Die bond film stripping mechanism for crystal grains
By adopting multi-point support and vacuum adsorption force on the solid crystal film and combining the average tensile force of the film pulling device, stable peeling and picking of grains are achieved, and the problems of grain deformation and damage in the prior art are solved.
Patent Information
- Application Number
- CN202421634063.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-11
- Publication Date
- 2025-06-10
- Estimated Expiration
- 2034-07-11
AI Technical Summary
The prior art may easily lead to grain deformation or damage when picking grains from solid crystal films, and the thimble technology has the problem of high unstableness when thrusting grains.
A peeling mechanism including a positioning platform, a vacuum control unit and a film pulling device is adopted to maintain the grains horizontal reference position through multi-point support and vacuum adsorption force, and the grains are peeled off from the solid crystal film by the average tensile force of the film pulling device.
The stable peeling and picking of grains is achieved, the adhesion of the solid crystal film to the grains is reduced, and the risk of deformation and damage of grains during the pickup process is reduced.
Smart Images
Figure CN222966080U_ABST
Abstract
Description
Technical Field
[0001] The present utility model relates to semiconductor equipment. More specifically, the present utility model is a peeling mechanism that peels a die from a die attach film (DAF) to facilitate the die picking system to pick up the die from the die attach film. Background Art
[0002] Semiconductor dies are manufactured by cutting a wafer into a predetermined size. Before the cutting process, the back surface of the wafer has been pre-attached to an adhesive die attach film (DAF). Therefore, the cut dies are still neatly arranged and adhered to the die attach film. Then, the dies on the die attach film will be picked up one by one in the die transfer system and sent to the subsequent process.
[0003] In the past, most of the methods for picking up dies from the die attach film used the thimble method. Generally, the die attach film is fixed on the surface of the wafer stage, the thimble is aligned with the target die, and the target die is lifted from the bottom of the die attach film. The target die is lifted higher than other non-target dies, and then the target die is adsorbed by the chuck. Summary of the Invention
[0004] The present utility model provides a mechanism for peeling a die from a die attach film, which does not use the method of lifting the target die with a thimble.
[0005] A die attach film peeling mechanism for a die provided by the present utility model includes:
[0006] A positioning platform, the top surface of which is provided with a circumferential frame, and a plurality of convex parts are evenly distributed on the top surface surrounded by the circumferential frame; the circumferential frame and the convex parts support and position the back surface of a die attach film, and the front surface of the die attach film adheres to a plurality of dies formed by cutting a wafer.
[0007] A vacuum control part, connected to the positioning platform, providing vacuum pressure between the convex parts.
[0008] A plurality of film pulling devices that can move up and down, surrounding the circumference of the positioning platform; each film pulling device clamps an edge of the die attach film.
[0009] Another die attach film peeling mechanism for a die provided by the present utility model includes:
[0010] A positioning platform, and a plurality of film pulling devices surrounding the circumference of the positioning platform;
[0011] The top surface of the positioning platform is provided with a circumferential frame, and a plurality of convex parts are evenly distributed on the top surface surrounded by the circumferential frame; the positioning platform is provided with a plurality of suction holes, and the plurality of suction holes are evenly distributed among the plurality of convex parts; the plurality of suction holes are connected to a vacuum control part; the vacuum control part provides vacuum pressure between each convex part through the plurality of suction holes;
[0012] The film pulling device includes a film clamping assembly and a film pulling assembly; the film clamping assembly includes a clamp and a clamp controller, and the clamp controller is connected to and controls the opening or closing of the clamp; the film pulling assembly is connected to and controls the up and down movement of the film clamping assembly.
[0013] As a preference of the above technical solution, preferably, the vacuum control part includes a vacuum hood enclosed at the bottom of the positioning platform and a vacuum source that provides the vacuum pressure in the vacuum hood, and the suction holes communicate with the vacuum hood.
