Mainboard heat dissipation testing device suitable for multiple stations

Abstract

The utility model discloses a mainboard heat dissipation testing device suitable for multiple stations, comprising a support assembly, a cooling mechanism, a detection mechanism and a transmission assembly, the cooling mechanism is vertically installed on the support assembly, the cooling mechanism is connected with the support assembly and is used for heat dissipation of a mainboard, the detection mechanism is vertically installed on the support assembly and is used for heat dissipation of the mainboard, and the transmission assembly is used for transmission of heat dissipation of the mainboard. The detection assembly is connected with the supporting assembly and used for detecting a mainboard, the transmission assembly is vertically installed on the supporting assembly, the transmission assembly is connected with the supporting assembly and used for driving the supporting assembly to move, the cooling mechanism comprises a cold discharge pipe, the cold discharge pipe is vertically installed on the supporting assembly, and the cold discharge pipe is connected with the supporting assembly and used for cooling the mainboard. And through combined use of the cold discharge pipe, the water pipe and the heat dissipation copper sheet, efficient heat dissipation of the mainboard can be realized. According to the combined heat dissipation system, the heat dissipation area is increased, the heat dissipation efficiency is improved, the temperature of the mainboard can be rapidly reduced, and stable operation of the mainboard is guaranteed.

Description

Technical Field

[0001] The utility model relates to the development field of electronic component heat dissipation technology, in particular to a heat dissipation testing device suitable for a multi-station mainboard. Background Art

[0002] With the rapid development of electronic technology, the motherboard, as the core component of electronic equipment, is crucial to the operation of the entire system in terms of performance and stability. During the operation of the motherboard, heat dissipation has always been the focus of engineers. Excessive temperature will not only affect the performance and life of various components on the motherboard, but may also cause system failures and even damage the equipment. Therefore, heat dissipation testing of the motherboard is an important part of ensuring the quality and performance of the motherboard;

[0003] From the perspective of the principle of water cooling, it can be divided into two categories: active water cooling and passive water cooling. In addition to having all the accessories of the water cooling radiator, active water cooling also requires the installation of a cooling fan to assist in heat dissipation, which can significantly improve the heat dissipation effect. Passive water cooling does not install any cooling fan, and only relies on the water cooling radiator itself to dissipate heat. This water cooling method is less effective than active water cooling. To solve this problem, the inventor has proposed a heat dissipation test device suitable for multi-station motherboards. This technical solution will improve the heat dissipation effect and test efficiency of the hot end of the semiconductor refrigeration plate, and needs to achieve the purpose of precise temperature control. Utility Model Content

[0004] In view of the deficiencies existing in the above-mentioned technologies, the utility model provides a heat dissipation testing device suitable for a multi-station motherboard.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a device suitable for multi-station motherboard heat dissipation testing, comprising a support assembly, a cooling mechanism, a detection mechanism and a transmission assembly, wherein the cooling mechanism is vertically installed on the support assembly, the cooling mechanism is connected to the support assembly, and is used to dissipate heat for the motherboard, the detection mechanism is vertically installed on the support assembly, the detection assembly is connected to the support assembly, and is used to detect the motherboard, the transmission assembly is vertically installed on the support assembly, the transmission assembly is connected to the support assembly, and is used to drive the support assembly to move, the cooling mechanism comprises a cold radiator, the cold radiator is vertically installed on the support assembly, the cold radiator is connected to the support assembly, and is used to cool the motherboard.

[0006] As a further explanation, a water pipe is provided outwardly from the radiator pipe, and the water pipe is vertically installed on the support assembly. A heat dissipation copper sheet is provided outwardly from the water pipe, and the heat dissipation copper sheet is vertically installed on the support assembly, and the water pipe is connected to the heat dissipation copper sheet.

[0007] As a further explanation, the transmission mechanism includes a driving cylinder and a transmission bearing, the driving cylinder is vertically mounted on the support assembly, and the transmission bearing is vertically mounted on the support assembly.

[0008] As a further explanation, the detection mechanism includes a photoelectric sensor and a needle mold. The photoelectric sensor is vertically installed on the support assembly, and the photoelectric sensor is connected to the support assembly for monitoring the cooling mechanism. The needle mold is vertically installed on the support assembly, and the needle mold is connected to the support assembly for detecting the temperature of the mainboard.

[0009] As a further explanation, the supporting assembly includes a vertical plate, a cover plate and a reinforcing plate, the vertical plate is vertically installed on the reinforcing plate, the vertical plate is connected to the reinforcing plate for supporting the vertical plate, the cover plate is vertically installed on the vertical plate, the cover plate is connected to the vertical plate, the reinforcing plate is installed at one end of the vertical plate, the radiator pipe is located inside the reinforcing plate, the water pipe is located inside the reinforcing plate, the heat dissipation copper sheet is located on the outer surface of the reinforcing plate, the driving cylinder is located inside the cover plate, the photoelectric sensor is located on the top of the reinforcing plate, and the needle mold is located on one side of the reinforcing plate.

