. It should also be noted in this specification that "connected / coupled" refers not only to the direct coupling of one component to another component, but also to the indirect coupling of one component to another component through an intermediate component.
[0038] It should be noted that the terms "including" and "having" and their variations involved in the documents of the present utility model are intended to cover non-exclusive inclusions. The terms "first", "second", etc. are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. Unless the context clearly indicates otherwise, it should be understood that the data used in this way can be interchanged under appropriate circumstances. In addition, the embodiments of the present utility model and the features in the embodiments can be combined with each other unless there is a conflict. In addition, in the above description, the description of well-known components and technologies is omitted to avoid unnecessary confusion of the concepts of the present utility model. In the above-mentioned embodiments, each embodiment focuses on the differences from other embodiments, and the same / similar parts between the embodiments can be referred to each other.
[0039] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.
Claims
1. A wafer box carrier, characterized in that: include: A body, wherein a wafer box placement area is provided on the surface of the body for placing the wafer box; A plurality of sliding rails are arranged on the surface of the main body, each of the sliding rails includes a first end located at the edge of the wafer box placement area and a second end away from the wafer box placement area; a plurality of chamfering limit parts are arranged on the surface of the main body, and the plurality of chamfering limit parts are movable chamfering limit parts, and the movable chamfering limit parts are arranged one by one on the sliding rails and can slide along the sliding rails.
2. The wafer box carrier according to claim 1, characterized in that: Also includes: A power device is located below the main body and connected to the movable chamfering limiter, and is used for driving the movable chamfering limiter to slide along the sliding track.
3. The wafer box carrier according to claim 2, characterized in that: Also includes: A connecting rod has one end connected to the movable chamfering limiter and the other end connected to a power device, and the power device drives the movable chamfering limiter to slide along the sliding track through the connecting rod.
4. The wafer box carrier according to claim 1, characterized in that: The distance between the second end of the sliding track and the edge of the wafer box placement area is 1 cm to 5 cm.
5. The wafer box carrier according to claim 1, characterized in that: The movable chamfering stopper can slide along the sliding track to the second end of the sliding track when placing a wafer box, so as to increase the placement area of the wafer box.
6. The wafer box carrier according to claim 5, characterized in that: The movable chamfering stopper can slide along the sliding track to the first end of the sliding track after the wafer box is placed, so as to push the offset wafer box back to the wafer box placement area.
7. The wafer box carrier according to claim 1, characterized in that: The main body also has a groove in the wafer box placement area for assisting in limiting the position of the wafer box.
8. A semiconductor machine, characterized in that: It comprises a wafer box carrier as described in any one of claims 1 to 7.