Filter and electronic device

Abstract

The utility model provides a filter and electronic equipment, and belongs to the technical field of filters, and the filter comprises a substrate; the metal substrate is arranged on the base plate, and a mounting cavity is defined by the metal substrate and the base plate; the piezoelectric substrate is arranged on the metal substrate and is positioned in the mounting cavity; and the transducer is arranged on the piezoelectric substrate.

Description

Technical Field

[0001] The present application belongs to the technical field of filters, and in particular relates to a filter and an electronic device. Background Art

[0002] In related technologies, such as Figure 1 As shown, the filter 100' is usually provided with a resin shell 180' on the substrate 110' to protect the piezoelectric substrate, the transducer and the solder 200'. However, the thermal conductivity of the resin shell is poor. When the filter is operated at high power, the heat generated is large. The resin shell will affect the heat dissipation of the filter, thereby reducing the performance of the filter. Utility Model Content

[0003] The purpose of the embodiments of the present application is to provide a filter and an electronic device that can effectively solve the technical problem of poor filter performance under high-power conditions.

[0004] In a first aspect, an embodiment of the present application provides a filter, including:

[0005] substrate;

[0006] A metal substrate is arranged on the base plate, and the metal substrate and the base plate surround a mounting cavity;

[0007] A piezoelectric substrate is disposed on the metal substrate and is located in the mounting cavity;

[0008] The transducer is arranged on the piezoelectric substrate.

[0009] As a possible implementation, the piezoelectric substrate and the metal substrate are bonded together; or the metal substrate is grown on the piezoelectric substrate.

[0010] As a possible implementation, the metal substrate includes:

[0011] A titanium metal layer, on which the piezoelectric substrate is disposed;

[0012] The metal substrate layer is arranged on the side of the titanium metal layer away from the piezoelectric substrate.

[0013] As a possible implementation, the metal substrate layer is an aluminum substrate layer, an aluminum alloy substrate layer, a copper substrate layer, a copper alloy substrate layer, a tin substrate layer, a tin alloy substrate layer, a nickel substrate layer, a nickel alloy substrate layer, a chromium substrate layer or a chromium alloy substrate layer.

[0014] As a possible implementation, it also includes:

[0015] The first solder is arranged on the titanium metal layer and connected to the base plate to fix the base plate and the metal substrate.

[0016] As a possible implementation, the edge of the base plate facing the metal substrate has a protrusion, the metal substrate is disposed on the protrusion, and at least a portion of the mounting cavity is formed inside the protrusion.

[0017] As a possible implementation, the protrusion is a polygonal ring structure or a circular ring structure, the piezoelectric substrate and the protrusion are matched, and at least a part of the piezoelectric substrate is embedded in the inner side of the protrusion.

[0018] As a possible implementation, the orthographic projection of the piezoelectric substrate on the substrate is located inside the orthographic projection of the metal substrate on the substrate.

[0019] As a possible implementation, it also includes:

[0020] The second solder is arranged on the side of the piezoelectric substrate facing away from the metal substrate and connected to the base plate, so as to electrically connect the base plate and the piezoelectric substrate.

[0021] In a second aspect, an embodiment of the present application provides an electronic device, including:

[0022] Motherboard;

[0023] As for the filter provided in the embodiment of the first aspect, the filter is connected to the main board.

[0024] In an embodiment of the present application, the filter includes a substrate, a metal substrate, a piezoelectric substrate and a transducer. The metal substrate is arranged on the substrate, and the substrate and the metal substrate enclose an installation cavity. The piezoelectric substrate is arranged in the installation cavity. The transducer is arranged on the piezoelectric substrate. The transmitting part of the transducer can convert the electrical signal into the mechanical vibration of the piezoelectric substrate, and the receiving part of the transducer can convert the mechanical vibration signal of the piezoelectric substrate into an electrical signal output, thereby realizing filtering.

