Bare chip assembling component

Abstract

The utility model discloses a bare chip assembly component, which comprises a power bare chip, a circuit substrate and a first electric connection component, one surface of the power bare chip is provided with a first connection electrode, and the other surface of the power bare chip is provided with a second connection electrode; the circuit substrate is provided with a first electric connection part and a second electric connection part, and the surface, provided with the first connection electrode, of the power bare chip is arranged opposite to the circuit substrate and is electrically connected with the first electric connection part; the second connection electrode of the power bare chip is electrically connected with the second electric connection part through the first electric connection assembly. By reasonably planning the connection between the power bare chip and the circuit substrate, the problems that a bare chip assembly component occupies a large space, the connection between the power bare chip and the circuit substrate cannot be reasonably planned, and the processing cost is increased due to the fact that two different welding devices need to be adopted in the manufacturing process are solved, the power density is improved, and the production and processing cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic devices, in particular to a bare chip assembly component. Background Art

[0002] Generally, the existing chip assembly interconnection scheme relies on the support of the power chip package shell, and the packaged power module is often used. Although the power chip package shell cannot realize electrical functions, its large volume will occupy the circuit substrate, resulting in the inability to mount more chip assembly components on the circuit substrate, and it is also unable to meet the higher power density requirements. In addition, from the perspective of production and processing costs, the cost per tube of the packaged power module is relatively high.

[0003] Although some chip assembly components currently omit the packaging shell of the power chip and directly integrate the power bare chip into the circuit substrate to complete the manufacture of the bare chip assembly component, it is impossible to reasonably plan the connection between the power bare chip and the circuit substrate. Usually, it is necessary to add two connection structures, bonding wires and copper tapes, to achieve the connection between electrodes located in different areas on the surface of the power bare chip and the circuit substrate. Due to the different welding processes of the bonding wires and copper tapes, two different welding equipment are required in the manufacturing process, which increases the processing cost of the product. Utility Model Content

[0004] The main purpose of the utility model is to propose a bare chip assembly component, aiming to solve the problems that the bare chip assembly component occupies a large space, cannot reasonably plan the connection between the power bare chip and the circuit substrate, and needs to use two different welding equipment during the manufacturing process, which increases the processing cost.

[0005] To achieve the above-mentioned purpose, the utility model provides a bare chip assembly assembly, comprising:

[0006] A power bare chip, wherein a first connection electrode is disposed on one surface of the power bare chip, and a second connection electrode is disposed on another surface of the power bare chip;

[0007] A circuit substrate, wherein the circuit substrate is provided with a first electrical connection portion and a second electrical connection portion, and a surface of the power bare chip provided with a first connection electrode is arranged opposite to the circuit substrate and is electrically connected to the first electrical connection portion;

[0008] A first electrical connection component, through which the second connection electrode of the power bare chip is electrically connected to the second electrical connection portion.

[0009] In one embodiment, an electrical connector is provided between the first electrical connection component and the second connection electrode of the power die, the position of the electrical connector corresponds to the position of the second connection electrode, and the first electrical connection component is electrically connected to the second connection electrode through the electrical connector.

[0010] In one embodiment, the electrical connection member includes a plurality of solder balls arranged at intervals, and the plurality of solder balls are arranged on a surface of the first electrical connection component.

[0011] In one embodiment, the bare chip assembly component further includes an adapter plate, which is disposed between the power bare chip and the circuit substrate, and the first connection electrode of the power bare chip is electrically connected to the first electrical connection portion of the circuit substrate through the adapter plate.

[0012] In one embodiment, at least one surface of the adapter board is covered with a conductive material, and the first connection electrode of the power bare chip is electrically connected to the first electrical connection portion of the circuit substrate through the conductive material.

