Pulse heating device for chip eutectic

Abstract

The utility model relates to the technical field of chip eutectic packaging, in particular to a pulse heating device for chip eutectic, which comprises a base, a three-way gas pipe joint, a straight gas pipe joint, a working cavity and a thermocouple, and is characterized in that the lower surface of the base is fixedly connected with ground feet, the surface of the base is fixedly connected with a table board bracket, and the table board bracket is fixedly connected with the ground feet. The surface of the table board support is fixedly connected with an insulating pedestal. According to the utility model, the ceramic table board is connected with the graphite heating sheet to form a heating table board of which the temperature can be rapidly increased and decreased, the heating table board is fixed on the insulating pedestal through the electrode screw and the ceramic pressing sheet, the positive and negative electrodes of the graphite heating sheet are led out through the electrode seat, the gas circuit support is arranged on the back of the insulating pedestal, and two pagoda gas pipe joints are arranged on the gas circuit support. The vacuum pipeline and the nitrogen pipeline are led out, the vacuum pipeline arranged in the gas path support is communicated with the vacuum hole in the ceramic table top, and the nitrogen pipeline arranged in the gas path support is communicated with the nitrogen cavity in the ceramic table top.

Description

Technical Field

[0001] The utility model relates to the technical field of chip eutectic packaging, in particular to a pulse heating device for chip eutectic. Background Technique

[0002] The chip eutectic packaging process is to contact different metals or alloys with a semiconductor chip and heat them to make them melt together to form a eutectic point, and then cool and solidify to realize the connection between the semiconductor device and the packaging material.

[0003] The pulse heating device is an essential device in the chip eutectic process. It can make the chip and the material eutectically connected by heating, so as to improve the electrical performance, heat dissipation performance and packaging compactness of the device. However, when using the existing pulse heating device for chip eutectic, the process of realizing the heating tabletop generally adopts the method of sintering the heating paste on a ceramic sheet, with complex manufacturing processes, single tabletop shape and high cost. Content of the Utility Model

[0004] The purpose of the utility model is to provide a pulse heating device for chip eutectic, so as to solve the problem of complex manufacturing processes caused by the method of sintering the heating paste on a ceramic sheet in the pulse heating device for chip eutectic mentioned in the above background technique.

[0005] To achieve the above object, the utility model provides the following technical solution: a pulse heating device for chip eutectic, including a base, a three-way gas pipe joint, a straight gas pipe joint, a working cavity and a thermocouple. The lower surface of the base is fixedly connected with feet, the surface of the base is fixedly connected with a table bracket, the surface of the table bracket is fixedly connected with an insulating pedestal, the lower surface of the insulating pedestal is fixedly connected with an electrode base, the lower surface of the insulating pedestal is fixedly connected with a gas path support, the surface of the insulating pedestal is fixedly connected with a magnet, the surface of the magnet is magnetically connected with a protective cover, the surface of the base is fixedly connected with a through-hole guard plate, the surface of the through-hole guard plate is fixedly connected with a material tray, the surface of the through-hole guard plate is fixedly connected with a vacuum tray, the surface of the base is fixedly connected with a gas pipe pressing block, the surface of the vacuum tray is provided with a reflector, the surface of the protective cover is movably connected with a sliding cover, the surface of the protective cover is fixedly connected with a fixed clip, the surface of the protective cover is movably connected with a movable clip, the surface of the protective cover is provided with a clip movable hinge, the surface of the protective cover is provided with a clip handle, the surface of the protective cover is movably connected with a clip pitch adjustment screw, the surface of the insulating pedestal is fixedly connected with a ceramic tabletop, the surface of the ceramic tabletop is provided with vacuum holes, the surface of the insulating pedestal is threadedly sleeved with an electrode screw, the surface of the electrode screw penetrates and is connected with a ceramic pressing piece, the surface of the insulating pedestal is fixedly connected with a graphite heating sheet, the surface of the insulating pedestal is provided with a nitrogen cavity, and the surface of the gas path support is fixedly connected with a pagoda gas pipe joint.

