Laser control device and wafer detection equipment

Abstract

The utility model provides a laser control device and wafer detection equipment. The laser control device comprises a laser, incident laser is emitted to a to-be-detected workpiece along an incident light path, and the incident laser forms reflected laser on the to-be-detected workpiece along a reflected light path; the light on-off element is arranged on the incident light path and used for controlling on-off of the incident laser; and the detection element is arranged on the reflected light path, is linked with the light on-off element and is used for detecting the reflected laser so as to enable the light on-off element to act. The laser control device comprises a laser device, a light on-off element and a detection element, reflected laser is detected through the detection element, on-off of an incident light path is controlled through the light on-off element, when the incident laser exceeds a working area, the incident laser can be shielded, propagation of the incident laser is blocked, potential safety hazards are eradicated, propagation of the reflected laser can be blocked, and the laser control efficiency is improved. Potential safety hazards of laser reflection are eliminated, and stability of laser output by the laser can be ensured.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor technology, and in particular relates to a laser control device and a wafer detection device. Background Art

[0002] Lasers are widely used in the semiconductor field. Lasers used in the semiconductor field are emitted by lasers and have the characteristics of high power. When they exceed the working area, they can easily burn pipes and lines, and even cause fires, posing safety risks.

[0003] In order to effectively manage safety risks, ensure the timeliness and reliability of laser shutdown, and avoid safety hazards when the laser exceeds the working area, it has become a technical problem that needs to be urgently solved in this field. Utility Model Content

[0004] The embodiments of the present application provide a laser control device and a wafer detection device. The laser control device can eliminate the potential safety hazard caused by the laser exceeding the working area and ensure the stability of the laser.

[0005] In the first aspect, an embodiment of the present application provides a laser control device, including a laser, which emits an incident laser along an incident light path to a workpiece to be inspected, and the incident laser forms a reflected laser on the workpiece to be inspected along a reflected light path; a light on-off element, which is arranged on the incident light path and is used to control the on-off of the incident laser; and a detection element, which is arranged on the reflected light path and is linked to the light on-off element and is used to detect the reflected laser to activate the light on-off element.

[0006] Optionally, the detection element is provided with a detection end for detecting the reflected laser; in vertical height, the detection end is located above the workpiece to be inspected, and a height difference is provided between the detection end and the upper end surface of the workpiece to be inspected.

[0007] Optionally, the laser control device further comprises an adjustment component, wherein the adjustment component is located on the incident light path and is used to adjust the path of the incident light path.

[0008] Optionally, the adjustment component includes a first reflector and a second reflector; the incident light path is a first incident section between the laser and the first reflector; the incident light path is a second incident section between the first reflector and the second reflector; the incident light path is a third incident section between the second reflector and the workpiece to be inspected; an angle is set between the first incident section and the second incident section, and between the second incident section and the third incident section; the light on-off element is located on the first incident section, the second incident section, or the third incident section.

[0009] Optionally, the adjustment component also includes a third reflector and a fourth reflector; the second incident section is divided into one segment between the first reflector and the third reflector; the second incident section is divided into two segments between the third reflector and the fourth reflector; the second incident section is divided into three segments between the fourth reflector and the second reflector; an angle is provided between the one segment and the two segments, and between the two segments and the three segments; the two segments are arranged parallel to the upper surface of the workpiece to be inspected, and the light on-off element is located on the two segments.

[0010] In the second aspect, an embodiment of the present application also provides a wafer inspection device, including an equipment body and the laser control device; the equipment body is provided with a detection element, the detection element is located above the wafer to be inspected, and is used to detect the scattered light formed on the wafer to be inspected by the incident laser of the laser control device; the laser control device is installed on the equipment body.

[0011] Optionally, the detection element is provided with a detection end, and the detection end is located above the wafer to be inspected and faces the wafer to be inspected; in the vertical direction, the detection end is located below the detection element of the laser control device.

[0012] Optionally, there are multiple detection elements, and the angles between the end faces of the multiple detection ends and the upper surface of the wafer to be detected are different.

