Composite circuit board

Abstract

The utility model discloses a composite circuit board, and relates to the field of circuit boards. The device comprises a device and a substrate, the top surface of the substrate is provided with a plugging terminal, the bottom of the substrate is provided with an insulating plate, the bottom of the insulating plate is provided with a root wire plate, the bottom of the root wire plate is provided with insulating glue, a pin at the bottom end of the plugging terminal penetrates through the substrate and the insulating plate and is electrically connected with the root wire plate, and a pin at the bottom end of the plugging terminal penetrates through the insulating plate and is electrically connected with the root wire plate. According to the utility model, through the plugging terminals, the connection mode of the plugging terminals is adopted to replace the operation of multi-wire connection of a traditional device and a circuit board, so that the alignment condition of the plugging terminals is a fixed mode, the operation of wire arrangement and wiring by operators is avoided, the workload of the operators is reduced, and the working efficiency is improved. The connection stability and efficiency between the device and the root wire plate are greatly improved, the mounting and dismounting processes are simplified, the stability and reliability of current transmission are ensured, and the requirements of electronic equipment for high efficiency and safety performance are met.

Description

Technical Field

[0001] The utility model relates to the field of circuit boards, and particularly to a composite circuit board. Background Art

[0002] A composite circuit board is a high-performance circuit board that combines the stability of a rigid circuit board and the flexibility of a flexible circuit board. It has both high strength and good flexibility, can adapt to various complex installation environments, and has excellent electrical performance to meet the requirements of high-frequency and high-speed signal transmission. Composite circuit boards are widely used in fields such as aerospace, automotive electronics, and medical equipment. With the progress of technology, they will face higher performance requirements. Their future development will focus more on further improving strength, flexibility, and electrical performance. At the same time, environmental protection and sustainability will also become important considerations.

[0003] In the currently common circuit board designs, the connection method between devices and the circuit board is mainly through signal lines and power lines. However, there is a problem in the actual use process of this connection method: there are cases of multi-line connections between the device and the circuit board, and it is necessary for operators or engineers to align the lines one by one before performing the connection operation. There may be cases where the connection is incorrect, which undoubtedly requires the operator to re-judge the connection lines and re-perform the connection operation, thus affecting the usability and reliability of the entire electronic device. Summary of the Utility Model

[0004] Based on this, the purpose of the utility model is to provide a composite circuit board to solve the technical problem of slow assembly efficiency when there are multi-line connections between devices and the circuit board in the prior art.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A composite circuit board includes a device and a substrate. A plug-in terminal is provided on the top surface of the substrate. An insulating board is provided at the bottom of the substrate. A root wire board is provided at the bottom of the insulating board. An insulating glue is provided at the bottom of the root wire board. The bottom pins of the plug-in terminal penetrate through the substrate and the insulating board and are electrically connected to the root wire board. A heat dissipation mechanism is provided outside the plug-in terminal. The heat dissipation mechanism includes thermal grease. Contact pieces are provided below both sides of the device.

[0006] By adopting the above technical solution, by applying thermal grease to the contact surface between the device and the substrate, during the long-term operation of the circuit board, the heat generated at the connection part between the device and the plug-in terminal can be effectively conducted to the contact pieces and the heat dissipation fins quickly. Such a design significantly increases the heat dissipation area and speeds up the heat dissipation, thereby preventing excessive heat accumulation between the device and the substrate.

[0007] Furthermore, the inner side of the abutting piece abuts against the surface of the device, and the abutting piece and the substrate are fixedly connected by welding.

[0008] By adopting the above technical solution, the effective transfer of heat is ensured. Since the abutting piece and the substrate are fixedly connected by welding, this connection method is stable and has a small thermal resistance, enabling the heat generated by the device to be smoothly conducted to the substrate through the abutting piece and then dissipated through the large area of the substrate.

[0009] Furthermore, a plurality of heat sinks are arranged on the surface of the abutting piece and are arranged along the height line of the abutting piece.

[0010] By adopting the above technical solution, the plurality of heat sinks effectively increase the heat dissipation area. These heat sinks are linearly arranged at equal intervals along the height line of the abutting piece, enabling the heat to be dissipated more evenly and improving the heat dissipation efficiency.

[0011] Furthermore, the material of the insulating glue is epoxy resin encapsulation insulating glue, and the material of the root wire board is copper clad plate.

[0012] By adopting the above technical solution, the material of the epoxy resin encapsulation insulating glue has good insulation performance and encapsulation performance, can effectively isolate the current, prevent short - circuit and leakage between circuits, thus improving the safety and stability of the circuit board. In some other embodiments, the root wire board has two or more than two structural material forms, specifically circuit boards made of PCB boards, alloy copper plates or alloy aluminum plates, and different structural materials can be selected according to actual usage conditions.

