Heat-insulation anti-condensation structure for water-cooling component of DMD (Digital Micromirror Device) chip

Abstract

The utility model discloses a heat insulation anti-condensation structure for a water cooling component of a DMD chip, and relates to the technical field of heat insulation and anti-condensation. Comprising a main shell, a containing cavity used for containing a water cooling component is formed in the main shell, and a plurality of heat insulation structures used for reducing the contact area of the water cooling component and the main shell are further arranged on the cavity wall of the containing cavity; an opening communicated with the accommodating cavity is formed in the main shell, and a part of the body of the water cooling component is exposed from the opening and is in contact with the DMD chip, so that the DMD chip is cooled. The heat-insulation anti-condensation structure for the water-cooling component of the DMD chip is used for isolating the water-cooling component from the external environment so as to reduce heat exchange between the water-cooling component and the external environment, so that water drops are prevented from being condensed on the water-cooling component, and the water drops are prevented from being condensed on the outer side of the main shell loaded with the water-cooling component; and short circuit and corrosion of the DMD chip and the chip circuit board caused by water drop condensation are effectively prevented.

Description

Technical Field

[0001] The utility model relates to the technical field of heat insulation and anti-condensation, in particular to a heat insulation and anti-condensation structure of a water cooling component for a DMD chip. Background Art

[0002] The DMD chip is a key component used in display and imaging related equipment. It has very strict requirements on temperature, humidity and cleanliness. Especially when used in laser display and laser imaging related equipment, the operating temperature of the DMD chip is often required to be controlled below 30°C. In this regard, the industry usually makes the liquid cooling component directly contact the DMD chip, and then passes 19°C coolant to the liquid cooling component to reduce the temperature of the liquid cooling component itself, thereby absorbing the heat generated by the DMD chip to achieve the purpose of cooling the DMD chip.

[0003] However, since the liquid-cooling component is in direct contact with the DMD chip, it is very close to the DMD chip and the circuit board where the chip is located. In addition, the liquid-cooling component itself passes through 19°C coolant, which will cause its own temperature to be relatively low, causing water droplets to condense on the surface of the liquid-cooling component. When the condensed water droplets drip onto the DMD chip or the circuit board where the chip is located, it will cause the DMD chip or the circuit board where the chip is located to short-circuit and corrode, affecting the normal use of the DMD chip. Utility Model Content

[0004] The utility model provides a heat-insulating and anti-condensation structure for a water-cooling component of a DMD chip, which is used to isolate the water-cooling component from the external environment to reduce heat exchange between the water-cooling component and the external environment, thereby preventing water droplets from condensing on the water-cooling component and preventing water droplets from condensing on the outside of a main shell loaded with the water-cooling component, so as to solve the above-mentioned technical problems.

[0005] The utility model solves the above-mentioned problem by providing a heat-insulating and anti-condensation structure for a water-cooling component of a DMD chip, comprising a main shell, wherein a receiving cavity for receiving the water-cooling component is provided in the main shell, and a plurality of heat-insulating structures for reducing the contact area between the water-cooling component and the main shell are provided on the cavity wall of the receiving cavity; an opening communicating with the receiving cavity is provided on the main shell, and part of the body of the water-cooling component is exposed from the opening and contacts with the DMD chip, thereby cooling the DMD chip.

[0006] Furthermore, the main shell is made of silicone.

[0007] Furthermore, the main shell includes a first shell part and a second shell part. The first shell part is provided with a hole, and the water supply pipe and the water outlet pipe both extend into the accommodating cavity through the hole to communicate with the water cooling component. The opening is provided on the second shell part, and the first shell part and the second shell part are spliced ​​with each other to form the main shell.

[0008] Furthermore, it also includes a mounting bracket, the main shell is fixed on one side of the mounting bracket, the DMD chip and the chip circuit board are fixed on the other side of the mounting bracket, and the body of the water cooling component exposed from the opening passes through the mounting bracket to contact the DMD chip.

[0009] Furthermore, a first screw connection member is provided on the water-cooling component, a mounting hole is provided on the second shell part, and a first screw connection hole is provided on the mounting bracket; when the water-cooling component is installed in the main shell, the first screw connection member passes through the mounting hole and cooperates with the first screw connection hole to thereby fix the main shell and the mounting bracket.

[0010] Furthermore, an annular protrusion is provided on the outer side of the second shell part around the mounting hole. When the main shell is fixed to one side of the mounting bracket, the annular protrusion is clamped between the second shell part and the mounting bracket, thereby sealing the mounting hole.

[0011] Furthermore, the first shell part and the second shell part are fixedly connected by bonding.

