Dummy load testing device and testing system for server cold plate

Abstract

The utility model relates to a dummy load testing device and a testing system of a server cold plate, the dummy load testing device comprises a housing, and a PCB, a radiator and a controller which are installed in the housing, the PCB is provided with N * M chip simulation loads which are distributed in an array mode, and N and M are the number of rows and the number of columns of the array respectively; the controller is in signal connection with the radiator and all the chip simulation loads; each chip simulation load is correspondingly provided with a cold plate and is fixed on the PCB through a buckle plate, so that the cold plate covers the chip simulation load; wherein the cold plate is provided with a liquid inlet and a liquid outlet; the shell is provided with a cooling liquid inlet and a cooling liquid outlet, the cooling liquid inlet is communicated with the liquid inlets of the cold plates, and the cooling liquid outlet is communicated with the liquid outlets of the cold plates. The dummy load testing device provided by the utility model is used for simulating the working load of a whole set of heating chips of an actual server and generating heat to test the heat dissipation performance of a cold plate.

Description

Technical Field

[0001] The utility model belongs to the technical field of liquid cooling plate testing for data center servers, and particularly relates to a dummy load testing device and a testing system for a server cold plate. Background Art

[0002] With the rapid development of data center technology, the testing of server cold plate performance has become particularly important. However, existing cold plate dummy load products can only simulate the heat generation of a single chip, and can only test the function of a single cold plate at a time, or the tested cold plates are arranged dispersedly, lacking a solution for overall testing of the cold plate system of the entire server.

[0003] In addition, most of the existing testing systems on the market have problems such as complex structure, cumbersome operation, and low energy efficiency. At the same time, ordinary cold plate dummy loads lack an intuitive and easy-to-use visualization interface and remote access function, resulting in a poor user experience at the using end and bringing inconvenience to testing and maintenance. Summary of the Utility Model

[0004] Based on the above-mentioned drawbacks and deficiencies existing in the prior art, one of the purposes of the present utility model is to at least solve one or more of the above problems existing in the prior art. In other words, one of the purposes of the present utility model is to provide a dummy load testing device and a testing system for a server cold plate that meet one or more of the foregoing requirements.

[0005] In order to achieve the above utility model purpose, the present utility model adopts the following technical solutions:

[0006] A dummy load testing device for a server cold plate includes a housing and a PCB board, a radiator, and a controller installed in the housing. The PCB board is provided with N*M chip simulation loads distributed in an array, where N and M are the number of rows and columns of the array respectively;

[0007] The controller is signal-connected to the radiator and all chip simulation loads;

[0008] Each chip simulation load is correspondingly provided with a cold plate, and is fixed to the PCB board through a buckle plate to cover the cold plate on the chip simulation load; wherein, the cold plate has a liquid inlet and a liquid outlet;

[0009] The housing has a coolant inlet and a coolant outlet, and the coolant inlet is respectively communicated with the liquid inlets of each cold plate, and the coolant outlet is respectively communicated with the liquid outlets of each cold plate.

[0010] As a preferred solution, the PCB board has several mounting holes evenly distributed along the circumference of the chip simulation load. Correspondingly, the buckle plate has fixing holes corresponding to the mounting holes one by one. A fixing member passes through the fixing hole and is threadedly connected to the mounting hole to fix the buckle plate to the PCB board.

[0011] As a preferred solution, the projection of the cold plate covers its corresponding chip simulation load.

[0012] As a preferred solution, the middle of the buckle plate has a hollow structure, and the circumferential direction of the buckle plate has an arc-shaped concave structure.

[0013] As a preferred solution, the fixing member is a screw or a bolt.

[0014] As a preferred solution, fixing lugs are respectively arranged on both sides of the housing.

[0015] As a preferred solution, the housing is further provided with a display screen, an electric control switch, a network cable interface, a host computer communication interface and a power supply interface, and the display screen, the electric control switch, the network cable interface, the host computer communication interface and the power supply interface are all signal-connected to the controller.

[0016] As a preferred solution, the types of the chip simulation loads include GPU chips, CPU chips and NV-Switch chips.

[0017] As a preferred solution, the radiator is a cooling fan and / or a copper tube radiator.

[0018] The present utility model further provides a dummy load test system for a server cold plate, which includes a compressor, an air-cooled condenser, an expansion valve, an evaporator, a liquid pump, and a dummy load test device according to any one of the above solutions. The evaporator, the coolant inlet, the coolant outlet of the dummy load test device and the liquid pump form a coolant circulation loop, and the evaporator, the compressor, the air-cooled condenser and the expansion valve form a coolant refrigeration loop.