[0014] As a preference of the above technical solution, preferably, the clamp includes a first clamping part and a second clamping part, the first clamping part and the second clamping part are pivotally connected to each other at the first end, and the second ends of the first clamping part and the second clamping part face the circumference of the positioning platform; the first clamping part is pivotally connected to the top end of a fixing part by a pivot member, and the first clamping part and the second clamping part can swing up and down with the pivot member as the center; the clamp controller is connected to and controls the opening and closing movement of the second clamping part relative to the first clamping part.
[0015] As a preference of the above technical solution, preferably, the clamp controller includes a first power cylinder and a first telescopic rod controlled by the first power cylinder; the first telescopic rod is hinged to the first end of the second clamping part, and the first power cylinder is hinged to the film pulling assembly.
[0016] As a preference of the above technical solution, preferably, the film pulling assembly includes a pull rod and a film pulling controller; the first end of the pull rod is connected to the first clamping part, and the second end of the pull rod is hinged to the first power cylinder; the film pulling controller is connected to and controls the up and down movement of the pull rod.
[0017] As a preference of the above technical solution, preferably, the film pulling controller includes a second power cylinder and a second telescopic rod controlled by the second power cylinder; the second telescopic rod is hinged to the pull rod.
[0018] The advantages of the present utility model are:
[0019] During the process of separating the chips, the die bonding film and all the chips adhered thereto are supported by the convex portions evenly distributed at multiple points on the positioning platform, so that the die bonding film and the chips thereon are maintained at a horizontal reference position. On this basis, by applying the adsorption force to the back surface of the die bonding film and the average tensile force to the periphery of the die bonding film, the state where each chip adheres to the die bonding film with its entire back surface is changed to a peeling state of point adhesion, and then in cooperation with the suction head of the chip picking device, the target chip is sucked to make it separate from the die bonding film.
[0020] During the entire process of peeling the die bonding film and sucking the chips, the horizontal reference positions of all the chips remain unchanged. Compared with the thimble technology described in the prior art, in the prior art, the thimble is used to push up the target chip from the bottom of the die bonding film, and the target chip is pushed up and higher than other non-target chips.
[0021] When the chips are in the above-mentioned peeling state, the adhesion force of the die bonding film to the chips can be reduced, and the suction head of the chip picking device can suck the target chip with a smaller suction force, thereby reducing the probability of chip deformation or damage.
[0022] According to the thickness of the chips, by controlling the vacuum pressure applied to the back surface of the die bonding film, the die bonding film can be peeled from the chips, and the chips can be maintained without deforming along with the die bonding film. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0024] Figure 1 Schematic external view of the chip peeling mechanism of the present utility model.
[0025] Figure 2 For Figure 1 Top view schematic diagram.
[0026] Figure 3 For Figure 1 Top view schematic external view of the positioning platform.
[0027] Figure 4 For Figure 1 Bottom view schematic external view of the positioning platform.
[0028] Figure 5 For Figure 3 Partial enlarged view.
[0029] Figure 6 For Figure 1Side schematic diagram and operation schematic of a film pulling device in Figure 1 。
[0030] Figure 7 For Figure 1 Side schematic diagram and operation schematic of a film pulling device in Figure 2 。
[0031] Figure 8 For Figure 1 Side schematic diagram and operation schematic of a film pulling device in Figure 3 。
[0032] Figure 9 Schematic side view and operation of the crystal grain peeling mechanism of the present utility model Figure 1 。
[0033] Figure 10 Schematic side view and operation of the crystal grain peeling mechanism of the present utility model Figure 2 。
[0034] Figure 11 Schematic side view and operation of the crystal grain peeling mechanism of the present utility model Figure 3 。
[0035] Figure 12A Describe the schematic operation of the present utility model to peel the crystal grains from the die bonding film Figure 1 。
[0036] Figure 12B Describe the schematic operation of the present utility model to peel the crystal grains from the die bonding film Figure 2 。
[0037] Figure 12C Describe the schematic operation of the present utility model to peel the crystal grains from the die bonding film Figure 3 。
[0038] Figure 12D Describe the schematic operation of the present utility model to peel the crystal grains from the die bonding film Figure 4 。
[0039] Among them, 10: positioning platform; 11: support feet; 12: machine base; 13: bracket; 14: support rod; 21: circumferential frame; 22: convex part; 23: suction hole; 24: vacuum hood; 25: joint; 26: vacuum control part; 30: film pulling device; 31: fixing part; 32: fixator; 40: film clamping assembly; 41: clamp; 42: first clamping part; 43: second clamping part; 44: pivot joint; 45: clamp controller; 46: first power cylinder; 47: first telescopic rod; 50: film pulling assembly; 51: pull rod; 52: film pulling controller; 53: second power cylinder; 54: second telescopic rod; 60: die bonding film; 61: crystal grain; 62: film edge; 70: suction head. Detailed implementation mode
[0040] To facilitate the description of the central idea expressed in the above-mentioned summary of the invention of the present invention, specific embodiments are used for expression. Various different objects in the embodiments are depicted according to suitable illustrative proportions, dimensions, deformation amounts or displacement amounts, rather than being drawn according to the proportions of actual components. This is stated first. And in the following description, elements with the same and symmetric configurations are represented by the same numbers. The terms "first", "second", "third" are only used to describe elements and cannot be understood as indicating or implying relative importance or order.
