Electronic module and inverter

Abstract

The utility model relates to an electronic module and an inverter, and relates to the technical field of inverters, the electronic module comprises a circuit board and a first heating component arranged on the circuit board, and further comprises a radiator and a heat conduction assembly, the heat conduction assembly is located between the radiator and the circuit board, and the heat conduction assembly is located between the radiator and the circuit board. The heat conduction assembly is connected with the radiator and the first heating component. Through the design of the heat conduction assembly, the heat conduction assembly is connected with the radiator and the first heating component, so that heat can be conducted to the radiator from the first heating component, the distance between the radiator and the first heating component can be greatly shortened, and the heat of the first heating component is rapidly conducted to the radiator; the electronic module can discharge heat more quickly during working, so that the temperature of components is reduced, the service life of the components is prolonged, and the problem of heat dissipation of small-size components on the power board is solved.

Description

Technical Field

[0001] The present application relates to the field of inverter technology, and in particular to an electronic module and an inverter. Background Art

[0002] In the field of high-power photovoltaic inverters, power components (such as IGBT, MOSFET, etc.) on the power board are connected to an external heat sink to effectively dissipate the generated heat. However, even if the main power components are well cooled, there are still some small-sized components (such as copper foil, chip capacitors, etc.) on the power board, and their temperature is difficult to effectively control. These small components have high temperatures, but due to their small size, they cannot directly contact the external heat sink, resulting in the heat cannot be effectively transferred to the outside of the inverter. This may have a negative impact on the service life of the inverter and increase the risk of inverter failure.

[0003] At present, the existing inverter power board heat dissipation design usually only focuses on directly connecting the main power components to the heat sink, while the heat dissipation problem of small-sized components on the PCB circuit board has not been effectively solved; although these small-sized components have low heat generation, due to their high heat density and the lack of effective heat dissipation methods, they can only rely on air heat dissipation, resulting in high temperatures of these components, thereby affecting the life and reliability of the entire system.

[0004] Therefore, the challenge facing current technology is how to effectively solve the heat dissipation problem of small-sized components on the power board to improve the life and reliability of the inverter system. Utility Model Content

[0005] In order to solve the heat dissipation problem of small-sized components on a power board, the present application provides an electronic module and an inverter.

[0006] The electronic module and inverter provided in this application adopt the following technical solution:

[0007] An electronic module includes a circuit board and a first heat generating component arranged on the circuit board, and also includes a heat sink and a heat conducting component, wherein the heat conducting component is located between the heat sink and the circuit board, and the heat conducting component connects the heat sink and the first heat generating component.

[0008] By adopting the above technical solution, the first heat-generating component will generate heat during operation, and the heat-conducting component can conduct the heat to the radiator, and dissipate the heat to the surrounding environment through the radiator, thereby reducing the operating temperature of the first heat-generating component; the present application adopts the design of the heat-conducting component, and the heat-conducting component can help heat to be conducted from the first heat-generating component to the radiator by connecting the radiator and the first heat-generating component, and can greatly shorten the distance between the radiator and the first heat-generating component, and quickly conduct the heat of the first heat-generating component to the radiator, so that the electronic module can discharge heat faster during operation, thereby reducing the temperature of the component, extending the service life of the component, and solving the heat dissipation problem of small-sized components on the power board; and this design can better utilize limited space to improve the heat dissipation effect, making the overall size of the electronic module more compact.

[0009] In a specific possible implementation, a second heat-generating component is provided on the circuit board, the height of the second heat-generating component is greater than the height of the first heat-generating component, the second heat-generating component is located between the radiator and the circuit board, and the second heat-generating component is connected to the radiator.

[0010] By adopting the above technical solution, the second heat-generating component is placed between the radiator and the circuit board. It can actively contact the radiator and be directly connected to the radiator, so that the heat can be effectively dissipated, thereby improving the heat dissipation efficiency, balancing the heat distribution, saving space and simplifying the system design.

[0011] In a specific possible implementation manner, the heat conductive assembly includes a metal heat conductive block and a heat conductive member, the metal heat conductive block is arranged between the heat sink and the heat conductive member, and the side of the heat conductive member away from the metal heat conductive block is connected to the first heat generating component.

