Electroplating equipment

Abstract

The utility model relates to electroplating equipment which comprises a carrier plate, an electroplating area, a silicon wafer cleaning area, a carrier plate cleaning area and a transfer device. The carrier plate is used for bearing silicon wafers. The electroplating area is used for electroplating the silicon wafer. And the silicon wafer cleaning area is used for cleaning the electroplated silicon wafer. The carrier plate cleaning area is used for cleaning the carrier plate. The transfer device can transfer the carrier plate among the electroplating area, the silicon wafer cleaning area and the carrier plate cleaning area; the transfer device comprises a material moving device, and the material moving device is used for feeding and discharging the carrier plates. According to the electroplating equipment, the carrier plate does not need to be disassembled, transferred and installed manually, integrated treatment of the electroplating process on the silicon wafer can be achieved, the electroplated silicon wafer is etched back, the carrier plate is cleaned, and the production efficiency is high.

Description

Technical Field

[0001] This application relates to the field of electroplating technology, and particularly to an electroplating device. Background Art

[0002] In the preparation process of solar cells, electroplating technology is usually used to prepare grid lines. During electroplating, copper and tin are respectively electroplated in the reserved grooves of the grid lines generated after development. Among them, during the production process of the hanging electroplating carrier plate, metal substances such as copper and tin and chemical solutions are likely to remain on the carrier plate. Therefore, it is usually necessary to clean the hanging electroplating carrier plate. In the traditional cleaning method of the hanging electroplating carrier plate, the carrier plate needs to be removed from the electroplating machine table and then transported to the stripping machine table for cleaning. After cleaning, the carrier plate is reinstalled on the electroplating machine table by manual loading. At the same time, it is usually necessary to perform back-etching on the electroplated silicon wafer. In the traditional process flow, the silicon wafer needs to be transferred from the electroplating machine table to the back-etching machine table manually. The workload is large when manually transferring the carrier plate, and the production efficiency is low. Utility Model Content

[0003] Based on this, it is necessary to provide an electroplating device that does not require manual disassembly, transportation, and installation of the carrier plate, and can realize the integrated processing of electroplating process for silicon wafers, back-etching of electroplated silicon wafers, and cleaning of the carrier plate, with relatively high production efficiency.

[0004] This application provides an electroplating device, including a carrier plate, an electroplating area, a silicon wafer cleaning area, a carrier plate cleaning area, and a transfer device;

[0005] The carrier plate is used to hold silicon wafers;

[0006] The electroplating area is used to electroplate silicon wafers;

[0007] The silicon wafer cleaning area is used to clean electroplated silicon wafers;

[0008] The carrier plate cleaning area is used to clean the carrier plate;

[0009] The transfer device can transfer the carrier plate between the electroplating area, the silicon wafer cleaning area, and the carrier plate cleaning area; the transfer device includes a material transfer device, and the material transfer device is used to load and unload the carrier plate.

[0010] In some embodiments, the electroplating area includes a first water washing tank, a first alkali washing tank, a first electroplating tank, and a second water washing tank connected in sequence;

[0011] The first water washing tank is connected to the transfer device, and the second water washing tank is connected to the transfer device;

[0012] The first water washing tank, the first alkali washing tank, the first electroplating tank, and the second water washing tank are respectively used for performing first water washing, first alkali washing, first electroplating, and second water washing on the silicon wafers.

[0013] In some embodiments, the electroplating area further includes a damage removal tank, which is connected between the first water washing tank and the transfer device; the damage removal tank is used for performing damage layer removal treatment on the silicon wafers.

[0014] In some embodiments, the electroplating area further includes a second electroplating tank, a second alkali washing tank, a third water washing tank, and a drying device connected in sequence; the second electroplating tank is connected to the second water washing tank, and the drying device is connected to the transfer device;

[0015] The second electroplating tank, the second alkali washing tank, the third water washing tank, and the drying device are respectively used for performing second electroplating, second alkali washing, third water washing, and drying on the silicon wafers.

[0016] In some embodiments, the electroplating area includes an isolation tank, which is connected between the second electroplating tank and the second water washing tank; the isolation tank is used for temporarily storing the silicon wafers.

[0017] In some embodiments, the silicon wafer cleaning area includes a fourth water washing tank, a third alkali washing tank, a photoresist cleaning tank, a fifth water washing tank, and a second drying device connected in sequence; both the fourth water washing tank and the second drying device are connected to the transfer device;

[0018] The fourth water washing tank, the third alkali washing tank, the photoresist cleaning tank, the fifth water washing tank, and the second drying device are respectively used for performing fourth water washing, third alkali washing, photoresist cleaning, fifth water washing, and drying on the silicon wafers.