[0013] In one embodiment, the bare chip assembly assembly further comprises a second electrical connection assembly, the adapter plate has a first surface and a second surface disposed opposite to each other, and the conductive material is disposed at least on the first surface of the adapter plate;

[0014] The first surface of the adapter board is disposed close to the power bare chip and is electrically connected to the first connection electrode of the power bare chip through the conductive material disposed on the first surface; the second surface of the adapter board is disposed close to the circuit substrate, and the first electrical connection portion of the circuit substrate is electrically connected to the conductive material disposed on the adapter board through the second electrical connection component;

[0015] Alternatively, the first surface of the adapter board is arranged against the circuit substrate and is electrically connected to the first connecting portion of the circuit substrate through a conductive material provided on the first surface, and the second surface of the adapter board is arranged against the power bare chip, and the first connecting electrode of the power bare chip is electrically connected to the conductive material provided on the adapter board through the second electrical connection component.

[0016] In one embodiment, the adapter plate is made of a ceramic sheet, and the conductive material coated on at least one surface of the adapter plate is copper foil.

[0017] In one embodiment, the first connection electrode is disposed on the lower surface of the power die, and the second connection electrode is disposed on the upper surface of the power die;

[0018] One of the first connection electrode and the second connection electrode includes a G pole and an S pole, and the other includes a D pole.

[0019] In one embodiment, the electrical connection component is a flexible circuit board.

[0020] In one embodiment, the first electrical connection portion and the second electrical connection portion are disposed on the same surface of the circuit substrate, and the bare chip assembly component further includes a packaging component, which is covered on the surface of the circuit substrate and encapsulates the power bare chip and the electrical connection component.

[0021] Compared with the prior art, the utility model has the following beneficial effects:

[0022] The technical solution of the utility model adopts power bare chips to solve the problems of high processing cost and large space occupation caused by directly using assembly components with packaging shells. By adopting power bare chips, the occupation of the surface space of the circuit substrate is reduced, and the utilization rate of the surface space of the circuit substrate is improved.

[0023] The first connection electrode and the second connection electrode of the power bare chip are respectively arranged on two surfaces of the power bare chip, and the surface of the power bare chip provided with the first connection electrode is arranged opposite to the circuit substrate and electrically connected to the first electrical connection part. By limiting the surface of the first connection electrode to be arranged opposite to the circuit substrate, the connection between the first electrical connection part of the circuit board and the first connection electrode of the power bare chip is realized by using the space in the vertical direction of the circuit board, so that the connection between the power bare chip and the circuit substrate can be made more stable, and the use of the electrical connection structure between the first connection part and the first connection electrode of the power bare chip can be reduced, so as to reduce the occupation of the surface space of the circuit substrate, avoid the problem of excessive space occupation of the overall structure due to the need to set up a connection structure for the first connection electrode and the first electrical connection part, and effectively improve the power density of the bare chip assembly component;

[0024] The second connection electrode of the power bare chip is electrically connected to the second electrical connection part through the first electrical connection component, which can avoid the need to add additional bonding wires, copper tapes and other connection structures to connect the power bare chip and the circuit substrate, which would occupy too much space and require the use of two different welding equipment during the manufacturing process, so as to further reduce the volume of the bare chip assembly component and reduce production and processing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0026] Figure 1 A schematic structural diagram of an embodiment of a bare chip assembly provided by the utility model;

[0027] Figure 2 for Figure 1 A top view of the middle circuit substrate;

[0028] Figure 3 for Figure 1 A top view of the transfer board;

[0029] Figure 4 This is a structural schematic diagram of another embodiment of a bare chip assembly provided by the utility model.

[0030] Description of Figure Numbers:

[0031] 100. Power die;

[0032] 200, circuit substrate; 210, first electrical connection portion; 220, second electrical connection portion;

[0033] 310, first electrical connection assembly; 311, electrical connection piece; 320, second electrical connection assembly;

[0034] 400, adapter plate; 410, connection solder joint;

[0035] 510, solder; 520, packaging component.

