Wafer marking device

Abstract

The utility model relates to the field of wafer production equipment, and discloses a wafer marking device which comprises a bearing module and marking heads, the marking heads can be arranged on the upper side and the lower side of the bearing module, the bearing module comprises a rotating shaft and a suction cup, the rotating shaft is rotationally arranged, and the suction cup is arranged at the top end of the rotating shaft. When the wafer is marked, the wafer is firstly placed on the suction cup, then the rotating shaft is started to drive the wafer to rotate, and the marking area of the wafer is adjusted. And the wafer is fixed through the sucker, so that the wafer is prevented from displacing, different types of wafers can be fixed, and the practicability of the device is improved.

Description

Technical Field

[0001] The utility model relates to the field of wafer production equipment, in particular to a wafer processing equipment, and specifically to a wafer marking device. Background Art

[0002] During the wafer processing, a marking head is needed for marking. Usually, information such as the lot number of the wafer is marked at the 12 o'clock direction of the wafer by laser, so as to facilitate the subsequent tracing of the production information of the wafer.

[0003] CN106583942A discloses a wafer marking mechanism, including a base, a bracket, a feeding box and a grasping mechanism. The bracket is installed at the upper end of the base. A plurality of marking platforms arranged in a line are provided at the upper end of the bracket. The feeding box is arranged at one end of the bracket and installed on the base. A calibration platform is further arranged between the bracket and the feeding box. A first slide rail parallel to the bracket is further arranged at one side of the upper end of the base. The grasping mechanism is arranged on the first slide rail. This wafer marking mechanism can mark wafers of different sizes by replacing the support plate, and can mark different positions of the wafer by sequentially placing the larger-sized wafer on different marking platforms, so that the continuity of marking is better, the working efficiency is improved, and the production cost is reduced.

[0004] When detecting wafers of different sizes with the above device, the production line needs to be paused, then the pressure plate is taken out, and then the support plate is taken out. After replacing the support plate of different models, the production line is started again. The operation is cumbersome and affects the operation of the production line. Summary of the Utility Model

[0005] In view of the defects and deficiencies existing in the prior art, the utility model provides a wafer marking device.

[0006] A wafer marking device includes a carrying module and a marking head. The marking head can be arranged on the upper side and / or the lower side of the carrying module. The carrying module includes a rotating shaft and a suction cup. The rotating shaft is rotatably arranged. The suction cup is arranged at the top end of the rotating shaft.

[0007] Preferably, it further includes a laser detection module. The laser detection module includes a laser emitter and a laser receiver. The laser emitter and the laser receiver are arranged opposite to each other, and a detection space is formed between the laser emitter and the laser receiver. The carrying module is located at one side of the laser detection module.

[0008] Preferably, two groups of marking heads are provided, and the two groups of marking heads are respectively located at the upper and lower sides of the detection space.

[0009] Preferably, the suction cup and the rotating shaft are matched through a threaded structure.

[0010] Preferably, a correction and compensation module is further included, and the carrying module is arranged on the correction and compensation module; the direction from the carrying module to the laser detection module is set as the first direction, and the direction perpendicular to the first direction is set as the second direction, and the correction and compensation module can drive the carrying module to move along the second direction and the first direction.

[0011] Preferably, the carrying module includes a cross slide, and the carrying module is installed on the moving part of the cross slide.

[0012] Preferably, a vacuum tube and a vacuum generator are further included. Part of the vacuum tube is arranged in the rotating shaft and is coaxially arranged with the rotating shaft. The two ends of the vacuum tube are respectively communicated with the suction cup and the vacuum generator.

[0013] Preferably, a sliding table is further included. The laser detection module is installed on the sliding table, and the sliding table can drive the laser detection module to approach or move away from the carrying module.

[0014] Preferably, a PLC control module is further included, and the PLC control module is electrically connected to the laser detection module, the correction and compensation module and the sliding table respectively.