[0019] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0020] (1) The dummy load test device of the present utility model is used to simulate the working load of a set of actual server heating chips (such as GPU chips, CPU chips, NV-Switch chips), generate heat to test the heat dissipation performance of the cold plate;

[0021] (2) The dummy load test device of the present utility model adopts a modular chip simulation load design, is connected and communicates through a standard interface, has high scalability and maintainability, and is convenient for the user side to increase, decrease and upgrade the chip simulation load according to actual needs;

[0022] (3) The dummy load test system of the present utility model uses a coolant circulation loop and a coolant refrigeration loop to form a complete test system, realizing intelligent control. Description of the Drawings

[0023] Figure 1 It is a schematic structural diagram of the dummy load test device according to Embodiment 1 of the present utility model;

[0024] Figure 2 It is a schematic diagram of the internal structure of the dummy load test device according to Embodiment 1 of the present utility model;

[0025] Figure 3 It is a schematic diagram of the structure of the buckle plate according to Embodiment 1 of the present utility model;

[0026] Figure 4 It is a schematic diagram of the structure of the dummy load test device from another perspective according to Embodiment 1 of the present utility model;

[0027] Figure 5 It is a schematic diagram of the structure of the dummy load test device from another perspective according to Embodiment 1 of the present utility model;

[0028] Figure 6 It is a schematic diagram of the structure of the dummy load test device from another perspective according to Embodiment 1 of the present utility model;

[0029] Figure 7 It is a framework diagram of the dummy load test system according to Embodiment 1 of the present utility model. Specific embodiments

[0030] To more clearly illustrate the embodiments of the present utility model, the specific embodiments of the present utility model will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings, and other embodiments can be obtained.

[0031] Embodiment 1:

[0032] As Figures 1 to 6 shown, the dummy load test device for the server cold plate of this embodiment includes a housing 1 and a PCB board 2, a radiator 3, and a controller 4 installed in the housing 1.

[0033] Specifically, the housing 1 is a flat cuboid structure, whose length is greater than the width, and the width is greater than twice the height, for simulating the size structure of a common server. Among them, the housing 1 is a sheet metal part, and the backplane can be a metal sheet metal or an additional FR-4 backplane, whose function is to connect and fix the PCB board, fully simulating the server heat dissipation scenario.

[0034] The PCB board 2 of this embodiment is fixed to the inner side of the backplane of the housing 1 through positioning screws 5, and a controller 4 is installed above the PCB board 2. The controller 4 can be a commonly used existing PLC control module to achieve intelligent control.

[0035] On the surface of the PCB board 2 in this embodiment, there are 3*4 chip simulation loads 6 distributed in an array, that is, chip simulation loads in three rows and four columns; the types of the chip simulation loads 6 include GPU chips, CPU chips, and NV-Switch chips, and heat is generated by the chip simulation loads 6 to test the heat dissipation performance of the cold plate.

[0036] The main function of the chip simulation load 6 is to simulate the heat generated by the load operation of chips such as server CPUs / GPUs. When the output voltage of the controller changes, the generated heat also changes. The chip simulation load 6 can adopt an alloy resistor type or a PTC resistor type; the advantages and disadvantages of the alloy resistor type: less affected by temperature, stable power, but cannot maintain constant current and constant power when the voltage changes. However, it can basically maintain constant power under AC 220V or DC 240V voltage; the advantages and disadvantages of the PTC resistor type: less affected by voltage, can operate with constant current and constant power, but the power fluctuates significantly and has a large impact when the temperature changes, and a large amount of harmonics will be generated.

[0037] A cold plate is provided corresponding to each chip simulation load 6, and the projection of the cold plate covers its corresponding chip simulation load. Preferably, the size of the cold plate is the same as that of the chip simulation load; it is fixed to the PCB board 2 through a buckle plate 7, so that the cold plate covers the chip simulation load 6; among them, the cold plate has a liquid inlet and a liquid outlet, and the specific structure of the cold plate can refer to the existing technology and will not be elaborated here. In addition, temperature sensors are respectively provided at the liquid inlet and the liquid outlet of the cold plate to detect the inlet liquid temperature and the outlet liquid temperature; the temperature sensors can adopt T-type teflon-sheathed thermocouple temperature measurement wires, which have the advantages of high sensitivity, rapid response, high temperature resistance, and high stability; chip temperature acquisition (12 channels), temperature measurement error ±0.5°C, and the temperature can be read locally and remotely.