[0013] Optionally, the equipment body is further provided with a planar motion mechanism and a processor; the planar motion mechanism is used to drive the wafer to be inspected to move in plane; the processor is respectively connected to the planar motion mechanism and the laser control device.

[0014] Optionally, the wafer inspection device further comprises a stage, which is mounted on the planar motion mechanism and is used to carry the wafer to be inspected; an upper end surface area of ​​the stage is larger than an upper end surface area of ​​the wafer to be inspected.

[0015] The embodiments of the present application provide a laser control device and a wafer detection device. The laser control device includes a laser, an optical on-off element, and a detection element. The detection element detects the reflected laser, and can block the incident laser when it exceeds the working area, blocking its propagation and eliminating safety hazards. The detection element is located on the reflected light path and will not affect the normal operation of the laser. It can also block the propagation of the reflected laser and eliminate the safety hazards of the reflected laser. When controlling the on-off of the incident laser, the stability of the laser output can be ensured by blocking the incident laser without turning off the laser. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solution of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0017] Figure 1 Schematic diagram of the laser control device of some embodiments of the present application on the device body Figure 1 ;

[0018] Figure 2 Schematic diagram of the laser control device of some embodiments of the present application on the device body Figure 2 ;

[0019] Figure 3 Schematic diagram of the laser control device of some embodiments of the present application on the device body Figure 3 ;

[0020] Figure 4 Schematic diagram of the laser control device of some embodiments of the present application on the device body Figure 4 ;

[0021] Figure 5 Schematic diagram of wafer inspection equipment according to some embodiments of the present application.

[0022] In the attached picture:

[0023] 1-laser; 2-light on / off element; 3-detection element; 4-stage; 5-adjustment component; 51-third reflector; 52-first reflector; 53-fourth reflector; 54-second reflector; 6-reflection light path; 7-incident light path; 71-first segment; 72-second segment; 73-first incident segment; 74-third segment; 75-third incident segment; 8-device body; 81-planar motion mechanism; 9-detection element; 10-wafer to be inspected. DETAILED DESCRIPTION

[0024] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0025] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0026] Lasers used in the semiconductor field are characterized by high power. When they exceed the working area, they are very likely to burn some pipes and lines, or even cause fires. Therefore, timely and reliable shutdown of lasers has become an urgent problem to be solved in this field. However, the inventors found that when the laser is emitting lasers, it needs to run for a period of time to output stable lasers. Frequently turning the laser on and off cannot meet the stability requirements of the laser.

[0027] In order to solve this technical problem, the embodiments of the present application provide a laser control device and a wafer detection device, which can eliminate the safety hazards caused by the laser exceeding the working area and ensure the stability of the laser.

[0028] Please refer to Figures 1 to 4 , Figure 1 Schematic diagram of the laser control device of some embodiments of the present application on the device body Figure 1 ; Figure 2 Schematic diagram of the laser control device of some embodiments of the present application on the device body Figure 2 ; Figure 3 Schematic diagram of the laser control device of some embodiments of the present application on the device body Figure 3 ; Figure 4 Schematic diagram of the laser control device of some embodiments of the present application on the device body Figure 4 .in, Figures 1 to 4 The different positions of the workpiece to be inspected when it moves in the plane are shown respectively. Figure 1 As shown in FIG, the incident laser irradiates the workpiece to be inspected, that is, the incident laser is in the working area; Figures 2 to 4 As shown, the incident laser does not irradiate the workpiece to be inspected, that is, the incident laser is not in the working area, and the workpiece to be inspected is the working area of ​​the incident laser.

[0029] First, as Figure 1As shown, an embodiment of the present application provides a laser control device, including a laser 1, a light-on / off element 2 and a detection element 3; the laser 1 emits an incident laser along an incident light path 7 to a workpiece to be inspected, and the incident laser forms a reflected laser along a reflected light path 6 on the workpiece to be inspected; the light-on / off element 2 is arranged on the incident light path 7; the detection element 3 is arranged on the reflected light path 6 and is linked with the light-on / off element 2.