[0015] Preferably, the laser emitter and the laser receiver are arranged in sequence in the vertical direction, and the laser emitter is located above the laser receiver.

[0016] Compared with the prior art, the utility model has the following obvious beneficial effects:

[0017] (1) When marking the wafer, first place the wafer on the suction cup, and then start the rotating shaft to drive the wafer to rotate to adjust the marking area of the wafer. The wafer is fixed by the suction cup to prevent the wafer from shifting. Suction cups of the same model can fix wafers of different models, and there is no need to frequently replace the suction cup. If the size of the wafer to be marked is quite different from that of the previous batch of wafers, just replace the corresponding model of the suction cup, and there is no need to disassemble and assemble other structures, which improves the practicability of the device.

[0018] (2) By setting the laser detection module, after the wafer is placed on the suction cup, the edge of the wafer is in the detection space, and then start the rotating shaft to drive the wafer to rotate. The laser detection module detects the edge of the wafer, which can not only judge whether the position of the wafer has shifted, but also detect the positions of features such as the center of the wafer, the straight edge and the notch, providing accurate positioning for subsequent processing procedures.

[0019] (3) It is provided with a PLC control module and a correction and compensation module. When the laser detection module detects that the position of the wafer deviates from the preset position, the PLC control module processes the error information and then transmits an instruction to the correction and compensation module to automatically compensate for the position deviation of the wafer, realizing the automation of the equipment, avoiding errors and improving accuracy. Description of the Drawings

[0020] Figure 1 It is a schematic diagram of the overall structure of Embodiment 1.

[0021] Figure 2 It is a schematic diagram of the structure of the carrier module and the laser detection module in Embodiment 1.

[0022] Label description: 1, base; 2, laser detection module; 201, laser emitter; 202, laser receiver; 3, carrier module; 301, rotating shaft; 302, suction cup; 4, correction and compensation module; 5, sliding table; 6, vacuum tube; 7, wafer; 8, marking head. Detailed Description of the Embodiment

[0023] To make the technical problems, technical solutions and advantages to be solved by the present utility model clearer, the following will be described in detail with specific examples, but the protection scope of the present utility model is not limited to the following specific embodiments.

[0024] Unless otherwise defined, all professional terms used hereinafter have the same meaning as commonly understood by those skilled in the art. The professional terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the protection scope of the present utility model.

[0025] Embodiment 1:

[0026] A wafer marking device, referring to Figure 1 , includes a base 1, a laser detection module 2, a carrier module 3, a correction and compensation module 4, a sliding table 5, a PLC control module and a marking head 8. The sliding table 5 is slidably connected to the base 1. Both the laser detection module 2 and the marking head 8 are installed on the sliding table 5. The correction and compensation module 4 is installed on the base 1. The carrier module 3 is installed on the correction and compensation module 4. The carrier module 3 is located on one side of the laser detection module 2. The sliding table 5 can drive the laser detection module 2 and the marking head 8 to approach or move away from the carrier module 3. The correction and compensation module 4 is used to drive the wafer 7 to move to compensate for the displacement offset of the wafer 7. The carrier module 3 is used to carry the wafer 7 and drive the wafer 7 to rotate, so that the laser detection module 2 scans and detects the edge area of the wafer 7 to judge the positions of features such as the center, straight edge and notch of the wafer 7.

[0027] Referring to Figure 2, the laser detection module 2 includes a laser emitter 201 and a laser receiver 202. The laser emitter 201 and the laser receiver 202 are arranged opposite to each other in the vertical direction. The laser emitter 201 is arranged above the laser receiver 202, and a detection space is formed between the laser emitter 201 and the laser receiver 202.

[0028] Refer to Figure 2 , the marking head 8 is located between the laser detection module 2 and the carrying module 3. When detecting wafers 7 of different models, move the sliding table 5 to adjust the distance between the laser detection module 2 and the carrying module 3, which is convenient for detecting the edges of wafers 7 of different models. In the prior art, marks are usually made in the edge area of the wafer 7. When the sliding table 5 moves to adjust the laser detection module 2, the position of the marking head 8 is adjusted at the same time, and there is no need to separately adjust the position of the marking head 8, which is convenient for the marking head 8 to mark the edge area of the wafer 7.