[0038] The specific structure of the buckle plate 7 fixed on the PCB board 2 in this embodiment is as follows: the PCB board 2 has four mounting holes 20 evenly distributed along the circumference of the chip simulation load 6. Correspondingly, the buckle plate 7 has fixing holes 70 corresponding to the mounting holes one by one. The buckle plate 7 is fixed on the PCB board 2 by bolts or screws passing through the fixing holes 70 and being threadedly connected to the mounting holes 20. Among them, the middle part of the buckle plate 7 has a hollow structure K, and the circumference of the buckle plate 7 has an arc-shaped concave structure S, which optimizes the buckle plate structure, uses less materials, and has a low cost.

[0039] The controller 4 in this embodiment is signal-connected to the radiator 3, all chip simulation loads, and temperature sensors for signal acquisition and intelligent control. Among them, the radiator 3 is a cooling fan and is located below the chip simulation load.

[0040] The housing 1 of this embodiment has a coolant inlet 11 and a coolant outlet 12. The coolant inlet 11 is connected to the liquid inlet of each cold plate through pipelines respectively, and the coolant outlet 12 is connected to the liquid outlet of each cold plate through pipelines respectively, realizing the liquid inlet and outlet of the cold plate.

[0041] In addition, fixed hanging ears 13 are respectively arranged on both sides of the housing 1, facilitating the installation of the dummy load test device in the liquid-cooled cabinet.

[0042] The housing 1 of this embodiment is also provided with a display screen 14, an electric control switch 15, a network cable interface 16, an upper computer communication interface 17 and a power supply interface 18. Among them, the network cable interface 16, the upper computer communication interface 17, the power supply interface 18, the coolant inlet 11 and the coolant outlet 12 are located at the same end of the housing 1, and the display screen 14 and the electric control switch 15 are located at the other end of the housing 1; the display screen 14, the electric control switch 15, the network cable interface 16, the upper computer communication interface 17 and the power supply interface 18 are all signal-connected to the controller 4. The above-mentioned standard interfaces such as the network cable interface, the upper computer communication interface, and the power supply interface C14 ensure the connection between various devices through the standard interfaces, such as USB, Ethernet, etc., ensuring the effective transmission of data and the interchangeability of devices. Each device is connected to the controller through a data cable and a power cable to realize data transmission and power supply.

[0043] The whole set of dummy load test devices can be designed into modular products with different thicknesses and depths according to "U", for example: it can be designed to be installed inside a 19-inch, 42U cabinet. In addition, local control or remote control can be selected. When locally controlled, the remote intelligent detection data cannot issue commands and can only read real-time data; similarly, when remotely controlled, local operations are ineffective.

[0044] As Figure 7 shown, the dummy load test system of the server cold plate of this embodiment includes a compressor I1, an air-cooled condenser I2, an expansion valve I3, an evaporator I4, a liquid pump I5 and the above-mentioned dummy load test device II. The evaporator I4, the coolant inlet and outlet of the dummy load test device and the liquid pump I5 form a coolant circulation loop, and the evaporator I4, the compressor I1, the air-cooled condenser I2 and the expansion valve I3 form a coolant refrigeration loop.

[0045] When the dummy load test system works, the dummy load test device can simulate the heat generation power of all chips of the whole set of servers. The generated heat is driven by the liquid pump to circulate the coolant, and heat exchange is carried out in the evaporator. The heat-exchanged coolant returns to the cold plate in the dummy load test device to form a circulating heat dissipation.

[0046] The controller is responsible for regulating the test parameters of the simulated load of each chip, such as voltage, power, temperature sensor, flow rate and pressure of the heat dissipation module, etc. The controller is responsible for setting parameters, starting the test, monitoring the test process and processing test data.

[0047] The main function settings of the dummy load test system for the server cold plate in this embodiment include:

[0048] 1) Load test: The load switches can be arbitrarily combined to simulate the actual heat generation situation of the chips in the computer room server and the line reliability, etc.;

[0049] 2) Control method: The load is equipped with multiple gear switches, and the load power can be controlled to increase / decrease through the gear switches;

[0050] 3) Temperature protection: When the load temperature exceeds the set safety threshold, an audible and visual alarm is given;

[0051] 4) Monitoring function: The device can be optionally equipped with a liquid crystal display screen, and the inlet and outlet, temperature, flow rate, alarm information, etc. can all be displayed on the liquid crystal screen.

[0052] The function control of the dummy load test system for the server cold plate in this embodiment includes:

[0053] a) Locally set the power. After the user sets the heat generation power value by touching / button pressing, the controller adjusts the voltage value output by the voltage regulator in an intelligent PID / three-stage manner according to the power value set by the user, thereby changing the output power of the device. During the operation of the device, the controller continuously collects the power through the voltage and current sensors and compares it with the preset power. When the deviation threshold is exceeded, the controller actively adjusts the output voltage of the voltage regulator to make the actual output power and the set value within the deviation threshold range;

[0054] b) Remotely communicate to set the power. The user uses devices such as PLCs to set the output power value of the device through RS485 communication.