[0030] The workpiece to be inspected is a workpiece that can produce mirror reflection, for example, the workpiece to be inspected can be a wafer to be inspected 10, which can produce mirror reflection on the upper end surface. The laser 1 is used to emit laser. When the laser 1 emits laser toward the workpiece to be inspected and irradiates the surface of the workpiece to be inspected, the laser emitted toward the workpiece to be inspected is the incident laser, and the laser after mirror reflection on the workpiece to be inspected is the reflected laser. The path along which the incident laser is taken is the incident light path 7, and the path along which the reflected laser is taken is the reflected light path 6. When the laser 1 is fixed, the incident light path 7 and the reflected light path 6 are fixed paths. The optical on-off element 2 is installed on the incident light path 7, and can disconnect the incident light path 7 by blocking the incident laser, thereby blocking the propagation of the incident laser. The detection element 3 is installed on the reflected light path 6, and can detect whether there is reflected laser on the reflected light path 6, so that the optical on-off element 2 is actuated.

[0031] When working, the incident laser is irradiated on the workpiece to be inspected to assist in the detection of the workpiece to be inspected. The incident laser is mirror-reflected on the workpiece to be inspected, and the reflected laser propagates along the reflection light path 6 and is detected by the detection element 3. When the detection element 3 detects the reflected laser, it means that the incident laser is irradiated on the workpiece to be inspected and forms a mirror reflection; when the detection element 3 does not detect the reflected laser, it means that the incident laser is not irradiated on the workpiece to be inspected (outside the working area), and at this time, the signal of the detection element 3 is transmitted to the light-on-off element 2, and the light-on-off element 2 is actuated to block the incident light path 7, shielding the incident laser and preventing the propagation of the incident laser.

[0032] The laser control device provided in the embodiment of the present application includes a laser 1, an optical on-off element 2 and a detection element 3. The detection element 3 detects the reflected laser, and the optical on-off element 2 can timely block the incident laser when the incident laser is not in the working area to block its propagation. The detection element 3 is located on the reflected light path 6, which will not affect the normal operation of the laser, and can also block the propagation of the reflected laser to eliminate the safety hazards of the reflected laser. By detecting the presence or absence of the reflected laser, it is determined whether the incident laser is in the working area, and the judgment is reliable, which can eliminate the safety hazards of the laser exceeding the working area. At the same time, when controlling the on and off of the incident laser, the incident laser is blocked by the optical on-off element 2 located on the incident light path 7 without turning off the laser 1, so as to ensure the stability of the laser output by the laser 1.

[0033] In some embodiments, Figure 2As shown, the detection element 3 is provided with a detection end. In terms of vertical height, the detection end is located above the workpiece to be inspected, and a height difference is provided between the detection end and the upper end surface of the workpiece to be inspected.

[0034] The detection element 3 receives the reflected laser through the detection end and detects the reflected laser. Firstly, it can block the propagation of the reflected laser. Secondly, it can detect whether there is reflected laser on the reflected light path 6 as a basis for whether the incident laser is in the working area. As an achievable form, the detection element 3 can be a laser detector.

[0035] The detection end is located above the workpiece to be inspected, and has a height difference with the upper end surface of the workpiece to be inspected, that is, there is a gap, which can avoid the scattered light of the incident laser that may exist on the workpiece to be inspected, avoid the interference of scattering on the detection end, and ensure the accuracy of the detection result.

[0036] In some embodiments, Figure 1 As shown, the laser control device further includes an adjustment component 5 , which is located on the incident light path 7 and can adjust the path of the incident light path 7 .

[0037] When the installation space is limited, in order to reduce the occupied area of ​​the laser control device on the horizontal plane, the path of the incident light path 7 can be adjusted by adjusting the component 5, shortening the length of the incident light path 7 and / or changing the direction of the incident light path 7, thereby adjusting the path of the incident light path 7. As an achievable form, the adjusting component 5 can be a manipulator that can move in space, driving the laser 1 to move in space, thereby adjusting the path of the incident light path 7; the adjusting component 5 can also form a tortuous incident light path 7 by performing mirror reflection on the incident laser, thereby adjusting the path of the incident light path 7.

