Resonator and temperature sensor integrated chip

Abstract

The utility model discloses a resonator and temperature sensor integrated chip. The resonator and temperature sensor integrated chip comprises a resonator, a control circuit, a frequency adjustment circuit, a temperature sensor, a frequency output port and a temperature output port, the resonator is electrically connected with the control circuit and is maintained by the control circuit to vibrate at an inherent frequency, so that the control circuit outputs a corresponding initial frequency signal; the frequency adjusting circuit is electrically connected with the control circuit and is used for receiving an initial frequency signal from the control circuit and processing the initial frequency signal to output a target frequency signal; the temperature sensor is used for acquiring the environment temperature; the frequency output port is connected with the frequency adjusting circuit so as to output the target frequency signal; the temperature output port is connected with the temperature sensor so as to output the environment temperature. According to the invention, multiple kinds of signals such as target frequency signals and environment temperature signals can be output, internal circuits of the chip can be utilized to a greater extent, and the functions of the chip are effectively enriched.

Description

Technical Field

[0001] This application relates to the field of circuit technologies, and particularly to a resonator and temperature sensor integrated chip. Background Art

[0002] As one of the important units of an electronic system, an oscillator has a very wide range of applications. The frequency stability, clock jitter, and power consumption of a crystal oscillator are the main parameters for measuring the performance of a crystal oscillator. As an alternative technology to crystal oscillators, Micro-Electro-Mechanical System (MEMS) oscillators have the advantages of small size, strong shock resistance and impact resistance, and no startup problems; and MEMS oscillators adopt the standard all-silicon processing process in modern integrated circuit manufacturing, and the process consistency and reliability are greatly improved.

[0003] As one of the important units of an electronic system, an MEMS oscillator chip has a very wide range of applications. However, the output function of existing MEMS oscillator chips is too single, such as only realizing frequency signal output, and it is difficult to meet the increasingly complex functional requirements of circuits. Utility Model Content

[0004] In view of this, this application provides a resonator and temperature sensor integrated chip, which can output multiple types of signals such as a target frequency signal and ambient temperature, can make greater use of the internal circuit of the chip, and effectively enrich the functions of the chip.

[0005] This application provides a resonator and temperature sensor integrated chip, and the resonator and temperature sensor integrated chip includes a resonator, a control circuit, a frequency adjustment circuit, a temperature sensor, a frequency output port, and a temperature output port;

[0006] The resonator is electrically connected to the control circuit, and is used to be maintained by the control circuit to vibrate at its natural frequency, so that the control circuit outputs a corresponding initial frequency signal;

[0007] The frequency adjustment circuit is electrically connected to the control circuit, and is used to receive the initial frequency signal from the control circuit for processing to output a target frequency signal;

[0008] The temperature sensor is used to obtain the ambient temperature;

[0009] The frequency output port is connected to the frequency adjustment circuit to output the target frequency signal;

[0010] The temperature output port is connected to the temperature sensor to output the ambient temperature.

[0011] Optionally, the resonator and temperature sensor integrated chip further includes a temperature compensation circuit; the temperature compensation circuit is connected between the temperature sensor and the frequency adjustment circuit; the temperature compensation circuit is configured to perform fitting processing on the ambient temperature to obtain a temperature fitting signal, and transmit the temperature fitting signal to the frequency adjustment circuit, and the frequency adjustment circuit is configured to obtain the temperature fitting signal to output a target frequency signal with a desired frequency.

[0012] Optionally, the temperature compensation circuit is a polynomial fitting circuit; the polynomial fitting circuit is configured to perform polynomial fitting on the ambient temperature to obtain the temperature fitting signal.

[0013] Optionally, the resonator and temperature sensor integrated chip is further provided with a control port; the control port is connected to the control end of the temperature compensation circuit and is used to control the working state of the temperature compensation circuit.

[0014] Optionally, when the control port receives a high level, the temperature compensation circuit works normally, and when it receives a low level, the temperature compensation circuit pauses working.

[0015] Optionally, the temperature sensor adopts a digital temperature sensor; the digital temperature sensor includes a first voltage-controlled oscillator, a first phase detector, and a counter; the first voltage-controlled oscillator is configured to receive an input voltage to generate a clock signal that varies with the input voltage, and the input voltage varies with temperature; the first phase detector is configured to convert the clock signal into a pulse signal after the clock signal reaches a preset frequency; the counter is configured to count the frequency of the clock signal and output a data coding value corresponding to the count value when detecting that the level state of the pulse signal is a preset level, and the data coding value is used to characterize the ambient temperature.

