Semiconductor wafer rewinding machine

Abstract

The utility model relates to the technical field of wafer carrying devices, in particular to a semiconductor wafer rewinding machine which comprises a machine table, a mounting table is slidably arranged in the middle of the machine table in the horizontal direction, the mounting table is used for being connected with a wafer box, and a rewinding selection groove is formed in the middle of the machine table. The mounting tables located on the two sides of the rewinding selection groove move oppositely or oppositely, and telescopic pieces are arranged at the two ends of the machine table so that the machine table can incline. The wafer reversing device has the following effects that when wafer reversing needs to be carried out, two corresponding wafer boxes are placed on the two sides of the machine table, the two wafer boxes can oppositely move on the machine table and move to the middle to be converged, at the moment, the wafer boxes on the two sides can be communicated through the wafer reversing selection groove, one side of the machine table is lifted up through the telescopic piece, and the wafer reversing selection groove can be communicated with the wafer boxes on the two sides; and therefore, the wafer in the wafer box on one side can slide into the wafer box on the other side, and a relatively convenient wafer reversing operation can be realized.

Description

Technical Field

[0001] The present application relates to the technical field of wafer handling devices, and in particular to a semiconductor wafer flipping machine. Background Art

[0002] In the wafer processing process, the wafer needs to be placed in a wafer box, and operations such as wafer flipping and wafer replacement need to be performed in different processes or processing steps. There are two traditional ways of flipping wafers: the first is to use a probe station to move the wafer out of the wafer box, and then place a new wafer box. The probe station puts the previously taken out wafer into the new wafer box. This method is cumbersome and time-consuming; the second is to manually move the wafer from one wafer box to another, which is prone to secondary contamination and breakage risks. The above two methods have high operating risks and low slicing efficiency. Utility Model Content

[0003] In order to more conveniently perform wafer flipping, the present application provides a semiconductor wafer flipping machine.

[0004] A semiconductor wafer flipping machine provided in the present application adopts the following technical solution: a semiconductor wafer flipping machine, including a machine table, a mounting table is provided in the middle of the machine table for sliding in the horizontal direction, the mounting table is used to connect the wafer box, the middle of the machine table has a flipping selection slot, the mounting tables located on both sides of the flipping selection slot move toward or away from each other, and the two ends of the machine table have telescopic parts to allow the machine table to tilt.

[0005] By adopting the above technical solution, when flipping is required, two corresponding wafer boxes are placed on both sides of the machine, and the two wafer boxes will move toward each other on the machine and merge in the middle. At this time, the wafer boxes on both sides can be connected through the flip selection slot, and one side of the machine can be lifted by the telescopic part, thereby tilting to form a height difference, so that the wafer in the wafer box on one side can slide to the wafer box on the other side, realizing a more convenient flipping operation.

[0006] Preferably, a hanging tower is provided in the middle of the machine, a box opening module is connected to the hanging tower, and the box opening module is connected to the hanging tower via a telescopic cylinder.

[0007] Preferably, the telescopic member is a lifting cylinder, one end of which is connected to the machine platform, and the other end of which is used to be supported on the ground.

[0008] Preferably, one end of the lifting cylinder is connected to a transition block, and the transition block is rotatably connected to the machine platform.

[0009] Preferably, the inclination angle of the machine table ranges from 5° to 20°.

[0010] Preferably, the film rewinding selection slot has a plurality of guide slots corresponding to the inner cavity of the box body, and a control push rod is slidably arranged in each guide slot for opening or closing the guide slot.

[0011] Preferably, a rotary transmission belt is provided on the machine platform, and the mounting platform is detachably connected to the rotary transmission belt.

[0012] Preferably, the rotary transmission belt has a connecting block, the mounting platform has a connecting seat matched with the connecting block, and the connecting seat has an embedding block embedded in the connecting block.

[0013] Preferably, the connecting seat has a receiving groove for the connecting block to be embedded in, and an elastic positioning member is provided on the connecting seat and located in the receiving groove.

[0014] Preferably, the platform is further provided with a guide rod, the guide rod passes through the mounting platform, and two guide rods are arranged in parallel.