[0038] The laser control device adjusts the path of the incident light path 7 by adjusting the component 5, which can reduce space occupation and thus improve universality.

[0039] In some embodiments, Figure 3 As shown, the adjustment component 5 includes a first reflector 52 and a second reflector 54; the incident light path 7 is a first incident section 73 between the laser 1 and the first reflector 52; the incident light path 7 is a second incident section between the first reflector 52 and the second reflector 54; the incident light path 7 is a third incident section 75 between the second reflector 54 and the workpiece to be inspected; an angle is provided between the first incident section 73 and the second incident section, and between the second incident section and the third incident section 75; the light on-off element 2 is located on the first incident section 73, the second incident section, or the third incident section 75.

[0040] The incident light path 7 is divided into three sections by the first reflector 52 and the second reflector 54, that is, along the propagation direction of the incident laser, the incident light path 7 is sequentially the first incident section 73, the second incident section and the third incident section 75. At the first incident section 73, the incident laser is emitted toward the first reflector 52 along the first incident section 73, the laser reflected from the first reflector 52 is emitted toward the second reflector 54 along the second incident section, and the laser reflected from the second reflector 54 is emitted toward the workpiece to be inspected along the third incident section 75. As an implementable form, the optical on-off element 2 can be a mechanical chopper, which controls the on-off of the incident light path 7 by the signal of the detection element 3.

[0041] There is an angle between the first incident section 73 and the second incident section, so that the incident light path 7 can be bent once at the first reflector 52; there is an angle between the second incident section and the third incident section 75, so that the incident light path 7 can be bent once at the second reflector 54. By introducing the first reflector 52 and the second reflector 54, the incident light path 7 can be bent twice, thereby reducing the space occupation, and the incident light path 7 can be arranged in a three-dimensional space. Correspondingly, the light-on-off element 2 can be installed on the first incident section 73, that is, the light-on-off element 2 is located between the laser 1 and the first reflector 52; the light-on-off element 2 can be installed on the second incident section, that is, the light-on-off element 2 is located between the first reflector 52 and the second reflector 54; the light-on-off element 2 can also be installed on the third incident section 75, that is, the light-on-off element 2 is located between the second reflector 54 and the workpiece to be inspected. The light-on / off element 2 can be located at any position in the first incident section 73 , the second incident section 75 , thereby enriching the installation options of the light-on / off element 2 and facilitating the structural layout.

[0042] In some embodiments, Figure 4 As shown, the adjustment component 5 also includes a third reflector 51 and a fourth reflector 53; the second incident section is a segment 71 between the first reflector 52 and the third reflector 51; the second incident section is a segment 72 between the third reflector 51 and the fourth reflector 53; the second incident section is a segment 74 between the fourth reflector 53 and the second reflector 54; an angle is set between the first segment 71 and the second segment 72, and between the second segment 72 and the third segment 74; the second segment 72 is parallel to the upper surface of the workpiece to be inspected, and the light-on / off element 2 is located on the second segment 72.

[0043] The second incident section is divided into three sections by the third reflector 51 and the fourth reflector 53. Along the propagation direction of the incident laser, the second incident section is successively divided into the first section 71, the second section 72 and the third section 74. The incident laser of the second incident section forms a mirror reflection at the third reflector 51 and a mirror reflection at the fourth reflector 53.

[0044] An included angle is provided between the first segment 71 and the second segment 72, and between the second segment 72 and the third segment 74, so as to further reduce the area occupied by the laser control device on the horizontal plane, and facilitate spatial layout. In addition, the second segment 72 is arranged parallel to the upper surface of the workpiece to be inspected, and the optical on-off element 2 is located on the second segment 72, so as to facilitate determining the installation foundation for the optical on-off element 2 and finding the installation position.

[0045] Please refer to Figure 5 , Figure 5 Schematic diagram of wafer inspection equipment according to some embodiments of the present application.

