PCIE interconnection system capable of long-distance signal transmission

Abstract

The utility model discloses a PCIE (Peripheral Component Interface Express) interconnection system capable of long-distance signal transmission, which comprises a main adaptation module and a target adaptation module which are arranged between a PCIE controller and PCIE equipment, the main adaptation module comprises a first PCIE switching chip, a first control chip, a first golden finger connector and a first socket, and the first control chip, the first golden finger connector and the first socket are respectively connected with the first PCIE switching chip. The target adaptation module comprises a second PCIE switching chip, and a second control chip, a second golden finger connector and a second socket which are respectively connected with the second PCIE switching chip, the first golden finger connector is connected to a slot of the PCIE controller so as to bidirectionally transmit PCIE signals of the PCIE controller, the second golden finger connector is directly or indirectly connected with different PCIE devices, and the second control chip, the second golden finger connector and the second socket are respectively connected with the second PCIE switching chip. And the first socket and the second socket are connected through a high-speed optical cable to transmit PCIE signals of the PCIE equipment in a two-way manner, so that the PCIE signals are transmitted between the first PCIE switching chip and the second PCIE switching chip. According to the utility model, the problems of short PCIE interconnection transmission distance and unstable communication in the prior art are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of PCIE signal processing, in particular to a PCIE interconnection system capable of long-distance signal transmission. Background Art

[0002] Existing PCIE interconnections are usually based on cable connections. Due to the attenuation of signal transmission, the length is generally not too long, and the maximum will not exceed 10 meters. There are also some designs on the market that convert PCIE signals into optical signals, but due to the need for signal matching, chips such as buffers or equalizers are usually added to adjust the signal quality. Such communication is unstable and the transmission distance is short. Utility Model Content

[0003] In view of the above technical problems, the utility model provides a PCIE interconnection system capable of long-distance signal transmission, so as to solve the problems of short transmission distance and unstable communication of PCIE interconnection in the prior art.

[0004] Other features and advantages of the present invention will become apparent from the following detailed description or may be learned in part from the practice of the present invention.

[0005] A PCIE interconnection system capable of long-distance signal transmission, the system comprising a main adapter module and a target adapter module arranged between a PCIE controller and a PCIE device, the main adapter module comprising a first PCIE switching chip and a first control chip respectively connected to the first PCIE switching chip, a first gold finger connector, and a first socket, the target adapter module comprising a second PCIE switching chip and a second control chip respectively connected to the second PCIE switching chip, a second gold finger connector, and a second socket, the first gold finger connector being connected to a slot of the PCIE controller to bidirectionally transmit PCIE signals of the PCIE controller, the second gold finger connector being directly or indirectly connected to different PCIE devices to bidirectionally transmit PCIE signals of the PCIE devices, and the first socket and the second socket being connected via a high-speed optical cable to enable PCIE signals to be transmitted between the first PCIE switching chip and the second PCIE switching chip.

[0006] Furthermore, the second gold finger connector forms a PCIE standard slot through an adapter board to connect different PCIE devices.

[0007] Furthermore, the second gold finger connector is directly connected to a PCIE standard card or a PCIE onboard device through a carrier board.

[0008] Furthermore, the first PCIE switch chip and the second PCIE switch chip operate in a transparent bridge mode.

[0009] Furthermore, the main adapter module and the target adapter module both have LEDs, which are connected to the corresponding first control chip and the second control chip, and are used to light up preset lamp beads according to the connection status of the first PCIE switching chip and the second PCIE switching chip.

[0010] Furthermore, the first control chip and the second control chip are CPLD or MCU.

[0011] Furthermore, the high-speed optical cable is a QSFP+ or mSAS-HDA interconnection optical cable.