[0036] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0038] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0039] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0040] At present, the existing chip assembly component interconnection scheme often uses packaged power modules. The cost of a single tube of a packaged power module is relatively high. Although the package shell of the power chip cannot realize the electrical function, the large volume will occupy the circuit substrate, resulting in the inability to mount more chip assembly components on the circuit substrate, and the inability to meet higher power density requirements. Although some existing products also save space occupied by the package shell by using power bare chips, such products cannot reasonably plan the connection between the power bare chip and the circuit substrate, and usually need to add two connection structures, bonding wires and copper tapes, to achieve the connection between electrodes located in different areas on the surface of the power bare chip and the circuit substrate. Due to the different welding processes of the bonding wires and copper tapes, two different welding equipment are required in the manufacturing process, which increases the processing cost of the product.

[0041] In order to reduce the space occupied by chip assembly components and reduce costs, the utility model proposes a bare chip assembly component. Figures 1 to 4 The bare chip assembly assembly includes a power bare chip 100, a circuit substrate 200 and a first electrical connection assembly 310. By using the power bare chip 100 to replace the packaged power module, the problems of high processing cost and large space occupation caused by directly using the packaged power chip are solved. By using the power bare chip 100, the surface space occupied by the circuit substrate 200 is reduced, and the utilization rate of the surface space of the circuit substrate 200 is improved.

[0042] A first connection electrode is provided on one surface of the power die 100, and a second connection electrode is provided on the other surface of the power die 100; the circuit substrate 200 is provided with a first electrical connection portion 210 and a second electrical connection portion 220. The surface of the power die 100 provided with the first connection electrode is arranged opposite to the circuit substrate 200 and is electrically connected to the first electrical connection portion 210; the second connection electrode of the power die 100 is electrically connected to the second electrical connection portion 220 through the first electrical connection component 310.

[0043] In the present invention, an integrated circuit may be optionally provided on the power die 100, and the first connection electrode and the second connection electrode may be optionally provided on two opposite surfaces of the power die 100. Taking the case where the first connection electrode and the second connection electrode are respectively provided on the upper and lower surfaces of the power die 100 as an example, the power die 100 shown in the present invention is provided on the circuit substrate 200 in a stacked form. The surface of the power die 100 provided with the first connection electrode is arranged opposite to the circuit substrate 200 and is electrically connected to the first electrical connection portion 210, and the connection between the first electrical connection portion 210 of the circuit board and the first connection electrode of the power die 100 is realized by using the space in the vertical direction of the circuit board, so that the connection between the power die 100 and the circuit substrate 200 can be more stable, and the use of the electrical connection structure between the first connection portion and the first connection electrode of the power die 100 can be reduced, thereby reducing the product volume and cost; on the other hand, the solution adopted in the present application can enable the electrodes located in different areas on the surface of the power die to be connected to the circuit substrate using the same welding process for welding, and only one welding device is required in the manufacturing process, further reducing the production cost of the product.

[0044] Optionally, the first connection electrode of the power bare chip 100 is directly electrically connected to the first electrical connection part 210 and the wiring, copper cladding, etc. of the circuit substrate 200 by welding or the like; or, a wire, an adapter plate 400, a conductive sheet, a conductive adhesive, a plug-in structure or any other electrical connection structure suitable for actual use is arranged between the first connection electrode of the power bare chip 100 and the first electrical connection part 210 of the circuit substrate 200 to electrically connect the first connection electrode of the power bare chip 100 to the first electrical connection part 210 of the circuit substrate 200; or, a surrounding plate or other connection structure is arranged on the surrounding side of the power bare chip 100, and the power bare chip 100 is connected and fixed on the circuit substrate 200 so that the first connection electrode of the power bare chip 100 is electrically connected to the first electrical connection part 210 of the circuit substrate 200 and other connection structures on the circuit substrate 200 through contact connection or the like. In this way, the surface space occupied by the circuit substrate 200 can be effectively reduced, avoiding the problem of the overall structure occupying too much space due to the need to set up an additional connection structure for the first connection electrode and the first electrical connection part 210, and effectively improving the power density of the bare chip assembly component.