[0010] As a further explanation, a movable plate is extended outward from the vertical plate, and the movable plate is installed inside the vertical plate. A connecting plate is extended outward from the reinforcing plate, and the connecting plate is vertically installed on the reinforcing plate. The connecting plate is connected to the heat dissipation copper plate and is used to limit the heat dissipation copper plate. The transmission bearing is located inside the movable plate.

[0011] As a further explanation, a limiting mechanism is provided extending outward from the reinforcing plate, and the limiting mechanism includes a guide shaft and a limiting rod. The guide shaft is vertically installed on the reinforcing plate, and the guide shaft is connected to the reinforcing plate for guiding and positioning the SOC. The limiting rod is vertically installed on the reinforcing plate and away from the guide shaft, and the limiting rod is connected to the reinforcing plate for limiting the reinforcing plate.

[0012] As a further explanation, a locking screw is provided extending outward from the reinforcing plate, the locking screw is vertically installed on the reinforcing plate, and the locking screw is connected to the limiting rod for limiting the limiting rod.

[0013] As a further explanation, bolts are provided extending outward from the heat dissipation copper sheet, and the bolts are vertically installed on the heat dissipation copper sheet. The bolts are connected to the heat dissipation copper sheet and are used to limit the heat dissipation copper sheet.

[0014] In summary, the utility model has the following beneficial effects: The utility model is a heat dissipation test device suitable for a multi-station motherboard, which can achieve efficient heat dissipation of the motherboard through the combined use of a cold radiator, a water pipe and a heat dissipation copper sheet. This combined heat dissipation system not only increases the heat dissipation area and improves the heat dissipation efficiency, but also can quickly reduce the temperature of the motherboard, ensuring the stable operation of the motherboard. The detection mechanism of the integrated photoelectric sensor and the needle mold can monitor the operating status of the cooling mechanism in real time, and accurately detect the temperature of the motherboard through the needle mold. This automated monitoring and detection method improves the accuracy and efficiency of the test, reduces human errors, and improves practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a three-dimensional structural schematic diagram of a multi-station motherboard heat dissipation testing device of the utility model;

[0016] Figure 2 This is a schematic diagram of the structure of a heat dissipation test device for a multi-station motherboard according to the utility model;

[0017] Figure 3 This is a left view of a multi-station motherboard heat dissipation test device of the utility model;

[0018] Figure 4 The utility model is a schematic diagram of the internal structure of a multi-station motherboard heat dissipation testing device.

[0019] Numbers in the figure: 10-support assembly, 101-vertical plate, 102-cover plate, 103-reinforcement plate, 104-connecting plate, 105-movable plate, 20-cooling mechanism, 201-cooling pipe, 202-water pipe, 203-heat dissipation copper sheet, 30-limiting assembly, 301-guide shaft, 302-limiting rod, 303-locking screw, 304-bolt, 40-transmission mechanism, 401-driving cylinder, 402-transmission bearing, 50-detection mechanism, 501-photoelectric sensor, 502-needle mold. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] like Figure 1-4As shown, a multi-station motherboard heat dissipation test device includes a support assembly, a cooling mechanism, a detection mechanism and a transmission assembly. The cooling mechanism is vertically installed on the support assembly, and the cooling mechanism is connected to the support assembly for dissipating heat for the motherboard. The detection mechanism is vertically installed on the support assembly, and the detection assembly is connected to the support assembly for detecting the motherboard. The transmission assembly is vertically installed on the support assembly, and the transmission assembly is connected to the support assembly for driving the support assembly to move. The cooling mechanism includes a cold radiator 201, and the cold radiator 201 is vertically installed on the support assembly, and the cold radiator 201 is connected to the support assembly for cooling the motherboard.

[0022] A water pipe 202 is provided outwardly from the cold exhaust pipe 201 , and the water pipe 202 is vertically installed on the support component. A heat dissipation copper sheet 203 is provided outwardly from the water pipe 202 , and the heat dissipation copper sheet 203 is vertically installed on the support component. The water pipe 202 is connected to the heat dissipation copper sheet 203 .

[0023] Specifically, the radiator 201 is connected to the heat sink 203 through the water pipe 202 to form a complete heat dissipation system. When the cooling mechanism is started, the coolant in the radiator 201 circulates and transfers heat to the heat sink 203 through the water pipe 202. The heat sink 203 effectively dissipates heat into the air with its large heat dissipation area, thereby achieving rapid cooling of the motherboard and improving practicality.

