Laser annealing equipment

Abstract

The utility model discloses laser annealing equipment. The laser annealing equipment comprises a box body, a carrying table, a laser device, a door opening and closing assembly and a gas injection assembly. The box body is provided with a feeding cavity and a processing cavity, the feeding cavity is communicated with the processing cavity, and the feeding cavity is provided with a feeding port; the carrying table is located in the machining cavity and used for carrying products. The laser device is used for generating laser so as to anneal the product carried by the carrying table; the door opening and closing assembly comprises a first door plate and a first driving part, and the first driving part is used for driving the first door plate to move so that the first door plate can open or close the feeding port; the gas injection assembly comprises a first gas injection part and a second gas injection part, the first gas injection part injects first gas into the feeding cavity, and the first gas is used for reducing the content of oxygen in the feeding cavity; the second gas injection part is used for injecting second gas into the machining cavity. The laser annealing equipment can quickly reduce the content of oxygen in the box body.

Description

Technical Field

[0001] This application relates to the technical field of laser annealing, and particularly to a laser annealing device. Background Art

[0002] During the manufacturing process of semiconductor chips, an ion implantation process is performed on the backside of the wafer, the source electrode, or the drain electrode of certain devices. The ion implantation process can cause severe damage to the silicon lattice, resulting in doped impurity ions not occupying the correct lattice positions, and some doped regions not having effective electrical activity.

[0003] After the ion implantation process, the wafer needs to be heated. After the wafer is heated to a high temperature state, the impurity atoms diffuse in the lattice and occupy substitution positions to achieve activation. During the subsequent rapid cooling, the atoms in the lattice rearrange to achieve the required lattice structure. This heating process is the annealing process.

[0004] Laser annealing is a process method that uses pulsed lasers to perform heat treatment on materials. Due to advantages such as high instantaneous temperature, short action time, and small heat affected zone, laser annealing can well meet the process requirements of electrical activity activation and thus becomes one of the key processes in chip manufacturing.

[0005] To avoid the reaction between oxygen and the wafer at a high temperature state, laser annealing of the wafer is performed in a box filled with a protective gas. Since the wafer needs to be sent into or out of the box, the box needs to be frequently filled with the protective gas to reduce the oxygen content in the box.

[0006] In related technologies, the rate of decrease in the oxygen content in the box is slow, resulting in low efficiency of laser annealing. Utility Model Content

[0007] This application aims to solve at least one of the technical problems existing in the prior art. For this reason, this application proposes a laser annealing device that can quickly reduce the oxygen content in the box.

[0008] The laser annealing device according to the first aspect embodiment of this application includes:

[0009] A box body provided with a feeding chamber and a processing chamber, the feeding chamber and the processing chamber are communicated, and the feeding chamber is provided with a feeding port;

[0010] A carrier stage located in the processing chamber, and the carrier stage is used to carry products;

[0011] A laser device for generating laser to anneal the products carried by the carrier stage;

[0012] The door opening and closing assembly includes a first door panel and a first driving member, and the first driving member is used to drive the first door panel to move so that the first door panel opens or closes the feeding port.

[0013] The gas injection assembly includes a first gas injection member and a second gas injection member. The first gas injection member is used to inject a first gas into the feeding chamber, and the first gas is used to reduce the oxygen content in the feeding chamber; the second gas injection member is used to inject a second gas into the processing chamber, and the second gas is used to reduce the oxygen content in the processing chamber.

[0014] The laser annealing equipment according to the embodiment of the present application has at least the following beneficial effects: The feeding chamber is provided with a feeding port, so the oxygen content in the feeding chamber is likely to increase. By injecting the first gas into the feeding chamber through the first gas injection member, the oxygen content in the feeding chamber can be reduced; the processing chamber is used for laser annealing of products (such as wafers), so reducing the oxygen content in the processing chamber is a direct requirement. By injecting the second gas into the processing chamber through the second gas injection member, the oxygen content in the processing chamber can be reduced; by reducing the oxygen content in the feeding chamber and the processing chamber simultaneously and specifically, it is beneficial to quickly reduce the oxygen content in the box.

[0015] According to some embodiments of the present application, the first gas includes an inert gas or nitrogen, and the second gas includes an inert gas or nitrogen.

[0016] According to some embodiments of the present application, the first gas and the second gas are the same.