[0041] Such as Figures 1 to 3 And Figure 9 , the grain peeling mechanism of the present invention includes a positioning platform 10 and a plurality of film pulling devices 30 arranged around the circumference of the positioning platform 10. The positioning platform 10 is positioned on a machine base 12 by several feet 11. A plurality of the film pulling devices 30 are installed on a bracket 13 around the positioning platform 10, and the bracket 13 is fixed to the machine base 12 by several support rods 14.
[0042] Such as Figures 3 to 5 , the positioning platform 10 is provided with a circumferential frame 21 along the circumference. The top surface of the positioning platform 10 surrounded by the circumferential frame 21 is evenly distributed with a plurality of convex parts 22. The positioning platform 10 is provided with several suction holes 23, and the suction holes 23 are between the convex parts 22. Several of the suction holes 23 are connected to a vacuum control unit 26. The positioning platform 10 is used to position a die bonding film 60 attached with cut grains 61. The area of the positioning platform 10, the size and spacing of the convex parts 22 can be designed accordingly according to the size of the die bonding film 60 and the length and width dimensions of the grains 61.
[0043] The vacuum control unit 26 includes a vacuum hood 24 enclosed at the bottom of the positioning platform 10 and a vacuum source (not shown in the figure) that provides vacuum pressure in the vacuum hood 24. In the illustration, the vacuum hood 24 is connected to the vacuum source (not shown in the figure) by several connectors 25. A vacuum pump or a vacuum pump can be used as the vacuum source. A vacuum regulating unit can cooperate with the vacuum source to adjust the vacuum pressure in the vacuum hood 24. In other words, the vacuum control unit 26 can adjust the vacuum pressure in the vacuum hood 24.
[0044] Such as Figures 6 to 8 , the film pulling device 30 includes a fixing member 31, a film clamping assembly 40, and a film pulling assembly 50.
[0045] The fixing member 31 is a rod, a plate or other objects with a vertical length. The fixing member 31 is mounted on the bracket 13 by a fixture 32.
[0046] The film clamping assembly 40 includes a clamp 41 and a clamp controller 45 for controlling the opening and closing of the clamp 41. The clamp 41 includes a first clamping portion 42 and a second clamping portion 43, which are pivotally connected or hinged to each other at the first end. Accordingly, the second ends of the two can be separated or closed, and the second ends of the two face the circumference of the positioning platform 10. The first clamping portion 42 is pivotally connected to the fixing member 31 by a pivot member 44. Accordingly, the first clamping portion 42 and the second clamping portion 43 can swing up and down with the pivot member 44 as the center. The clamp controller 45 includes a first power cylinder 46 and a first telescopic rod 47 controlled by the first power cylinder 46. The first telescopic rod 47 is hinged to the first end of the second clamping portion 43, and the first power cylinder 46 is hinged to a pull rod 51 of the film pulling assembly 50.