[0006] Preferably, the three-way gas pipe joint is arranged below the vacuum tray, the straight gas pipe joint is arranged below the vacuum tray, and the protective cover is magnetically connected with the surface of the insulating pedestal through a magnet.

[0007] Preferably, the surface of the gas pipe pressing block is provided with multiple groups of round grooves, and the thermocouple penetrates and is connected with the surface of the gas pipe pressing block.

[0008] Preferably, the surface of the fixed clip is provided with a groove, the fixed clip is fixedly connected with the surface of the protective cover through a bolt, the movable clip is movably connected with the surface of the protective cover through a bolt, and the movable clip is movably connected with the surface of the clip movable hinge through a clip pitch adjustment screw.

[0009] Preferably, the vacuum pipeline built in the gas path support is connected in a through way with the vacuum holes, a nitrogen cavity is formed inside the insulating pedestal through the ceramic tabletop, and the nitrogen pipeline built in the gas path support is connected in a through way with the nitrogen cavity.

[0010] Preferably, the graphite heating sheet is in abutting connection with the surface of the ceramic pressing piece, the resistance of the graphite heating sheet is... ohms, both the electrode base and the electrode screw are made of gold-plated material, and the graphite heating sheet is fixedly connected with the surface of the insulating pedestal through the electrode screw.

[0011] Preferably, the pagoda air pipe connector is in two groups respectively connected to the vacuum pipe and the nitrogen pipe, the insulating base forms a working cavity through a protective cover, the thermocouple is fixedly connected to the surface of the vacuum pipe and the nitrogen pipe, and the thermocouple is connected to the surface of the air pipe pressing block through.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] 1. By connecting the ceramic table and the graphite heating plate, a heating table whose temperature can be quickly raised or lowered is formed, and then it is fixed on the insulating table through electrode screws and ceramic pressing sheets, and the positive and negative electrodes of the graphite heating plate are led out by the electrode seat. An air path support is installed on the back of the insulating table, and two pagoda air pipe joints are installed on the air path support to lead out the vacuum pipe and the nitrogen pipe. The vacuum pipe built into the air path support is connected to the vacuum hole on the ceramic table, and the nitrogen pipe built into the air path support is connected to the nitrogen cavity on the ceramic table, so as to heat the ceramic table. The pulse heating device cooperates with the pulse heating controller to achieve a heating and cooling rate of 30℃ / s, which meets most application scenarios and achieves fast and convenient heating of the chip. The protective cover can be quickly removed through the connection between the protective cover and the magnet, so as to simplify the complex process.

[0014] 2. The chip can be clamped by connecting the fixed clamp and the movable clamp, and it can be firmly clamped when processing the chip. Then, the connection between the clamp movable hinge and the clamp pitch adjustment top screw is used to adjust the distance between the movable clamp and the ceramic table, and the sliding cover is used to control the size of the window of the working chamber, thereby controlling the nitrogen volatilization area. After the processing is completed, the clamp handle and the clamp movable hinge can be connected, and the clamp movable hinge can be pried with the clamp handle to drive the movable clamp to loosen the clamped chip, thereby achieving the overall effect of facilitating the control of the chip during the processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a front view stereoscopic schematic diagram of the structure of the utility model;

[0016] Figure 2 It is a bottom-up stereoscopic schematic diagram of the structure of the utility model;

[0017] Figure 3 It is a schematic diagram of a three-dimensional partial cross-section of the structure of the through-hole guard plate of the utility model;

[0018] Figure 4 It is a three-dimensional schematic diagram of the structure of the insulating pedestal of the utility model;

[0019] Figure 5 It is a schematic diagram of a three-dimensional partial cross-section of the structure of the insulating pedestal of the utility model;

[0020] Figure 6 This is a three-dimensional schematic diagram of the structure of the base of the present utility model.