[0015] In summary, the present application includes at least one of the following beneficial technical effects:

[0016] 1. When film reversal is required, two corresponding wafer boxes are placed on both sides of the machine. The two wafer boxes will move towards each other on the machine and meet in the middle. At this time, the wafer boxes on both sides can be connected through the film reversal selection slot. One side of the machine is lifted by the telescopic part, so that it is tilted to form a height difference, so that the wafer in one wafer box slides to the other wafer box, realizing a more convenient film reversal operation;

[0017] 2. Selective rewinding can be achieved by controlling the opening and closing of the push rod in the rewind selection slot;

[0018] 3. When installing the connecting seat, the elastic positioning piece can play a role of pre-positioning, making it easier for the connecting block to be embedded in the receiving groove. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a schematic diagram of the structure of Example 1 of the present application;

[0020] Figure 2 is a partial explosion schematic diagram of Example 1 of the present application;

[0021] Figure 3 yes Figure 2 A magnified view of part A in FIG.

[0022] Figure 4 is a partial cross-sectional view of the rotary transmission belt and the mounting platform in Example 2 of the present application;

[0023] Figure 5 This is another partial cross-sectional view of the rotary transmission belt and the mounting platform in Example 2 of the present application.

[0024] Explanation of the reference numerals: 100, machine platform; 111, mounting platform; 112, rotary transmission belt; 113, guide rod; 114, hanging tower; 115, box opening module; 116, rewind selection groove; 117, guide groove; 118, control push rod; 120, lifting cylinder; 121, transition block; 122, linkage groove; 131, connecting block; 132, connecting seat; 133, accommodating groove; 134, embedded block; 135, spring; 136, positioning column; 137, positioning groove; 142, groove. DETAILED DESCRIPTION

[0025] The present application is further described in detail below in conjunction with the accompanying drawings.

[0026] Embodiment 1: A semiconductor wafer flipping machine, referring to Figure 1 , including a machine platform 100, a mounting platform 111 is slidably arranged in the middle of the machine platform 100 in the horizontal direction, and a rotating transmission belt 112 is arranged on both sides of the machine platform 100. The rotating transmission belt 112 moves on the machine platform 100 in a circular manner, and is generally driven by a motor to move. The mounting platform 111 is fixed on the rotating transmission belt 112, and when the rotating transmission belt 112 moves, it can drive the mounting platform 111 to move. In order to limit the movement trajectory of the mounting platform 111, a guide rod 113 is also arranged on the machine platform 100, and the guide rod 113 is penetrated through the mounting platform 111, and two guide rods 113 are arranged in parallel.

[0027] Reference Figure 1 , Figure 2 , the machine 100 has a hanging tower 114 in the middle, and a box opening module 115 is connected to the hanging tower 114, and the box opening module 115 is connected to the hanging tower 114 through a telescopic cylinder. The mounting table 111 is used to connect and fix the wafer box. The machine 100 has a flip selection slot 116 in the middle, and the mounting tables 111 located on both sides of the flip selection slot 116 move toward or away from each other. The mounting table 111 will drive the wafer box toward the middle of the machine 100, that is, the hanging tower 114 part. At this time, the box opening module 115 is moved toward the wafer box through the telescopic cylinder, so as to open the wafer box. Of course, in other embodiments, the box opening module 115 may not be provided, and the opened wafer box may be placed on the mounting table 111. Specifically, it needs to be changed according to needs.

[0028] The film rewinding selection slot 116 has a plurality of guide slots 117 corresponding to the cavities in the box body, and a control push rod 118 is slidably arranged in each guide slot 117 for opening or closing the guide slot 117. Generally, the control push rod 118 is driven by a cylinder, for example, five vertically distributed guide slots 117 are arranged correspondingly, for example, if the film rewinding is required for the guide slots 1 and 3, the control push rods 118 in the guide slots 1 and 3 are controlled to open. The control push rod 118 is divided into three parts, the middle part is connected to the cylinder, and the parts on both sides are used to insert and close the two sides of the guide slot 117.

[0029] Reference Figure 2 , Figure 3 , both ends of the machine 100 have telescopic parts to allow the machine 100 to tilt. During the tilting process, the opened guide groove 117 can enable the corresponding wafer to move to the wafer box on the other side, and then be closed by the box opening and closing module. In this embodiment, the telescopic part is a lifting cylinder 120, and the end of the lifting cylinder 120 is connected to a transition block 121, and the transition block 121 is rotatably connected to the end of the machine 100, and the other end of the lifting cylinder 120 is supported on the ground. It is worth noting that in this embodiment, the travel range of the lifting cylinder 120 will make the tilt angle of the machine 100 be 5-20°.

[0030] At the same time, in order to ensure smooth lifting, a linkage groove 122 is provided at the end of the platform 100 along the horizontal direction, and the rotation axis of the transition block 121 will be embedded in the linkage groove 122 to adapt to the relative sliding of the two during the lifting process.