[0024] The transmission mechanism includes a driving cylinder 401 and a transmission bearing 402. The driving cylinder 401 is vertically mounted on the support assembly, and the transmission bearing 402 is vertically mounted on the support assembly.

[0025] Specifically, the transmission assembly drives the support assembly to move through the driving cylinder 401 and the transmission bearing 402 to achieve the heat dissipation test of the motherboard at different stations. When the test is completed, the transmission assembly resets the support assembly, which improves practicality.

[0026] The detection mechanism includes a photoelectric sensor 501 and a needle mold 502. The photoelectric sensor 501 is vertically installed on the support component, and the photoelectric sensor 501 is connected to the support component for monitoring the cooling mechanism. The needle mold 502 is vertically installed on the support component, and the needle mold 502 is connected to the support component for detecting the temperature of the mainboard.

[0027] Specifically, the photoelectric sensor 501 monitors the operating state of the cooling mechanism to ensure that the cooling system works normally. At the same time, the needle mold 502 accurately detects the temperature of the mainboard and feeds the data back to the control system. The control system adjusts the operating parameters of the cooling mechanism according to the feedback data to achieve the best heat dissipation effect, thereby improving practicality.

[0028] The supporting assembly includes a vertical plate 101, a cover plate 102 and a reinforcing plate 103. The vertical plate 101 is vertically installed on the reinforcing plate 103, and the vertical plate 101 is connected to the reinforcing plate 103 for supporting the vertical plate 101. The cover plate 102 is vertically installed on the vertical plate 101, and the cover plate 102 is connected to the vertical plate 101. The reinforcing plate 103 is installed at one end of the vertical plate 101. The radiator pipe 201 is located inside the reinforcing plate 103, the water pipe 202 is located inside the reinforcing plate 103, the heat dissipation copper sheet 203 is located on the outer surface of the reinforcing plate 103, the driving cylinder 401 is located inside the cover plate 102, the photoelectric sensor 501 is located on the top of the reinforcing plate 103, and the needle mold 502 is located on one side of the reinforcing plate 103.

[0029] Specifically, the vertical plate 101, the cover plate 102 and the reinforcing plate 103 provide a stable supporting environment, and through the movable plate 105 and the connecting plate 104 structure, the stability of the mainboard during the test is ensured, thereby improving the stability.

[0030] A movable plate 105 is extended outward from the vertical plate 101 and installed inside the vertical plate 101. A connecting plate 104 is extended outward from the reinforcing plate 103 and installed vertically on the reinforcing plate 103. The connecting plate 104 is connected to the heat dissipation copper plate 203 and is used to limit the heat dissipation copper plate 203. The transmission bearing 402 is located inside the movable plate 105.

[0031] Specifically, by providing the movable plate 105 , it is convenient to drive the cylinder 401 to drive the movable plate 105 to move, and by providing the connecting plate 104 , it is convenient to connect two or more heat dissipating copper sheets 203 together, thereby improving practicality.

[0032] A limiting mechanism is provided extending outward from the reinforcing plate 103, and the limiting mechanism includes a guide shaft 301 and a limiting rod 302. The guide shaft 301 is vertically installed on the reinforcing plate 103, and the guide shaft 301 is connected to the reinforcing plate 103, and is used to guide and position the SOC. The limiting rod 302 is vertically installed on the reinforcing plate 103 and is away from the guide shaft 301. The limiting rod 302 is connected to the reinforcing plate 103, and is used to limit the reinforcing plate 103.

[0033] Specifically, the guide shaft 301 and the limiting rod 302 cooperate to achieve accurate guiding and positioning of the SOC and limiting of the reinforcing plate 103. This design can not only ensure the accurate position of the motherboard during the test, but also prevent the motherboard from deflecting or shaking during the movement.

[0034] A locking screw 303 is provided on the reinforcing plate 103 extending outward. The locking screw 303 is vertically installed on the reinforcing plate 103 . The locking screw 303 is connected to the limiting rod 302 to limit the limiting rod 302 .

[0035] Bolts 304 are provided extending outward from the heat dissipation copper sheet 203 . The bolts 304 are vertically mounted on the heat dissipation copper sheet 203 . The bolts 304 are connected to the heat dissipation copper sheet 203 and are used to limit the heat dissipation copper sheet 203 .

[0036] Specifically, the guide shaft 301 and the limit rod 302 ensure the precise position of the motherboard during the test to prevent deviation or shaking. The locking screw 303 is used to fix the position of the heat dissipation copper sheet 203 and the limit rod 302 to ensure the accuracy and stability of the test and improve the practicality.