[0012] Furthermore, the mounting bracket is a plate body, and a through channel is provided in the middle of the mounting bracket for only a part of the body of the water cooling component to pass through.

[0013] Furthermore, a second screw connector is provided on the mounting bracket, and a second screw hole is opened on the chip circuit board. The second screw connector is connected by cooperating with the second screw hole to fix the mounting bracket to one side of the chip circuit board. The DMD chip is installed on the other side of the chip circuit board. The chip circuit board is also provided with a through channel for part of the body of the water cooling component to pass through.

[0014] Furthermore, the thermal insulation structure is a hole, a groove or a protrusion.

[0015] Beneficial effects of the utility model:

[0016] The utility model discloses a heat-insulating and anti-condensation structure for a water-cooling component for a DMD chip. The water-cooling component is loaded into a main shell, and the water-cooling component is exposed only at an opening on the shell and contacts the DMD chip. Under the premise of ensuring the cooling function of the water-cooling component on the DMD chip, the water-cooling component and the external air environment are isolated to the greatest extent, so that the heat absorbed by the water-cooling component from the external air environment is reduced.

[0017] Moreover, the main shell is made of silicone, and a number of insulation structures are arranged on the wall of the accommodating cavity of the main shell. The former is used to reduce the heat transfer efficiency of the main shell, and the latter is used to reduce the contact area between the water-cooling component and the main shell. Both are used to enhance the thermal insulation performance of the main shell. In addition to further reducing the heat absorbed by the water-cooling component from the external air environment, it can also make the outer surface of the main shell close to or consistent with the external ambient temperature, thereby effectively preventing the problem of water drop condensation on the outside of the main shell. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings, which are incorporated into the specification and constitute a part of the specification, illustrate embodiments of the utility model and are used together with the description to explain the principles of the utility model. In these drawings, similar reference numerals are used to represent similar elements. The drawings described below are some embodiments of the utility model, rather than all embodiments. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 An exploded view of the overall structure of the heat insulation and anti-condensation structure of this embodiment;

[0020] Figure 2 is a schematic structural diagram of the first shell portion of this embodiment;

[0021] Figure 3 This is one of the structural schematic diagrams of the second shell part of this embodiment;

[0022] Figure 4 This is the second structural schematic diagram of the second shell part of this embodiment;

[0023] 1-main shell, 2-accommodating cavity, 3-thermal insulation structure, 4-opening, 5-first shell part, 6-second shell part, 7-mounting bracket, 8-first screw connection member, 9-mounting hole, 10-first screw connection hole, 11-annular protrusion, 12-second screw connection member, 13-second screw hole;

[0024] 14- water cooling components, 15- DMD chip, 16- chip circuit board. DETAILED DESCRIPTION

[0025] The directional terms such as up, down, left, right, front, back, front, back, top, bottom, etc. mentioned or may be mentioned in this specification are defined relative to the structures shown in the drawings. The words "inside" and "outside" refer to the direction toward or away from the geometric center of a specific component, respectively. They are relative concepts, and therefore may change accordingly according to different locations and different usage conditions. Therefore, these or other directional terms should not be interpreted as restrictive terms.

[0026] See also Figures 1 to 4 A specific embodiment of the utility model is a heat-insulating and anti-condensation structure of a water-cooling component for a DMD chip, comprising a main shell 1, a receiving chamber 2 is provided in the main shell 1, the receiving chamber 2 has only one opening 4 formed on the main shell 1, a water-cooling component 14 is arranged in the receiving chamber 2, the water-cooling component 14 can only be exposed from the opening 4, and only the part of the water-cooling component 14 exposed from the opening 4 can contact the DMD chip 15 to cool the DMD chip 15.

[0027] Specifically, please Figure 1 The orientation shown is taken as an example and reference Figure 1 The main shell 1 is installed on a mounting bracket 7 and is located on the left side of the mounting bracket 7, the DMD chip 15 is installed on the chip circuit board 16 and is located on the right side of the chip circuit board 16, and the mounting bracket 7 is fixedly installed on the left side of the chip circuit board 16; a through channel is opened at the center position of the mounting bracket 7 and the chip circuit board 16, and when the mounting bracket 7 is fixed to the chip circuit board 16, the two through channels are connected to each other, and the part of the body of the water cooling component 14 exposed from the opening 4 of the main shell 1 also extends into the through channel and abuts against the DMD chip 15 at the right side outlet of the through channel.