[0045] In addition, the second connection electrode of the power bare chip 100 is electrically connected to the second electrical connection part 220 through the first electrical connection component 310, and the connection can be achieved by a welding device. This avoids the need to add bonding wires, copper tapes and other connection structures to connect the power bare chip 100 and the circuit substrate 200, which occupies a large space and requires the use of two different welding devices to increase processing costs. This is used to further reduce the volume of the bare chip assembly component and reduce production and processing costs.

[0046] Optionally, the circuit substrate 200 can be made of, but not limited to, a copper-clad laminate, a paper-based substrate, a fiberglass board, etc. The first electrical connection component 310 shown can be a flexible printed circuit board (FPC), a copper sheet, an electrical connection line, an adapter board 400 or any other electrical connection structure suitable for actual use and having an electrical connection function, so as to complete the electrical connection between the second connection electrode of the power die 100 and the second electrical connection part 220.

[0047] To ensure a stable connection between the first electrical connection component 310 and the power bare chip 100 and make the electrical connection more reliable, in one embodiment, an electrical connector 311 is provided between the first electrical connection component 310 and the second connection electrode of the power bare chip 100. The position of the electrical connector 311 corresponds to the position of the second connection electrode, and the first electrical connection component 310 is electrically connected to the second connection electrode through the electrical connector 311.

[0048] Optionally, the electrical connector 311 shown can be, but is not limited to, a solder ball, solder paste or other solder 510, conductive glue, copper busbar or any other electrical connection structure suitable for actual use, which is arranged at the position corresponding to the second connecting electrode shown, so that the first electrical connection component 310 is electrically connected to the second connecting electrode of the power die 100 shown through the electrical connector 311 in any manner suitable for actual production use, such as welding, bonding, plugging, etc., to further complete the electrical connection between the second electrical connection portion 220 of the circuit substrate 200 and the second connecting electrode of the power die 100.

[0049] In order to facilitate material acquisition and processing, and to provide support for the first electrical connection component 310, so that the first electrical connection portion 210 is stably connected to the second connection electrode of the power bare chip 100 and plays a role in heat dissipation to avoid heat accumulation, the electrical connection member 311 shown in the utility model adopts an electrical connection structure arranged at intervals or an electrical connection member 311 with a certain gap as a further example. The electrical connection member 311 shown can be specifically arranged on the first electrical connection component 310 and / or the second connection electrode.

[0050] To facilitate connection, in one embodiment, the electrical connector 311 includes a plurality of solder balls arranged at intervals, and the plurality of solder balls are arranged on the surface of the first electrical connection component 310. The positions of the plurality of solder balls arranged at intervals correspond to the positions of the second connection electrodes. The solder balls are directly preset on the surface of the first electrical connection component 310, which can effectively improve the production and processing efficiency, reduce processing errors, improve the yield rate, and avoid the problem of processing inconvenience caused by the need to adjust the positions of the first electrical connection component 310 and the second electrical connection part 220 accordingly during the production and processing. Solder ball connection can also optimize the electrical performance of the bare chip assembly component, improve the packaging density, avoid deformation and unstable connection problems that may occur due to lead connection, make the connection and installation more stable and reliable, and improve the assembly yield rate.

[0051] Specifically, in the present invention, a first electrical connection portion 210 and a second electrical connection portion 220 are provided on the circuit substrate 200 , and the first electrical connection portion 210 and the second electrical connection portion 220 are provided on the same surface of the circuit substrate 200 .

[0052] In one embodiment, the bare chip assembly further includes an interposer 400 .