[0012] The technical solution of the utility model has the following beneficial effects:

[0013] Through the first PCIE switching chip, the second PCIE switching chip, the first control chip, the second control chip and the high-speed optical cable, the PCIE signal can be exchanged, and the transmission distance is arbitrarily determined according to the length of the high-speed optical cable, which greatly extends the transmission distance of the PCIE signal and effectively reduces the strength of the entire system; the main adapter module and the target adapter module do not need to use chips such as repeaters or equalizers, which greatly reduces the difficulty of production debugging, reduces costs, and also simplifies the hardware design and production of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A structural block diagram of a PCIE interconnection system according to an embodiment of this specification;

[0015] Figure 2 This is a schematic diagram of the main adaptation module and the target adaptation module of the embodiment of this specification. DETAILED DESCRIPTION

[0016] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as being limited to the examples set forth herein; on the contrary, these embodiments are provided so that the present disclosure will be more comprehensive and complete, and the concepts of the example embodiments are fully conveyed to those skilled in the art. The described features, structures, or characteristics may be combined in one or more embodiments in any suitable manner. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure may be practiced while omitting one or more of the specific details, or other components, devices, steps, etc. may be employed. In other cases, known technical solutions are not shown or described in detail to avoid obscuring various aspects of the present disclosure.

[0017] like Figure 1-2As shown, a PCIE interconnection system capable of long-distance signal transmission is provided, the system includes a main adaptation module 100 and a target adaptation module 200 arranged between a PCIE controller 300 and a PCIE device 400, the main adaptation module 100 includes a first PCIE switching chip 101 and a first control chip 102, a first gold finger connector 103, and a first socket 104 respectively connected to the first PCIE switching chip 101, and the target adaptation module 200 includes a second PCIE switching chip 201 and a second control chip 102 respectively connected to the second PCIE switching chip 201 202, a second gold finger connector 203, and a second socket 204. The first gold finger connector 103 is connected to the slot of the PCIE controller 300 to bidirectionally transmit the PCIE signal of the PCIE controller 300. The second gold finger connector 203 is directly or indirectly connected to different PCIE devices 400 to bidirectionally transmit the PCIE signal of the PCIE device 400. The first socket 104 and the second socket 204 are connected through a high-speed optical cable 500 so that the PCIE signal is transmitted between the first PCIE switch chip 101 and the second PCIE switch chip 201.

[0018] The second gold finger connector 203 forms a PCIE standard slot through an adapter board to connect different PCIE devices 400. Alternatively, the second gold finger connector 203 is directly connected to a PCIE standard card or a PCIE onboard device through a carrier board.

[0019] The first PCIE switch chip 101 and the second PCIE switch chip 201 operate in a transparent bridge mode.

[0020] Both the main adaptation module 100 and the target adaptation module 200 have LEDs, which are connected to the corresponding first control chip 102 and the second control chip 202 and are used to light up preset lamp beads according to the connection status of the first PCIE switching chip 101 and the second PCIE switching chip 201.

[0021] The first control chip 102 and the second control chip 202 are CPLD or MCU.

[0022] High-speed optical cables are AOC interconnect optical cables such as QSFP+ or mSAS-HDA, which can achieve long-distance transmission of up to 100M.

[0023] Principle description:

[0024] The whole system is realized by two cards, the main adapter module 100 (called Host end) and the target adapter module 200 (Target end), and a set of interconnecting optical fibers. The Host end is connected to the standard slot of the PCIE controller 300 (such as CPU) through a gold finger connector, and the Target end converts the gold finger connector into a standard PCIE slot through an adapter board to connect various standard PCIE devices 400. The Host end and the Target end are connected through a high-speed optical cable to transmit Tx and Rx signals, and the clock and reset signals are generated by each.

[0025] The PCIE controller 300 establishes a connection with the first PCIE switch chip 101 on the Host end to achieve data transmission. The Host end and the Target end are interconnected through a high-speed optical cable, and a connection is established between the two PCIE switch chips to achieve data transmission.

[0026] The Target end can also be converted into a standard slot through a gold finger connector, or directly connected to a PCIE standard card or a PCIE onboard device through a carrier board.

[0027] The above systems work independently, and the specific working mode is determined by the configuration mode of the first PCIE switch chip 101 and the second PCIE switch chip 201. For example, when both the Host and Target ends are configured as transparent bridge mode, the PCIE controller 300 can directly access the PCIE device 400, thereby realizing long-distance PCIE connection.