[0017] According to some embodiments of the present application, it further includes:

[0018] The air curtain member is connected to the box body, and the air curtain member is used to spray a third gas to form an air curtain, and the air curtain is used to separate the air outside the feeding port from the gas in the feeding chamber.

[0019] According to some embodiments of the present application, the third gas includes an inert gas or nitrogen.

[0020] According to some embodiments of the present application, it further includes:

[0021] The static eliminator is connected to the box body, and the static eliminator is used to spray an ionized gas onto the product carried by the stage.

[0022] According to some embodiments of the present application, it further includes:

[0023] The air pressure detection device is connected to the box body, and the air pressure detection device is used to detect the air pressure of the gas in the processing chamber.

[0024] According to some embodiments of the present application, it further includes:

[0025] An oxygen concentration detection device, which is connected to the box body, and is used to detect the oxygen content in the processing chamber.

[0026] According to some embodiments of the present application, it further includes:

[0027] A camera, which is connected to the box body, and is used to acquire an image of the product carried by the stage.

[0028] According to some embodiments of the present application, it further includes:

[0029] A lighting lamp, which is connected to the box body, and is used to emit visible light to at least one of the feeding chamber and the processing chamber.

[0030] Additional aspects and advantages of the present application will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present application. Description of the Drawings

[0031] The following will further illustrate the present application in conjunction with the drawings and embodiments, where:

[0032] Figure 1 is the internal structure diagram of the laser annealing equipment according to the embodiment of the present application;

[0033] Figure 2 is Figure 1 the perspective view of the laser annealing equipment in another angle in

[0034] Figure 3 is Figure 1 the schematic diagram of the laser device and the stage of the laser annealing equipment in

[0035] Figure 4 is Figure 1 the perspective view of the switch door assembly of the laser annealing equipment in

[0036] Figure 5 is Figure 1 the perspective view of the gate assembly of the laser annealing equipment in

[0037] Reference numerals: box body 100, feeding chamber 110, processing chamber 120, feeding port 130, suction hole 140, left side plate 150;

[0038] stage 210, product 220, laser device 230;

[0039] switch door assembly 300, first door panel 310, first driving member 320;

[0040] gas injection assembly 400, first gas injection member 410, second gas injection member 420, gas supply joint 430;

[0041] Air curtain member 510, static eliminator 520, camera 530, lighting lamp 540, air pressure detection device 550, oxygen concentration detection device 560;

[0042] Gate assembly 600, second driving member 610, second door panel 620. Detailed implementation manners

[0043] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application and should not be construed as a limitation to the present application.

[0044] In the description of the present application, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. This is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0045] In the description of the present application, the meaning of "several" is one or more, the meaning of "multiple" is two or more, and understandings such as "greater than", "less than", "exceeding", etc. do not include the present number, and understandings such as "above", "below", "within", etc. include the present number. If there is a description of "first" and "second", it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.

[0046] In the description of the present application, unless otherwise clearly defined, words such as "set", "installed", "connected", etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in the present application in combination with the specific content of the technical solution.

[0047] In the description of the present application, the descriptions with reference to terms such as "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0048] Refer to Figures 1 to 3, A laser annealing device according to an embodiment of the first aspect of the present application includes a box body 100, a stage 210, a laser device 230, a door opening and closing assembly 300, and a gas injection assembly 400. The box body 100 is provided with a feeding chamber 110 and a processing chamber 120. The feeding chamber 110 and the processing chamber 120 are communicated, and the feeding chamber 110 is provided with a feeding port 130. The stage 210 is located in the processing chamber 120, and the stage 210 is used to carry the product 220. The laser device 230 is used to generate laser to anneal the product 220 carried by the stage 210. The door opening and closing assembly 300 includes a first door panel 310 and a first driving member 320. The first driving member 320 is used to drive the first door panel 310 to move so that the first door panel 310 opens or closes the feeding port 130.

[0049] The gas injection assembly 400 includes a first gas injection member 410 and a second gas injection member 420. The first gas injection member 410 is used to inject a first gas into the feeding chamber 110, and the first gas is used to reduce the oxygen content in the feeding chamber 110. The second gas injection member 420 is used to inject a second gas into the processing chamber 120, and the second gas is used to reduce the oxygen content in the processing chamber 120.