[0016] Optionally, the frequency adjustment circuit includes a fractional-N phase-locked loop; the fractional-N phase-locked loop is configured to receive the initial frequency signal, and use the initial frequency signal as a reference signal to perform frequency division and modulation on an internal clock signal to output a target frequency signal with a desired frequency.

[0017] Optionally, the fractional-N phase-locked loop is provided with a frequency control terminal; the frequency control terminal is electrically connected to the output terminal of the temperature compensation circuit and is used to access the temperature fitting signal output by the temperature compensation circuit, adjust its own frequency division ratio, and thus adjust the frequency of the output signal to obtain a target frequency signal with a desired frequency.

[0018] Optionally, the frequency adjustment circuit includes a fractional-output frequency divider; the fractional-output frequency divider is configured to receive the initial frequency signal and perform frequency division on the initial frequency signal to output a target frequency signal with a desired frequency.

[0019] Optionally, the frequency adjustment circuit includes a multi - modulus frequency divider and a Σ - Δ modulator; the multi - modulus frequency divider is configured to receive the initial frequency signal, determine a frequency division ratio according to the modulation signal output by the Σ - Δ modulator, and divide the initial frequency signal according to the frequency division ratio to obtain a target frequency signal; an input end of the Σ - Δ modulator is electrically connected to an output end of the multi - modulus frequency divider, and an output end is connected to an input end of the multi - modulus frequency divider, and is configured to receive the frequency signal output by the multi - modulus frequency divider, modulate the frequency signal to obtain a modulation signal, and input the modulation signal to the multi - modulus frequency divider.

[0020] The resonator and temperature sensor integrated chip provided in this application is provided with a frequency output port for outputting a target frequency signal and a temperature output port for outputting the ambient temperature, which can make better use of the internal circuits of the chip to a greater extent, effectively enrich the functions of the chip, and can also clearly inform the user of the ambient temperature of the current resonator and temperature sensor integrated chip, avoiding function waste. Description of the Drawings

[0021] In order to more clearly illustrate the technical solutions in the embodiments of this application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of this application. For those skilled in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0022] Figure 1 and Figure 2 shows the structural schematic diagrams of the resonator and temperature sensor integrated chips in different embodiments of this application;

[0023] Figure 3 shows the structural schematic diagram of the digital temperature sensor in an embodiment of this application;

[0024] Figure 4 and Figure 5 shows the structural schematic diagrams of the resonator and temperature sensor integrated chips in other embodiments of this application. Detailed Embodiments

[0025] The following will clearly and completely describe the technical solutions in the embodiments of this application with reference to the drawings. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of this application. Without conflict, the following various embodiments and their technical features can be combined with each other.

[0026] The present application provides a resonator and temperature sensor integrated chip, which includes a MEMS Die (MEMS bare die) and an IC Die (IC bare die), and can be formed by packaging the two. Refer to Figure 1 , a resonator 100 is provided on the MEMS Die, and the resonator 100 is a MEMS resonator. A control circuit 200, a frequency adjustment circuit 300, and a temperature sensor (which can also be denoted as Tsensor) 400 are provided on the IC Die. Of course, it is not limited to this. Some circuit components on the IC Die, such as capacitors and resistors, can also be provided on the MEMS Die to make full use of the space on the MEMS Die. In addition, the resonator and temperature sensor integrated chip is also provided with a frequency output port F and a temperature output port T.

[0027] The above-mentioned MEMS Die and IC Die are electrically connected. Specifically, the resonator 100 and the control circuit 200 are electrically connected, and the resonator 100 is configured to be maintained by the control circuit 200 to vibrate at its natural frequency, and the control circuit 200 can output a corresponding initial frequency signal. The frequency adjustment circuit 300 is electrically connected to the control circuit 200, and the frequency adjustment circuit 300 receives the initial frequency signal from the control circuit 200 for processing to output a target frequency signal. The temperature sensor 400 can be used to sense the surrounding ambient temperature to obtain temperature information. The frequency output port F is connected to the frequency adjustment circuit 300 to output the target frequency signal. The temperature output port T is connected to the temperature sensor 400 to output the ambient temperature.