[0025] Among them, the piezoelectric substrate is arranged on a metal substrate, and the metal substrate has good heat dissipation performance. Therefore, even under high-power conditions, the metal substrate can improve the heat dissipation effect of the filter. For example, the metal substrate can transfer heat to the substrate more quickly, achieve better heat dissipation, and improve performance, thereby improving the performance of the filter under high-power conditions and improving the stability of the filter. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0027] Figure 1 A cross-sectional view of a filter in the related art is shown;

[0028] Figure 2 A schematic diagram showing the propagation of acoustic wave energy in a filter in the related art is shown;

[0029] Figure 3 A cross-sectional view of a filter provided by an embodiment of the present application is shown;

[0030] Figure 4 A cross-sectional view showing a filter provided by an embodiment of the present application, in which a metal substrate is prepared on a piezoelectric substrate;

[0031] Figure 5 A cross-sectional view of a filter provided by an embodiment of the present application for preparing a transducer on a piezoelectric substrate is shown;

[0032] Figure 6 A cross-sectional view showing a filter provided by an embodiment of the present application, in which a second solder is prepared on a piezoelectric substrate and a first solder is prepared on a metal substrate;

[0033] Figure 7 A schematic diagram showing the propagation of acoustic wave energy in a filter provided by an embodiment of the present application is shown;

[0034] Figure 8 A cross-sectional view showing a partial structure of a filter provided by an embodiment of the present application;

[0035] Fig. 9 A cross-sectional view showing a partial structure of a filter provided by an embodiment of the present application;

[0036] Fig.10 A schematic diagram of a filter provided by an embodiment of the present application is shown.

[0037] Figure 1 and Figure 2 Reference numerals:

[0038] 100' filter, 110' substrate, 130' piezoelectric substrate, 140' transducer, 180' resin housing, 190' gap, 200' solder;

[0039] Figures 3 to 10 Reference numerals:

[0040] 100 filter, 110 substrate, 112 protrusion, 120 metal substrate, 122 titanium metal layer, 124 metal substrate layer, 130 piezoelectric substrate, 140 transducer, 150 first solder, 160 second solder, 170 mounting cavity, 200 electronic device, 210 mainboard. DETAILED DESCRIPTION

[0041] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0042] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0043] In the description of the present application, it should be understood that the terms "upper", "inner", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0044] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0045] Combine the following Figures 3 to 10 A filter 100 and an electronic device 200 according to an embodiment of the present application are described.

[0046] In a first aspect, the present application provides a filter 100, comprising: a substrate 110; a metal substrate 120, disposed on the substrate 110, the metal substrate 120 and the substrate 110 enclosing a mounting cavity 170; a piezoelectric substrate 130, disposed on the metal substrate 120 and located within the mounting cavity 170; and a transducer 140, disposed on the piezoelectric substrate 130.

[0047] In the embodiment of the present application, the filter 100 includes a substrate 110, a metal substrate 120, a piezoelectric substrate 130 and a transducer 140. The metal substrate 120 is arranged on the substrate 110, and the substrate 110 and the metal substrate 120 enclose an installation cavity 170. The piezoelectric substrate 130 is arranged in the installation cavity 170. The transducer 140 is arranged on the piezoelectric substrate 130. The transmitting part of the transducer 140 can convert an electrical signal into a mechanical vibration of the piezoelectric substrate 130, and the receiving part of the transducer 140 can convert the mechanical vibration signal of the piezoelectric substrate 130 into an electrical signal output, thereby realizing filtering.

[0048] Among them, the piezoelectric substrate 130 is arranged on the metal substrate 120, and the metal substrate 120 has good heat dissipation performance. Therefore, even under high-power conditions, the metal substrate 120 can improve the heat dissipation effect of the filter 100. For example: the metal substrate 120 can transfer heat to the substrate 110 more quickly, achieve better heat dissipation, and improve performance, thereby improving the performance of the filter 100 under high-power conditions and improving the stability of the filter 100.

[0049] Furthermore, in the related art, such as Figure 2 As shown, when the acoustic wave energy passes through the piezoelectric substrate 130', the acoustic wave energy mainly propagates along the surface of the piezoelectric substrate 130' in the form of acoustic waves, but part of the energy is scattered into the interior of the piezoelectric substrate 130' and eventually dissipated, thus generating energy dissipation, such as Figure 7 As shown, in the filter 100 provided by the present application, the metal substrate 120 and the piezoelectric substrate 130 form a composite substrate. Due to the high sound velocity difference between the metal substrate 120 and the piezoelectric substrate 130, a reflecting surface is formed at the junction of the metal layer and the piezoelectric substrate 130, and the energy scattered by the piezoelectric substrate 130 is reflected back to the surface of the piezoelectric substrate 130, thereby reducing the sound wave energy dissipation of the piezoelectric substrate 130 and improving the performance of the filter 100.