[0021] In the figure: 1. Base; 2. Anchor feet; 3. Tabletop bracket; 4. Electrode holder; 5. Insulating pedestal; 6. Air duct support; 7. Protective cover; 8. Material tray; 9. Vacuum tray; 10. Three-way gas pipe joint; 11. Straight gas pipe joint; 12. Gas pipe clamp; 13. Reflector; 14. Slide cover; 15. Fixed clamping piece; 16. Movable clamping piece; 17. Clamping piece movable hinge; 18. Clamping piece handle; 19. Clamping piece pitch adjustment setscrew; 20. Ceramic tabletop; 21. Vacuum hole; 22. Ceramic pressing piece; 23. Graphite heating sheet; 24. Electrode screw; 25. Nitrogen cavity; 26. Magnet; 27. Through-hole guard plate; 28. Tower-shaped gas pipe joint; 29. Working cavity; 30. Thermocouple. Specific embodiments

[0022] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0023] Please refer to Figure 1-6 , an embodiment provided by the present utility model:

[0024] A pulsed heating device for chip eutectic, comprising a base 1, a three-way gas pipe joint 10, a straight gas pipe joint 11, a working cavity 29 and a thermocouple 30. The lower surface of the base 1 is fixedly connected with a floor foot 2 for supporting the base 1. The surface of the base 1 is fixedly connected with a table support 3 for supporting an insulating pedestal 5. The surface of the table support 3 is fixedly connected with an insulating pedestal 5 for heating a chip placed above a ceramic tabletop 20. The lower surface of the insulating pedestal 5 is fixedly connected with an electrode base 4 for forming positive and negative electrodes. The lower surface of the insulating pedestal 5 is fixedly connected with a gas path bracket 6 for connecting a vacuum pipeline and a nitrogen pipeline. The surface of the insulating pedestal 5 is fixedly connected with a magnet 26 for adsorbing a protective cover 7. The surface of the magnet 26 is magnetically connected with a protective cover 7 for protecting the chip during the heating process. The surface of the base 1 is fixedly connected with a through-hole guard plate 27 for protecting the pipeline placed above the base 1. The surface of the through-hole guard plate 27 is fixedly connected with a material tray 8 for holding materials. The surface of the through-hole guard plate 27 is fixedly connected with a vacuum tray 9 for setting the chip. The surface of the base 1 is fixedly connected with a gas pipe pressing block 12 for pressing down the pipeline for integrated processing to avoid pipeline scattering. The surface of the vacuum tray 9 is provided with a reflector 13 for emitting light. The surface of the protective cover 7 is movably connected with a sliding cover 14 for controlling the area where nitrogen acts. The surface of the protective cover 7 is fixedly connected with a fixed clip 15 for clamping the chip. The surface of the protective cover 7 is movably connected with a movable clip 16 for clamping or loosening the chip. The surface of the protective cover 7 is provided with a clip movable hinge 17 which can be used to pry with a clip handle 18 to change the distance between the movable clip 16 and the ceramic tabletop 20. The surface of the protective cover 7 is provided with a clip handle 18 for prying the clip movable hinge 17. The surface of the protective cover 7 is movably connected with a clip pitch adjustment screw 19 for pitch adjustment of the movable clip 16. The surface of the insulating pedestal 5 is fixedly connected with a ceramic tabletop 20 for heating and for placing the chip. The surface of the ceramic tabletop 20 is provided with a vacuum hole 21 for pipeline ventilation. The surface of the insulating pedestal 5 is threadedly sleeved with an electrode screw 24 for clamping and fixing a graphite heating sheet 23. The surface of the electrode screw 24 is penetrated and connected with a ceramic pressing sheet 22 for fixing the graphite heating sheet 23. The surface of the insulating pedestal 5 is fixedly connected with a graphite heating sheet 23 for cooperating with the ceramic tabletop 20 to form a heating tabletop. The surface of the insulating pedestal 5 is provided with a nitrogen cavity 25 for gas reaction. The surface of the gas path bracket 6 is fixedly connected with a bellows gas pipe joint 28 for connecting the pipeline.

[0025] Further, the three-way gas pipe joint 10 is arranged below the vacuum tray 9 for connecting the pipeline paths. The straight gas pipe joint 11 is arranged below the vacuum tray 9 for connecting the pipeline. The protective cover 7 is magnetically connected with the surface of the insulating pedestal 5 through the magnet 26. The magnetic connection can facilitate the quick disassembly and installation of the protective cover 7, providing convenience for the use of the pulsed heating device.