[0028] The above-mentioned resonator and temperature sensor integrated chip is provided with a frequency output port F for outputting the target frequency signal and a temperature output port T for outputting the ambient temperature, which can make greater use of the internal circuits of the chip, effectively enrich the functions of the chip, and clearly inform the user of the ambient temperature of the current resonator and temperature sensor integrated chip, avoiding function waste. Among them, the control circuit 200 can adopt an existing resonator starting circuit, such as a Pierce circuit, and the present application does not have too many restrictions.

[0029] In practical applications, the oscillation frequency of the resonator will change with the change of the ambient temperature, thereby affecting the frequency of the output oscillation signal. In view of this situation, in some embodiments, the above-mentioned resonator and temperature sensor integrated chip further includes a temperature compensation circuit (which can also be denoted as Polyfit) 500, such as Figure 2 shown, the temperature compensation circuit 500 is connected between the temperature sensor 400 and the frequency adjustment circuit 300. The temperature compensation circuit 500 and the temperature sensor 400 can form a temperature compensation module, and the temperature compensation module can sense the surrounding ambient temperature, appropriately transform the temperature information, and then adjust the frequency adjustment circuit 300 to achieve the effect of stable output frequency.

[0030] The above temperature sensor 400 can be used to sense the ambient temperature to obtain temperature information. Among them, the temperature sensor 400 can select a conventional temperature sensor to sense the ambient temperature, such as a thermistor or a thermosensitive capacitor, etc. Of course, it is not limited to this. For example, the temperature sensor 400 can also select a digital temperature sensor.

[0031] In some examples, referring to Figure 3 , the digital temperature sensor may include a first voltage-controlled oscillator 411, a first phase detector 412, and a counter 413. Specifically, the first voltage-controlled oscillator 411 is used to receive the input voltage Vctrl to generate a clock signal that varies with the input voltage Vctrl; wherein the input voltage Vctrl varies with temperature, and it can be obtained by a voltage acquisition module (not shown in the figure) provided at the input end of the first voltage-controlled oscillator 411. The voltage acquisition module is used to provide a voltage that varies with temperature. For example, the voltage acquisition module can be implemented by a device that varies with temperature such as a thermosensitive capacitor. The first phase detector 412 is used to convert the clock signal into a pulse signal after detecting that the clock signal generated by the first voltage-controlled oscillator 411 reaches a preset frequency. The counter 413 is used to count the frequency of the clock signal output by the first voltage-controlled oscillator 411 when detecting that the level state of the pulse signal is a preset level, and output a data coding value corresponding to the count value. The data coding value is used to represent the temperature value (i.e., the ambient temperature).

[0032] Optionally, the above digital temperature sensor may further include an input circuit (not shown in the figure). The input circuit can be provided between the voltage acquisition module and the first voltage-controlled oscillator 411 and connected to an input end of the first voltage-controlled oscillator 411. The input voltage Vctrl can be output to the first voltage-controlled oscillator 411 through the input circuit. Optionally, the input circuit includes a charge-discharge capacitor. By sampling the input voltage Vctrl through the charge-discharge capacitor and outputting the sampled voltage to the first voltage-controlled oscillator 411, the transmission of the input voltage Vctrl can be realized.

[0033] The above temperature compensation circuit 500 is used to receive temperature information such as ambient temperature for fitting processing to obtain a temperature fitting signal, and transmit the temperature fitting signal to the frequency adjustment circuit 300 to compensate for the influence of the ambient temperature on the resonator 100, so that the frequency adjustment circuit 300 outputs a target frequency signal with a desired frequency. As described above, the resonator and temperature sensor integrated chip is provided with a temperature output port T for outputting the ambient temperature sensed by the temperature sensor 400, so as to make better use of the internal circuit of the chip to a greater extent and enrich the functions of the resonator and temperature sensor integrated chip.