[0050] As a possible implementation, the piezoelectric substrate 130 and the metal substrate 120 are bonded together; or the metal substrate 120 is grown on the piezoelectric substrate 130 .

[0051] Specifically, the piezoelectric substrate 130 and the metal substrate 120 may be connected by bonding, that is, the piezoelectric substrate 130 and the metal substrate 120 are manufactured separately and then bonded together, thereby reducing the production cost.

[0052] The piezoelectric substrate 130 and the metal substrate 120 may also be connected by electroplating, evaporation or sputtering, so that the metal substrate 120 grows on the piezoelectric substrate 130, thereby increasing the contact area and connection strength between the piezoelectric substrate 130 and the metal substrate 120, and improving the heat dissipation effect of the metal substrate 120 on the piezoelectric substrate 130.

[0053] As a possible implementation, the metal substrate 120 includes: a titanium metal layer 122 , on which the piezoelectric substrate 130 is disposed; and a metal substrate layer 124 , which is disposed on a side of the titanium metal layer 122 away from the piezoelectric substrate 130 .

[0054] Specifically, the metal substrate 120 includes a titanium metal layer 122 and a metal substrate layer 124. The piezoelectric substrate 130 is arranged on the titanium metal layer 122. The metal substrate layer 124 is arranged on the side of the titanium metal layer 122 away from the piezoelectric substrate 130. The titanium metal layer 122 can be used as a seed layer, and the metal substrate layer 124 is prepared on the titanium metal layer 122. The titanium metal layer 122 can play a better connecting role, thereby improving the connection strength between the piezoelectric substrate 130 and the metal substrate 120.

[0055] As a possible implementation, the metal substrate layer 124 is an aluminum substrate layer, an aluminum alloy substrate layer, a copper substrate layer, a copper alloy substrate layer, a tin substrate layer, a tin alloy substrate layer, a nickel substrate layer, a nickel alloy substrate layer, a chromium substrate layer or a chromium alloy substrate layer.

[0056] Specifically, the metal substrate layer 124 can be any one of an aluminum substrate layer, an aluminum alloy substrate layer, a copper substrate layer, a copper alloy substrate layer, a tin substrate layer, a tin alloy substrate layer, a nickel substrate layer, a nickel alloy substrate layer, a chromium substrate layer and a chromium alloy substrate layer. Aluminum, aluminum alloy, copper, copper alloy, tin, tin alloy, nickel, nickel alloy, chromium and chromium alloy have high thermal conductivity and good rigidity, thereby ensuring the heat dissipation effect of the filter 100 and enhancing the protection effect of the piezoelectric substrate 130 and the transducer 140 in the mounting cavity 170.

[0057] As a possible implementation manner, it further includes: a first solder 150 disposed on the titanium metal layer 122 and connected to the substrate 110 to fix the substrate 110 and the metal substrate 120 .

[0058] Specifically, the filter 100 also includes a first solder 150 , which is disposed between the titanium metal layer 122 and the substrate 110 , thereby achieving a fixed connection between the substrate 110 and the metal substrate 120 . In addition, the first solder 150 has high sealing performance, which can improve the waterproof performance of the filter 100 .

[0059] The first solder 150 may be located at the edge of the titanium metal layer 122 .

[0060] like Figure 1As shown, in the related art, since the connection between the resin housing 180' and the substrate 110' is only based on the viscosity of the resin housing 180' and the substrate 110', high requirements are placed on process parameters such as bonding surface cleanliness and temperature, and gaps 190' are easily generated, thereby affecting the sealing effect of the filter 100'. Figure 8 As shown, in the present application, the metal substrate 120 and the base plate 110 are connected and fixed by the first solder 150, which improves the sealing between the two, thereby reducing the possibility of generating gaps between the two, and the moisture sensitivity level (MSL) can be improved from MSL3 of the resin package to MSL1.

[0061] As a possible implementation, the edge of the substrate 110 facing the metal substrate 120 has a protrusion 112 , the metal substrate 120 is disposed on the protrusion 112 , and at least a portion of the mounting cavity 170 is formed inside the protrusion 112 .