[0053] As an example, refer to Figures 1 to 3 , the adapter plate 400 is arranged close to the surface of the power bare chip 100 provided with the second connection electrode, and the adapter plate 400 and the circuit substrate 200 are arranged on both sides of the power bare chip 100 relatively. With the adapter plate 400 as the first electrical connection component, the first connection electrode of the power bare chip 100 is directly electrically connected to the first electrical connection part 210 of the circuit substrate 200, and the second connection electrode of the power bare chip 100 is electrically connected to the second electrical connection part 220 through the adapter plate 400. The adapter plate 400 plays a heat dissipation role, and the adapter plate 400 is connected to the circuit substrate 200 through the solder 510 or other first connection parts. The first connection parts are enclosed outside the power bare chip 100. The adapter plate 400 and the first connection parts are arranged to provide protection for the power bare chip 100, so that the overall structure of the bare chip assembly component is more stable, so that the use of other connection structures can be reduced, and the product volume and cost can be reduced. During the manufacturing process, only one welding device is used to complete the connection between electrodes located at different areas on the surface of the power bare chip 100 and the first electrical connection part 210 and the second electrical connection part 220, which can further reduce the production cost of the product.

[0054] As another example, refer to Figure 4 , the adapter plate 400 is disposed between the power bare chip 100 and the circuit substrate 200, and the first connection electrode of the power bare chip 100 is electrically connected to the first electrical connection portion 210 of the circuit substrate 200 through the adapter plate 400. The second connection electrode of the power bare chip 100 is electrically connected to the second electrical connection portion 220 through the flexible circuit board or other first electrical connection components 310. By arranging the adapter plate 400 between the first connection electrode of the power bare chip 100 and the circuit substrate 200, the first connection electrode of the power bare chip 100 is electrically connected to the first electrical connection portion 210 of the circuit substrate 200 through the adapter plate 400, and the adapter plate 400 optimizes the heat dissipation performance of the bare chip assembly and provides support for the power bare chip 100, so that the overall structure of the bare chip assembly is more stable.

[0055] In one embodiment, at least one surface of the adapter board 400 is covered with a conductive material, and the first connection electrode of the power bare chip 100 is electrically connected to the first electrical connection portion 210 of the circuit substrate 200 through the conductive material. The conductive material coated on at least one surface of the adapter board 400 can be used to realize the electrical connection between the circuit substrate 200 and the power bare chip 100, or can be used only to provide a connection medium for realizing non-electrical connection methods such as welding and bonding between the adapter board 400 and the circuit substrate 200, so as to further realize the connection and fixation of the overall structure of the bare chip assembly component. Among them, when the adapter board 400 is used to realize the electrical connection between the circuit substrate 200 and the power bare chip 100, the circuit substrate 200 can be electrically connected to the adapter board 400 through solder, a flexible circuit board or other electrical connection structures, and the adapter board 400 is electrically connected to the circuit substrate 200 through solder, a flexible circuit board or other electrical connection structures.

[0056] The adapter board 400 shown can be a DBC (Direct Bond Copper) ceramic substrate or other connecting plates. Specifically, the adapter board 400 is a ceramic sheet or other insulating sheet, and the conductive material coated on at least one surface of the adapter board 400 is copper foil, aluminum foil or any other conductive material suitable for practical use.

[0057] Since the heat storage capacity of the ceramic sheet itself is small, the use of the ceramic sheet can optimize the heat dissipation performance, so that the heat can be dissipated outward more quickly to avoid heat accumulation; in addition, the insulation performance of the ceramic sheet itself can also play a good electrical isolation role. The use of a copper-clad ceramic sheet as the adapter plate 400 can not only ensure the stability and reliability of the electrical connection, but also further ensure the safety of the operation of the bare chip assembly when used in vehicles such as electric devices, new energy vehicles and other equipment. The adapter plate 400 shown in the utility model uses a copper-clad ceramic sheet as a further example. Due to the stability of its own structure, the ceramic sheet can also play a bearing role in the utility model, used to provide support for the power bare chip 100, so that the power bare chip 100 is stably connected to the circuit substrate 200, and the overall structure of the bare chip assembly is ensured to be more stable and reliable.

[0058] Optionally, the first connection electrode and the second connection electrode may be disposed on two opposite surfaces of the power die 100. Specifically, the first connection electrode is disposed on the upper surface of the power die 100, and the second connection electrode is disposed on the lower surface of the power die 100; or, the first connection electrode is disposed on the lower surface of the power die 100, and the second connection electrode is disposed on the upper surface of the power die 100.