[0034] In some examples, the above temperature compensation circuit 500 can be a polynomial fitting circuit. After receiving temperature information such as the ambient temperature, the temperature compensation circuit 500 performs polynomial fitting calculations on the temperature information to obtain a temperature fitting signal corresponding to the temperature information. The relevant values used in the fitting calculations in the polynomial fitting circuit (such as the parameters of each device, etc.) can be preset; for example, the integrated chip of the resonator and temperature sensor is placed in a space where the temperature can be determined, and the temperature is gradually adjusted to obtain the frequencies of multiple actual output signals, and the temperature corresponding to each frequency is recorded, obtaining multiple groups of frequencies and temperatures, as well as the target frequencies corresponding to each group of frequencies and temperatures; the relevant values used in the fitting calculations in the polynomial fitting circuit are obtained by fitting through multiple groups of corresponding frequencies and temperatures, so that the polynomial fitting circuit can use these values to perform polynomial fitting on the temperature information to obtain a temperature fitting signal capable of performing temperature compensation. Inputting this temperature fitting signal into the frequency adjustment circuit 300 can enable the frequency adjustment circuit 300 to perform temperature compensation based on the initial frequency signal and output a target frequency signal with the desired frequency. Optionally, the polynomial fitting circuit can be implemented by a digital circuit.

[0035] In addition, in some examples, referring to Figure 2 , the above integrated chip of the resonator and temperature sensor is also provided with a control port K. The control port K is connected to the control end of the temperature compensation circuit 500 and is used to control the working state of the temperature compensation circuit 500. For example, if a high level 1 is input to the control port K, the temperature compensation circuit 500 can operate normally to obtain temperature information for fitting processing, input the temperature fitting signal into the frequency adjustment circuit 300, and enable the frequency adjustment circuit 300 to perform temperature compensation to reduce the temperature impact and improve the stability of the output frequency; if a low level 0 is input to the control port K, the temperature compensation circuit 500 is turned off. At this time, the temperature compensation circuit 500 pauses working and does not perform fitting processing on the temperature information, reducing the circuit power consumption; or a low level 0 is input to the control port K. At this time, the corresponding coefficients of the temperature compensation circuit 500 can be adjusted so that the temperature compensation circuit 500 does not affect the frequency processing work of the frequency adjustment circuit 300, such as not affecting the frequency division ratio of the internal devices of the frequency adjustment circuit 300.

[0036] Optionally, the user can determine the signal input to the control port K according to the temperature information output by the temperature output port T, so as to determine whether the current resonator and temperature sensor integrated chip perform temperature compensation work. Optionally, the above control circuit 200 can also be electrically connected to the temperature output port T, the temperature compensation circuit 500, and the control port K respectively, so as to obtain the ambient temperature output by the temperature output port T, and determine the signal input to the control port K according to the ambient temperature. For example, when the ambient temperature is within a range where the oscillation frequency of the resonator 100 is less affected, a low level 0 is input to the control port K, and when the ambient temperature is within a range where the oscillation frequency of the resonator 100 is more affected, a high level 1 is input to the control port K.

[0037] In some embodiments, referring to Figure 4 , the frequency adjustment circuit 300 may include a fractional-N phase locked loop (FNPLL) 310. The fractional-N phase locked loop 310 includes a second phase detector (PD), a loop filter (LPF), a second voltage controlled oscillator (VCO), and a programmable frequency divider (such as an N / N+1 frequency divider), etc. The fractional-N phase locked loop 310 can receive an initial frequency signal and use the initial frequency signal as a reference signal to divide and modulate an internal clock signal to output a target frequency signal with a desired frequency. It can be understood that the fractional-N phase locked loop 310 is provided with a frequency control terminal, and this frequency control terminal is used to access an external control signal (such as the temperature fitting signal output by the temperature compensation circuit 500), and adjust its own frequency division ratio through this external control signal, so as to adjust the frequency of the output signal to obtain a target frequency signal with a desired frequency.

[0038] Specifically, referring to Figure 4 , the temperature compensation circuit 500 can be electrically connected to the fractional-N phase locked loop 310. For example, the temperature compensation circuit 500 can be electrically connected to the frequency control terminal of the fractional-N phase locked loop 310. After the temperature compensation circuit 500 receives the ambient temperature and performs fitting processing to obtain a temperature fitting signal, it inputs the temperature fitting signal to the fractional-N phase locked loop 310. The temperature fitting signal can be used to adjust the frequency division ratio of the fractional divider in the fractional-N phase locked loop 310, so as to implement temperature compensation for the oscillation frequency of the resonator 100 changed due to temperature change, thereby being able to suppress the adverse effect of temperature on the frequency of the output target frequency signal, and making the target frequency signal more stable.