[0012] By adopting the above technical solution, during operation, the heat generated by the first heat-generating component is directly transferred to the heat-conducting member, and then transferred to the metal heat-conducting block through the heat-conducting member and then to the radiator for dissipation; by using the metal heat-conducting block and the heat-conducting member in combination, the metal heat-conducting block can greatly shorten the distance between the radiator and the first heat-generating component, and the heat-conducting member can fill the gap between the metal heat-conducting block and the first heat-generating component, which is conducive to allowing the first heat-generating component to fully contact with the heat-conducting member, improving the thermal conductivity, ensuring the efficiency and uniformity of heat conduction, and avoiding local overheating caused by heat accumulation. The thermal conductivity of the heat-conducting member can effectively enhance the conduction of heat, so that the heat is transferred from the first heat-generating component to the metal heat-conducting block more quickly and dissipated through the radiator, thereby improving the heat dissipation efficiency of the entire module.

[0013] In a specific possible implementation manner, the heat sink includes a substrate and heat dissipation fins, the heat dissipation fins are located on a side of the substrate away from the circuit board, the substrate is connected to the metal heat conductive block, and the substrate is connected to the second heat generating component.

[0014] By adopting the above technical solution, the connection between the substrate and the metal heat conductive block helps to effectively transfer heat. When the first heat-generating component generates heat, the heat will be transferred to the radiator through the substrate; the substrate is directly connected to the second heat-generating component. This design simplifies the heat conduction path and improves the heat transfer efficiency of the entire system; the heat dissipation fins are located on the side of the substrate away from the circuit board. Its design can effectively increase the heat dissipation surface area and improve the heat dissipation efficiency of the radiator.

[0015] In a specific possible implementation manner, a heat conducting layer is provided between the metal heat conducting block and the substrate.

[0016] By adopting the above technical solution and utilizing the design of the heat-conducting layer, the thermal resistance between the heat sink and the metal heat-conducting block can be reduced, the flow of heat can be promoted, and the heat dissipation efficiency of the entire system can be further improved.

[0017] In a specific possible implementation manner, the metal heat conductive block and the base plate are provided with bolt holes.

[0018] By adopting the above technical solution and utilizing the design of the bolt holes, the metal heat conducting block and the base plate can be fixed and connected. By using bolts, a firm connection between the two components can be ensured to prevent loosening during vibration or transportation.

[0019] In a specific implementation manner, the metal heat conductive block is an aluminum alloy block.

[0020] By adopting the above technical solution, the metal heat conductive block is an aluminum alloy block. The aluminum alloy block has a relatively high thermal conductivity, which makes it very suitable for use as a metal heat conductive block. It can quickly conduct heat and distribute it to a larger surface, helping heat to be dissipated more efficiently. While ensuring good thermal conductivity, cost-effectiveness and adaptability can also be achieved.

[0021] An inverter comprises the electronic module as described above.

[0022] By adopting the above technical solution, the inverter of the present application utilizes the above-designed electronic module to achieve personalized thermal management according to the size and heat dissipation requirements of the power components; for small-sized power components, the heat can be effectively transferred to the radiator through the design of metal heat-conducting blocks and heat-conducting parts, thereby solving the heat dissipation problem of small-sized components on the power board; and for large-sized power components, the heat can be directly transferred to the radiator for dissipation through the design of direct connection with the radiator; for components of different sizes, targeted heat conduction design is implemented, so that the heat can be effectively transferred to the radiator, thereby avoiding the problem of heat accumulation inside the circuit board or local overheating.

[0023] In summary, the present application includes at least one of the following beneficial technical effects:

[0024] 1. The electronic module of the present application uses a metal heat-conducting block and a heat-conducting member in combination. The metal heat-conducting block can greatly shorten the distance between the radiator and the first heat-generating component. The heat-conducting member can fill the small gap between the metal heat-conducting block and the first heat-generating component, thereby ensuring the efficiency and uniformity of heat conduction and avoiding local overheating caused by heat accumulation. The heat-conducting performance of the heat-conducting member can effectively enhance the conduction of heat, so that the heat is transferred from the first heat-generating component to the metal heat-conducting block more quickly and dissipated through the radiator, thereby improving the heat dissipation efficiency of the entire module.

[0025] 2. The electronic module of the present application utilizes the second heat generating component to be placed between the heat sink and the circuit board, which can actively contact the heat sink and be directly connected to the heat sink, so that the heat can be effectively dissipated, thereby improving the heat dissipation efficiency, balancing the heat distribution, saving space and simplifying the system design;

[0026] 3. The inverter of the present application, utilizing the electronic module of the present application, can realize personalized thermal management according to the size and heat dissipation requirements of the power components; for small-sized power components, the heat can be effectively transferred to the radiator through the design of metal heat-conducting blocks and heat-conducting parts, thereby solving the heat dissipation problem of small-sized components on the power board; and for large-sized power components, the heat can be directly transferred to the radiator and dissipated through the design of direct connection with the radiator; for components of different sizes, targeted heat conduction design is implemented, so that the heat can be effectively transferred to the radiator, thereby avoiding the problem of heat accumulation inside the circuit board or local overheating. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the structure of the electronic module of the embodiment of the present application.