[0028] The most critical point is: in this embodiment, the cavity wall of the accommodating cavity 2 includes a top wall with a hole, a bottom wall with an opening 4, and an octagonal side wall, wherein a plurality of strip grooves are evenly arranged on the octagonal side wall of the accommodating cavity 2, and two fan-shaped grooves are arranged on the top wall of the accommodating cavity 2, and in order to ensure that the water-cooling component 14 can expose enough of its body from the opening 4, no grooves are arranged on the bottom wall of the accommodating cavity 2. In this regard, when the water-cooling component 14 is placed in the accommodating cavity 2, due to the presence of the two fan-shaped grooves and the plurality of strip grooves, the contact area between the cavity wall of the accommodating cavity 2 and the water-cooling component 14 can be greatly reduced, thereby reducing the heat transfer between the main shell 1 and the water-cooling component 14, making the outer temperature of the main shell 1 closer to the external environment temperature, effectively avoiding water condensation on the outer side of the main shell 1, and effectively isolating the water-cooling component 14 from the external environment, avoiding water condensation on the outer surface of the water-cooling component 14.

[0029] It should be noted that the above-mentioned fan-shaped grooves and strip-shaped grooves are both insulation structures 3; in addition, in other embodiments, the insulation structure 3 can also be an arc-shaped protrusion arranged on the top wall and / or bottom wall and / or side wall of the accommodating cavity 2, or a hole arranged on the top wall and / or bottom wall and / or side wall of the accommodating cavity 2, or other forms of insulation structure 3 that can effectively reduce the contact area between the water-cooling component 14 and the main shell 1.

[0030] Further, in the present embodiment, four first screw-connecting members 8 are evenly arranged on the water-cooling member 14, four mounting holes 9 are matched on the second housing portion 6, the diameter of the mounting holes 9 is larger than the diameter of the first screw-connecting members 8, and four first screw-connecting holes 10 are matched on the mounting bracket 7. In this regard, when the water-cooling member 14 is installed in the main housing 1 and the main housing 1 is butt-jointed and assembled, the four first screw-connecting members 8 on the water-cooling member 14 are respectively inserted into one mounting hole 9, and extend from the respective inserted mounting holes 9 to the outside of the main housing 1, and then are threadedly connected one by one with the four first screw-connecting holes 10 on the mounting bracket 7, so as to fix the main housing 1 to the left side of the mounting bracket 7.

[0031] In addition, four second screw connectors 12 are also provided on the mounting bracket 7, and four second screw holes 13 are opened on the chip circuit board 16; when the main shell 1 is fixed to the mounting bracket 7, the technician can make the four second screw connectors 12 respectively cooperate with one second screw hole 13 for threaded connection to fix the mounting bracket 7 and the chip circuit board 16 to each other, so that the exposed body of the water cooling component 14 can pass through the through channel to stably contact the DMD chip 15.

[0032] Furthermore, in the present embodiment, an annular protrusion 11 is provided at the edge of the opening 4 and the edge of the openings of the four mounting holes 9, and the annular protrusion 11 is also made of silicone; when the main shell 1 is fixedly connected to the mounting bracket 7, the annular protrusion 11 will be spaced between the second shell portion 6 and the mounting bracket 7, and under the extrusion of the mounting bracket 7, an annular sealing ring structure is formed on the outside of the opening 4 and the outside of the openings of the mounting holes 9, thereby preventing outside air from entering the main shell 1 along the gap between the mounting hole 9 and the first screw connection 8 and / or along the gap between the water-cooling component 14 and the opening 4, resulting in poor air tightness of the main shell 1 and affecting the thermal insulation performance of the main shell 1.

[0033] It should be noted that in other embodiments, technicians can select a specific number of first screw connectors 8, set a specific number of mounting holes 9 and a specific number of first screw holes 10, select a specific number of second screw connectors 12, and set a specific number of second screw holes according to actual needs. Therefore, the specific numbers of the above five are not limited to four in this embodiment.

[0034] In addition, in the present embodiment, the first screw connection member 8 and the second screw connection member 12 are both screw rods, and the first screw connection hole 10 and the second screw connection hole are both threaded holes adapted to the screw rods.

[0035] In this embodiment, in order to improve the corrosion resistance of the main shell 1, increase the service life of the main shell 1, and further prevent the low temperature of the water-cooling component 14 from being transferred to the outer surface of the main shell 1, the manufacturing material of the main shell 1 is silicone with lower heat transfer efficiency and better chemical stability.