[0047] The film pulling assembly 50 includes the pull rod 51 described above and a film pulling controller 52. The first end of the pull rod 51 is connected to the first clamping portion 42 of the clamp 41, and the second end of the pull rod 51 is hinged to the first power cylinder 46 of the clamp controller 45. The film pulling controller 52 includes a second power cylinder 53 and a second telescopic rod 54 controlled by the second power cylinder 53. The second telescopic rod 54 is hinged to the pull rod 51.
[0048] As Figure 6 and Figure 7 , the telescopic actuation of the first telescopic rod 47 can control the second clamping portion 43 of the clamp 41 to open or close relative to the first clamping portion 42.
[0049] As Figure 6 and Figure 8 , when the clamp 41 is closed, the telescopic movement of the second telescopic rod 54 actuates the pull rod 51 to move up and down. Accordingly, the film clamping assembly 40 is actuated to swing up and down with the pivot member 44 as the center.
[0050] As Figures 9 to 11 , the operation of the crystal grain peeling mechanism of the present invention is described in a schematic side view. To avoid the situation of overly complex or overlapping lines in the drawing of the plurality of film pulling devices 30 arranged in a circle, the film pulling devices 30 on the left and right are used to represent the operation of the present invention. However, it can be inferred that the operations of all the film pulling devices 30 are the same.
[0051] As Figure 9 and Figure 12A , the clamp 41 is opened, and a solid crystal film 60 with a die 61 attached is placed and positioned on the positioning platform 10. The center and circumference of the wafer constituting the cut die 61 are aligned with the center of the positioning platform 10 and the circumferential frame 21 by known technical means, and a plurality of the protrusions 22 support the bottom surface of the solid crystal film 60. The film edge 62 of the solid crystal film 60 extends beyond the circumferential frame 21 and is placed on the first clamping portion 42 of the clamp 41. During the positioning of the solid crystal film 60, the vacuum control unit 26 can provide a slight vacuum pressure to the vacuum cover 24, and the positioning platform 10 can slightly absorb the solid crystal film 60 through the suction hole 23, so as to facilitate the adjustment and positioning of the solid crystal film 60.
[0052] like Figure 10 and Figure 12B , the first power cylinder 46 controls the first telescopic rod 47 to extend, so that the second clamping part 43 is closed toward the first clamping part 42, and the clamp 41 clamps the film edge 62 of the solid crystal film 60. At this time, the vacuum control part 26 adjusts the vacuum pressure in the vacuum cover 24. The vacuum control part 26 can provide appropriate vacuum pressure in the vacuum cover 24 according to the thickness of the grain 61, and the space between the protrusions 22 is adsorbed from the back of the solid crystal film 60 through the suction hole 23. The solid crystal film 60 between the protrusions 22 is deformed downward by the vacuum adsorption force, and the state of each grain 61 on the solid crystal film 60 is changed from the state of full back adhesion to the solid crystal film 60 to the state of point adhesion and peeling, and the point adhesion position is at the top of the protrusion 22. The vacuum control part 26 can provide appropriate vacuum pressure in the vacuum cover 24 according to the thickness of the grain 61, so as to prevent the grain 61 from being damaged by the vacuum pressure or deformation of the solid crystal film 60. The thickness information of the die 61 may be provided in advance by the program management server.
[0053] like Figure 11 and Figure 12C , the vacuum control unit 26 continues to provide appropriate vacuum pressure, and the clamp 41 still clamps the film edge 62 of the solid crystal film 60. At this time, the second power cylinder 53 actuates the second telescopic rod 54 to retract and pull the pull rod 51 downward, and the pull rod 51 actuates the clamping film assembly 40 to move downward, and the clamping film assembly 40 swings downward with the first clamping part 42 and the pivot 44 as the center. Most of the clamping film assemblies 40 are synchronously actuated, and an average tensile force is applied to the solid crystal film 60 through the film edge 62 of the solid crystal film 60, as a result, the solid crystal film 60 held on the positioning platform 10 is stretched, the interval between each grain 61 is widened, and is supported by the convex portion 22, so that the pick-up performance of the grain 61 is improved.