[0028] Figure 2 It is a schematic diagram used to show the structure of the heat conduction component.

[0029] Figure 3 It is a cross-sectional view used to show the bolt holes.

[0030] Figure 4 It is a schematic diagram for showing the structure of the first heating element and the second heating element.

[0031] Explanation of the reference numerals: 1. Circuit board; 2. First heat generating component; 3. Radiator; 31. Substrate; 32. Heat dissipating fins; 4. Heat conducting assembly; 41. Metal heat conducting block; 42. Heat conducting member; 5. Second heat generating component; 6. Bolt hole. DETAILED DESCRIPTION

[0032] The following is combined with Figure 1-4 This application is described in further detail.

[0033] Embodiment 1

[0034] Reference Figure 1 and Figure 2 , the embodiment of the present application discloses an electronic module, the electronic module includes a circuit board 1, the circuit board 1 is provided with a first heat generating component 2, in this embodiment, the height of the first heat generating component includes but is not limited to less than 2mm;

[0035] It also includes a heat sink 3 and a heat conducting component 4, the heat conducting component 4 is located between the heat sink 3 and the circuit board 1, the heat conducting component 4 is correspondingly arranged with the first heat generating component 2, and the heat conducting component 4 connects the heat sink 3 and the first heat generating component 2;

[0036] When working, the first heat generating component 2 generates heat, and the heat conducting component 4 can conduct the heat to the radiator 3, and dissipate the heat to the surrounding environment through the radiator 3, thereby reducing the working temperature of the first heat generating component 2;

[0037] Through the design of the heat-conducting component 4, the heat-conducting component 4 can help heat to be transferred from the first heat-generating component 2 to the heat-sink 3 by connecting the heat sink 3 and the first heat-generating component 2, and can greatly shorten the distance between the heat sink 3 and the first heat-generating component 2, and quickly transfer the heat of the first heat-generating component 2 to the heat sink 3, so that the electronic module can discharge heat faster when working, thereby reducing the temperature of the component, extending the service life of the component, and solving the heat dissipation problem of small-sized components on the power board.

[0038] The heat conducting assembly 4 includes a metal heat conducting block 41 and a heat conducting member 42. The metal heat conducting block 41 is disposed between the heat sink 3 and the heat conducting member 42. The heat conducting member 42 is connected to the first heat generating component 2 at a side away from the metal heat conducting block 41. In the present embodiment, there is a certain gap between the metal heat conducting block 41 and the first heat generating component 2. The heat conducting member 42 can fill the gap, and can effectively transfer the heat of the first heat generating component 2 to the heat sink 3.

[0039] In this embodiment, the material of the metal heat conductive block 41 can be the same as that of the heat sink 3. The metal heat conductive block 41 includes but is not limited to an aluminum alloy block. The metal heat conductive block 41 can also be a copper block or other metal blocks with high thermal conductivity. The aluminum alloy block in this embodiment has a relatively high thermal conductivity, which makes it very suitable for use as the metal heat conductive block 41. It can quickly conduct heat and distribute it to a larger surface, helping heat to be dissipated more effectively. While ensuring good thermal conductivity, it can also achieve cost-effectiveness and adaptability. Compared with other metals, aluminum is a lightweight metal, which makes it very useful in designing lightweight electronic equipment and heat dissipation systems. Aluminum alloys are easy to process into different shapes and sizes, and can be cut or formed according to specific needs to meet the heat dissipation requirements of different components. Aluminum alloys are usually lower in cost, which helps to reduce overall system costs.

[0040] In this embodiment, the material of the heat conducting member 42 includes but is not limited to a silicone thermal pad or a thermally conductive gel. The silicone thermal pad has good softness and plasticity, can adapt to surfaces of different shapes, fill and fill the gap between the metal heat conducting block 41 and the first heating component 2, and is conducive to allowing the first heating component 2 to fully contact with the heat conducting member 42, improve the thermal conductivity, and ensure the efficiency and uniformity of heat conduction; and the thermally conductive gel is usually made of a material with good thermal conductivity, such as silicone or a specific polymer. This property enables the gel to effectively absorb and transfer heat. During the manufacturing process, the thermally conductive gel can ensure that the thermally conductive gel is filled into the gap between the metal heat conducting block 41 and the first heating component 2 through a gluing process, and can make the thermally conductive gel filling more uniform, ensuring the effect and stability of the heat conducting member 42 when in use; the design of the silicone thermal pad or the thermally conductive gel enables the heat conducting member 42 to fill the gap between the metal heat conducting block 41 and the first heating component 2, prevent air from blocking the heat conduction path, and ensure that the heat can be effectively conducted to the radiator 3;