[0062] Specifically, the edge of the substrate 110 facing the metal substrate 120 has a protrusion 112, that is, a depression is formed at the center of the substrate 110, and the metal substrate 120 is arranged on the protrusion 112, and at least a partial installation cavity 170 is formed on the inner side of the protrusion 112, thereby providing installation space for the piezoelectric substrate 130 and the transducer 140, and reducing the installation gap after the filter 100 is assembled, so that the entire filter 100 has only the installation gap formed between the substrate 110 and the metal substrate 120, thereby improving the waterproof performance of the filter 100.

[0063] As a possible implementation, the protrusion 112 is a polygonal ring structure or a circular ring structure, the piezoelectric substrate 130 and the protrusion 112 are matched, and at least a portion of the piezoelectric substrate 130 is embedded in the inner side of the protrusion 112 .

[0064] Specifically, the protrusion 112 is a polygonal ring structure or a circular ring structure, the piezoelectric substrate 130 and the protrusion 112 are adapted to each other, and at least part of the piezoelectric substrate 130 is embedded in the inner side of the protrusion 112, so that the piezoelectric substrate 130 and the protrusion 112 form a certain seal, reducing the possibility of dust and other debris entering the installation cavity 170, thereby improving the yield rate of the filter 100.

[0065] like Figure 1 As shown, in the related art, since the resin housing 180' is usually formed by injection molding, the resin material is easy to invade the transducer 140', thereby affecting the yield of the filter 100'. Fig. 9As shown, the filter 100 provided in the present application utilizes the inherent strength of the metal substrate 120, does not use a resin film, and sets a protrusion 112 on the upper surface of the substrate 110, thereby reserving a groove, so that a stepped structure is formed at the edge of the substrate 110. After the metal substrate 120 and the piezoelectric substrate 130 are engaged with the substrate 110, the groove located in the middle position of the protrusion 112 forms a cavity structure. The resin film is not used to reduce the source of foreign matter. At the same time, the protrusion 112 can effectively prevent other foreign matter from invading and causing functional failure of the filter 100.

[0066] As a possible implementation, the orthographic projection of the piezoelectric substrate 130 on the substrate 110 is located inside the orthographic projection of the metal substrate 120 on the substrate 110 .

[0067] Specifically, the orthographic projection of the piezoelectric substrate 130 on the substrate 110 is located inside the orthographic projection of the metal substrate 120 on the substrate 110, that is, the size of the piezoelectric substrate 130 is smaller than the size of the metal substrate 120. Therefore, the cooperation between the substrate 110 and the metal substrate 120 can completely protect the piezoelectric substrate 130 and reduce the possibility of damage to the piezoelectric substrate 130.

[0068] After the metal substrate 120 is prepared on the piezoelectric substrate 130 , part of the piezoelectric substrate 130 may be cut off to reduce the volume of the piezoelectric substrate 130 .

[0069] As a possible implementation manner, the second solder 160 is further included, which is disposed on a side of the piezoelectric substrate 130 away from the metal substrate 120 and connected to the base plate 110 , so as to electrically connect the base plate 110 and the piezoelectric substrate 130 .

[0070] Specifically, the filter 100 also includes a second solder 160, which is arranged between the piezoelectric substrate 130 and the substrate 110, so that the substrate 110 and the piezoelectric substrate 130 are electrically connected, wherein the second solder 160 is located on the side of the piezoelectric substrate 130 away from the metal substrate 120, thereby ensuring the embedded fit of the piezoelectric substrate 130 and the substrate 110 to ensure that the piezoelectric substrate 130 has sufficient volume.

[0071] When producing the filter 100, if Figure 4 As shown, a titanium metal layer 122 and a metal substrate layer 124 may be prepared on one side of a piezoelectric substrate 130 first.

[0072] Specifically, a titanium metal layer 122 having a good connection effect is formed on one side of the piezoelectric substrate 130 by evaporation or sputtering, and the titanium metal layer 122 is used as a seed layer. The piezoelectric substrate 130 can be a wafer, and its material is lithium tantalate LiTaO 3 or lithium niobate LiNbO 3 .

[0073] The metal substrate layer 124 is manufactured on the titanium metal layer 122 by electroplating, evaporation or sputtering. The titanium metal layer 122, the metal substrate layer 124 and the piezoelectric substrate 130 together constitute a composite substrate.