[0054] like Figure 12D, in cooperation with the suction head 70 of the die 61 picking device, sucks the target die 61 to make it separate from the die bonding film 60. When the die 61 is in the peeled state, the adhesive force of the die bonding film 60 to the die 61 is reduced. The suction head 70 of the die picking machine can suck the target die 61 with a smaller suction force, and the adhesive force pulling can be reduced when the die 61 separates from the die bonding film 60.
[0055] The top surface of the circumferential frame 21 of the positioning platform 10 and the tops of the convex portions 22 are maintained at the same horizontal reference level. Accordingly, the die bonding film 60 positioned on the positioning platform 10 and the die 61 thereon are also maintained at this horizontal reference level. On this basis, through the adsorption force applied to the back surface of the die bonding film 60 and the average tensile force applied to the periphery of the die bonding film 60, the state where each die 61 adheres to the die bonding film 60 with the entire back surface is changed to a peeled state of dot-like adhesion, and then in cooperation with the suction head 70 of the die 61 picking device, the target die 61 is sucked to make it separate from the die bonding film 60.
[0056] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. A device for peeling off a solid crystal film of a crystal grain, characterized in that: include: A positioning platform, the top surface of which is provided with a circumferential frame, and the top surface surrounded by the circumferential frame is evenly provided with a plurality of convex portions; the circumferential frame and the convex portions support and position the back side of a die-bonding film, and the front side of the die-bonding film is adhered with a plurality of crystal grains consisting of cut wafers; A vacuum control unit connected to the positioning platform to provide vacuum pressure between the protrusions; A plurality of film-pulling devices which can move up and down surround the circumference of the positioning platform; each of the film-pulling devices clamps a film edge of the solid crystal film.
2. A device for peeling off a solid crystal film of a crystal grain, characterized in that: include: A positioning platform, and a plurality of film-drawing devices surrounding the circumference of the positioning platform; The top surface of the positioning platform is provided with a circumferential frame, and the top surface surrounded by the circumferential frame is evenly distributed with a plurality of convex parts; the positioning platform is provided with a plurality of suction holes, and the plurality of suction holes are evenly distributed between the plurality of the convex parts; the plurality of suction holes are connected to a vacuum control part; the vacuum control part provides vacuum pressure between the plurality of the convex parts through the plurality of suction holes; The film-pulling device comprises a film clamping assembly and a film-pulling assembly; the film clamping assembly comprises a clamp and a clamp controller, the clamp controller is connected to and controls the clamp to open or close; the film-pulling assembly is connected to and controls the film clamping assembly to move up and down.
3. The die-bonding film peeling mechanism according to claim 2, characterized in that: The vacuum control part includes a vacuum cover sealed at the bottom of the positioning platform and a vacuum source providing the vacuum pressure in the vacuum cover, and the suction hole is connected to the vacuum cover.
4. The die-bonding film peeling mechanism according to claim 2, characterized in that: The clamp includes a first clamp and a second clamp, the first clamp and the second clamp are pivotally connected to each other at the first end, and the second ends of the first clamp and the second clamp are facing the circumference of the positioning platform; the first clamp is pivotally connected to the top end of a fixing member by a pivot member, and the first clamp and the second clamp can swing up and down with the pivot member as the center; the clamp controller is connected to and controls the opening and closing movement of the second clamp relative to the first clamp.
5. The die-bonding film peeling mechanism according to claim 4, characterized in that: The clamp controller comprises a first power cylinder and a first telescopic rod controlled by the first power cylinder; the first telescopic rod is hinged to the first end of the second clamping part, and the first power cylinder is hinged to the film pulling assembly.
6. The die bonding film peeling mechanism according to claim 5, characterized in that: The film-pulling assembly comprises a pull rod and a film-pulling controller; the pull rod is connected to the first clamping portion with its first end, and the second end of the pull rod is hinged to the first power cylinder; the film-pulling controller is connected to and controls the pull rod to move up and down.
7. The die bonding film peeling mechanism according to claim 6, characterized in that: The film pulling controller comprises a second power cylinder and a second telescopic rod controlled by the second power cylinder; the second telescopic rod is hinged to the pulling rod.