[0041] During operation, the heat generated by the first heat-generating component 2 is directly transferred to the heat-conducting member 42, and then transferred to the metal heat-conducting block 41 through the heat-conducting member 42 and then to the radiator 3 for dissipation; through the combined use of the metal heat-conducting block 41 and the heat-conducting member 42, the metal heat-conducting block 41 can greatly shorten the distance between the radiator 3 and the first heat-generating component 2, and the heat-conducting member 42 can fill the small gap between the metal heat-conducting block 41 and the first heat-generating component 2 to ensure the efficiency and uniformity of heat conduction and avoid local overheating caused by heat accumulation. The thermal conductivity of the heat-conducting member 42 can effectively enhance the conduction of heat, so that the heat is transferred from the first heat-generating component 2 to the metal heat-conducting block 41 more quickly and dissipated through the radiator 3, thereby improving the heat dissipation efficiency of the entire module.

[0042] Reference Figure 3 and Figure 4 A second heating component 5 is provided on the circuit board 1, the height of the second heating component 5 is greater than the height of the first heating component 2, the second heating component 5 is located between the radiator 3 and the circuit board 1, and the second heating component 5 is connected to the radiator 3;

[0043] The second heat-generating component 5 is placed between the heat sink 3 and the circuit board 1 and connected to the heat sink 3 by design. In this design, the second heat-generating component 5 can directly contact and be directly connected to the heat sink 3, so that the heat can be effectively dissipated, thereby improving the heat dissipation efficiency, balancing the heat distribution, saving space and simplifying the system design.

[0044] The first heat-generating component 2 includes copper foil, capacitors, and memory particles, and the second heat-generating component 5 includes an IGBT module and a MOSFET module. In the present embodiment, the actual size of the first heat-generating component 2 is smaller than the actual size of the second heat-generating component 5. In the present embodiment, the heat generated by the second heat-generating component 5 during actual operation is greater than the heat generated by the first heat-generating component 2 during actual operation. The present application selects different thermal conductive designs for components with different thermal characteristics to dissipate heat more effectively, thereby ensuring the stability and performance of the entire system and achieving the best performance of overall thermal management.

[0045] The heat sink 3 includes a substrate 31 and heat dissipation fins 32. The heat dissipation fins 32 are located on a side of the substrate 31 away from the circuit board 1. The substrate 31 is connected to the metal heat conductive block 41. In this embodiment, the metal heat conductive block 41 and the substrate 31 are provided with a connecting bolt hole 6. The metal heat conductive block 41 and the substrate 31 are connected and fixed by bolts through the bolt hole 6. The design of the bolt hole 6 can be used to fix and connect the metal heat conductive block 41 and the substrate 31. By using bolts, the connection between the two components can be ensured to be firm and prevent loosening during vibration or transportation. The connection between the substrate 31 and the metal heat conductive block 41 helps to effectively transfer heat. When the first heat generating component 2 generates heat, the heat will be transferred to the heat sink 3 through the substrate 31.

[0046] And the substrate 31 is connected to the second heat-generating component 5; the substrate 31 is directly connected to the second heat-generating component 5, and this design simplifies the heat conduction path and improves the heat transfer efficiency of the entire system; in this heat dissipation process, the heat dissipation fins 32 are located on the side of the substrate 31 away from the circuit board 1, and its design can effectively increase the heat dissipation surface area and improve the heat dissipation efficiency of the radiator 3.

[0047] The present application also provides an inverter, which includes the electronic module as described above; the inverter uses the electronic module designed in the present application to achieve personalized thermal management according to the size and heat dissipation requirements of the power components in the inverter; for small-sized power components, the design of the metal heat conductive block 41 and the heat conductive member 42 can be used to effectively conduct the heat to the radiator 3, thereby solving the heat dissipation problem of the small-sized components on the power board; and for large-sized power components, the design of direct connection with the radiator 3 can be used to achieve direct conduction of heat to the radiator 3 for dissipation; for components of different sizes, a targeted heat conduction design is implemented, so that the heat can be effectively conducted to the radiator 3, thereby avoiding the problem of heat accumulation inside the circuit board 1 or local overheating.