[0039] In some embodiments, referring to Figure 5, the frequency adjustment circuit 300 includes a fractional output divider (FOD) 320; the fractional output divider 320 is configured to receive an initial frequency signal and divide the initial frequency signal to output a target frequency signal with a desired frequency. It can be understood that the division ratio of the fractional output divider 320 is adjusted to adjust the frequency of the output signal to obtain a target frequency signal with a desired frequency. Optionally, the fractional output divider 320 is provided with a frequency control terminal, which can be used to access an external control signal (such as the temperature fitting signal output by the temperature compensation circuit 500), and the division ratio of itself is adjusted by the external control signal, so as to adjust the frequency of the output signal to obtain a target frequency signal with a desired frequency.

[0040] Of course, it is not limited thereto. In other embodiments, the frequency adjustment circuit 300 may also include a multi-modulus divider (MMD) and a sigma-delta modulator (SDM).

[0041] The multi-modulus divider is configured to receive an initial frequency signal, determine a division ratio according to the modulation signal output by the sigma-delta modulator, and divide the initial frequency signal according to the division ratio to obtain a target frequency signal. The initial division ratio of the multi-modulus divider may be defaulted to a fixed division ratio and is matched with the frequency of the initial frequency signal. The multi-modulus divider in this embodiment may select a conventional multi-modulus divider, for example, formed by connecting multiple 2 / 3 divisible dividers, which is not specifically limited here.

[0042] One input end of the sigma-delta modulator may be connected to the output end of the multi-modulus divider to receive the frequency signal output by the multi-modulus divider and modulate the frequency signal to obtain a modulation signal. The output end of the sigma-delta modulator may be connected to an input end of the multi-modulus divider to input the modulation signal into the multi-modulus divider. The above modulation signal is used to adjust the division ratio of the multi-modulus divider, and the frequency signal generated by the multi-modulus divider is adjusted in real time according to the division ratio, so that the frequency of the output target frequency signal can be more stable.

[0043] The above resonator and temperature sensor integrated chip is further provided with a temperature output port T in addition to the frequency output port F, which is used to output the temperature so as to clearly inform the user of the ambient temperature of the current resonator and temperature sensor integrated chip, and can make greater use of the internal circuit of the chip to avoid waste of functions. The above resonator and temperature sensor integrated chip further includes a temperature compensation circuit 500, which can adjust the frequency adjustment circuit 300 after appropriately transforming the ambient temperature to provide the stability of the output target frequency signal. In addition, the resonator and temperature sensor integrated chip is further provided with a control port K, and the control port K is connected to the control end of the temperature compensation circuit 500 and is used to control the working state of the temperature compensation circuit 500, which can reduce the power consumption of controlling the temperature compensation circuit 500.

[0044] Although the present application has been shown and described with respect to one or more implementations, equivalent variations and modifications will occur to those skilled in the art based on a reading and understanding of this specification and the drawings. The present application includes all such modifications and variations and is limited only by the scope of the appended claims. In particular, with respect to the various functions performed by the above components, the terms used to describe such components are intended to correspond to any component (unless otherwise indicated) that performs the specified function of the component (i.e., it is functionally equivalent), even if it is not structurally equivalent to the disclosed structure that performs the function in the exemplary implementations of the present specification shown herein.

[0045] That is, the above is only an embodiment of the present application, and thus does not limit the patent scope of the present application. Any equivalent structural or equivalent process transformation made by using the content of the specification and drawings of the present application, such as the mutual combination of technical features between embodiments, or direct or indirect application in other related technical fields, shall be equally included in the patent protection scope of the present application.

[0046] In addition, for structural elements with the same or similar characteristics, the present application may use the same or different reference numerals for identification. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more features. In the description of the present application, "a plurality" means two or more unless otherwise specifically defined.

[0047] In this application, the term "exemplary" is used to mean "serving as an example, instance, or illustration". Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or superior to other embodiments. The foregoing description is provided to enable any person skilled in the art to make and use this application. In the foregoing description, various details are set forth for purposes of explanation. It will be understood by those of ordinary skill in the art that the application may be practiced without these specific details. In other instances, well-known structures and processes are not set forth in detail to avoid obscuring the description of this application with unnecessary detail. Accordingly, this application is not intended to be limited to the embodiments shown, but is to be accorded the widest scope consistent with the principles and features disclosed herein.