[0019] In some embodiments, the silicon wafer cleaning area further includes a seed layer cleaning tank and a sixth water washing tank connected to each other; the seed layer cleaning tank is connected to the fifth water washing tank, and the sixth water washing tank is connected to the second drying device; the seed layer cleaning tank and the sixth water washing tank are respectively used for performing seed layer cleaning and sixth water washing on the silicon wafers.

[0020] In some embodiments, the carrier plate cleaning area includes a seventh water washing tank, a chemical cleaning chamber, and an eighth water washing tank connected in sequence; the seventh water washing tank is connected to the transfer device;

[0021] The seventh water washing tank, the chemical cleaning chamber, and the eighth water washing tank are respectively used for performing seventh water washing, chemical cleaning, and eighth water washing on the carrier plate.

[0022] In some of these embodiments, the chemical cleaning chamber includes a first chemical cleaning tank, a second chemical cleaning tank, and a third chemical cleaning tank connected in sequence.

[0023] In some of these embodiments, the electroplating equipment includes a first buffer chamber connected between the transfer device and the seventh water washing tank, and the first buffer chamber is used for temporarily storing the carrier plates to be cleaned.

[0024] In some of these embodiments, the electroplating equipment has a second buffer chamber connected between the eighth water washing tank and the transfer device, and the second buffer chamber is used for temporarily storing the carrier plates to be loaded after cleaning.

[0025] In the above electroplating equipment, the material transfer device is used for loading and unloading the carrier plates, the transfer device is used for transferring the carrier plates between the electroplating area, the silicon wafer cleaning area, and the carrier plate cleaning area, and the carrier plates can move between the above-mentioned areas. This equipment does not require manual disassembly, transfer, and installation of the carrier plates, and can realize the integrated processing of the electroplating process for silicon wafers, the back etching of the electroplated silicon wafers, and the cleaning of the carrier plates, with relatively high production efficiency. Description of the Drawings

[0026] Figure 1 Schematic structural diagram of the electroplating equipment provided by an embodiment of the present application;

[0027] Figure 2 Schematic structural diagram of the electroplating equipment provided by another embodiment of the present application.

[0028] Description of the Reference Numerals

[0029] 100, electroplating area; 101, damage removal tank; 102, first water washing tank; 103, first alkali washing tank; 104, first electroplating tank; 105, second water washing tank; 106, isolation tank; 107, second electroplating tank; 108, second alkali washing tank; 109, third water washing tank; 110, first drying device; 200, silicon wafer cleaning area; 201, fourth water washing tank; 202, third alkali washing tank; 203, photoresist cleaning tank; 204, fifth water washing tank; 205, seed layer cleaning tank; 206, sixth water washing tank; 207, second drying device; 300, carrier plate cleaning area; 310, seventh water washing tank; 320, chemical cleaning chamber; 321, first chemical cleaning tank; 322, second chemical cleaning tank; 323, third chemical cleaning tank; 330, eighth water washing tank; 400, transfer device; 500, first buffer chamber; 600, second buffer chamber. Detailed Embodiments

[0030] To make the above objects, features, and advantages of the present application more obvious and understandable, the following describes the specific embodiments of the present application in detail with reference to the accompanying drawings. Many specific details are set forth in the following description to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs. The terms used in the description of this application herein are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" as used herein includes any and all combinations of one or more of the related listed items.

[0032] In the description of this application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to this application.

[0033] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of this application, "a plurality" means at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0034] In this application, unless otherwise clearly specified and limited, the terms "install", "connect", "couple", "fix", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0035] Refer to Figure 1As shown in the figure, the present application provides an electroplating device, which includes a carrier plate, an electroplating area 100, a silicon wafer cleaning area 200, a carrier plate cleaning area 300, and a transfer device 400. The carrier plate is used to hold the silicon wafer. The electroplating area 100 is used to electroplate the silicon wafer. The silicon wafer cleaning area 200 is used to clean the electroplated silicon wafer. The carrier plate cleaning area 300 is used to clean the carrier plate. The transfer device 400 can transfer the carrier plate between the electroplating area 100, the silicon wafer cleaning area 200, and the carrier plate cleaning area 300; the transfer device 400 includes a material transfer device, and the material transfer device is used to load and unload the carrier plate.