[0055] When the dummy load test system for the server cold plate in this embodiment is specifically implemented, it can be carried out through the following steps:

[0056] ① Connect and communicate each device module according to the standard interface to form a complete test system;

[0057] ② Set the test parameters and scenarios through the controller and start the test system;

[0058] ③ The dummy load test device simulates the actual load situation according to the test requirements, and the radiator controls heat dissipation according to the real-time temperature;

[0059] ④ Display the test data, system status and real-time parameters through the visualization interface, and the user end can monitor and operate through the interface;

[0060] ⑤ Process the test data: After the test, the controller collects the test data and processes it to generate a test report.

[0061] Embodiment 2:

[0062] The dummy load test device of this embodiment is different from that of Embodiment 1 in that:

[0063] The radiator uses a copper tube radiator or a combination of a cooling fan and a copper tube radiator;

[0064] The heat dissipation method is changed from a combination of air and liquid (cold plate + fan) to full-stack liquid cooling (cold plate + liquid cooling heat exchanger), with higher heat dissipation efficiency and effectively reducing the noise effect;

[0065] Other structures can refer to Embodiment 1;

[0066] The dummy load test system of this embodiment uses the dummy load test device of this embodiment.

[0067] Embodiment 3:

[0068] The dummy load test device of this embodiment is different from that of Embodiment 1 in that:

[0069] The array parameters of the chip simulation load can be determined according to actual application requirements, not limited to 3*4 in Embodiment 1;

[0070] Other structures can refer to Embodiment 1;

[0071] The dummy load test system of this embodiment uses the dummy load test device of this embodiment.

[0072] It should be noted that the above embodiments can be freely combined as needed. The above is only a detailed description of the preferred embodiments and principles of the present invention. For those of ordinary skill in the art, according to the idea provided by the present invention, there will be changes in the specific implementation manners, and these changes should also be regarded as the protection scope of the present invention.

Claims

1. A dummy load test device for a server cold plate, characterized in that: It includes a housing and a PCB board, a heat sink and a controller installed in the housing. The PCB board is provided with N*M chip simulation loads distributed in an array, where N and M are the number of rows and columns of the array respectively. The controller is connected to the radiator and all chips with simulated load signals; A cold plate is provided corresponding to each chip simulation load and fixed to the PCB board through a buckle plate, so that the cold plate cover is arranged on the chip simulation load; wherein the cold plate has a liquid inlet and a liquid outlet; The shell has a cooling liquid inlet and a cooling liquid outlet. The cooling liquid inlet is respectively communicated with the liquid inlet of each cold plate, and the cooling liquid outlet is respectively communicated with the liquid outlet of each cold plate.

2. The dummy load testing device according to claim 1, characterized in that: The PCB board has a plurality of mounting holes evenly distributed along the circumference of the chip simulated load. Correspondingly, the gusset plate has fixing holes corresponding to the mounting holes one by one. The fixing parts penetrate the fixing holes and are threadedly connected to the mounting holes to fix the gusset plate to the PCB board.

3. The dummy load testing device according to claim 2, characterized in that: The projection of the cold plate covers the corresponding chip simulated load.

4. The dummy load testing device according to claim 2, characterized in that: The middle part of the buckle plate has a hollow structure, and the circumference of the buckle plate has an arc-shaped concave structure.

5. The dummy load testing device according to claim 2, characterized in that: The fixing member is a screw or a bolt.

6. The dummy load testing device according to claim 1, characterized in that: The two sides of the shell are respectively provided with fixing ears.

7. The dummy load testing device according to any one of claims 1 to 6, characterized in that: The housing is also provided with a display screen, an electric control switch, a network cable interface, a host computer communication interface and a power supply interface, and the display screen, the electric control switch, the network cable interface, the host computer communication interface and the power supply interface are all connected to the controller signal.

8. The dummy load testing device according to any one of claims 1 to 6, characterized in that: The types of chip simulation loads include GPU chips, CPU chips and NV-Switch chips.

9. The dummy load testing device according to any one of claims 1 to 6, characterized in that: The radiator is a cooling fan and / or a copper tube radiator.

10. A dummy load test system for a server cold plate, characterized in that: It includes a compressor, an air-cooled condenser, an expansion valve, an evaporator, a liquid pump, and a dummy load test device as described in any one of claims 1 to 9. The evaporator, the coolant inlet, the coolant outlet and the liquid pump of the dummy load test device constitute a coolant circulation loop, and the evaporator, the compressor, the air-cooled condenser, and the expansion valve constitute a coolant refrigeration loop.

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