[0029] There are two groups of marking heads 8. In this embodiment, each group of marking heads 8 includes one marking head 8, and the number of marking heads 8 can be selected according to actual processing requirements. The two marking heads 8 are respectively located on the upper and lower sides of the detection space, which is convenient for marking the upper and lower sides of the wafer 7.

[0030] Refer to Figure 1 and Figure 2 , the carrying module 3 includes a rotating shaft 301 and a suction cup 302. The rotating shaft 301 is rotatably connected to the base 1. The rotating shaft 301 is arranged in the vertical direction. The suction cup 302 is arranged at the top of the rotating shaft 301. The suction cup 302 and the rotating shaft 301 are detachably connected through a threaded structure. External threads are provided on the outer wall of the hollow cylindrical connecting part of the suction cup 302. The rotating shaft 301 is arranged in a hollow cylindrical shape, and internal threads adapted to the above external threads are provided at the top of the rotating shaft 301. The adsorption surface of the suction cup 302 is used to place the wafer 7. By setting the suction cup 302, it is avoided that the wafer 7 falls off when the rotating shaft 301 rotates, the stability of the device is improved, and the suction cup 302 can adsorb wafers 7 of different sizes, improving the practicability of the device. Multiple suction cups 302 of different models can be provided. If the size of the wafer 7 to be marked is quite different from that of the previous batch of wafers 7, the suction cup 302 can be unscrewed from the top of the rotating shaft 301 and replaced with a suction cup 302 of the corresponding size to improve the stability during the processing of the wafer 7 and avoid the wafer 7 from falling or shifting from the rotating shaft 301.

[0031] Refer to Figure 2 , the wafer alignment device further includes a vacuum tube 6 and a vacuum generator. The two ends of the vacuum tube 6 are respectively communicated with the vacuum generator and the suction cup 302. Part of the pipeline of the vacuum tube 6 is located inside the rotating shaft 301 and is coaxially arranged with the rotating shaft 301, which is convenient for connecting the suction cup 302.

[0032] Refer to Figure 1, the direction from the carrier module 3 to the laser detection module 2 is set as the first direction, and the direction perpendicular to the first direction is set as the second direction. The correction and compensation module 4 can drive the carrier module 3 to move along the second direction and the first direction. In this embodiment, the correction and compensation module 4 is a cross slide. The cross slide includes a first lead screw group and a second lead screw group. The first lead screw group includes a lead screw one, a lead screw nut one and a motor one. The lead screw one is rotatably connected to the base 1, the lead screw one is arranged parallel to the first direction, the lead screw nut one is threadedly connected to the lead screw one, and the motor one is fixedly connected to the base 1 and used to drive the lead screw one to rotate. The second lead screw group includes a lead screw two, a lead screw nut two and a motor two. The lead screw two is rotatably connected to the lead screw nut one, the lead screw two is arranged parallel to the second direction, the lead screw nut two is threadedly connected to the lead screw two, and the motor two is fixedly connected to the lead screw nut one and used to drive the lead screw two to rotate. The rotating shaft is fixedly connected to the lead screw nut two.

[0033] The PLC control module is electrically connected to the laser detection module 2, the correction and compensation module 4 and the sliding table 5 respectively. The PLC control module is provided with a preset coordinate of the wafer 7. The laser detection module 2 converts the detected position coordinate of the wafer 7 into an electrical signal and transmits it into the PLC control module. In the PLC control module, the detected position coordinate of the wafer 7 is compared with the preset coordinate. If there is an error between the two, the error information is fed back to the correction and compensation module 4, and the correction and compensation module 4 drives the wafer 7 to move to adjust the position of the wafer 7. When detecting wafers of different models, the PLC control module issues a signal to adjust the distance between the sliding table 5 and the carrier module 3 to adapt to the model of the wafer 7 and avoid interference between the sliding table 5 and the wafer 7.