[0036] In the above electroplating device, the material transfer device is used to load the carrier plate and unload the carrier plate from the carrier plate. The transfer device is used to transfer the carrier plate between the electroplating area, the silicon wafer cleaning area, and the carrier plate cleaning area. The carrier plate can move between the above-mentioned areas. This device does not require manual disassembly, transfer, and installation of the carrier plate, and can realize the integrated processing of the electroplating process of the silicon wafer, the back etching of the electroplated silicon wafer, and the cleaning of the carrier plate, with relatively high production efficiency. It can be understood that the silicon wafer includes, but is not limited to, the solar cell substrate to be prepared with electrodes.

[0037] In some embodiments, the carrier plate is a hanging electroplating carrier plate.

[0038] Refer to Figure 2 As shown in the figure, in some of these embodiments, the electroplating area 100 includes a first water washing tank 102, a first alkali washing tank 103, a first electroplating tank 104, and a second water washing tank 105 connected in sequence. The first water washing tank 102 is connected to the transfer device 400, and the second water washing tank 105 is connected to the transfer device 400. The first water washing tank 102, the first alkali washing tank 103, the first electroplating tank 104, and the second water washing tank 105 are respectively used to perform the first water washing, the first alkali washing, the first electroplating, and the second water washing on the silicon wafer.

[0039] Through the sequentially arranged first water washing tank 102, first alkali washing tank 103, first electroplating tank 104, and second water washing tank 105, the silicon wafer can be first water washed and first alkali washed and then first electroplated to prepare a metal conductive layer. At the same time, the second water washing tank can clean the electroplating solution remaining on the electroplated metal conductive layer.

[0040] In some of these embodiments, the electroplating area 100 further includes a damage removal tank 101, and the damage removal tank 101 is connected between the first water washing tank 102 and the transfer device 400; the damage removal tank 101 is used to perform a damage layer removal treatment on the silicon wafer. Exemplarily, the damage removal tank 101 is used to perform a damage layer removal treatment on the silicon wafer with an alkaline solution.

[0041] In some of these embodiments, the electroplating area 100 further includes a second electroplating tank 107, a second alkali cleaning tank 108, a third water washing tank 109, and a drying device 110 connected in sequence; the second electroplating tank 107 is connected to the second water washing tank 105, and the drying device 110 is connected to the transfer device 400. The second electroplating tank 107, the second alkali cleaning tank 108, the third water washing tank 109, and the drying device 110 are respectively used for performing second electroplating, second alkali cleaning, third water washing, and drying on the silicon wafers.

[0042] Through the sequentially arranged second electroplating tank 107, second alkali cleaning tank 108, and third water washing tank 109, second electroplating, second alkali cleaning, and third water washing can be performed on the silicon wafers. Different electroplating solutions from those in the first electroplating tank 104 can be added to the second electroplating tank 107 to achieve electroplating of different materials on the silicon wafers. At the same time, the drying device 110 can dry the silicon wafers after electroplating.

[0043] In some of these embodiments, the electroplating area 100 includes an isolation tank 106, and the isolation tank 106 is connected between the second electroplating tank 107 and the second water washing tank 105; the isolation tank 106 is used for temporarily storing the silicon wafers.

[0044] Through the setting of the isolation tank 106, after the silicon wafers complete the first electroplating process, they can be temporarily stored in the isolation tank 106 for waiting.

[0045] In some of these embodiments, the silicon wafer cleaning area 200 includes a fourth water washing tank 201, a third alkali cleaning tank 202, a photoresist cleaning tank 203, a fifth water washing tank 204, and a second drying device 207 connected in sequence; both the fourth water washing tank 201 and the second drying device 207 are connected to the transfer device 400. The fourth water washing tank 201, the third alkali cleaning tank 202, the photoresist cleaning tank 203, the fifth water washing tank 204, and the second drying device 207 are respectively used for performing fourth water washing, third alkali cleaning, photoresist cleaning, fifth water washing, and drying on the silicon wafers.

[0046] Through the sequentially connected fourth water washing tank 201, third alkali cleaning tank 202, photoresist cleaning tank 203, and fifth water washing tank 204, fourth water washing, third alkali cleaning, photoresist cleaning, and fifth water washing can be successively performed on the electroplated silicon wafers to remove the patterned photoresist on the surface of the silicon wafers during patterned electroplating, so as to achieve back etching of the silicon wafers. At the same time, the second drying device 207 can dry the silicon wafers after back etching.

[0047] In some of these embodiments, the silicon wafer cleaning area 200 further includes a seed layer cleaning tank 205 and a sixth water washing tank 206 that are connected; the seed layer cleaning tank 205 is connected to the fifth water washing tank 204, and the sixth water washing tank 206 is connected to the second drying device 207; the seed layer cleaning tank 205 and the sixth water washing tank 206 are respectively used for performing seed layer cleaning and sixth water washing on the silicon wafer.