[0048] The implementation principle of the embodiment of the present application is as follows: by using the electronic module designed in the present application, personalized thermal management can be achieved according to the size and heat dissipation requirements of the power components in the inverter; for small-sized power components, the heat can be effectively transferred to the heat sink 3 through the design of the metal heat conductive block 41 and the heat conductive member 42; and for large-sized power components, the heat can be directly transferred to the heat sink 3 and dissipated through the design of direct connection with the heat sink 3;

[0049] During operation, since the second heat-generating component 5 is placed between the radiator 3 and the circuit board 1 and connected to the radiator 3, the heat generated by the second heat-generating component 5 is directly transferred to the radiator 3, and the heat of the second heat-generating component is directly dissipated through the radiator 3;

[0050] The heat generated by the first heat-generating component 2 is transferred to the heat-conducting member 42, and then transferred to the metal heat-conducting block 41 through the heat-conducting member 42, and then transferred to the heat sink 3 for dissipation; through the combined use of the metal heat-conducting block 41 and the heat-conducting member 42, the metal heat-conducting block 41 can greatly shorten the distance between the heat sink 3 and the first heat-generating component 2, and the heat-conducting member 42 can fill the small gap between the metal heat-conducting block 41 and the first heat-generating component 2, thereby ensuring the efficiency and uniformity of heat conduction, and avoiding local overheating caused by heat accumulation. The thermal conductivity of the heat-conducting member 42 can effectively enhance the conduction of heat, so that the heat is transferred from the first heat-generating component 2 to the metal heat-conducting block 41 more quickly and dissipated through the heat sink 3, thereby improving the heat dissipation efficiency of the entire module;

[0051] The present application implements a targeted heat conduction design for components of different sizes, so that the heat can be effectively conducted to the heat sink 3, thereby avoiding the problem of heat accumulation inside the circuit board 1 or local overheating.

[0052] Embodiment 2

[0053] The overall structure of this embodiment is the same as that of the first embodiment. Figure 1-4As shown, the difference between this embodiment and the first embodiment is that a heat conducting layer is provided between the metal heat conducting block 41 and the substrate 31 of the heat sink 3 (it should be noted that the heat conducting layer is not shown in the figure). In this embodiment, the heat conducting layer includes but is not limited to a heat conducting silicone grease layer and a heat conducting pad layer. In this embodiment, in order to reduce the thermal resistance between the heat sink 3 and the metal heat conducting block 41, the heat conducting silicone grease can be applied to the contact surface between the metal heat conducting block 41 and the substrate 31 to form a heat conducting layer.

[0054] The high thermal conductivity of the thermal conductive layer can effectively improve the heat conduction efficiency, so that the heat is transferred from the metal thermal conductive block 41 to the radiator 3 more quickly, and thus enters the radiator 3 for heat dissipation more quickly; the thermal conductive layer can reduce the thermal resistance between the radiator 3 and the metal thermal conductive block 41, promote the flow of heat, and further improve the heat dissipation efficiency of the entire system; the thermal conductive layer can fill the tiny gap between the radiator 3 and the metal thermal conductive block 41, ensure the efficiency and uniformity of heat conduction, and further optimize the heat dissipation effect; by optimizing heat conduction and reducing thermal resistance, the thermal conductive layer can improve the reliability of the system, reduce the impact of thermal stress on components, and extend the service life of components.

[0055] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. An electronic module, characterized in that: It includes a circuit board and a first heat-generating component arranged on the circuit board; it also includes a heat sink and a heat-conducting component, the heat-conducting component is located between the heat sink and the circuit board, and the heat-conducting component connects the heat sink and the first heat-generating component; the heat-conducting component includes a metal heat-conducting block and a heat-conducting member, the metal heat-conducting block is arranged between the heat sink and the heat-conducting member, and the side of the heat-conducting member away from the metal heat-conducting block is connected to the first heat-generating component.

2. The electronic module according to claim 1, characterized in that: A second heating component is disposed on the circuit board. The height of the second heating component is greater than the height of the first heating component. The second heating component is located between the radiator and the circuit board, and the second heating component is connected to the radiator.

3. The electronic module according to claim 2, characterized in that: The heat sink comprises a substrate and heat dissipation fins, wherein the heat dissipation fins are located on a side of the substrate away from the circuit board, the substrate is connected to the metal heat conductive block, and the substrate is connected to the second heat generating component.

4. The electronic module according to claim 3, characterized in that: A heat conducting layer is provided between the metal heat conducting block and the substrate.

5. The electronic module according to claim 3, characterized in that: The metal heat conducting block and the base plate are provided with bolt holes.

6. The electronic module according to claim 1, characterized in that: The metal heat-conducting block is an aluminum alloy block.

7. An inverter, characterized in that: The inverter comprises the electronic module according to any one of claims 1-6.

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