[0013] Furthermore, the material of the insulating board is fiberglass board, and electrical symbols, area classifications, and text descriptions are marked on the surface of the substrate.

[0014] By adopting the above technical solution, the insulating board uses fiberglass board as the material, which has good insulation performance and mechanical strength, can effectively isolate the circuit, prevent electrical faults, and can withstand a certain amount of external force and impact, enhancing the stability and durability of the circuit board.

[0015] Furthermore, a plurality of terminal blocks are arranged on one side of the top surface of the substrate, for providing connection points for the data lines of external electrical signals and digital signals to be connected to the circuit board.

[0016] By adopting the above technical solution, the plurality of terminal blocks provide convenient connection points for the data lines of external electrical signals and digital signals to the circuit board, enabling the circuit board to easily access various data lines and achieve fast data transmission and signal exchange with the outside world.

[0017] Furthermore, a plurality of mounting holes are formed on the surface of the substrate, for providing bolt mounting points for the device and the substrate.

[0018] By adopting the above technical solution, multiple mounting holes provide convenient points for bolt mounting between the device and the substrate, enabling the device to be stably mounted on the substrate and improving the stability and reliability of the overall structure.

[0019] Furthermore, the substrate is of a frame structure and is used to enclose and protect the insulating board, root wire board, and insulating glue inside the substrate.

[0020] By adopting the above technical solution, using the substrate to protect the insulating board, root wire board, and insulating glue is beneficial to improving the overall protection performance of the circuit board, thereby enhancing the adaptability of the circuit board to different usage environments and increasing its service life and durability.

[0021] Furthermore, the insulating board, root wire board, and insulating glue are arranged in sequence from top to bottom.

[0022] By adopting the above technical solution, its structure has a relatively distinct hierarchical division. While enhancing the strength of its connection structure, it provides a relatively clear hierarchical division mechanism for maintenance and operating personnel, facilitating the assembly and maintenance operations of the circuit board and improving its usability.

[0023] Furthermore, mounting ears are provided on both sides of the substrate and are used to provide bolt connection points between the circuit board and external devices.

[0024] By adopting the above technical solution, the mounting ears provide a relatively convenient installation method for the connection form between the circuit board and the device during the subsequent use of the circuit board, thereby further improving the usability of the circuit board and enhancing the stability of its installation structure.

[0025] In summary, the main beneficial effects of the present utility model are as follows:

[0026] 1. By using pluggable terminals, the present utility model adopts the connection method of pluggable terminals to replace the operation of multi-wire connection between traditional devices and circuit boards. As a result, the alignment of the pluggable terminals is in a fixed form, avoiding the operations of wire arrangement and wiring by operators, reducing the workload of the staff, greatly enhancing the connection stability and efficiency between the device and the root wire board, not only simplifying the installation and disassembly processes but also ensuring the stability and reliability of current transmission, thus meeting the requirements of electronic devices for high efficiency and safety performance;

[0027] 2. By providing a heat dissipation mechanism, the utility model coats thermal grease on the contact surface between the device and the substrate. During the long-term operation of the circuit board, it can effectively conduct the heat generated at the connection part between the device and the plug-in terminal to the abutting piece and the heat sink quickly, significantly increasing the heat dissipation area, enabling the heat to dissipate faster, preventing excessive accumulation of heat between the device and the circuit board. At the same time, this measure also improves the safety protection performance of the circuit board and the device, because the timely dissipation of heat reduces the risk of faults or damages that may be caused by overheating. This not only extends the service life of the circuit board and the device but also ensures that they can maintain good performance during long-term use. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a three-dimensional structural schematic diagram of the utility model;

[0029] Figure 2 is an exploded structural schematic diagram of the utility model;

[0030] Figure 3 is a top view structural schematic diagram of the utility model;

[0031] Figure 4 is a structural schematic diagram of the heat dissipation mechanism of the utility model;

[0032] Figure 5 is the utility model Figure 2 The enlarged structural schematic diagram at position A in.

[0033] In the figure: 1. Device; 2. Substrate; 3. Plug-in terminal; 4. Wiring terminal; 5. Insulating board; 6. Root wire board; 7. Insulating glue; 8. Mounting hole; 9. Heat dissipation mechanism; 901. Thermal grease; 902. Abutting piece; 903. Heat sink. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0034] Next, the technical solutions in the embodiments of the utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the utility model. The embodiments described below by referring to the drawings are exemplary and are only used to explain the utility model and should not be construed as a limitation of the utility model.

[0035] In the description of the utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, so it should not be construed as a limitation of the utility model. In addition, the terms "first", "second", "third" are only used for descriptive purposes and should not be construed as indicating or implying relative importance.

[0036] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", "linkage", and "setting" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection: it can be a mechanical connection or an electrical connection: it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0037] The following will describe the embodiments of the present utility model according to its overall structure.