[0048] The seed layer cleaning tank 205 and the sixth water washing tank 206 can also perform seed layer cleaning on the silicon wafer after removing the photoresist. It can be understood that before electroplating and patterning the grid lines on the solar cell substrate, usually, sputtering or plating of the seed layer is performed on the entire substrate surface of the silicon wafer. The seed layer cleaning tank 205 can remove the excess seed layer on the unpatterned lithography part.

[0049] In some of these embodiments, the carrier cleaning area 300 includes a seventh water washing tank 310, a chemical cleaning chamber 320, and an eighth water washing tank 330 that are sequentially connected; the seventh water washing tank 310 is connected to the transfer device 400. The seventh water washing tank 310, the chemical cleaning chamber 320, and the eighth water washing tank 330 are respectively used for performing seventh water washing, chemical cleaning, and eighth water washing on the carrier.

[0050] Through the sequentially connected seventh water washing tank 310, chemical cleaning chamber 320, and eighth water washing tank 330, the electroplated carrier can be sequentially subjected to seventh water washing, chemical cleaning, and eighth water washing to perform the stripping treatment on the carrier, that is, to remove the residual metal substances such as copper and tin on the carrier surface and the waste chemical liquid.

[0051] In some of these embodiments, the chemical cleaning chamber 320 includes a first chemical cleaning tank 321, a second chemical cleaning tank 322, and a third chemical cleaning tank 323 that are sequentially connected.

[0052] Through the sequentially connected first chemical cleaning tank 321, second chemical cleaning tank 322, and third chemical cleaning tank 323, different chemical cleaning agents can be added to the first chemical cleaning tank 321, second chemical cleaning tank 322, and third chemical cleaning tank 323 respectively to achieve a better cleaning effect on the carrier.

[0053] In some of these embodiments, the electroplating equipment includes a first buffer chamber 500, and the first buffer chamber 500 is connected between the transfer device 400 and the seventh water washing tank 310. The first buffer chamber 500 is used for temporarily storing the carriers to be cleaned.

[0054] In some of these embodiments, the electroplating equipment includes a second buffer chamber 600, and the second buffer chamber 600 is connected between the eighth water washing tank 330 and the transfer device 400. The second buffer chamber 400 is used for temporarily storing the carriers to be loaded after cleaning.

[0055] By providing the first buffer chamber 500 and / or the second buffer chamber 600 to temporarily store the substrate to be cleaned or the substrate to be loaded after cleaning, it is convenient to adjust and add the liquid in each tank.

[0056] In some embodiments, the electroplating equipment further includes a liquid feeding device which is respectively connected to the feeding ends of the electroplating area 100, the silicon wafer cleaning area 200 and the substrate cleaning area 300. The liquid feeding device is used to inject the solutions required for the processes into the electroplating area 100, the silicon wafer cleaning area 200 and the substrate cleaning area 300 respectively. By injecting the solutions required for the processes into the electroplating area 100, the silicon wafer cleaning area 200 and the substrate cleaning area 300 respectively through the liquid feeding device, the operation is convenient and the production efficiency is relatively high.

[0057] In some embodiments, the liquid feeding device is respectively connected to the feeding ends of the damage removal tank 101, the first water washing tank 102, the first alkali washing tank 103, the first electroplating tank 104, the second water washing tank 105, the second electroplating tank 107, the second alkali washing tank 108, the third water washing tank 109, the fourth water washing tank 201, the third alkali washing tank 202, the photoresist cleaning tank 203, the fifth water washing tank 204, the seed layer cleaning tank 205, the sixth water washing tank 206, the seventh water washing tank 310, the first chemical cleaning tank 321, the second chemical cleaning tank 322, the third chemical cleaning tank 323 and the eighth water washing tank 330.

[0058] In some embodiments, the electroplating equipment includes a transfer device which is used to transfer the substrate between the electroplating area 100, the silicon wafer cleaning area 200, the substrate cleaning area 300 and the transfer device 400.

[0059] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0060] The above-described embodiments only represent several implementation manners of the present application, and the description is relatively specific and detailed. However, it should not be construed as a limitation on the scope of the patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims, and the description and drawings can be used to explain the content of the claims.