[0034] When marking the wafer 7, place the wafer 7 on the chuck 302 so that the edge of the wafer 7 is located in the detection space. Then start the rotating shaft 301 to drive the wafer 7 to rotate. The laser detection module 2 detects the edge of the wafer 7 and transmits the collected information to the PLC control module to judge and detect the center position, straight edge and notch position of the wafer 7. When the wafer 7 is unqualified, the PLC control module issues a scrapping or rework signal; if the wafer 7 is detected to be qualified and the center position of the wafer 7 is offset, the PLC issues an adjustment instruction and transmits it to the displacement compensation module to adjust the position of the wafer 7 to the preset coordinate, and then start the marking head 8 to mark the wafer 7.

[0035] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model.

[0036] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present utility model, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0037] In the present utility model, unless otherwise clearly defined and limited, the terms "mounted", "connected", "connected to", "fixed", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and may be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0038] In the present utility model, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "on", "above" and "on the upper side" of the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "below" and "on the lower side" of the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature. It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it may be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are only for the purpose of illustration and do not represent the only implementation manner.

Claims

1. A wafer marking device, characterized in that: The invention comprises a carrying module (3) and a marking head (8), wherein the marking head (8) is arranged on the upper side and / or the lower side of the carrying module (3), and the carrying module (3) comprises a rotating shaft (301) and a suction cup (302), wherein the rotating shaft (301) is rotatably arranged, and the suction cup (302) is arranged at the top end of the rotating shaft (301).

2. The wafer marking device according to claim 1, characterized in that: The invention also comprises a laser detection module (2), wherein the laser detection module (2) comprises a laser transmitter (201) and a laser receiver (202), wherein the laser transmitter (201) and the laser receiver (202) are arranged relative to each other, and a detection space is formed between the laser transmitter (201) and the laser receiver (202); and the bearing module (3) is located on one side of the laser detection module (2).

3. The wafer marking device according to claim 2, characterized in that: The marking heads (8) are provided in two groups, and the two groups of marking heads (8) are respectively located at the upper and lower sides of the detection space.

4. The wafer marking device according to claim 1, characterized in that: The suction cup (302) and the rotating shaft (301) are matched via a threaded structure.

5. The wafer marking device according to claim 2, characterized in that: It also comprises a correction compensation module (4), the carrier module (3) being arranged on the correction compensation module (4); the direction from the carrier module (3) to the laser detection module (2) is set as a first direction, and the direction perpendicular to the first direction is set as a second direction, and the correction compensation module (4) can drive the carrier module (3) to move along the second direction and the first direction.

6. The wafer marking device according to claim 5, characterized in that: The bearing module (3) comprises a cross slide, and the bearing module (3) is mounted on the moving part of the cross slide.

7. The wafer marking device according to claim 1, characterized in that: It also includes a vacuum tube (6) and a vacuum generator, wherein a portion of the vacuum tube (6) is arranged inside the rotating shaft (301) and is coaxially arranged with the rotating shaft (301), and the two ends of the vacuum tube (6) are respectively connected to the suction cup (302) and the vacuum generator.

8. The wafer marking device according to claim 5, characterized in that: It also comprises a sliding platform (5), on which the laser detection module (2) and the marking head (8) are both mounted, and the sliding platform (5) can drive the laser detection module (2) and the marking head (8) to move closer to or farther from the carrier module (3).

9. The wafer marking device according to claim 8, characterized in that: It also comprises a PLC control module, which is electrically connected to the laser detection module (2), the correction compensation module (4) and the sliding platform (5) respectively.

10. The wafer marking device according to claim 2, characterized in that: The laser transmitter (201) and the laser receiver (202) are arranged in sequence along a vertical direction, and the laser transmitter (201) is located above the laser receiver (202).

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