[0038] A composite circuit board, as Figures 1 - 5 shown, includes a device 1 and a substrate 2. A plug-in terminal 3 is provided on the top surface of the substrate 2, an insulating plate 5 is provided at the bottom of the substrate 2, a root wire board 6 is provided at the bottom of the insulating plate 5, and an insulating glue 7 is provided at the bottom of the root wire board 6. The bottom end pins of the plug-in terminal 3 penetrate through the substrate 2 and the insulating plate 5 and are electrically connected to the root wire board 6. A heat dissipation mechanism 9 is provided outside the plug-in terminal 3. The heat dissipation mechanism 9 includes thermal grease 901. Contact pieces 902 are provided below both sides of the device 1. By coating thermal grease on the contact surface between the device 1 and the substrate 2, during the long-term operation of the circuit board, the heat generated at the connection part between the device 1 and the plug-in terminal 3 can be effectively conducted to the contact pieces 902 and the heat sink 903 quickly. Such a design significantly increases the heat dissipation area and speeds up the heat dissipation, thereby preventing excessive heat accumulation between the device 1 and the substrate 2. At the same time, the implementation of this heat dissipation measure greatly improves the safety protection performance of the substrate 2 and the device 1 and reduces the risk of failures or damages that may be caused by overheating. This not only helps to extend the service life of the substrate 2 and the device 1 but also ensures that the circuit board can continuously exhibit good performance during long-term operation.

[0039] Referring to Figure 2 、 Figure 4 、 Figure 5 , the inner side of the contact piece 902 abuts against the surface of the device 1. The contact piece 902 and the substrate 2 are fixedly connected by welding, ensuring the effective transfer of heat. Since the contact piece 902 and the substrate 2 are fixedly connected by welding, this connection method is stable and has a small thermal resistance, enabling the heat generated by the device 1 to be smoothly conducted to the substrate 2 through the contact piece 902 and then dissipated through the large area of the substrate 2. At the same time, the welded fixed connection also enhances the overall structural stability and reduces the risk of connection loosening or failure that may be caused by vibration or temperature changes. This not only helps to protect the device 1 from damage but also ensures that the circuit board can maintain good electrical performance and heat dissipation effect in various working environments.

[0040] Refer to Figure 2 、 Figure 4 、 Figure 5 On the surface of the abutting piece 902, a plurality of heat sinks 903 are provided, and they are arranged linearly at equal intervals or non-equidistantly along the height line of the abutting piece 902. The plurality of heat sinks 903 effectively increase the heat dissipation area. These heat sinks 903 are arranged linearly at equal intervals or non-equidistantly along the height line of the abutting piece 902, enabling the heat to be dissipated more evenly, improving the heat dissipation efficiency. At the same time, the arrangement of the heat sinks 903 linearly at equal intervals also optimizes the air flow, facilitating the convective and radiative heat dissipation of the heat, thereby further reducing the operating temperature of the device 1. This structure not only helps to extend the service life of the device 1 and the circuit board, but also ensures the stability and performance of the electronic device during high-load operation.

[0041] Refer to Figure 2 、 Figure 4 、 Figure 5 The material of the insulating glue 7 is epoxy resin encapsulation insulating glue, and the material of the root wire board 6 is copper clad plate. The material of the epoxy resin encapsulation insulating glue has good insulation performance and encapsulation performance, which can effectively isolate the current, prevent short circuits and leakage between circuits, thereby improving the safety and stability of the circuit board. At the same time, the root wire board 6 can also be made of PCB board, alloy copper plate or alloy aluminum plate, which has good electrical conductivity and thermal conductivity, can ensure the stable transmission of current, and helps to quickly dissipate heat. It not only improves the electrical performance of the circuit board, but also enhances its heat dissipation ability, thereby extending the service life of the circuit board and ensuring the reliable operation of the electronic device.

[0042] Refer to Figure 1 、 Figure 2 、 Figure 3 The material of the insulating board 5 is fiberglass board, and electrical symbols, area classifications, and text descriptions are marked on the surface of the substrate 2. The insulating board 5 uses fiberglass board as the material, which has good insulation performance and mechanical strength, can effectively isolate the circuit, prevent electrical faults, and can withstand a certain amount of external force and impact, enhancing the stability and durability of the circuit board. At the same time, electrical symbols, area classifications, and text descriptions are marked on the surface of the substrate 2. These markings are clear and easy for engineers to install, debug, and maintain the circuit board, improving work efficiency, reducing operation errors, and thus ensuring the safe and reliable operation of the electronic device.