[0050] The laser annealing device according to the embodiment of the present application has at least the following beneficial effects: Since the feeding chamber 110 is provided with the feeding port 130, the oxygen content in the feeding chamber 110 is likely to increase. By injecting the first gas into the feeding chamber 110 through the first gas injection member 410, the oxygen content in the feeding chamber 110 can be reduced; the processing chamber 120 is used for laser annealing of the product 220 (such as a wafer), so reducing the oxygen content in the processing chamber 120 is a direct requirement. By injecting the second gas into the processing chamber 120 through the second gas injection member 420, the oxygen content in the processing chamber 120 can be reduced; by reducing the oxygen content in the feeding chamber 110 and the processing chamber 120 simultaneously and specifically, it is beneficial to quickly reduce the oxygen content in the box body 100.

[0051] Specifically, in some embodiments, the first driving member 320 can drive the first door panel 310 to perform a linear motion in the front-rear direction or drive the first door panel 310 to perform a linear motion in the up-down direction. When the first door panel 310 covers the feeding port 130, the feeding port 130 is closed. In these embodiments, the first driving member 320 can be one of a cylinder, a linear motor, a motor-driven gear-rack mechanism, a motor-driven screw-nut mechanism, a motor-driven crank-slider mechanism, a motor-driven synchronous belt-synchronous pulley mechanism, and a motor-driven sprocket-chain mechanism.

[0052] In another embodiment, to make the first door panel 310 fit more closely to the box body 100 and have better sealing performance when the first door panel 310 closes the feeding port 130, the first driving member 320 is used to drive the first door panel 310 to move linearly in the up-and-down direction and to drive the first door panel 310 to move linearly in the left-and-right direction. When the first door panel 310 moves in the up-and-down direction, the overlapping area of the projections of the first door panel 310 and the feeding port 130 in the left-and-right direction will gradually increase or decrease. When the first door panel 310 moves in the left-and-right direction, the first door panel 310 will gradually approach or move away from the left side plate 150 of the box body 100. When the first door panel 310 approaches the left side plate 150 of the box body 100, the gap between the first door panel 310 and the left side plate 150 of the box body 100 will decrease, and the sealing performance will be better.

[0053] Specifically, referring to Figure 4 , the first driving member 320 may include two cylinders. One cylinder is used to drive the first door panel 310 to move linearly in the up-and-down direction, and the other cylinder is used to drive the first door panel 310 to move linearly in the left-and-right direction, and one cylinder is located on the output end of the other cylinder. In addition, any one of the cylinders can also be replaced by a linear motor, a motor-driven gear-rack mechanism, a motor-driven screw-nut mechanism, a motor-driven crank-slider mechanism, a motor-driven synchronous belt-synchronous pulley mechanism, or a motor-driven sprocket-chain mechanism.

[0054] It should be noted that, in order to anneal the product 220 carried by the stage 210, the processing head of the laser device 230 can be placed in the processing chamber 120, or the laser device 230 can also be completely placed outside the box body 100.

[0055] Specifically, referring to Figure 1 , the first gas injection member 410 is located in the feeding chamber 110. In another embodiment, the first gas injection member 410 can also be located outside the box body 100 and inject the first gas into the feeding chamber 110 through a joint penetrating the box body 100. The second gas injection member 420 is the same in this regard.

[0056] It should be noted that, in order to inject the first gas into the feeding chamber 110, a first air passage is usually provided in the first gas injection member 410. After the first air passage is communicated with the gas source providing the first gas, the first gas can be injected into the feeding chamber 110. The second gas injection member 420 is the same in this regard.

[0057] In some embodiments of the present application, the first gas includes an inert gas or nitrogen, and the second gas includes an inert gas or nitrogen.

[0058] After injecting the inert gas and nitrogen, oxygen can be discharged, and the inert gas and nitrogen are not likely to react with the product 220 (such as a wafer). Therefore, both the inert gas and nitrogen can be used as excellent protective gases, thereby ensuring the smooth progress of laser annealing.

[0059] In the improved solution of the above embodiment, the first gas and the second gas are the same.

[0060] By using the same gas, the gas supply systems of the first gas injection member 410 and the second gas injection member 420 are simpler, which is conducive to reducing the equipment cost of the laser annealing equipment.