[0059] Generally, the power die 100 includes a G pole (gate), an S pole (source) and a D pole (drain). In the present invention, the first connection electrode includes at least one electrode, the second connection electrode includes at least one electrode, one of the first connection electrode and the second connection electrode is disposed on the upper surface of the power die 100, and the other is disposed on the lower surface of the power die 100.

[0060] Specifically, in one embodiment, the first connection electrode is disposed on the lower surface of the power die 100, and the second connection electrode is disposed on the upper surface of the power die 100. One of the first connection electrode and the second connection electrode includes a G pole and an S pole, and the other includes a D pole.

[0061] As an embodiment of the present invention, refer to Figures 1 to 3 The adapter plate 400 is disposed close to the surface of the power bare chip 100 where the second connection electrode is disposed, and the adapter plate 400 and the circuit substrate 200 are disposed on two sides of the power bare chip 100 opposite to each other.

[0062] Taking the example that the first connection electrode is disposed on the upper surface of the power die 100 and the second connection electrode is disposed on the lower surface of the power die 100, specifically, the lower surface of the adapter board 400 is disposed close to the second connection electrode of the power die 100, and the lower surface of the adapter board 400 is provided with a conductive material. The circuit substrate 200 is provided with a first electrical connection portion 210 and a second electrical connection, the first connection electrode of the power die 100 is electrically connected to the first connection portion of the circuit substrate 200 through a solder 510, the second connection electrode of the power die 100 is connected to the conductive material on the lower surface of the adapter board 400 through the solder 510, the lower surface of the adapter board 400 is provided with a connection soldering point 410, and the connection soldering point 410 of the adapter board 400 is electrically connected to the second electrical connection portion 220 of the circuit substrate 200 through the solder 510, the connector, and the first connector disposed at intervals outside the power die 100.

[0063] Taking the example that the first connecting electrode includes a G pole and an S pole, and the second connecting electrode includes a D pole, the G pole and the S pole of the power bare chip 100 are electrically connected to the first connecting part of the circuit substrate 200 through the solder 510, and the D pole of the power bare chip 100 is connected to the conductive material on the lower surface of the adapter board 400 through the solder 510.

[0064] Furthermore, the circuit substrate 200 is provided with a connection position, the shape and size of the connection position correspond to the shape and size of the power bare chip 100, there are a plurality of first electrical connection parts 210 and second electrical connection parts 220, a plurality of first electrical connection parts 210 are provided in the middle of the circuit board to form a connection position, and a plurality of second electrical connection parts 220 are provided at intervals along the periphery of the connection position. The power bare chip 100 is provided on the connection position and is electrically connected to the first electrical connection part 210 through a first connection electrode, the second connection electrode of the power bare chip 100 is connected to the adapter board 400, and the adapter board 400 is electrically connected to the second electrical connection part 220 through a first connection member such as solder 510, the first connection member is enclosed outside the power bare chip 100, and the power bare chip 100 is protected by the setting of the adapter board 400 and the first connection member, so that the overall structure of the bare chip assembly assembly is more stable.

[0065] Reference Figure 4 As another embodiment of the present invention, refer to Figure 4 The adapter plate 400 is disposed between the power bare chip 100 and the circuit substrate 200 .

[0066] The bare chip assembly assembly further includes a second electrical connection assembly 320 . The adapter plate 400 has a first surface and a second surface disposed opposite to each other. The conductive material is disposed at least on the first surface of the adapter plate 400 .

[0067] On the basis of this embodiment, as an example, the first surface of the adapter board 400 is arranged against the power bare chip 100 and is electrically connected to the first connecting electrode of the power bare chip 100 through the conductive material provided on the first surface, and the second surface of the adapter board 400 is arranged against the circuit substrate 200, and the first electrical connection portion 210 of the circuit substrate 200 is electrically connected to the conductive material provided on the adapter board 400 through the second electrical connection component 320.