[0031] The implementation principle of Example 1 of the present application is as follows: the mounting table 111 is connected to the wafer box and is located on both sides. The mounting table 111 drives the wafer boxes to approach each other. When it moves to the middle, the box opening module 115 moves downward through the telescopic cylinder to open the wafer box, and then the middle rewinding selection slot 116 is selectively opened by controlling the push rod 118. Then one end is raised by the lifting cylinder 120, and then the wafer is reversed. After the rewinding is completed, the wafer box is closed by the box opening module 115 and transported through the mounting table 111.

[0032] Embodiment 2: The difference from Embodiment 1 is that, referring to Figure 4 , Figure 5 The rotary transmission belt 112 has a connecting block 131 , and the mounting table 111 has a connecting seat 132 matched with the connecting block 131 , so that different wafer boxes can be realized by replacing the mounting table 111 .

[0033] Specifically, the connection seat 132 has a receiving groove 133 for the connection block 131 to be embedded, and the connection seat 132 has an embedded block 134 embedded in the connection block 131. In this embodiment, the embedded block 134 is threadedly connected to the connection seat 132, and when the embedded block 134 is embedded in the connection block 131, the connection seat 132 and the connection block 131 are fixed.

[0034] In order to facilitate the docking of the two, an elastic positioning member is provided on the connection seat 132 and located in the receiving groove 133. Positioning grooves 137 are provided on the connection seat 132 and located on both sides of the insert block 134. In this embodiment, the elastic positioning member includes a spring 135 and a positioning column 136. The spring 135 is arranged in the positioning groove 137, and the positioning column 136 is connected and fixed to the end of the spring 135. The end of the positioning column 136 away from the spring 135 is spherical and can contact the outer wall of the connection block 131. At the same time, the outer wall of the connection block 131 has a groove 142 for the end of the positioning column 136 to be embedded, so that the spring 135 embeds the positioning column 136 to form a pre-positioning, and then the insert block 134 is embedded in the connection block 131 to achieve the final positioning.

[0035] The embodiments of this specific implementation method are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. Therefore, all equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A semiconductor wafer flipping machine, comprising a machine platform (100), characterized in that: A mounting platform (111) is provided in the middle of the machine (100) so as to slide in the horizontal direction. The mounting platform (111) is used to connect a wafer box. A wafer flip selection groove (116) is provided in the middle of the machine (100). The mounting platforms (111) located on both sides of the wafer flip selection groove (116) move towards or away from each other. Telescopic parts are provided at both ends of the machine (100) so as to allow the machine (100) to tilt.

2. A semiconductor wafer flipping machine according to claim 1, characterized in that: The machine platform (100) has a hanging tower (114) in the middle, the hanging tower (114) is connected to a box body opening module (115), and the box body opening module (115) is connected to the hanging tower (114) via a telescopic cylinder.

3. A semiconductor wafer flipping machine according to claim 2, characterized in that: The telescopic member is a lifting cylinder (120), one end of the lifting cylinder (120) is connected to the machine platform (100), and the other end is used for supporting on the ground.

4. A semiconductor wafer flipping machine according to claim 3, characterized in that: One end of the lifting cylinder (120) is connected to a transition block (121), and the transition block (121) is rotatably connected to the machine platform (100).

5. The semiconductor wafer flipping machine according to claim 4, characterized in that: The inclination angle of the machine platform (100) ranges from 5 to 20 degrees.

6. The semiconductor wafer flipping machine according to claim 1, characterized in that: The film rewind selection slot (116) has a plurality of guide slots (117) corresponding to the cavities in the box body, and a control push rod (118) is slidably arranged in each guide slot (117) for opening or closing the guide slot (117).

7. The semiconductor wafer flipping machine according to claim 1, characterized in that: The machine platform (100) is provided with a rotary transmission belt (112), and the mounting platform (111) is detachably connected to the rotary transmission belt (112).

8. The semiconductor wafer flipping machine according to claim 7, characterized in that: The rotary transmission belt (112) has a connecting block (131), the mounting platform (111) has a connecting seat (132) matched with the connecting block (131), and the connecting seat (132) has an embedded block (134) embedded in the connecting block (131).

9. The semiconductor wafer flipping machine according to claim 8, characterized in that: The connecting seat (132) has a receiving groove (133) for the connecting block (131) to be embedded in, and an elastic positioning piece is provided on the connecting seat (132) and located in the receiving groove (133).

10. The semiconductor wafer flipping machine according to claim 9, characterized in that: The machine platform (100) is also provided with a guide rod (113), the guide rod (113) being passed through the mounting platform (111), and two guide rods (113) are arranged in parallel.

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