[0037] By using the cooling radiator 201, the water pipe 202 and the heat dissipation copper sheet 203 in combination, efficient heat dissipation of the mainboard can be achieved. This combined heat dissipation system not only increases the heat dissipation area and improves the heat dissipation efficiency, but also can quickly reduce the temperature of the mainboard and ensure the stable operation of the mainboard. The detection mechanism of the integrated photoelectric sensor 501 and the needle mold 502 can monitor the operating status of the cooling mechanism in real time and accurately detect the temperature of the mainboard through the needle mold 502. This automated monitoring and detection method improves the accuracy and efficiency of the test, reduces human errors, and improves practicality.

[0038] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0039] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A heat dissipation test device for a multi-station motherboard, characterized in that: including a support assembly; A cooling mechanism, the cooling mechanism is vertically mounted on the supporting assembly, the cooling mechanism is connected to the supporting assembly, and is used to dissipate heat from the mainboard; A detection mechanism, the detection mechanism is vertically mounted on the support assembly, the detection mechanism is connected to the support assembly, and is used to detect the mainboard; A transmission assembly, the transmission assembly is vertically mounted on the support assembly, the transmission assembly is connected to the support assembly, and is used to drive the support assembly to move; The cooling mechanism comprises a cold radiator pipe, which is vertically mounted on the supporting assembly and connected to the supporting assembly for cooling the mainboard.

2. A multi-station motherboard heat dissipation test device according to claim 1, characterized in that: A water pipe is provided outwardly from the cold radiator pipe, and the water pipe is vertically installed on the support assembly. A heat dissipation copper sheet is provided outwardly from the water pipe, and the heat dissipation copper sheet is vertically installed on the support assembly. The water pipe is connected to the heat dissipation copper sheet.

3. A heat dissipation testing device for a multi-station motherboard according to claim 2, characterized in that: The transmission assembly includes a driving cylinder and a transmission bearing. The driving cylinder is vertically mounted on the support assembly, and the transmission bearing is vertically mounted on the support assembly.

4. The heat dissipation testing device for a multi-station motherboard according to claim 3, characterized in that: The detection mechanism includes a photoelectric sensor and a needle mold. The photoelectric sensor is vertically installed on the support component, and the photoelectric sensor is connected to the support component for monitoring the cooling mechanism. The needle mold is vertically installed on the support component, and the needle mold is connected to the support component for detecting the temperature of the mainboard.

5. The heat dissipation testing device for a multi-station motherboard according to claim 4, characterized in that: The supporting assembly includes a vertical plate, a cover plate and a reinforcing plate. The vertical plate is vertically installed on the reinforcing plate, and the vertical plate is connected to the reinforcing plate for supporting the vertical plate. The cover plate is vertically installed on the vertical plate, and the cover plate is connected to the vertical plate. The reinforcing plate is installed at one end of the vertical plate. The cold exhaust pipe is located inside the reinforcing plate, the water pipe is located inside the reinforcing plate, the heat dissipation copper sheet is located on the outer surface of the reinforcing plate, the driving cylinder is located inside the cover plate, the photoelectric sensor is located on the top of the reinforcing plate, and the needle mold is located on one side of the reinforcing plate.

6. The heat dissipation testing device for a multi-station motherboard according to claim 5, characterized in that: A movable plate is provided outwardly extending from the vertical plate, and the movable plate is installed inside the vertical plate. A connecting plate is provided outwardly extending from the reinforcing plate, and the connecting plate is vertically installed on the reinforcing plate. The connecting plate is connected to the heat dissipating copper plate and is used to limit the heat dissipating copper plate. The transmission bearing is located inside the movable plate.

7. The heat dissipation testing device for a multi-station motherboard according to claim 6, characterized in that: A limiting mechanism is provided on the reinforcing plate extending outward, and the limiting mechanism includes a guide shaft and a limiting rod. The guide shaft is vertically installed on the reinforcing plate, and the guide shaft is connected to the reinforcing plate for guiding and positioning the SOC. The limiting rod is vertically installed on the reinforcing plate and away from the guide shaft, and the limiting rod is connected to the reinforcing plate for limiting the reinforcing plate.

8. The heat dissipation testing device for a multi-station motherboard according to claim 7, characterized in that: The reinforcing plate is provided with a locking screw extending outwardly, the locking screw is vertically installed on the reinforcing plate, and the locking screw is connected to the limiting rod to limit the limiting rod.

9. The heat dissipation testing device for a multi-station motherboard according to claim 2, characterized in that: Bolts are provided extending outward from the heat dissipation copper sheet. The bolts are vertically mounted on the heat dissipation copper sheet. The bolts are connected to the heat dissipation copper sheet and are used to limit the heat dissipation copper sheet.

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