[0068] As another example, the first surface of the adapter board 400 is arranged against the circuit substrate 200 and is electrically connected to the first connection portion of the circuit substrate 200 through the conductive material provided on the first surface, and the second surface of the adapter board 400 is arranged against the power bare chip 100, and the first connection electrode of the power bare chip 100 is electrically connected to the conductive material provided on the adapter board 400 through the second electrical connection component 320.

[0069] In the above example, the second surface of the adapter board 400 may be provided with a conductive material or may not be provided with a conductive material. The second surface of the adapter board 400 may be connected and fixed to the circuit substrate 200 or the power die 100 by welding, bonding, or the like using solder 510, adhesive, or the like. The first electrical connection component and the second electrical connection component may optionally use the same or different electrical connection structures. For example, the first connection electrode includes a D pole, and the second connection electrode includes a G pole and an S pole. The first surface of the adapter board 400 is disposed against the power die 100 and is electrically connected to the D pole of the power die 100 through the conductive material disposed on the first surface. The second surface of the adapter board 400 is disposed against the circuit substrate 200 and is connected and fixed to the circuit substrate 200 using solder, adhesive, or the like. The first electrical connection portion 210 of the circuit substrate 200 is electrically connected to the conductive material disposed on the first surface of the adapter board 400 through the second electrical connection component 320. The G pole and the S pole of the power die 100 are connected to the first electrical connection component 310. Electrically connected to the second electrical connection portion 220; or, the first surface of the adapter board 400 is arranged against the circuit substrate 200 and is electrically connected to the first connection portion of the circuit substrate 200 through the conductive material provided on the first surface, the second surface of the adapter board 400 is arranged against the power bare chip 100, and is connected and fixed to the power bare chip 100 through solder, adhesive, etc., the D pole of the power bare chip 100 is electrically connected to the conductive material provided on the first surface / second surface of the adapter board 400 through the second electrical connection component 320, and the G pole and S pole of the power bare chip 100 are electrically connected to the second electrical connection portion 220 through the first electrical connection component 310.

[0070] An adapter board 400 is arranged between the first connection electrode of the power bare chip 100 and the circuit substrate 200, so that the first connection electrode of the power bare chip 100 is electrically connected to the first electrical connection part 210 of the circuit substrate 200 through the adapter board 400, and the adapter board 400 provides support for the power bare chip 100, so that the overall structure of the bare chip assembly component is more stable.

[0071] In order to facilitate material acquisition and connection, and to further reduce the overall space occupied by the bare chip assembly component, in one embodiment, the electrical connection component uses a flexible circuit board.

[0072] The flexible circuit board has the functions of light weight, thin thickness, free folding and bending, good heat dissipation performance and low overall cost. It is suitable for changing the position and shape according to the actual application of the bare chip assembly component, and completing the electrical connection between the power bare chip 100 and the circuit substrate 200. It is used to reasonably plan the connection relationship between the power bare chip 100 and the circuit substrate 200, reduce the overall space occupied by the bare chip assembly component, optimize the heat dissipation performance of the bare chip assembly component, and reduce the overall processing cost.

[0073] Specifically, the first electrical connection component 310 and the second electrical connection component 320 shown are flexible circuit boards, so that the use of redundant bonding wires and copper strips between the power die 100 and the circuit substrate 200, and between the adapter plate 400 and the power die 100 can be reduced, the overall occupied space can be reduced, and the overall structure and electrical connection relationship can be simpler, which is convenient for production, assembly and promotion. In addition, the connection between the power die 100 and the circuit substrate 200, and between the adapter plate 400 and the power die 100 is achieved by welding using the same welding process, and only one welding device is required during the manufacturing process, which can further reduce the production cost of the product and avoid the need to use two different welding devices to increase the cost.

[0074] In one embodiment, the first electrical connection portion 210 and the second electrical connection portion 220 are disposed on the same surface of the circuit substrate 200, and the bare chip assembly assembly further includes a packaging component 520, which is covered on the surface of the circuit substrate 200 and covers the power die 100 and the electrical connection component. It is used to complete the packaging of the bare chip assembly assembly. By increasing the packaging density, the stability and reliability of the bare chip assembly assembly are optimized, and the bare chip assembly assembly is prevented from being affected by the external environment. In this way, the service life of the bare chip assembly assembly can be extended, and the bare chip assembly assembly can be conveniently tested, installed and used.

