Wafer coating device
By installing springs and pins inside the fixed block of the wafer coating device, gravity and elastic force are used to avoid contact between the wafer and the clamp ring, the problem of easy adhesion of wafers in the processing process is solved, and production efficiency and product yield are improved.
Patent Information
- Application Number
- CN202421976327.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-15
- Publication Date
- 2025-06-10
- Estimated Expiration
- 2034-08-15
AI Technical Summary
The clamping ring design in existing wafer coating devices is likely to lead to wafer adhesion in the processing process, affecting production efficiency and product yield.
A wafer coating device is designed to prevent contact between the wafer and the clamp ring by installing springs and pins inside the fixed block, and prevent adhesion by using gravity and elastic force.
It effectively avoids the adhesion of wafers to the clamping ring in the processing process, and improves production efficiency and product yield.
Smart Images
Figure CN222961524U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a wafer coating device. Background Art
[0002] In the semiconductor manufacturing process, the processing accuracy and efficiency of the wafer directly affect the performance and cost of the chip. In the metal coating process, a thick metal film will be deposited on the surface of the wafer. However, due to the thickness of the metal film and the limitations of the processing technology, the clamping ring design in the existing wafer coating device often encounters the problem of wafer and clamping ring adhesion in actual applications.
[0003] At present, the clamping ring design of common wafer coating equipment mainly relies on physical contact to fix the wafer. These clamping rings are usually made of high-temperature resistant materials and can withstand high temperature and high pressure process environments. However, as the thickness of the metal film increases, the contact area between the wafer and the clamping ring becomes larger, causing the wafer to adhere to the clamping ring more easily, affecting subsequent transmission and processing. This phenomenon is known as "wafer sticking" in the industry, which seriously affects production efficiency and product yield.
[0004] Therefore, we need a wafer coating device to solve the problem that the wafer will adhere to the clamping ring during the processing process, so that the wafer will not adhere to the clamping ring during the processing process. Utility Model Content
[0005] The purpose of the present application is to solve the problem that wafers are easily broken during the process of taking and placing. In order to solve the above problem, the present application provides a wafer coating device, which can prevent the wafers from being easily broken during the process of taking and placing.
[0006] To achieve the above-mentioned purpose, the embodiment of the present application adopts the following technical scheme: a heater; a clamping ring, which is arranged under the heater; a wafer, which is arranged in the clamping ring; a presser foot, which is evenly arranged around the clamping ring, and there are multiple presser feet, and multiple through holes are arranged in the middle of the presser foot; a fixed block is arranged directly above each presser foot, and multiple through holes are arranged in the middle of the fixed block, and the through holes of the fixed block are placed corresponding to the positions of the through holes of the presser foot, and a spring and a pin are arranged inside the fixed block; the outer length of the pin is set to protrude from the clamping ring; the spring is connected to the pin, and the spring is used to control the extension and retraction of the pin.
[0007] In the above technical scheme, the embodiment of the present application solves the problem of the wafer adhering to the clamping ring during the processing by installing a spring and a pin inside the fixed block. When the wafer contacts the pressure foot, gravity causes the spring and the pin to retract. When the heater descends and the wafer is about to detach from the clamping ring, the elastic force causes the spring and the pin to pop out and push the wafer away, thereby preventing the wafer from continuing to contact the clamping ring. This solves the problem of the wafer adhering to the clamping ring during the processing, and prevents the wafer from adhering to the clamping ring during the processing.
[0008] Further, according to an embodiment of the present application, the length of the pin is designed to protrude 0.5 mm from the inside of the clamp ring.
[0009] Further, according to an embodiment of the present application, the fixing block is mounted on the presser foot by means of screws.
[0010] Further, according to an embodiment of the present application, the middle portion of the clamping ring is configured to be hollow, and the shape corresponds to the shape of the wafer.
[0011] Further, according to an embodiment of the present application, the middle portion of the clamp ring further includes:
[0012] A first limiting portion, the first limiting portion is arranged on the outer ring of the hollow part of the clamp ring;
[0013] A second limiting portion, the second limiting portion is arranged on the outer ring of the first limiting portion;
[0014] The third limiting portion is arranged on the outer ring of the second limiting portion.
[0015] Further, according to an embodiment of the present application, the shapes of the first limiting portion, the second limiting portion and the third limiting portion are set to be circular.
[0016] Further, according to the embodiment of the present application, the second limiting portion and the third limiting portion have the same height, and the first limiting portion is lower in height than the second limiting portion and the third limiting portion.
[0017] Further, according to an embodiment of the present application, two springs and pins are provided in each fixing block.