[0026] Furthermore, multiple groups of circular grooves are provided on the surface of the trachea pressing block 12 for integrating multiple groups of pipes, integrating all the ventilation holes of the pipes together, and at the same time depressing the pipes to prevent them from shifting during ventilation. The thermocouple 30 is connected through the surface of the trachea pressing block 12 for heating the vacuum pipe and the nitrogen pipe.

[0027] Furthermore, a channel is provided on the surface of the fixed clamp piece 15 for bolt fixation. The fixed clamp piece 15 is fixedly connected to the surface of the protective cover 7 through bolts to ensure the clamping of one side of the chip. The movable clamp piece 16 is movably connected to the surface of the protective cover 7 through bolts, and can clamp or loosen the chip placed on the ceramic table 20. The movable clamp piece 16 is movably connected to the surface of the clamp piece pitching adjustment screw 19 and the clamp piece movable hinge 17, and is used for the clamp piece handle 18 to pry the clamp piece movable hinge 17, thereby changing the position of the movable clamp piece 16 and the distance between the movable clamp piece 16 and the ceramic table 20.

[0028] Furthermore, the vacuum pipe built in the gas path support 6 is connected to the vacuum hole 21 in a through - way manner. A nitrogen cavity 25 is formed inside the insulating pedestal 5 through the ceramic table 20. The formed nitrogen cavity 25 provides space for the reaction of the gas to ensure the normal heating of the chip. The nitrogen pipe built in the gas path support 6 is connected to the nitrogen cavity 25 in a through - way manner for transporting nitrogen into the insulating pedestal 5 for use to cool the heated chip.

[0029] Furthermore, the graphite heating sheet 23 is in abutting connection with the surface of the ceramic pressing sheet 22 for cooperating with the ceramic table 20 to form a heating table. The resistance of the graphite heating sheet 23 is 0.5 ohm. Both the electrode seat 4 and the electrode screw 24 are made of gold - plated material. The graphite heating sheet 23 is fixedly connected to the surface of the insulating pedestal 5 through the electrode screw 24, firmly fixing the graphite heating sheet 23 under the ceramic table 20, and quickly heating the ceramic table 20 through conduction.

[0030] Furthermore, the tapered trachea connectors 28 are provided in two groups and are respectively connected to the vacuum pipe and the nitrogen pipe. The insulating pedestal 5 forms a working cavity 29 through the protective cover 7. The working cavity 29 is used for the working area. The thermocouple 30 is fixedly connected to the surfaces of the vacuum pipe and the nitrogen pipe for heating the vacuum pipe and the nitrogen pipe. The thermocouple 30 is connected through the surface of the trachea pressing block 12 for ventilation to assist in heating.

[0031] Working principle: When using the pulse heating device for chip eutectic, first, the protective cover 7 can be removed. The chip can be placed above the ceramic tabletop 20, with one side of the chip abutted against the fixed clamping piece 15. Then, move the movable clamping piece 16 to clamp the chip, and then put the protective cover 7 back. The protective cover 7 will automatically adsorb on the surface of the insulating pedestal 5. Subsequently, the graphite heating sheet 23 is energized through the electrode base 4 to heat the ceramic tabletop 20 and heat the chip. After the heating is completed, nitrogen is conveyed through the nitrogen pipeline to cool the heated chip. The area of nitrogen release can be controlled by sliding the sliding cover 14. Then, pry open the clamping piece movable hinge 17 through the clamping piece handle 18 to tilt up the movable clamping piece 16, so that the front end of the movable clamping piece 16 is far away from the surface of the ceramic tabletop 20, and the clamping of the chip can be released to remove the chip.

[0032] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above exemplary embodiments, and the present utility model can be implemented in other specific forms without departing from the spirit or basic characteristics of the present utility model. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present utility model. Any reference signs in the claims should not be regarded as limiting the claimed rights.