[0075] In the utility model, the bare chip assembly component shown can be applied to vehicles such as new energy vehicles. The bare chip assembly component applied to the vehicle adopts all the technical solutions of all the above-mentioned embodiments, and therefore has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments. The specific implementation methods of its embodiments refer to the above-mentioned embodiments and will not be repeated here one by one.

[0076] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A bare chip assembly, characterized in that: include: A power bare chip, wherein a first connection electrode is disposed on one surface of the power bare chip, and a second connection electrode is disposed on another surface of the power bare chip; A circuit substrate, wherein the circuit substrate is provided with a first electrical connection portion and a second electrical connection portion, and a surface of the power bare chip provided with a first connection electrode is arranged opposite to the circuit substrate and is electrically connected to the first electrical connection portion; A first electrical connection component, through which the second connection electrode of the power bare chip is electrically connected to the second electrical connection portion.

2. The bare chip assembly as claimed in claim 1, wherein: An electrical connector is provided between the first electrical connection component and the second connection electrode of the power die. The position of the electrical connector corresponds to the position of the second connection electrode. The first electrical connection component is electrically connected to the second connection electrode through the electrical connector.

3. The bare chip assembly as claimed in claim 2, characterized in that: The electrical connection member includes a plurality of solder balls arranged at intervals, and the plurality of solder balls are arranged on the surface of the first electrical connection component.

4. The bare chip assembly as claimed in claim 1, wherein: The bare chip assembly component further includes an adapter plate, which is disposed between the power bare chip and the circuit substrate, and the first connection electrode of the power bare chip is electrically connected to the first electrical connection portion of the circuit substrate through the adapter plate.

5. The bare chip assembly as claimed in claim 4, characterized in that: At least one surface of the adapter plate is covered with a conductive material, and the first connection electrode of the power bare chip is electrically connected to the first electrical connection portion of the circuit substrate through the conductive material.

6. The bare chip assembly as claimed in claim 5, characterized in that: The bare chip assembly assembly further includes a second electrical connection assembly, the adapter plate has a first surface and a second surface disposed opposite to each other, and the conductive material is disposed at least on the first surface of the adapter plate; The first surface of the adapter board is disposed close to the power bare chip and is electrically connected to the first connection electrode of the power bare chip through the conductive material disposed on the first surface; the second surface of the adapter board is disposed close to the circuit substrate, and the first electrical connection portion of the circuit substrate is electrically connected to the conductive material disposed on the adapter board through the second electrical connection component; Alternatively, the first surface of the adapter board is arranged against the circuit substrate and is electrically connected to the first connecting portion of the circuit substrate through a conductive material provided on the first surface, and the second surface of the adapter board is arranged against the power bare chip, and the first connecting electrode of the power bare chip is electrically connected to the conductive material provided on the adapter board through the second electrical connection component.

7. The bare chip assembly as claimed in claim 5, characterized in that: The adapter plate is a ceramic sheet, and the conductive material covered on at least one surface of the adapter plate is copper foil.

8. The bare chip assembly as claimed in claim 1, wherein: The first connecting electrode is disposed on the lower surface of the power bare chip, and the second connecting electrode is disposed on the upper surface of the power bare chip; One of the first connection electrode and the second connection electrode includes a G pole and an S pole, and the other includes a D pole.

9. The bare chip assembly according to any one of claims 1 to 8, characterized in that: The electrical connection component adopts a flexible circuit board.

10. The bare chip assembly according to any one of claims 1 to 8, characterized in that: The first electrical connection part and the second electrical connection part are arranged on the same surface of the circuit substrate. The bare chip assembly component also includes a packaging component, which is covered on the surface of the circuit substrate and covers the power bare chip and the electrical connection component.

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