[0018] Further, according to the embodiment of the present application, a protruding receiving portion is provided in the middle part of the presser foot.
[0019] Further, according to an embodiment of the present application, the spring is made of stainless steel.
[0020] Compared with the prior art, the present application has the following beneficial effects: the present application installs a spring and a pin inside the fixed block, and when the wafer contacts the pressure foot, gravity causes the spring and the pin to retract. When the heater descends and the wafer is about to detach from the clamping ring, the elastic force causes the spring and the pin to pop out and push the wafer away, preventing the wafer from continuing to contact the clamping ring, thereby solving the problem of the wafer adhering to the clamping ring during the processing process and preventing the wafer from adhering to the clamping ring during the processing process. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] The present application is further described below in conjunction with the accompanying drawings and embodiments.
[0022] Figure 1 An axonometric view of a wafer coating device.
[0023] Figure 2 It is the front view of a wafer coating device.
[0024] Figure 3 It is the top view of a wafer coating device.
[0025] Figure 4 It is the rear view of a wafer coating device.
[0026] Figure 5 It is the partial enlarged axonometric view of the pressing foot after improvement in the second embodiment.
[0027] Figure 6 It is the partial enlarged axonometric view of the receiving part after improvement in the second embodiment.
[0028] Figure 7 It is the front view of an improved wafer coating device.
[0029] Figure 8 It is Figure 7 the A-A cross-sectional view of
[0030] In the attached drawings
[0031] 1. Heater 2. Wafer 3. Clamping ring
[0032] 31. First limiting part 32. Second limiting part 33. Third limiting part
[0033] 4. Pressing foot 41. Vibration module 411. Vibration motor
[0034] 412. Shock-absorbing pad 42. Receiving part 421. Contact point
[0035] 5. Fixed block 51. Spring 52. Pin Detailed implementation manners
[0036] In order to clearly and completely describe the purpose, technical solution of the present utility model, and make the advantages more clear and understandable, the following further details the embodiments of the present utility model with reference to the attached drawings. It should be understood that the specific embodiments described herein are part of the embodiments of the present utility model, rather than all of the embodiments, and are only used to explain the embodiments of the present utility model, not to limit the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present utility model.
[0037] In the description of the present utility model, it should be noted that the terms "center", "middle", "upper", "lower", "left", "right", "inner", "outer", "top", "bottom", "side", "vertical", "horizontal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "one", "first", "second", "third", "fourth", "fifth", "sixth" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.
[0038] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0039] For the purpose of simplicity and illustration, the principles of the embodiments are described primarily by reference to examples. In the following description, many specific details are presented to provide a thorough understanding of the embodiments. However, it is apparent that, for those of ordinary skill in the art, these embodiments may not be limited to these specific details in practice. In some instances, known methods and apparatus are not described in detail to avoid making these embodiments unnecessarily difficult to understand. In addition, all embodiments may be used in combination with each other.
[0040] Embodiment 1: Figures 1-4 As shown, a wafer coating device comprises: a heater 1; a clamping ring 3, which is arranged below the heater 1; a wafer 2, which is arranged in the clamping ring 3;
[0041] A presser foot 4 is evenly arranged around the clamp ring 3, and there are multiple presser feet 4, and multiple through holes are arranged in the middle of the presser foot 4; a fixed block 5 is arranged directly above each presser foot 4, and multiple through holes are arranged in the middle of the fixed block 5. The through holes of the fixed block 5 are placed corresponding to the positions of the through holes of the presser foot 4, and a spring 51 and a pin 52 are arranged inside the fixed block 5. By installing the spring 51 and the pin 52 inside the fixed block 5, when the wafer 2 contacts the presser foot 4, the gravity acts to retract the spring 51 and the pin 52. When the heater 1 descends and the wafer 2 is about to leave the clamp ring 3, the elastic force causes the spring 51 and the pin 52 to pop out and push away the wafer 2, so as to avoid the wafer 2 from continuing to contact the clamp ring 3, so that the wafer 2 will not adhere to the clamp ring 3 during the processing process.
[0042] The outer length of the pin 52 is set to protrude from the clamping ring 3; the spring 51 is connected to the pin 52, and the spring 51 is used to control the telescoping of the pin 52. The length of the pin is designed to protrude 0.5 mm inside the clamping ring 3.
[0043] The fixing block 5 is installed on the presser foot 4 by screws. The fixing block 5 is installed on the presser foot 4 by screws. The surface of the fixing block 5 is provided with a perforation, which facilitates the disassembly and replacement of internal components during cleaning and maintenance, reduces downtime, and improves the overall usage efficiency of the equipment.