[0043] Refer to Figure 1 、 Figure 2 、 Figure 3, on one side of the top surface of the substrate 2, a plurality of connection terminals 4 are provided, which are used to provide connection points for the data lines of external electrical signals and digital signals and the circuit board. The plurality of connection terminals 4 provide convenient connection points for the data lines of external electrical signals and digital signals and the circuit board, enabling the circuit board to easily access various data lines, realizing fast data transmission and signal exchange with the outside world. At the same time, the setting of these connection terminals 4 also greatly simplifies the installation and debugging process of the circuit board, improving work efficiency. In addition, the clear connection points also reduce the risk of connection errors, thus ensuring the accuracy of data transmission and the stability of the operation of electronic devices.

[0044] Refer to Figure 1 , Figure 2 , Figure 3 , Figure 5 , on the surface of the substrate 2, a plurality of mounting holes 8 are provided, which are used to provide bolt mounting points for the device 1 and the substrate 2. The plurality of mounting holes 8 provide convenient points for the bolt mounting between the device 1 and the substrate 2, enabling the device 1 to be stably mounted on the substrate 2, improving the stability and reliability of the overall structure. At the same time, through the bolt connection method, the installation, disassembly, and replacement of the device 1 can be conveniently carried out, facilitating maintenance and upgrading. The clear mounting points also reduce errors and uncertainties during the installation process, thus ensuring the safe operation and performance of electronic devices.

[0045] The implementation principle of the present utility model is as follows: First, the device 1 is inserted into the plug-in terminal 3. Through the plug-in terminal 3, the device 1 is electrically connected to the root wire board 6. A heat-conducting silicone grease is coated at the contact surface between the device 1 and the substrate 2. During the long-term use of the circuit board, it is beneficial to use the heat-conducting silicone grease to quickly conduct the heat generated at the connection between the device 1 and the plug-in terminal 3 to the outer contact piece 902 and heat sink 903, thereby expanding the heat dissipation area and preventing excessive heat accumulation between the device 1 and the circuit board, thus enhancing the safety protection of the circuit board and the device 1 and improving its service life and performance;

[0046] In the form of the plug-in terminal 3, it is beneficial to improve the connection stability and connection efficiency between the device 1 and the root wire board 6.

[0047] Parts not involved in the present utility model are the same as or can be implemented using the prior art, and will not be elaborated here.

[0048] Although embodiments of the present utility model have been shown and described, the specific embodiments are only explanations of the present utility model and not limitations thereof. The specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art can make modifications, substitutions, and variations that do not make a creative contribution to the embodiments as needed, but as long as they are within the scope of the claims of the present utility model, they are protected by the patent law.

Claims

1. A composite circuit board, characterized in that: The device comprises a device (1) and a substrate (2), wherein a plug-in terminal (3) is arranged on the top surface of the substrate (2), an insulating plate (5) is arranged on the bottom of the substrate (2), a root plate (6) is arranged on the bottom of the insulating plate (5), an insulating glue (7) is arranged on the bottom of the root plate (6), the bottom pins of the plug-in terminal (3) pass through the substrate (2) and the insulating plate (5) and are electrically connected to the root plate (6), a heat dissipation mechanism (9) is arranged on the outside of the plug-in terminal (3), and the heat dissipation mechanism (9) comprises thermal conductive silicone grease (901), and abutment sheets (902) are arranged below both sides of the device (1).

2. The composite circuit board according to claim 1, characterized in that: The inner side of the contact piece (902) contacts the surface of the device (1), and the contact piece (902) is fixedly connected to the substrate (2) by welding.

3. The composite circuit board according to claim 1, characterized in that: A plurality of heat sinks (903) are provided on the surface of the abutting piece (902) and are arranged along a height line of the abutting piece (902).

4. The composite circuit board according to claim 1, characterized in that: The material of the insulating glue (7) is epoxy resin encapsulation bonding glue, and the material of the root wire board (6) is a copper plate, a PCB board, an alloy copper plate or an alloy aluminum plate.

5. The composite circuit board according to claim 1, characterized in that: The insulating board (5) is made of a glass fiber board, and the surface of the base plate (2) is marked with electrical symbols, area classifications, and text descriptions.

6. The composite circuit board according to claim 1, characterized in that: A plurality of connection terminals (4) are arranged on one side of the top surface of the substrate (2) for providing connection points between data lines of external electrical signals and digital signals and the circuit board.

7. The composite circuit board according to claim 1, characterized in that: The surface of the substrate (2) is provided with a plurality of mounting holes (8) for providing bolt mounting points for the device (1) and the substrate (2).

8. The composite circuit board according to claim 1, characterized in that: The base plate (2) is a frame-type structure, and is used to cover and protect the insulating plate (5), the root wire plate (6), and the insulating glue (7) inside the base plate (2).

9. The composite circuit board according to claim 1, characterized in that: The insulating plate (5), the root wire plate (6), and the insulating glue (7) are arranged in sequence from top to bottom.

10. The composite circuit board according to claim 1, characterized in that: Both sides of the base plate (2) are provided with mounting ears, which are used to provide bolt connection points between the circuit board and external equipment.

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