[0046] Second, as Figure 5 As shown, the embodiment of the present application also provides a wafer inspection device, the wafer inspection device includes a laser control device, and thus the wafer inspection device has all the advantages of the above embodiments. The wafer inspection device can be a dark field defect inspection device for detecting processing defects on the wafer surface.

[0047] In some embodiments, Figure 5 As shown, the wafer inspection device includes an equipment body 8 and a laser control device, and the laser control device is installed on the equipment body 8. The equipment body 8 is provided with a detection element 9, and the detection element 9 is located above the wafer 10 to be inspected, and detects the scattered light formed on the wafer 10 to be inspected by the incident laser of the laser control device.

[0048] The laser 1 of the laser control device emits an incident laser toward the wafer 10 to be inspected. The incident laser irradiates the wafer 10 to be inspected, and a reflected laser is formed on the wafer 10 to be inspected and received by the detection element 3. The wafer 10 to be inspected moves in a plane on the device body 8, so that the incident laser can irradiate every position of the wafer 10 to be inspected. When there is a defect on the surface of the wafer 10 to be inspected, the incident laser is scattered at the defect, and the scattered light is captured by the detection element 9 and recorded by the device body 8. When the wafer 10 to be inspected moves away from the incident laser as it moves in a plane, the reflected laser disappears, the detection element 3 outputs a signal, and the light on-off element 2 is turned off to block the incident laser.

[0049] The wafer inspection equipment provided in the embodiment of the present application can not only realize dark field inspection of the wafer 10 to be inspected, but also process the reflected laser, control the incident laser (the incident laser is blocked by the light-on / off element 2 when it exceeds the working area), and ensure the stability of the incident laser, thereby ensuring the accuracy of the inspection.

[0050] In some embodiments, Figure 5 As shown, the detection element 9 is provided with a detection end, which is located above the wafer 10 to be detected and faces the wafer 10 to be detected; in the vertical direction, the detection end is located below the detection element 3 of the laser control device.

[0051] The detection end is a port for the detection element 9 to receive scattered light. In the vertical direction, the detection end is closer to the upper end surface of the wafer 10 to be inspected, while the detection element 3 is farther away from the upper end surface of the wafer 10 to be inspected.

[0052] The detection end is close to the upper end surface of the wafer 10 to be inspected, which can accurately capture scattered light and reduce the influence of attenuation of scattered light during propagation on the detection result; the detection element 3 is far away from the upper end surface of the wafer 10 to be inspected, which can reduce the interference of scattering on the detection result.

[0053] In some embodiments, Figure 5 As shown, there are multiple detection elements 9, and the angles between the end faces of the multiple detection ends and the upper surface of the wafer 10 to be detected are different.

[0054] A plurality of detection elements 9 are arranged, and the arrangement angles of the plurality of detection ends are different. The plurality of detection elements 9 are arranged at different positions above the wafer 10 to be inspected, and thus scattered light can be received from multiple angles, making the detection result more accurate.

[0055] In some embodiments, Figure 5 As shown, the device body 8 is also provided with a planar motion mechanism 81 and a processor; the planar motion mechanism 81 drives the wafer 10 to be inspected to move in a plane; the processor is respectively connected to the planar motion mechanism 81 and the light on / off element 2 and the detection element 3 of the laser control device.

[0056] The device body 8 drives the wafer 10 to be inspected to move in the plane through the plane motion mechanism 81, and the plane motion mechanism 81 is connected to the processor. The processor is used to control the operation of the device body 8, including the operation control of the plane motion mechanism 81. Under the control of the processor, when the plane motion mechanism 81 is running, the processor can obtain the operating status in real time, and then the real-time position of the wafer 10 to be inspected is controlled by the processor. When the wafer 10 to be inspected is not on the incident light path 7, the processor can control the light on-off element 2 to shield the incident laser.

[0057] The wafer inspection equipment is connected to the planar motion mechanism 81 through a processor, so that the processor can obtain the position of the wafer 10 to be inspected in real time and directly determine whether the incident laser is irradiated on the wafer 10 to be inspected; at the same time, the wafer inspection equipment can also detect the reflected laser through the detection element 3 to determine whether the incident laser is irradiated on the wafer 10 to be inspected, and then the two can form a double insurance mechanism, forming double protection, used in combination, and backed up each other, eliminating the safety hazard of laser exceeding the working area, ensuring the stability of the laser, and strong reliability.