Claims

1. An electroplating device, characterized in that: It comprises a carrier, an electroplating area (100), a silicon wafer cleaning area (200), a carrier cleaning area (300) and a transfer device (400); The carrier plate is used to receive the silicon wafer; The electroplating area (100) is used to electroplate the silicon wafer; The silicon wafer cleaning area (200) is used to clean the silicon wafer after electroplating; The carrier cleaning area (300) is used to clean the carrier; The transfer device (400) is capable of transferring the carrier between the electroplating area (100), the silicon wafer cleaning area (200) and the carrier cleaning area (300); the transfer device (400) comprises a material transfer device, which is used to load and unload the carrier.

2. The electroplating equipment according to claim 1, characterized in that: The electroplating area (100) comprises a first water washing tank (102), a first alkali washing tank (103), a first electroplating tank (104) and a second water washing tank (105) which are connected in sequence; The first water washing tank (102) is connected to the transfer device (400), and the second water washing tank (105) is connected to the transfer device (400); The first water washing tank (102), the first alkali washing tank (103), the first electroplating tank (104) and the second water washing tank (105) are used to perform a first water washing, a first alkali washing, a first electroplating and a second water washing on the silicon wafers, respectively.

3. The electroplating equipment according to claim 2, characterized in that: The electroplating area (100) further comprises a damage removal tank (101), wherein the damage removal tank (101) is connected between the first water washing tank (102) and the transfer device (400); the damage removal tank (101) is used to perform damage layer removal processing on the silicon wafer.

4. The electroplating equipment according to claim 2, characterized in that: The electroplating area (100) further comprises a second electroplating tank (107), a second alkali washing tank (108), a third water washing tank (109) and a drying device (110) which are connected in sequence; the second electroplating tank (107) is connected to the second water washing tank (105), and the drying device (110) is connected to the transfer device (400); The second electroplating tank (107), the second alkali washing tank (108), the third water washing tank (109) and the drying device (110) are used to perform a second electroplating tank, a second alkali washing, a third water washing and drying on the silicon wafers, respectively.

5. The electroplating equipment according to claim 4, characterized in that: The electroplating area (100) comprises an isolation groove (106), wherein the isolation groove (106) is connected between the second electroplating groove (107) and the second washing groove (105); the isolation groove (106) is used for temporarily storing silicon wafers.

6. The electroplating equipment according to claim 1, characterized in that: The silicon wafer cleaning area (200) comprises a fourth water washing tank (201), a third alkali washing tank (202), a photoresist cleaning tank (203), a fifth water washing tank (204) and a second drying device (207) which are connected in sequence; the fourth water washing tank (201) and the second drying device (207) are both connected to the transfer device (400); The fourth water washing tank (201), the third alkali washing tank (202), the photoresist cleaning tank (203), the fifth water washing tank (204) and the second drying device (207) are respectively used to perform a fourth water washing, a third alkali washing, a photoresist cleaning, a fifth water washing and drying on the silicon wafer.

7. The electroplating equipment according to claim 6, characterized in that: The silicon wafer cleaning area (200) further comprises a seed layer cleaning tank (205) and a sixth water washing tank (206) which are connected to each other; the seed layer cleaning tank (205) is connected to the fifth water washing tank (204), and the sixth water washing tank (206) is connected to the second drying device (207); the seed layer cleaning tank (205) and the sixth water washing tank (206) are used for performing seed layer cleaning and sixth water washing on the silicon wafer, respectively.

8. The electroplating equipment according to claim 1, characterized in that: The carrier cleaning area (300) comprises a seventh water washing tank (310), a chemical cleaning chamber (320), and an eighth water washing tank (330) which are connected in sequence; the seventh water washing tank (310) is connected to the transfer device (400); The seventh water washing tank (310), the chemical cleaning chamber (320) and the eighth water washing tank (330) are used to perform a seventh water washing, a chemical cleaning and an eighth water washing on the carrier, respectively.

9. The electroplating equipment according to claim 8, characterized in that: The chemical cleaning chamber (320) comprises a first chemical cleaning tank (321), a second chemical cleaning tank (322) and a third chemical cleaning tank (323) which are connected in sequence.

10. The electroplating equipment according to claim 8, characterized in that: The electroplating equipment comprises a first buffer chamber (500), the first buffer chamber (500) being connected between the transfer device (400) and the seventh washing tank (310), the first buffer chamber (500) being used for temporarily storing a carrier plate to be cleaned; And / or, the electroplating equipment includes a second cache chamber (600), the second cache chamber (600) is connected between the eighth washing tank (330) and the transfer device (400), and the second cache chamber (600) is used to temporarily store the carrier plate to be loaded after cleaning.

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