Claims

1. A resonator and temperature sensor integrated chip, characterized in that: The resonator and temperature sensor integrated chip includes a resonator, a control circuit, a frequency adjustment circuit, a temperature sensor, a frequency output port and a temperature output port; The resonator is electrically connected to the control circuit, and is used to be maintained by the control circuit to vibrate at a natural frequency, so that the control circuit outputs a corresponding initial frequency signal; The frequency adjustment circuit is electrically connected to the control circuit and is used to receive an initial frequency signal from the control circuit for processing to output a target frequency signal; The temperature sensor is used to obtain the ambient temperature; The frequency output port is connected to the frequency adjustment circuit to output the target frequency signal; The temperature output port is connected to the temperature sensor to output the ambient temperature.

2. The resonator and temperature sensor integrated chip according to claim 1, characterized in that: The resonator and temperature sensor integrated chip also includes a temperature compensation circuit; the temperature compensation circuit is connected between the temperature sensor and the frequency adjustment circuit; The temperature compensation circuit is used to perform fitting processing on the ambient temperature to obtain a temperature fitting signal, and transmit the temperature fitting signal to the frequency adjustment circuit. The frequency adjustment circuit is used to obtain the temperature fitting signal to output a target frequency signal with a desired frequency.

3. The resonator and temperature sensor integrated chip according to claim 2, characterized in that: The temperature compensation circuit is a polynomial fitting circuit; The polynomial fitting circuit is used to perform polynomial fitting on the ambient temperature to obtain the temperature fitting signal.

4. The resonator and temperature sensor integrated chip according to claim 2, characterized in that: The resonator and temperature sensor integrated chip is also provided with a control port; the control port is connected to the control end of the temperature compensation circuit and is used to control the working state of the temperature compensation circuit.

5. The resonator and temperature sensor integrated chip according to claim 4, characterized in that: When the control port receives a high level, the temperature compensation circuit works normally, and when the control port receives a low level, the temperature compensation circuit stops working.

6. The resonator and temperature sensor integrated chip according to claim 1, characterized in that: The temperature sensor is a digital temperature sensor; the digital temperature sensor comprises a first voltage-controlled oscillator, a first phase detector and a counter; The first voltage-controlled oscillator is used to receive an input voltage to generate a clock signal that varies with the input voltage, and the input voltage varies with temperature; The first phase detector is used to convert the clock signal into a pulse signal after the clock signal reaches a preset frequency; The counter is used to count the frequency of the clock signal when it is detected that the level state of the pulse signal is a preset level, and output a data encoding value corresponding to the count value, wherein the data encoding value is used to represent the ambient temperature.

7. The resonator and temperature sensor integrated chip according to claim 2, characterized in that: The frequency adjustment circuit includes a fractional frequency phase-locked loop; The fractional frequency phase-locked loop is used to receive the initial frequency signal, and use the initial frequency signal as a reference signal to divide and modulate the internal clock signal, so as to output a target frequency signal with a desired frequency.

8. The resonator and temperature sensor integrated chip according to claim 7, characterized in that: The fractional-frequency phase-locked loop is provided with a frequency control end; the frequency control end is electrically connected to the output end of the temperature compensation circuit, and is used to access the temperature fitting signal output by the temperature compensation circuit, adjust its own frequency division ratio, and thus adjust the frequency of the output signal to obtain a target frequency signal with a desired frequency.

9. The resonator and temperature sensor integrated chip according to claim 1, characterized in that: The frequency adjustment circuit includes a fractional output frequency divider; The fractional output frequency divider is used to receive an initial frequency signal and divide the initial frequency signal to output a target frequency signal with a desired frequency.

10. The resonator and temperature sensor integrated chip according to claim 1, characterized in that: The frequency adjustment circuit includes a multi-mode frequency divider and a Σ-Δ modulator; The multi-mode frequency divider is used to receive the initial frequency signal, determine the frequency division ratio according to the modulation signal output by the Σ-Δ modulator, and divide the initial frequency signal according to the frequency division ratio to obtain the target frequency signal; The input end of the Σ-Δ modulator is electrically connected to the output end of the multi-mode frequency divider, and the output end is connected to an input end of the multi-mode frequency divider, for receiving a frequency signal output by the multi-mode frequency divider, modulating the frequency signal to obtain a modulation signal, and inputting the modulation signal into the multi-mode frequency divider.

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