Claims

1. A pulse heating device for chip eutectic, comprising a base (1), a three-way air pipe joint (10), a straight air pipe joint (11), a working chamber (29) and a thermocouple (30), characterized in that: The lower surface of the base (1) is fixedly connected to a foot (2); the surface of the base (1) is fixedly connected to a tabletop bracket (3); the surface of the tabletop bracket (3) is fixedly connected to an insulating seat (5); the lower surface of the insulating seat (5) is fixedly connected to an electrode seat (4); the lower surface of the insulating seat (5) is fixedly connected to an air path support (6); the surface of the insulating seat (5) is fixedly connected to a magnet (26); the surface of the magnet (26) is magnetically connected to a protective cover (7); the surface of the base (1) is fixedly connected to a through-hole guard plate (27); the surface of the through-hole guard plate (27) is fixedly connected to a material tray (8); the surface of the through-hole guard plate (27) is fixedly connected to a vacuum tray (9); the surface of the base (1) is fixedly connected to an air pipe pressing block (12); the surface of the vacuum tray (9) is provided with a reflector (13); the surface of the protective cover (7) is movably connected to a sliding cover (14) ), the surface of the protective cover (7) is fixedly connected with a fixed clip (15), the surface of the protective cover (7) is movably connected with a movable clip (16), the surface of the protective cover (7) is provided with a clip movable hinge (17), the surface of the protective cover (7) is provided with a clip handle (18), the surface of the protective cover (7) is movably connected with a clip pitch adjustment top screw (19), the surface of the insulating pedestal (5) is fixedly connected with a ceramic table top (20), the surface of the ceramic table top (20) is provided with a vacuum hole (21), the surface of the insulating pedestal (5) is connected with an electrode screw (24) through a threaded sleeve, the surface of the electrode screw (24) is connected with a ceramic pressing plate (22), the surface of the insulating pedestal (5) is fixedly connected with a graphite heating plate (23), the surface of the insulating pedestal (5) is provided with a nitrogen cavity (25), and the surface of the gas path support (6) is fixedly connected with a pagoda gas pipe joint (28).

2. The pulse heating device for chip eutectic according to claim 1, characterized in that: The three-way air pipe joint (10) is arranged below the vacuum tray (9), the straight air pipe joint (11) is arranged below the vacuum tray (9), and the protective cover (7) is connected to the surface of the insulating pedestal (5) by magnetic attraction via a magnet (26).

3. The pulse heating device for chip eutectic according to claim 1, characterized in that: The surface of the air pipe pressing block (12) is provided with a plurality of groups of circular grooves, and the thermocouple (30) penetrates and is connected to the surface of the air pipe pressing block (12).

4. The pulse heating device for chip eutectic according to claim 1, characterized in that: A groove is provided on the surface of the fixed clamp (15); the fixed clamp (15) is fixedly connected to the surface of the protective cover (7) via bolts; the movable clamp (16) is movably connected to the surface of the protective cover (7) via bolts; and the movable clamp (16) is movably connected to the surface of the clamp pitch adjustment top screw (19) and the clamp movable hinge (17).

5. The pulse heating device for chip eutectic according to claim 1, characterized in that: The vacuum pipeline built into the gas path support (6) is connected to the vacuum hole (21); a nitrogen cavity (25) is formed inside the insulating pedestal (5) through the ceramic table top (20); and the nitrogen pipeline built into the gas path support (6) is connected to the nitrogen cavity (25).

6. The pulse heating device for chip eutectic according to claim 1, characterized in that: The graphite heating sheet (23) is abutted against the surface of the ceramic pressing sheet (22), the resistance of the graphite heating sheet (23) is 0.5 ohms, the electrode seat (4) and the electrode screw (24) are both made of gold-plated material, and the graphite heating sheet (23) is fixedly connected to the surface of the insulating base (5) via the electrode screw (24).

7. The pulse heating device for chip eutectic according to claim 1, characterized in that: The pagoda air pipe joints (28) are in two groups, connected to the vacuum pipe and the nitrogen pipe respectively; the insulating pedestal (5) is formed with a working cavity (29) through a protective cover (7); the thermocouple (30) is fixedly connected to the surface of the vacuum pipe and the nitrogen pipe; the thermocouple (30) is connected to the surface of the air pipe pressing block (12) through the thermocouple (30).

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