[0036] Furthermore, in order to facilitate the installation of the water-cooling component 14 into the accommodating chamber 2, the main shell 1 includes a first shell part 5 and a second shell part 6, the accommodating chamber 2 is also divided into two cavities, and the two cavities are also respectively arranged on the first shell part 5 and the second shell part 6, and a hole is provided on the first shell part 5, which connects the cavity of the first shell part 5 and the outside, and the water supply pipe and the water outlet pipe are both extended into the cavity of the first shell part 5 through the hole to communicate with the water-cooling component 14, and the opening 4 is arranged on the second shell part 6; in addition, the first shell part 5 and the second shell part 6 can be butt-jointed with each other to form a complete main shell 1, and the two cavities are also spliced ​​to form a complete accommodating chamber 2; and when butt-jointing and assembling the first shell part 5 and the second shell part 6, the technician can also apply structural glue on the butt joint surfaces of the two shell parts to butt and fix the two shell parts to maintain the shape of the main shell 1 formed by butt joint.

[0037] Anything not mentioned above is applicable to the prior art.

[0038] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit it. Although the utility model is described in detail with reference to the above embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the above embodiments, or replace some of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the utility model.

Claims

1. A heat-insulating and anti-condensation structure for a water-cooling component of a DMD chip, characterized in that: The invention comprises a main shell (1), wherein a receiving chamber (2) for receiving a water-cooling component (14) is provided in the main shell (1), and a plurality of heat-insulating structures (3) for reducing the contact area between the water-cooling component (14) and the main shell (1) are provided on the wall of the receiving chamber (2); an opening (4) communicating with the receiving chamber (2) is provided on the main shell (1), and a part of the body of the water-cooling component (14) is exposed from the opening (4) and contacts with a DMD chip (15), thereby cooling the DMD chip (15).

2. The heat-insulating and anti-condensation structure of the water-cooling component for DMD chips according to claim 1, characterized in that: The main housing (1) is made of silica gel.

3. The heat-insulating and anti-condensation structure of the water-cooling component for DMD chips according to claim 1, characterized in that: The main shell (1) comprises a first shell part (5) and a second shell part (6); the first shell part (5) is provided with a hole, through which a water supply pipe and a water outlet pipe extend into the accommodating cavity (2) to communicate with a water cooling component (14); an opening (4) is provided on the second shell part (6); the first shell part (5) and the second shell part (6) are spliced ​​together to form the main shell (1).

4. The heat-insulating and anti-condensation structure of the water-cooling component for DMD chips according to claim 3, characterized in that: It also includes a mounting bracket (7), the main housing (1) is fixed on one side of the mounting bracket (7), the DMD chip (15) and the chip circuit board (16) are both fixed on the other side of the mounting bracket (7), and the body of the water cooling component (14) exposed from the opening (4) passes through the mounting bracket (7) to contact the DMD chip (15).

5. The heat-insulating and anti-condensation structure of the water-cooling component for DMD chips according to claim 4, characterized in that: A first screw connection member (8) is provided on the water-cooling component (14), a mounting hole (9) is provided on the second housing portion (6), and a first screw connection hole (10) is provided on the mounting bracket (7); when the water-cooling component (14) is installed in the main housing (1), the first screw connection member (8) passes through the mounting hole (9) and is matched and connected with the first screw connection hole (10), thereby fixing the main housing (1) and the mounting bracket (7).

6. The heat-insulating and anti-condensation structure of the water-cooling component for DMD chips according to claim 5, characterized in that: The outer side of the second housing portion (6) is also provided with an annular protrusion (11) surrounding the mounting hole (9); when the main housing (1) is fixed to one side of the mounting bracket (7), the annular protrusion (11) is clamped between the second housing portion (6) and the mounting bracket (7), thereby sealing the mounting hole (9).

7. The heat-insulating and anti-condensation structure of the water-cooling component for DMD chips according to claim 3, characterized in that: The first shell part (5) and the second shell part (6) are fixedly connected by bonding.

8. The heat-insulating and anti-condensation structure of the water-cooling component for DMD chips according to claim 4, characterized in that: The mounting bracket (7) is a plate body, and a through passage is provided in the middle of the mounting bracket (7) for only a portion of the body of the water cooling component (14) to pass through.

9. The heat-insulating and anti-condensation structure of the water-cooling component for DMD chips according to claim 4, characterized in that: A second screw connection member (12) is provided on the mounting bracket (7), and a second screw hole (13) is provided on the chip circuit board (16). The second screw connection member (12) is connected by cooperating with the second screw hole (13) to fix the mounting bracket (7) to one side of the chip circuit board (16). The DMD chip is mounted on the other side of the chip circuit board (16). The chip circuit board (16) is also provided with a through passage through which a part of the body of the water cooling component (14) passes.

10. The heat-insulating and anti-condensation structure of the water-cooling component for DMD chips according to claim 1, characterized in that: The heat insulation structure (3) is a hole, a groove or a protrusion.

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