[0028] In conventional PCIE signal transmission, equalization training is performed at the PCIE control end and the PCIE device 400 end to solve the problem of electrical signal attenuation in the transmission channel. In the application of optical signals, the connection between the PCIE control end and the PCIE device 400 end cannot be properly equalized due to the presence of an optical module, so it is necessary to actively configure the corresponding equalization parameters. In the utility model, the relevant equalization configuration parameters are read through logic devices such as CPLD / MCU, and then the interfaces of the first PCIE switching chip 101 and the second PCIE switching chip 201 are configured accordingly to match the parameters at both ends, thereby achieving good signal quality.

[0029] The utility model uses a first PCIE switching chip 101, a second PCIE switching chip 201, a first control chip 102, a second control chip 202 and a high-speed optical cable 500 to enable PCIE signals to be exchanged. The transmission distance is arbitrarily determined according to the length of the high-speed optical cable, which greatly extends the transmission distance of the PCIE signal and effectively reduces the strength of the entire system. The main adapter module 100 and the target adapter module 200 do not need to use chips such as repeaters or equalizers, which greatly reduces the difficulty of production debugging, reduces costs, and also simplifies the hardware design and production of the product.

[0030] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit them; although the utility model is described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the above embodiments, or replace some or all of the technical features therein by equivalent; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the various embodiments of the utility model. In addition, those skilled in the art can understand that although some embodiments described herein include certain features included in other embodiments instead of other features, the combination of features of different embodiments means that they are within the scope of the utility model and form different embodiments. For example, in the above claims, any one of the embodiments claimed for protection can be used in any combination. The information disclosed in this background technology section is only intended to deepen the understanding of the overall background technology of the utility model, and should not be regarded as admitting or suggesting in any form that the information constitutes prior art known to those skilled in the art.

Claims

1. A PCIE interconnection system capable of long-distance signal transmission, characterized in that: The system includes a main adaptation module and a target adaptation module arranged between a PCIE controller and a PCIE device, wherein the main adaptation module includes a first PCIE switching chip and a first control chip respectively connected to the first PCIE switching chip, a first gold finger connector, and a first socket, and the target adaptation module includes a second PCIE switching chip and a second control chip respectively connected to the second PCIE switching chip, a second gold finger connector, and a second socket, wherein the first gold finger connector is connected to the slot of the PCIE controller to bidirectionally transmit the PCIE signal of the PCIE controller, the second gold finger connector is directly or indirectly connected to different PCIE devices to bidirectionally transmit the PCIE signal of the PCIE device, and the first socket and the second socket are connected through a high-speed optical cable so that the PCIE signal is transmitted between the first PCIE switching chip and the second PCIE switching chip.

2. The PCIE interconnection system capable of long-distance signal transmission according to claim 1, characterized in that: The second gold finger connector forms a PCIE standard slot through an adapter board to connect different PCIE devices.

3. The PCIE interconnection system capable of long-distance signal transmission according to claim 1, characterized in that: The second gold finger connector is directly connected to the PCIE standard card or the PCIE onboard device through the carrier board.

4. The PCIE interconnection system capable of long-distance signal transmission according to claim 1, characterized in that: The first PCIE switch chip and the second PCIE switch chip operate in a transparent bridge mode.

5. The PCIE interconnection system capable of long-distance signal transmission according to claim 1, characterized in that: The main adapter module and the target adapter module both have LEDs, which are connected to the corresponding first control chip and the second control chip and are used to light up preset lamp beads according to the connection status of the first PCIE switching chip and the second PCIE switching chip.

6. The PCIE interconnection system capable of long-distance signal transmission according to claim 1, characterized in that: The first control chip and the second control chip are one of CPLD and MCU.

7. The PCIE interconnection system capable of long-distance signal transmission according to claim 1, characterized in that: The high-speed optical cable is a QSFP+ or mSAS-HDA interconnection optical cable.

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