[0061] Specifically, the gas injection assembly 400 further includes a gas supply joint 430. The gas supply joint 430 is fixed to the box body 100 and is used to communicate with a gas source. After two pipelines are led out from the gas supply joint 430, they can be respectively connected to the first gas injection member 410 and the second gas injection member 420 to realize simultaneous gas supply.

[0062] Refer to Figure 2 In some embodiments of the present application, the laser annealing equipment further includes an air curtain member 510. The air curtain member 510 is connected to the box body 100 and is used to inject a third gas to form an air curtain, and the air curtain is used to separate the air outside the feed inlet 130 from the gas inside the feed cavity 110.

[0063] By providing the air curtain member 510, when the feed inlet 130 is opened, it is beneficial to reduce the air entering the feed cavity 110 from the feed inlet 130, and thus it is beneficial to reduce the time for the feed cavity 110 to be filled with the first gas.

[0064] Specifically, the air curtain member 510 is provided with a second air duct and air outlet holes. The second air duct is used to communicate with a gas source that provides the third gas, the air outlet holes are communicated with the second air duct, and the cross-section of the air outlet holes is rectangular, so that the third gas ejected from the air outlet holes can form an air curtain.

[0065] In the improved solution of the above embodiment, there are two air curtain members 510, and both of the two air curtain members 510 are located outside the box body 100. One air curtain member 510 is located above the feed inlet 130, and the other air curtain member 510 is located below the feed inlet 130. The two air curtain members 510 blow air towards each other, and the flow rate of the air curtain is sufficient to ensure that the air curtain can stably separate the air outside the feed inlet 130 from the gas inside the feed cavity 110.

[0066] In the improved solution of the above embodiment, the third gas includes an inert gas or nitrogen.

[0067] If the air ejected by the air curtain member 510 is air, if the scattered air enters the feed cavity 110, it will increase the time for the feed cavity 110 to be filled with the first gas. Inert gases and nitrogen can be used as protective gases. When the air curtain member 510 ejects an inert gas or nitrogen, if the scattered inert gas or nitrogen enters the feed cavity 110, it helps to reduce the time for the feed cavity 110 to be filled with the first gas.

[0068] Reference Figure 1 In some embodiments of the present application, the laser annealing apparatus further includes an electrostatic eliminator 520. The electrostatic eliminator 520 is connected to the box body 100, and the electrostatic eliminator 520 is configured to eject an ionized gas to the product 220 carried by the stage 210.

[0069] By ejecting the ionized gas to the product 220, it is beneficial to eliminate the static electricity of the product 220, and further beneficial to reduce the probability of the product 220 being damaged by static electricity.

[0070] Specifically, the electrostatic eliminator 520 is located in the feeding chamber 110, and the electrostatic eliminator 520 is fixed to the box body 100 by a fastener.

[0071] Reference Figure 1 In some embodiments of the present application, the laser annealing apparatus further includes a gas pressure detection device 550. The gas pressure detection device 550 is connected to the box body 100, and the gas pressure detection device 550 is configured to detect the gas pressure in the processing chamber 120.

[0072] By providing the gas pressure detection device 550, the gas pressure in the processing chamber 120 can be monitored in real time, which is beneficial to determining whether the gas pressure in the processing chamber 120 is greater than the atmospheric pressure. When the gas pressure in the processing chamber 120 is greater than the atmospheric pressure, the air outside the box body 100 is not easily introduced into the processing chamber 120, which is beneficial to reducing the oxygen content in the processing chamber 120.

[0073] Specifically, the gas pressure detection device 550 can be a pressure gauge, a pressure sensor, a pressure detector or other devices.

[0074] Reference Figure 1 In some embodiments of the present application, the laser annealing apparatus further includes an oxygen concentration detection device 560. The oxygen concentration detection device 560 is connected to the box body 100, and the oxygen concentration detection device 560 is configured to detect the oxygen content in the processing chamber 120.

[0075] By providing the oxygen concentration detection device 560, the oxygen content in the processing chamber 120 can be detected in real time, which is beneficial to accurately determining whether the atmosphere in the processing chamber 120 is suitable for processing the product 220, and beneficial to determining whether the injection of the second gas needs to be stopped.