[0044] The middle part of the clamping ring 3 is set to be hollow, and its shape corresponds to the shape of the wafer 2, so that it can be in the same position when replacing the wafer 2. The middle part of the clamping ring 3 also includes: a first limiting part 31, which is arranged on the outer ring of the hollow part of the clamping ring 3; a second limiting part 32, which is arranged on the outer ring of the first limiting part 31; a third limiting part 33, which is arranged on the outer ring of the second limiting part 32. The shapes of the first limiting part 31, the second limiting part 32, and the third limiting part 33 are set to be circular. The heights of the second limiting part 32 and the third limiting part 33 are the same, and the height of the first limiting part 31 is lower than that of the second limiting part 32 and the third limiting part 33. The first limiting part 31 is used to position the wafer 2 to prevent the wafer 2 from moving randomly and sticking to other parts of the clamping ring 3. The heights of the second limiting part 32 and the third limiting part 33 are the same, and a hollow area is formed in the middle to limit the position of the heater 1, ensuring uniform heating of the wafer 2 by the heater 1 and preventing the wafer 2 from sticking due to overheating in some areas.
[0045] Each fixing block 5 is provided with two springs 51 and pins 52. A protruding receiving part 42 is arranged in the middle of the presser foot 4. The receiving part 42 is used to receive the wafer 2, reducing the contact area between the wafer 2 and the presser foot 4 and preventing excessive sticking areas of the wafer 2. By arranging two springs 51 and pins 52 in each fixing block 5, a more stable resilience is provided to ensure effective prevention of adhesion under different pressure conditions.
[0046] The spring 51 is made of stainless steel material to ensure elasticity and durability.
[0047] Embodiment 2: As Figure 5 shown, on the basis of Embodiment 1, this embodiment further improves the presser foot 4, including: a vibration module 41 is further arranged on the side of the presser foot 4;
[0048] The vibration module 41 further includes: a vibration motor 411, which is arranged on the side of the presser foot 4. A shock pad 412 is arranged between the vibration motor 411 and the presser foot 4, and the vibration motor 411 is in contact with the wafer 2.
[0049] A vibration motor with high frequency and low amplitude is adopted to ensure stable vibration effect and no damage to the clamping ring 3 and the wafer 2. The shock pad 412 is located between the vibration motor and the pressing foot 4 to absorb excessive vibration and prevent vibration from having an adverse impact on other components. Through the integrated vibration device, the accumulation of the metal film on the clamping ring 3 can be effectively reduced, preventing the wafer 2 from adhering to the clamping ring 3, and further improving the efficiency and product quality in the thick metal film process.
[0050] Embodiment 3: As Figures 6-8 shown, on the basis of Embodiment 1, this embodiment further improves the receiving part 42. The receiving part 42 is provided with: contact points 421. There are multiple rows of contact points 421, and the height of the contact points 421 gradually increases from the inside to the outside;
[0051] The height of the innermost contact point 421 is fixed, and the external contact points 421 can all move up and down according to the pressure of the wafer 2. The lowest point of the displacement is the height of the innermost contact point 421.
[0052] When the wafer 2 is placed into the clamping ring 3, the wafer 2 first contacts the outermost contact point 421, and gradually presses the outermost contact point 421 downward according to gravity and gradually contacts the inner contact points 421. When contacting the innermost contact point 421, all the contact points 421 are at the same height, completing the reception of the wafer 2. When the wafer 2 is to be separated from the clamping ring 3, the elastic force causes the spring 51 and the pin 52 to pop out, pushing away the wafer 2. The wafer 2 gradually moves upward, first leaving the innermost contact point 421, and then gradually leaving all the contact points 421. Setting the contact points 421 can further reduce the contact area of the wafer 2, preventing the wafer 2 from sticking due to too large a contact area. Then, by setting the displaceable contact points 421, the wafer 2 gradually leaves the clamping ring 3, preventing the wafer 2 from shifting in position and sticking to other areas of the clamping ring 3 due to sudden separation.
[0053] Embodiment 4: As Figures 1-8 shown, on the basis of Embodiment 1, this embodiment further improves the spring 51. The two springs 51 in each fixing block 5 are set as two springs 51 with different elastic forces. On the basis of the existing spring 51 design, the second spring 51 with different elastic forces is set to ensure that there is an appropriate resilience to push the wafer away from the clamping ring 3 under different pressure conditions, so that the wafer will not adhere to the clamping ring during the processing technology.
[0054] Embodiment 5: As Figures 1-8 shown, on the basis of Embodiments 1 - 4, this embodiment also provides a usage method of a wafer coating device, including:
[0055] Ensure that all components of the wafer 2 coating device, including the heater 1, the clamp ring 3, the pressure foot 4, the fixing block 5, the spring 51, the pin 52 and the vibration device, are in normal working condition, and check the vibration device to ensure its normal operation.