[0074] The material of the metal substrate layer 124 may be aluminum, copper, tin, nickel, chromium or alloys thereof.

[0075] like Figure 5 As shown, electrodes of the transducer 140 are prepared on the other side of the piezoelectric substrate 130 .

[0076] Specifically, electrodes of the transducer 140 , circuit connection lines, and pads required for the second solder 160 are manufactured on another surface layer of the piezoelectric substrate 130 by evaporation or sputtering.

[0077] The material of the electrode of the transducer 140 may be aluminum, copper, nickel, chromium or alloys thereof.

[0078] like Figure 6 As shown, a second solder 160 is then prepared on the piezoelectric substrate 130 , and a first solder 150 is prepared on the titanium metal layer 122 .

[0079] Specifically, the edge of the piezoelectric substrate 130 is cut off by shallow cutting, so that the piezoelectric substrate 130 is retracted into the metal substrate 120, and a pad space for setting the first solder 150 is reserved, and the first solder 150 and the second solder 160 are manufactured by ball planting.

[0080] like Figure 3 As shown, the filter 100 is obtained by embedding the piezoelectric substrate 130 and the metal substrate 120 with the base plate 110 and performing high temperature welding.

[0081] Specifically, the completed components are fastened onto the substrate 110 , and the structure is solidified by reflow soldering, and then cut into individual filters 100 .

[0082] As a possible implementation, the transducer 140 may be an interdigital transducer (IDT), and the filter 100 may be a surface acoustic wave filter (SAW).

[0083] Second, as Fig.10 As shown, the present application provides an electronic device 200, including: a main board 210; and a filter 100 as provided in the first aspect embodiment, the filter 100 being connected to the main board 210.

[0084] The electronic device 200 provided in the present application includes the filter 100 provided in the first aspect embodiment, and therefore has all the beneficial effects of the filter 100 provided in the first aspect embodiment, which will not be described one by one here.

[0085] The filter 100 may be disposed on the main board 210 , or the filter 100 may be connected to the main board 210 via a wire.

[0086] In the description of this specification, the description with reference to the terms "one embodiment" or "specific embodiment" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0087] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A filter, characterized in that: include: substrate; A metal substrate is disposed on the base plate, wherein the metal substrate and the base plate surround a mounting cavity; A piezoelectric substrate, disposed on the metal substrate and located in the mounting cavity; The transducer is arranged on the piezoelectric substrate.

2. The filter according to claim 1, characterized in that The piezoelectric substrate and the metal substrate are bonded to each other; or The metal substrate is grown on the piezoelectric substrate.

3. The filter according to claim 1, characterized in that The metal substrate comprises: a titanium metal layer, the piezoelectric substrate being arranged on the titanium metal layer; The metal substrate layer is arranged on a side of the titanium metal layer away from the piezoelectric substrate.

4. The filter according to claim 3, characterized in that The metal substrate layer is an aluminum substrate layer, an aluminum alloy substrate layer, a copper substrate layer, a copper alloy substrate layer, a tin substrate layer, a tin alloy substrate layer, a nickel substrate layer, a nickel alloy substrate layer, a chromium substrate layer or a chromium alloy substrate layer.

5. The filter according to claim 3, characterized in that Also includes: The first solder is arranged on the titanium metal layer and connected to the base plate to fix the base plate and the metal substrate.

6. The filter according to any one of claims 1 to 5, characterized in that The edge of the base plate facing the metal substrate has a protrusion, the metal substrate is arranged on the protrusion, and at least a part of the installation cavity is formed inside the protrusion.

7. The filter according to claim 6, characterized in that The protrusion is a polygonal ring structure or a circular ring structure, the piezoelectric substrate and the protrusion are matched, and at least a part of the piezoelectric substrate is embedded in the inner side of the protrusion.

8. The filter according to claim 7, characterized in that The orthographic projection of the piezoelectric substrate on the substrate is located inside the orthographic projection of the metal substrate on the substrate.

9. The filter according to any one of claims 1 to 4, characterized in that: Also includes: The second solder is arranged on a side of the piezoelectric substrate away from the metal substrate and connected to the base plate, so as to electrically connect the base plate and the piezoelectric substrate.

10. An electronic device, characterized in that: include: Motherboard; The filter according to any one of claims 1 to 9, wherein the filter is connected to the mainboard.

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