[0076] Specifically, the oxygen concentration detection device 560 can adopt an oxygen detector (such as an electrochemical sensor, a paramagnetic oxygen analyzer, an infrared absorption spectrometer), an oxygen detection tube, a magnetic mechanical oxygen analyzer or other devices.

[0077] Reference Figure 1, in some embodiments of the present application, the laser annealing device further includes a camera 530, which is connected to the box body 100 and is used to acquire an image of the product 220 carried by the stage 210.

[0078] By providing the camera 530, an image of the product 220 can be acquired in real time, which is beneficial to judging the annealing quality of the product 220.

[0079] Refer to Figure 1 , in an improved solution of the above embodiment, the laser annealing device further includes a lighting lamp 540, which is connected to the box body 100 and is used to emit visible light to at least one of the feeding chamber 110 and the processing chamber 120.

[0080] By illuminating at least one of the feeding chamber 110 and the processing chamber 120, lighting can be provided when maintaining the laser annealing device, making the maintenance more convenient.

[0081] Refer to Figure 1 and Figure 5 , the box body 100 is provided with an air suction hole 140, which is communicated with the processing chamber 120 and is used to be communicated with a negative pressure air source. The laser annealing device further includes a gate assembly 600, and the gate assembly 600 includes a second door panel 620 and a second driving member 610. The second driving member 610 is used to drive the second door panel 620 to move so as to open or close the air suction hole 140.

[0082] By providing the air suction hole 140, it is beneficial to accelerate the exchange of the second gas and air, and further beneficial to shorten the time for filling the second gas into the processing chamber 120. After the oxygen concentration in the processing chamber 120 drops to the required range, the air suction hole 140 can be closed.

[0083] Specifically, the specific structure of the second driving member 610 can refer to the first driving member 320, and will not be repeated here.

[0084] The above has described the embodiments of the present application in detail with reference to the drawings. However, the present application is not limited to the above embodiments, and various changes can be made without departing from the purpose of the present application within the scope of knowledge possessed by those of ordinary skill in the art. In addition, the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

Claims

1. Laser annealing equipment, characterized in that: include: The box body is provided with a feeding chamber and a processing chamber, the feeding chamber and the processing chamber are connected, and the feeding chamber is provided with a feeding port; A carrier, located in the processing chamber, and used for carrying the product; A laser device, used for generating laser light to anneal the product carried by the carrier; The opening and closing door assembly comprises a first door panel and a first driving member, wherein the first driving member is used to drive the first door panel to move so that the first door panel opens or closes the feed opening; The gas injection assembly includes a first gas injection piece and a second gas injection piece. The first gas injection piece injects a first gas into the feed chamber, and the first gas is used to reduce the oxygen content in the feed chamber; the second gas injection piece is used to inject a second gas into the processing chamber, and the second gas is used to reduce the oxygen content in the processing chamber.

2. The laser annealing equipment according to claim 1, characterized in that: The first gas includes an inert gas or nitrogen, and the second gas includes an inert gas or nitrogen.

3. The laser annealing equipment according to claim 2, characterized in that: The first gas and the second gas are the same.

4. The laser annealing equipment according to any one of claims 1 to 3, characterized in that: Also includes: An air curtain member is connected to the box body, and is used for spraying a third gas to form an air curtain, and the air curtain is used for separating the air outside the feed port from the gas in the feed cavity.

5. The laser annealing equipment according to claim 4, characterized in that: The third gas includes an inert gas or nitrogen.

6. The laser annealing equipment according to any one of claims 1 to 3, characterized in that: Also includes: An electrostatic eliminator is connected to the box, and is used for spraying ionized gas toward the product carried by the carrier.

7. The laser annealing equipment according to any one of claims 1 to 3, characterized in that: Also includes: An air pressure detection device is connected to the box body, and is used to detect the air pressure of the gas in the processing chamber.

8. The laser annealing equipment according to any one of claims 1 to 3, characterized in that: Also includes: An oxygen concentration detection device is connected to the box, and is used to detect the oxygen content in the processing chamber.

9. The laser annealing equipment according to any one of claims 1 to 3, characterized in that: Also includes: A camera is connected to the box, and the camera is used to obtain an image of the product carried by the platform.

10. The laser annealing equipment according to any one of claims 1 to 3, characterized in that: Also includes: An illumination lamp is connected to the box body, and is used for emitting visible light to at least one of the feeding chamber and the processing chamber.

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