[0056] Before starting the operation, clean the clamp ring 3, the pressure foot 4 and the surface of the wafer 2 to ensure that there are no residues and impurities to avoid affecting the coating effect.
[0057] Place the wafer 2 in the middle of the clamp ring 3 to ensure that the wafer 2 is completely located in the first limiting portion 31. Adjust the position of the wafer 2 to match the shape of the hollow area in the middle of the clamp ring 3.
[0058] The wafer 2 is fixed in the clamp ring 3 by the pressure foot 4. A plurality of through holes are provided in the middle of the pressure foot 4. When the wafer 2 contacts the pressure foot 4, gravity causes the spring 51 and the pin 52 to retract. The wafer 2 first contacts the outermost contact point 421, and according to gravity, the outermost contact point 421 is gradually pressed downward and contacts the inner contact point 421. When the innermost contact point 421 is contacted, all the contact points 421 are at the same height, thus completing the reception of the wafer 2.
[0059] The heater 1 is started to gradually heat up to the required coating temperature, and the temperature of the heater 1 is ensured to be evenly distributed to avoid local overheating of the wafer 2.
[0060] The micro vibration motor is started according to a preset time interval or at a specific operation stage, and the vibration frequency and time are adjusted through the control module. Ensure that the vibration motor works stably and does not damage the clamp ring 3 and the wafer 2. By slightly vibrating the wafer 2, it is prevented that the wafer 2 and the clamp ring 3 are in contact for too long and cause sticking.
[0061] When wafer 2 is about to leave the clamp ring 3, the elastic force causes the spring 51 and the pin 52 to pop out and push away wafer 2. Wafer 2 gradually moves upward, first leaving the innermost contact point 421, and then gradually leaving all contact points 421. Setting contact points 421 can further reduce the contact area of wafer 2, and prevent wafer 2 from sticking due to excessive contact area. Then, by setting movable contact points 421, wafer 2 can be gradually separated from clamp ring 3 to prevent wafer 2 from sticking to other areas of clamp ring 3 due to displacement of position caused by sudden separation, thereby completing the processing of wafer 2.
[0062] Although the above describes the illustrative specific implementation methods of the present application so that technicians in this technical field can understand the present application, the present application is not limited to the scope of the specific implementation methods. For ordinary technicians in this technical field, as long as various changes are within the spirit and scope of the present application defined and determined by the attached claims, all application creations using the concept of the present application are protected.
Claims
1. A wafer coating device, comprising: Heater; A clamp ring, the clamp ring being arranged below the heater; a wafer, wherein the wafer is disposed in the clamping ring; A presser foot, the presser foot is evenly arranged around the clamp ring, a plurality of the presser feet are provided, and a plurality of through holes are provided in the middle of the presser foot; The invention is characterized in that a fixing block is arranged directly above each of the presser feet, a plurality of through holes are arranged in the middle of the fixing block, the through holes of the fixing block are placed corresponding to the through holes of the presser feet, and a spring and a pin are arranged inside the fixing block; The outer length of the pin is set to protrude from the clamp ring; The spring is connected to the pin, and the spring is used to control the extension and retraction of the pin.
2. A wafer coating device according to claim 1, characterized in that: The length of the pin is designed to protrude 0.5 mm from the inside of the clamp ring.
3. The wafer coating device according to claim 1, characterized in that: The fixing block is mounted on the presser foot by means of screws.
4. The wafer coating device according to claim 1, characterized in that: The middle part of the clamp ring is hollow, and its shape corresponds to the shape of the wafer.
5. A wafer coating device according to claim 4, characterized in that: The middle part of the clamp ring also includes: A first limiting portion, wherein the first limiting portion is arranged on an outer ring of a hollow portion of the clamp ring; A second limiting portion, the second limiting portion is arranged on an outer ring of the first limiting portion; A third limiting portion is arranged on an outer circle of the second limiting portion.
6. The wafer coating device according to claim 5, characterized in that: The first limiting portion, the second limiting portion and the third limiting portion are configured to be circular in shape.
7. The wafer coating device according to claim 5, characterized in that: The second limiting portion and the third limiting portion have the same height, and the first limiting portion has a lower height than the second limiting portion and the third limiting portion.
8. The wafer coating device according to claim 1, characterized in that: Two springs and two pins are arranged in each of the fixing blocks.
9. The wafer coating device according to claim 1, characterized in that: A protruding receiving portion is arranged in the middle of the presser foot.
10. The wafer coating device according to claim 1, characterized in that: The spring is made of stainless steel.