[0058] In some embodiments, Figure 5As shown, the wafer inspection device also includes a stage 4, which is installed on the planar motion mechanism 81 and is used to carry the wafer 10 to be inspected; the upper end surface area of ​​the stage 4 is larger than the upper end surface area of ​​the wafer 10 to be inspected.

[0059] The upper end surface area of ​​the stage 4 is larger than the upper end surface area of ​​the wafer 10 to be inspected. Firstly, it can form a reliable support for the wafer 10 to be inspected. Secondly, when the incident laser does not irradiate the wafer 10 to be inspected (the incident laser exceeds the working area), it can block the incident laser and provide certain protection for the lines, pipelines, etc.

[0060] The above is only a specific implementation of the present application. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working processes of the systems, modules and units described above can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the protection scope of the present application is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in this application, and these modifications or replacements should be included in the protection scope of this application.

Claims

1. A laser control device, characterized in that: include: A laser emits incident laser light along an incident light path toward a workpiece to be inspected, wherein the incident laser light forms reflected laser light on the workpiece to be inspected along a reflected light path; An optical on-off element, arranged on the incident light path, for controlling the on-off of the incident laser; The detection element is arranged on the reflected light path and is linked with the light switching element to detect the reflected laser to activate the light switching element.

2. The laser control device according to claim 1, characterized in that: The detection element is provided with a detection end for detecting the reflected laser; In terms of vertical height, the detection end is located above the workpiece to be inspected, and a height difference is provided between the detection end and the upper end surface of the workpiece to be inspected.

3. The laser control device according to claim 1, characterized in that: It also includes an adjustment component, which is located on the incident light path and is used to adjust the path of the incident light path.

4. The laser control device according to claim 3, characterized in that: The adjustment assembly includes a first reflector and a second reflector; The incident light path is a first incident section between the laser and the first reflector; The incident light path is a second incident section between the first reflector and the second reflector; The incident light path is a third incident section between the second reflector and the workpiece to be inspected; An included angle is set between the first incident section and the second incident section, and between the second incident section and the third incident section; The light switching element is located on the first incident section, the second incident section, or the third incident section.

5. The laser control device according to claim 4, characterized in that: The adjustment assembly also includes a third reflector and a fourth reflector; The second incident section is a segment between the first reflector and the third reflector; The second incident section is divided into two sections between the third reflector and the fourth reflector; The second incident section is divided into three sections between the fourth reflector and the second reflector; An included angle is provided between the first segment and the second segment, and between the second segment and the third segment; The two segments are arranged parallel to the upper surface of the workpiece to be inspected, and the light-on / off element is located on the two segments.

6. A wafer inspection device, characterized in that: It comprises a device body and a laser control device as claimed in any one of claims 1 to 5; The device body is provided with a detection element, which is located above the wafer to be inspected and is used to detect scattered light formed on the wafer to be inspected by the incident laser of the laser control device; The laser control device is installed on the equipment body.

7. The wafer inspection device according to claim 6, characterized in that: The detection element is provided with a detection end, and the detection end is located above the wafer to be detected and faces the wafer to be detected; In the vertical direction, the detection end is located below the detection element of the laser control device.

8. The wafer inspection device according to claim 7, characterized in that: There are multiple detection elements, and the angles between the end faces of the multiple detection ends and the upper surface of the wafer to be detected are different.

9. The wafer inspection device according to claim 7, characterized in that: The device body is also provided with a planar motion mechanism and a processor; The planar motion mechanism is used to drive the wafer to be inspected to move in plane; The processor is connected to the planar motion mechanism and the laser control device respectively.

10. The wafer inspection device according to claim 9, characterized in that: It also includes a stage, which is mounted on the planar motion mechanism and is used to carry the wafer to be inspected; The upper end surface area of ​​the stage is larger than the upper end surface area of ​​the wafer to be inspected.

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